CN201796950U - Light emitting diode light source structure - Google Patents
Light emitting diode light source structure Download PDFInfo
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- CN201796950U CN201796950U CN2010202855694U CN201020285569U CN201796950U CN 201796950 U CN201796950 U CN 201796950U CN 2010202855694 U CN2010202855694 U CN 2010202855694U CN 201020285569 U CN201020285569 U CN 201020285569U CN 201796950 U CN201796950 U CN 201796950U
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- circuit board
- light source
- emitting diode
- source structure
- light
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Abstract
The utility model relates to a light emitting diode light source structure, which forms a novel combined circuit board through combining a light emitting diode with an easy-processing easy-assembling and low-material-cost glass fiber base material or metal base material circuit board and one or a plurality of ceramic base material circuit boards with good heat conduction effect, wherein the ceramic base material circuit board can meet the heat radiation requirements of the high-power light emitting diode light source, in addition, the problems of difficult processing and assembly of the ceramic base material circuit board can be solved through the glass fiber base material or metal base material circuit board, and meanwhile, the glass fiber base material or metal base material circuit board can also solve the problem of dimension limitation of the ceramic base material circuit board.
Description
Technical field
The utility model is about a kind of light-emitting diode light source structure.
Background technology
Light-emitting diode (LED) is the very high light source of a luminous efficiency, recently the High Power LED light source has been widely used in being assembled into the led lighting that the tool environmental protection subtracts the carbon notion, yet, led lighting must have good heat dissipation design, when lighting led lighting, the heat energy that is produced from the High Power LED wafer must conduct to the heat radiation module through circuit board, again through the radiating fin of heat radiation on the module with thermal energy conduction to ambient air, take away this heat energy by flow air, the usefulness of each heat biography interface is all very important, otherwise the heat energy that LED wafer produces builds up because of can not effectively dissipating, the heat energy of being accumulated can make the temperature of LED wafer raise fast, high temperataure phenomena is except the useful life of meeting impairment light-emitting diode, and high temperature is the main cause of lumination of light emitting diode decrease in efficiency especially.
The heat energy that the High Power LED wafer is produced must effectively see through circuit board and be delivered on the heat radiation module, the radiating fin that this heat energy could see through the heat radiation module again passes to heat energy in the air, the heat energy that LED wafer produced just can not accumulated, therefore, the High Power LED light source needs the good circuit board of a heat conduction usefulness.
LED source all is to use glass fibre copper foil plate (for example FR4) as its circuit board material for a long time, because the purposes of glass fibre copper foil plate is general, technology maturation and inexpensive, and the heat energy that LED wafer produced is not high, and the bad problem of the heat conduction of glass fibre copper foil plate is unimportant; Improvement along with the LED wafer material, the brightness of new light-emitting diode is raised always, its power also is enhanced always, power is higher then to need preferable heat conducting LED source circuit board, therefore the higher-wattage LED source changes use metal base circuit board (MCPCB) mostly, wherein the metal base circuit board is the electrical insulating material of metallic substrate surfaces coating one deck macromolecule membrane, the macromolecule membrane surface forms a conducting channel again, owing to use metal substrate to replace glass fiber material, therefore make the heat dissipation problem that rigorous metal base circuit board can improve general higher-wattage LED source.
Luminous efficiency lifting more always along with light LED material, and its brightness of new application of LED source also is required to promote again, for example applied to lighting use, causing need more high-power LED source, and development High Power LED light source needs new circuit board heat dissipation design.
The circuit board heat dissipation design of above-mentioned High Power LED, as adopt the glass fibre copper foil plate, not good because of the thermal conduction characteristic of its fiberglass sheet material, therefore must form enough through holes and recharge with heat conduction glue at sheet material, the thermal energy transfer that light-emitting diode produced is arrived the back side of circuit board; As adopt the metal base circuit board, because of its heat is hindered on the macromolecule membrane layer, therefore must improve the heat conduction of the electrical insulating material of its macromolecule membrane again.The former must get out enough through holes at fiberglass sheet material, also will fill heat conduction glue, and procedure for processing is loaded down with trivial details, and thermal conduction effect increases limited; The latter is because of relating to the problem of the low thermal conduction characteristic of macromolecular material, so the thermal conduction characteristic of metal base circuit board never has breakthrough development.Therefore, High Power LED adopts the available circuit plate that the problem of poor heat radiation will take place.
The development of High Power LED recently, adopt the ceramic base material circuit board as the circuit board of High Power LED so that overcome its heat dissipation problem, wherein the radiating effect of ceramic base material circuit board is excellent, its thermal conduction characteristic is several times as much as existing metal base circuit board and glass fibre copper foil plate, can satisfy the heat radiation requirement of High Power LED light source; Yet, the ceramic material high rigidity of ceramic base material circuit board, easy crisp characteristic, have processing, assembling difficult problem, for example boring, screw lock etc., moreover, because the production method of ceramic base material relates to the high temperature sintering processing procedure of ceramic material, is not easy very much to obtain larger area ceramic base material circuit board.
The application of development High Power LED light source, especially aspect lighting use, must adopt the circuit board of enough heat conduction usefulness, and its circuit board must be easy processing, assembling easily, otherwise the not good meeting of heat dissipation causes the luminous efficacy of High Power LED to descend, even the useful life of impairment light-emitting diode, be not easy processing or be not easy assembling then to cause High Power LED light source manufacturing cost to reduce, also can limit its range of application.
The utility model content
Main purpose of the present utility model provides a kind of light-emitting diode light source structure that has low manufacturing cost and high heat dissipation efficiency concurrently, and circuit board wherein of the present utility model is to be incorporated into easy processing, the easily good ceramic base material circuit board of assembling and the fiberglass substrate that the cost of material is low or metal base circuit board and or the hot biography of number usefulness and the compound circuit plate that forms.
Another purpose of the present utility model provides a kind of light-emitting diode light source structure of easy assembling, though light-emitting diode is fixed on the high ceramic base material circuit board of heat dissipation in the light-emitting diode light source structure, but the processing difficulties that the characteristic of ceramic material makes, be difficult for and the combination of heat radiation module, yet adopted the fiberglass substrate or the metal base circuit board of one combination, thereby light-emitting diode light source structure of the present utility model is very easy to be assembled on the heat radiation module.
Another purpose of the present utility model provides a kind of light-emitting diode light source structure that is assembled into the large tracts of land light source easily, though light-emitting diode is fixed in the ceramic base material circuit board high heat dissipation is arranged, but the characteristic of ceramic material makes processing difficulties, be difficult for obtaining larger area ceramic base material circuit board, yet adopt fiberglass substrate or metal base circuit board as large-area structural circuit plate, to disperse than the ceramic base material circuit board of small size to be installed in this structural circuit plate again, and can effectively form large-area LED source and needn't sacrifice its heat dissipation again.
Technical solution adopted in the utility model is: a kind of light-emitting diode light source structure, and it comprises: first circuit board, this circuit board are provided with one or several impenetrating mouths; Second circuit board is a ceramic substrate, has on the substrate surface by the formed circuit of conducting metal; And LED source, be fixed on the second circuit board; Wherein, this second circuit board correspondence is consolidated in the impenetrating mouth of this first circuit board, forms between this first circuit board and the second circuit board to be electrically connected.
Wherein this second circuit board can be that aluminum oxide substrate directly engages copper base or aluminium nitride substrate directly engages copper base.
Useful technique effect of the present utility model is: LED source of the present utility model, process in conjunction with easy by one, easily the glass base material of assembling and low material cost or metal base circuit board with one or the good ceramic base material circuit board of number heat biography usefulness form a novel compound circuit plate, the magnetic base material circuit board of wherein making pottery can satisfy the heat radiation requirement of High Power LED light source, and glass base material or metal base circuit board can be improved the processing of ceramic base material circuit board, the assembling difficult problem, glass base material or metal base circuit board also can overcome the restricted dimensionally problem of ceramic base material circuit board simultaneously.
Description of drawings
Fig. 1 is the exploded perspective schematic diagram of the utility model light-emitting diode light source structure.
Fig. 2 is the generalized section of the utility model light-emitting diode light source structure.
Fig. 3 is the generalized section of another light-emitting diode light source structure of the utility model.
Fig. 4 is the generalized section of another light-emitting diode light source structure of the utility model.
Fig. 5 is the generalized section of another light-emitting diode light source structure of the utility model.
Fig. 6 is the schematic diagram that the utility model light-emitting diode light source structure combines with heat dissipation element.
[main element symbol description]
1 first circuit board, 11 first circuit board circuit, 12 impenetrating mouths
13 electrical connecting elements, 14 power supply pads, 15 screw lock through holes
2 second circuit boards, 21 ceramic substrates, 22 second circuit board circuit
23 circuit board interface, 3 LED source, 31 wafers
34 encapsulation of 32 lead frames, 33 heat-conducting blocks
35 heat conduction materials, 4 direct encapsulation LED light source 41 first circuit boards
411 first circuit board circuit, 413 electrical connecting elements, 415 screw lock through holes
42 second circuit boards, 421 ceramic substrates, 422 second circuit board circuit
432 encapsulation of 43 LED source, 431 wafers
5 iterative structure LED source, 51 first circuit boards
511 first circuit board circuit, 52 impenetrating mouths, 53 second circuit boards
54 second circuit board circuit, 55 LED source, 56 heat conduction materials
57 solders side, 6 LED light source module, 61 first circuit boards
611 electrical connecting elements, 62 second circuit boards, 63 LED source
65 spiral locks, 64 heat dissipation elements, 641 radiating fins, 642 thermal greases
Embodiment
The utility model is about a kind of light-emitting diode light source structure, in conjunction with the light-emitting diode light source structure of High Power LED on compound circuit plate with easy processing, easy assembling, low material cost and high heat biography usefulness, can satisfy the heat radiation requirement of High Power LED light source, processing that again can the improved circuit plate, assembling difficult problem overcome the restricted dimensionally problem of circuit board simultaneously.
Fig. 1 is the exploded perspective schematic diagram of the utility model light-emitting diode light source structure, Figure 2 shows that the generalized section of light-emitting diode light source structure, wherein first circuit board 1, this circuit board surface has first circuit board circuit 11, circuit board is provided with and runs through 12, the electrical connecting element 13 and the power supply pad 14 that connect first circuit board circuit 11, in addition need the time also can establish one or several screw lock through holes 15, first circuit board adopts processing easily, assembling reaches the circuit board that the cost of material is low easily, glass fibre copper foil plate circuit board for example, urea copper foil plate circuit board or metal substrate circuit board, wherein this first circuit board is single face circuit board or double-sided PCB.Wherein second circuit board 2 is made up of ceramic substrate 21 and the surperficial formed second circuit board circuit 22 of conducting metal of going up thereof, wherein second circuit board 2 is selected from direct joint copper base (DBC), direct copper facing substrate (DPC) or low temperature co-fired multilayer ceramic substrate (LTCC) etc., and wherein ceramic substrate 21 can be selected from aluminum oxide substrate or aluminium nitride substrate.Second circuit board 2 is embedded in the impenetrating mouth 12 of first circuit board 1, first circuit board, form circuit board interface 23 between the second circuit board, can impose solid in this interface in order to fixedly first circuit board and second circuit board and make a Heterogeneous Composite circuit board, and this second circuit board 2 is arranged with copline and is embedded and form coplanar compound circuit plate structure in the impenetrating mouth 12 of this first circuit board 1, first circuit board circuit 11 and second circuit board circuit 22 are connected by electrical connecting element 13, this electrical connecting element 13 can select for use the Zero-ohm resistor element to be welded between first circuit board circuit 11 and the second circuit board circuit 22, and has an effect of affixed first circuit board and second circuit board, wherein LED source 3 comprises LED wafer 31, lead frame 32, heat-conducting block 33 and encapsulate 34, and be fixed on the second circuit board 2, LED wafer 31 is electrically connected on the second circuit board circuit 22 by lead frame 32, be provided with heat conduction material 35 between heat-conducting block 33 and the second circuit board 2, can select for use heat such as scolding tin or heat-conducting cream to pass the good material of characteristic, the heat energy that wafer 31 is produced is delivered on the second circuit board 2 by heat-conducting block 33 and heat conduction material 35, and wherein LED source can adopt single encapsulation LED light source or polycrystalline encapsulation LED light source.
In the light-emitting diode light source structure of the present utility model, impenetrating mouth corresponding to first circuit board, be connected with second circuit board, be provided with between this first circuit board and the second circuit board and be electrically connected, if first circuit board is provided with several impenetrating mouths, then make several second circuit boards be embedded at respectively and form a compound circuit plate in these several impenetrating mouths, wherein processing easily, the first circuit board of assembling and low material cost can be obtained than the large-area circuits plate easily, can be processed into different sizes easily, shape or processing perforate, can also be fixed on the heat sink by safe screw lock, wherein these several second circuit boards can adopt the circuit board than small size, and needn't directly be fixed on the heat dissipation element, but second circuit board is a heat passes the good circuit board of usefulness, and still the thermal energy transfer that can effectively LED source be produced is to heat dissipation element.
Fig. 3 is the generalized section of another light-emitting diode light source structure of the utility model; it is a direct encapsulation COB; chip-on-board) LED source 4; wherein first circuit board 41 is provided with first circuit board circuit 411; impenetrating mouth (filling by second circuit board in the diagram) and screw lock through hole 415; wherein second circuit board 42 is made up of ceramic substrate 421 and second circuit board circuit 422; LED source 43 direct encapsulation LEDs wherein; its wafer 431 directly is fixed on the second circuit board circuit 422; and by encapsulation 432 and outer isolation and protection; form with first circuit board by electrical connecting element 413 again and be electrically connected; wherein direct encapsulation LED light source also can adopt the LED source of the structure of polycrystalline encapsulation, that is is packaged into LED source again at second circuit board circuit 422 fixing most wafers 431.
Fig. 4 is the generalized section of another light-emitting diode light source structure of the utility model, it is the LED source 5 of an iterative structure, wherein first circuit board 51 is provided with first circuit board circuit 511 and impenetrating mouth 52, second circuit board 53 is provided with second circuit board circuit 54, wherein this second circuit board 53 is fixed in the periphery of the impenetrating mouth 52 of this first circuit board 51 in superimposed mode, and form a solder side 57, this solder side 57 has the effect that is electrically connected and fixedlys connected first circuit board 51 and second circuit board 53 concurrently, form the relation of iterative structure between first circuit board 51 and the second circuit board 53, wherein LED source 55 is fixed on this second circuit board 53,55 of LED source are exposed to the impenetrating mouth 52 of first circuit board 51, and the heat energy that light-emitting diode produced is delivered on the second circuit board 53 by heat conduction material 56 therebetween.
Fig. 5 is the generalized section of another light-emitting diode light source structure of the utility model, it is the light-emitting diode light source structure that several LED source are combined into, wherein first circuit board 61 is provided with several impenetrating mouths (being filled by second circuit board in the diagram), 62 of several second circuit boards are embedded at respectively and form a compound circuit plate in these several impenetrating mouths, formed by electrical connecting element 611 between first circuit board 61 and the second circuit board 62 and be electrically connected, 63 of several LED source are individually fixed on several second circuit boards 62.This light-emitting diode light source structure discloses to utilize can make a larger area LED source than the second circuit board 62 of small size easily in conjunction with larger area first circuit board 61, and overcomes a difficult problem that is difficult for obtaining than the second circuit board 62 of large tracts of land ceramic base material simultaneously.
Fig. 6 is the schematic diagram that the utility model light-emitting diode light source structure combines with heat dissipation element, it is the LED light source module 6 that is made up by light-emitting diode light source structure shown in Figure 5 and heat dissipation element 64, it is affixed that wherein first circuit board 61 utilizes spiral lock 65 and heat dissipation element 64, circuit board and heat dissipation element 64 are provided with thermal grease 642, the heat energy that LED source 63 is produced is delivered to heat dissipation element 64 via second circuit board 62 and thermal grease 642, by radiating fin 641 heat energy is emitted in the surrounding environment again.
Claims (19)
1. light-emitting diode light source structure is characterized in that comprising:
First circuit board, this circuit board are provided with one or several impenetrating mouths;
Second circuit board is a ceramic substrate, has on the substrate surface by the formed circuit of conducting metal; And
LED source is fixed on the second circuit board;
Wherein, this second circuit board correspondence is consolidated in the impenetrating mouth of this first circuit board, forms between this first circuit board and the second circuit board to be electrically connected.
2. light-emitting diode light source structure as claimed in claim 1 is characterized in that this first circuit board is selected from glass fibre copper foil plate, urea copper foil plate or metal substrate.
3. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this second circuit board is selected from direct joint copper base, direct copper facing substrate or low temperature co-fired multilayer ceramic substrate.
4. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is the glass fibre substrate, and this second circuit board is directly to engage copper base.
5. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is a metal substrate, and this second circuit board is directly to engage copper base.
6. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is the single face circuit board.
7. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is a double-sided PCB.
8. light-emitting diode light source structure as claimed in claim 1 is characterized in that the ceramic substrate of this second circuit board is selected from aluminum oxide substrate or aluminium nitride substrate.
9. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this second circuit board is that aluminum oxide substrate directly engages copper base.
10. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this second circuit board is that aluminium nitride substrate directly engages copper base.
11. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is provided with several impenetrating mouths.
12. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is provided with several screw lock through holes.
13. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this first circuit board is provided with the power supply pad.
14. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this second circuit board is arranged and is embedded in the impenetrating mouth of this first circuit board with copline.
15. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this second circuit board is fixed in the impenetrating mouth periphery of this first circuit board in superimposed mode.
16. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this LED source is a single packaged light source.
17. light-emitting diode light source structure as claimed in claim 16 is characterized in that, this single packaged light source is a polycrystalline encapsulation LED light source.
18. light-emitting diode light source structure as claimed in claim 1 is characterized in that, this LED source is direct encapsulation LED light source.
19. light-emitting diode light source structure as claimed in claim 18 is characterized in that, this direct encapsulation LED light source is a polycrystalline encapsulation LED light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202855694U CN201796950U (en) | 2010-08-09 | 2010-08-09 | Light emitting diode light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202855694U CN201796950U (en) | 2010-08-09 | 2010-08-09 | Light emitting diode light source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201796950U true CN201796950U (en) | 2011-04-13 |
Family
ID=43851851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202855694U Expired - Fee Related CN201796950U (en) | 2010-08-09 | 2010-08-09 | Light emitting diode light source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201796950U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620164A (en) * | 2012-03-12 | 2012-08-01 | 青岛莱菲迪光电科技有限公司 | High-power light emitting diode (LED) lamp bank without aluminum base board and preparation process thereof |
| CN108240564A (en) * | 2016-12-27 | 2018-07-03 | 天津职业技术师范大学 | A kind of uniform LED lamp panel of illuminance |
| CN108347502A (en) * | 2017-01-24 | 2018-07-31 | Lg电子株式会社 | Lighting device and mobile terminal including it |
| US10824054B2 (en) | 2017-01-24 | 2020-11-03 | Lg Electronics Inc. | Mobile terminal |
| WO2022214033A1 (en) * | 2021-04-09 | 2022-10-13 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control apparatus |
-
2010
- 2010-08-09 CN CN2010202855694U patent/CN201796950U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620164A (en) * | 2012-03-12 | 2012-08-01 | 青岛莱菲迪光电科技有限公司 | High-power light emitting diode (LED) lamp bank without aluminum base board and preparation process thereof |
| CN108240564A (en) * | 2016-12-27 | 2018-07-03 | 天津职业技术师范大学 | A kind of uniform LED lamp panel of illuminance |
| CN108347502A (en) * | 2017-01-24 | 2018-07-31 | Lg电子株式会社 | Lighting device and mobile terminal including it |
| CN108347502B (en) * | 2017-01-24 | 2020-09-08 | Lg电子株式会社 | Lighting device and mobile terminal comprising same |
| US10824054B2 (en) | 2017-01-24 | 2020-11-03 | Lg Electronics Inc. | Mobile terminal |
| WO2022214033A1 (en) * | 2021-04-09 | 2022-10-13 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20120809 |