CN201017568Y - 超薄柔性led显示屏*** - Google Patents

超薄柔性led显示屏*** Download PDF

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CN201017568Y
CN201017568Y CNU2007201209607U CN200720120960U CN201017568Y CN 201017568 Y CN201017568 Y CN 201017568Y CN U2007201209607 U CNU2007201209607 U CN U2007201209607U CN 200720120960 U CN200720120960 U CN 200720120960U CN 201017568 Y CN201017568 Y CN 201017568Y
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汪浩然
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Abstract

一种超薄柔性LED显示屏***，包括LED显示单元和通过线路板与之连接的信号处理单元、电源单元，其特征在于：所述的LED显示单元是贴片式LED显示单元，线路板是柔性线路板；贴片式LED显示单元包括一柔性基板、焊接于柔性基板正面的LED灯和焊接于柔性基板的背面的集成电路，柔性基板背面周边还设有双面泡沫胶；柔性线路板由基材、胶、铜箔、胶及补强材料依次复合叠加而成；基材是PI材料，所述的胶是EXPOXY胶，所述的补强材料是PI材料。本实用新型适用于各种LED显示装置。

Description

超薄柔性LED显示屏***
技术领域
本实用新型涉及一种新型的LED显示屏，特指一种超薄柔性LED显示屏***。
背景技术
LED(Lighting Emitting Diode)即发光二极管，是一种半导体固体发光器件。它是利用固体半导体芯片作为发光材料，在半导体中通过载流子发生复合放出过剩的能量而引起光子发射，直接发出红、黄、蓝、绿、青、橙、紫、白色的光。LED具有工作电压低，耗电量小，发光效率高，发光响应时间极短，光色纯，结构牢固，抗冲击，耐振动，性能稳定可靠，重量轻，体积小，成本低等一系列特性，LED显示屏就是利用LED作为光源制造出来的显示信息和装饰环境的产品。
LED显示屏是一种以LED为基本发光体的主动可控电发光设备，通过***的控制处理单元(电脑或单片机***)，可显示文字、图形、图象等信息，按每个基本发光点的LED的三原色组成区分可分为单基色显示屏、双基色显示屏、真彩色(三基色)显示屏。
如图1所示，传统的显示屏显示面由若干个LED显示单元1按“搭积木”方式拼接而成，LED显示单元1的构造为：若干LED显示模块+常规印刷线路板PCB+若干集成电路芯片构成；LED显示模块的构造为按特定间距和特定数量把LED发光体集中排列在一个矩阵里，同时把这些LED的阳极和阴极按一定规律连接起来并连接到该矩阵的外引脚上，方便于显示单元的安装和控制实现，如图2是市场上最通用的型号为2088AEG的8*8 LED显示模块结构图，图中，64个LED灯2矩阵排列在固定板3中。
然而，传统的LED显示屏由于其最基本组成要素：LED显示单元的特性，使其具有一些不可克服的缺陷，主要如下：
1、LED显示模块和常规印刷线路板PCB的尺寸较大，且使用的材料均为刚性不可弯曲，导致传统LED显示屏必须被制作为一个水平的、刚性不可弯折的显示设备，该设备的安装位置因此也存在严格的要求，极大的限制了传统LED显示屏的使用范围；
2、LED显示模块和常规印刷线路板PCB的厚度较大，同时质量较重，以1m2的使用常规2088AEG LED显示模块制作的显示屏计，质量为24.6Kg；这就要求常规的LED显示屏必须制作足够强度的内部安装支架，以确保设备结构和安装安全，同时这也导致常规显示屏质量和厚度过大(常规显示屏厚度约为5cm-50cm之间)；对于空间较小的使用环境或不易于工程施工的使用环境，传统LED显示屏的局限性是很大的；
3、在常规的LED显示模块中LED的间距和LED配色组成仅有有限的几种选择，LED的显示模块外形全部为方形，这是由提供LED显示套件的上游公司规定好的；如客户根据其需要定制具有特殊的LED间距或LED配色方案或不规则形状的LED显示屏，由于巨额的LED显示套件摸具费和数以月计的工期使客户的要求变得不现实，同时这也是常规LED显示屏不能贴合市场的很大局限性；
4、传统的LED灯的导光通道如图3所示，LED灯2固定于固定板3上，外周为筒状支撑台4，LED灯的发光角度受支撑台4的高度限制，存在较大的视觉盲区，传统的LED显示屏视角在110度左右；
总之，现有的LED显示屏重量重，只能平板显示，且发光视角范围小，不能根据实际需要调整每个LED单元的排列距离，严重制约了LED显示在广告媒体中的应用。
实用新型内容
本实用新型装置所解决的问题在于克服以上存在的不足而提供一种超薄柔性LED显示屏***。
这种超薄柔性LED显示屏***，包括LED显示单元和通过线路板与之连接的信号处理单元、电源单元，其特征在于：所述的LED显示单元是贴片式LED显示单元，线路板是柔性线路板。
贴片式LED显示单元包括一柔性基板、焊接于柔性基板正面的LED灯和焊接于柔性基板的背面的集成电路，柔性基板背面周边还设有双面泡沫胶。
柔性线路板由基材、胶、铜箔、胶及补强材料依次复合叠加而成。
基材是PI材料，所述的胶是EXPOXY胶，所述的补强材料是PI材料。
使用本实用新型的超薄柔性LED显示屏***有以下用益效果：
1、重量轻。相比现有的LED显示屏24.6Kg/m2，本实用新型的显示单元的重量仅为150g/m2。
2、厚度薄，可弯曲。可以根据广告墙面的特点或广告设计的需要把显示屏按不同曲面设计。
3、视角范围大。利用贴片式LED灯发光范围大的特点，增加了视角范围，广告效果更明显。
4、整个显示屏由若干个显示单元拼接而成，由于其粘贴的安装特点，可以按需要调整各显示单元的间距，克服了现有的显示屏不能调整间距的缺点。
附图说明
图1是现有LED显示屏示意图。
图2是现有LED显示模块示意图。
图3是现有LED灯导光通道示意图。
图4是本实用新型***示意图。
图5是本实用新型LED显示单元示意图。
图6是本实用新型LED灯导光通道示意图。
图7是本实用新型柔性线路板结构示意图。
图8是本实用新型安装示意图。
具体实施方式
下面结合附图对本实用新型作进一步的说明。
如图4所示，这种超薄柔性LED显示屏***与现有LED显示屏相同，包括LED显示单元10和通过线路板20与之连接的信号处理单元30、电源单元40，电源单元40负责提供本实用新型的电源，一般为AC-DC电源，根据***的要求输出范围在+3.3V-+15V之间；如用在汽车等特殊场所，也可采用DC-DC电源，输出范围在+3.3V-+15V之间；信号处理单元30为本实用新型的控制中心，本单元首先具有录入功能，可以通过电脑、键盘、遥控器、无线传输模块等设备完成显示信息的录入，通过本单元的处理，这些信息成为数字信号，被传送到LED显示单元完成显示，根据显示数据量的大小，本信号处理单元40通常为计算机***或单片机***；所不同的是，LED显示单元10是贴片式LED显示单元，线路板20是柔性线路板；再参见图5，贴片式LED显示单元10包括一柔性基板11和焊接于柔性基板11正面的LED灯12和焊接于柔性基板11的背面的集成电路13，柔性基板背面周边还设有双面泡沫胶14(同时参见图8)。由于LED显示单元10采用了体积小，厚度薄器件，保证了本单元的轻、薄、可弯曲的特性，本单元厚度一般不超过3mm，重量小于150g/m2。贴片式LED灯12结构如图6所示，其比较大的发光视角扩大了视角范围，增加广告效果。再如图7，柔性线路板20(FPC)具有厚度小、重量轻、可作3D立体组装及动态弯曲等特性，其由铜箔21、胶22、基材23、补强材料24依次复合叠加而成，铜箔(Copper Foil)使用机械特性好的压延铜箔，保证在大角度弯曲状态10000次不断裂，厚度为0.034mm；基材(Base Film)采用阻燃性能、耐热性能均好的PI材料，厚度为0.051mm；胶(Adhesive)采用Expoxy胶，厚度为0.0254mm；补强材料(Stiffener)采用PI材料，使用补强材料使柔性线路板(FPC)具有一定刚性，不致于太软，厚度为0.0254mm，这种柔性线路板(FPC)以双面板计厚度约为0.27mm，远薄于常规印刷线路板(PCB)的正常厚度1.6mm；但其电气性能和加工特性与常规印刷线路板(PCB)毫无差别。
参见图8，施工中，为保证***的厚度足够薄，电源单元和信号处理单元(未示出)采用外置方式，通过隐蔽的导线和LED显示单元10相连；LED显示单元的安装使用“粘接”的方法，在柔性基板11的两面设有粘性较好的双面泡沫胶14，通过背面的双面泡沫胶直接把贴片式LED粘到安装作业面50上，由于其轻、薄、可弯曲的特性，使安装施工的变得极其简单、安全而富有效率，更重要的是LED灯的间距可由施工者按需要进行调整，不限安装模板的限制。
以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下，其架构形式能够灵活多变，可以派生系列产品。只是做出若干简单推演或替换，都应当视为属于本实用新型由所提交的权利要求书确定的专利保护范围。

Claims (4)

1.一种超薄柔性LED显示屏***，包括LED显示单元和通过线路板与之连接的信号处理单元、电源单元，其特征在于：所述的LED显示单元是贴片式LED显示单元，线路板是柔性线路板。
2.根据权利要求1的超薄柔性LED显示屏***，其特征在于：所述的贴片式LED显示单元包括一柔性基板、焊接于柔性基板正面的LED灯和焊接于柔性基板的背面的集成电路，柔性基板背面周边还设有双面泡沫胶。
3.根据权利要求1的超薄柔性LED显示屏***，其特征在于：所述的柔性线路板由基材、胶、铜箔、胶及补强材料依次复合叠加而成。
4.根据权利要求2的超薄柔性LED显示屏***，其特征在于：所述的基材是PI材料，所述的胶是EXPOXY胶，所述的补强材料是PI材料。
CNU2007201209607U 2007-06-22 2007-06-22 超薄柔性led显示屏*** Expired - Fee Related CN201017568Y (zh)

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Application Number Priority Date Filing Date Title
CNU2007201209607U CN201017568Y (zh) 2007-06-22 2007-06-22 超薄柔性led显示屏***
EP08158584A EP2023391A3 (en) 2007-06-22 2008-06-19 Flexible LED screen
US12/142,778 US9237652B2 (en) 2007-06-22 2008-06-20 Flexible LED screen
US14/957,593 US9936561B2 (en) 2007-06-22 2015-12-02 Flexible LED screen

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201425819Y (zh) * 2009-04-17 2010-03-17 袁钖鸿 一种柔性显示屏
US20110148746A1 (en) * 2009-12-18 2011-06-23 Philip Eric Devorris Sealed flexible light emitting diode display system with remote waterproof control
KR101381815B1 (ko) * 2010-09-29 2014-04-07 삼성디스플레이 주식회사 터치 스크린 패널 및 그 제조방법
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US8976009B2 (en) 2013-09-24 2015-03-10 Peter McGie Voice recognizing digital messageboard system and method
US20150110476A1 (en) * 2013-10-22 2015-04-23 Brian B. Walker Low cost method of temporary in store product advertising for retail stores
GB2519587A (en) 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
GB2536191A (en) 2015-01-05 2016-09-14 Barco Nv Flexible display tile and method of producing same
USD786811S1 (en) * 2015-09-15 2017-05-16 Shenzhen coleder opto-electronics co, ltd LED electronic display
US9734744B1 (en) * 2016-04-27 2017-08-15 Joan Mercior Self-reacting message board
USD804712S1 (en) 2016-05-23 2017-12-05 Roe Visual Co., Ltd. LED display screen with a quick installation structure
JP2017216272A (ja) * 2016-05-30 2017-12-07 大日本印刷株式会社 多層回路基板及びそれを用いたｌｅｄドットマトリックス表示装置
US11452198B2 (en) * 2019-07-25 2022-09-20 Borgwarner, Inc. Thermally insulated printed circuit board
CN111028708B (zh) * 2019-12-16 2021-12-28 广州视源电子科技股份有限公司 Led箱体及led显示屏
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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949581A (en) * 1997-08-12 1999-09-07 Daktronics, Inc. Display system
US6290713B1 (en) * 1999-08-24 2001-09-18 Thomas A. Russell Flexible illuminators for phototherapy
US6811563B2 (en) * 2003-01-09 2004-11-02 Henry C. Savage, Jr. Portable light delivery apparatus and methods for delivering light to the human body
CA2586847A1 (en) * 2004-11-09 2006-05-18 Steven Gardner Device and method of phototherapy for jaundiced infants
JP2006186136A (ja) * 2004-12-28 2006-07-13 Toshiba Corp 両面部品実装回路基板及びその製造方法
TWI277381B (en) * 2005-04-12 2007-03-21 Au Optronics Corp Double-sided flexible printed circuit board

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CN102724812A (zh) * 2012-06-08 2012-10-10 王定锋 直接在软性线路板上焊接led制作的外露字和方法
CN103400924A (zh) * 2013-08-14 2013-11-20 中国科学院长春光学精密机械与物理研究所 微型柔性led阵列器件及制备方法
CN103400924B (zh) * 2013-08-14 2015-11-25 中国科学院长春光学精密机械与物理研究所 微型柔性led阵列器件及制备方法
CN106228912A (zh) * 2016-07-29 2016-12-14 上海铁歌科技有限公司 一种可粘贴的超薄全彩led薄膜显示屏
CN106228912B (zh) * 2016-07-29 2019-07-30 上海铁歌科技有限公司 一种可粘贴的超薄全彩led薄膜显示屏
CN106912163A (zh) * 2017-04-27 2017-06-30 福建祥云光电科技有限公司 小间距p2.5双层线路板制作工艺
US10665646B2 (en) 2017-05-12 2020-05-26 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Splicing screen, display device and mobile terminal
CN109424131A (zh) * 2017-08-27 2019-03-05 南京乐朋电子科技有限公司 一种多功能超薄智能墙纸
CN110364091A (zh) * 2019-07-15 2019-10-22 深圳市广艺高科技有限公司 一种柔性led汽车广告屏及其制造方法
CN114333652A (zh) * 2022-01-17 2022-04-12 深圳市君同科技有限公司 一种柔性的led车载显示屏应用方法

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