CN1983547A - 用于半导体制造设备内的晶片盒输送的装置和方法 - Google Patents
用于半导体制造设备内的晶片盒输送的装置和方法 Download PDFInfo
- Publication number
- CN1983547A CN1983547A CNA2006101470955A CN200610147095A CN1983547A CN 1983547 A CN1983547 A CN 1983547A CN A2006101470955 A CNA2006101470955 A CN A2006101470955A CN 200610147095 A CN200610147095 A CN 200610147095A CN 1983547 A CN1983547 A CN 1983547A
- Authority
- CN
- China
- Prior art keywords
- wafer case
- compartment
- trailer
- manufacturing facility
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims abstract description 9
- 238000003860 storage Methods 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000000977 initiatory effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/164,793 US20070128010A1 (en) | 2005-12-06 | 2005-12-06 | An apparatus for pod transportation within a semiconductor fabrication facility |
US11/164,793 | 2005-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1983547A true CN1983547A (zh) | 2007-06-20 |
CN100501962C CN100501962C (zh) | 2009-06-17 |
Family
ID=38118927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101470955A Expired - Fee Related CN100501962C (zh) | 2005-12-06 | 2006-11-14 | 用于半导体制造设备内的晶片盒输送的装置和方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070128010A1 (zh) |
CN (1) | CN100501962C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752284B (zh) * | 2008-12-08 | 2011-11-09 | 台湾积体电路制造股份有限公司 | 具有便携式储存器的自动化物料搬运***及其操作方法 |
CN101648186B (zh) * | 2008-08-12 | 2013-05-15 | 中茂电子(深圳)有限公司 | 具承载装置搬移装置的太阳能晶圆分类*** |
CN103295944A (zh) * | 2012-02-22 | 2013-09-11 | 三星电子株式会社 | 载体传输器以及利用其传输基板载体的方法 |
TWI634384B (zh) * | 2017-04-26 | 2018-09-01 | 台灣積體電路製造股份有限公司 | 傳送盒與半導體製程元件傳輸系統 |
CN108807245A (zh) * | 2017-04-26 | 2018-11-13 | 台湾积体电路制造股份有限公司 | 传送盒与半导体制程元件传输*** |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7591624B2 (en) * | 2006-01-09 | 2009-09-22 | International Business Machines Corporation | Reticle storage pod (RSP) transport system utilizing FOUP adapter plate |
JP2008195471A (ja) * | 2007-02-09 | 2008-08-28 | Daifuku Co Ltd | 物品搬送設備 |
US8047756B2 (en) * | 2008-04-04 | 2011-11-01 | Savant Automation, Inc. | Automatic load transfer device and method for automated material handling systems |
TWI560125B (en) * | 2013-10-15 | 2016-12-01 | Inotera Memories Inc | Overhead hoist transport system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3066615A (en) * | 1960-09-02 | 1962-12-04 | Expl Pour Le Transp Continu Pa | Self-propelled train for semi-continuous conveyor systems |
US3784028A (en) * | 1972-06-09 | 1974-01-08 | Dresser Ind | Gantry crane |
KR0167881B1 (ko) * | 1994-11-28 | 1999-02-01 | 김주용 | 웨이퍼 반송 시스템 및 그 제어방법 |
TW348162B (en) * | 1996-09-30 | 1998-12-21 | Murada Kikai Kk | Work carrying system |
JPH1159829A (ja) * | 1997-08-08 | 1999-03-02 | Mitsubishi Electric Corp | 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法 |
CN1156389C (zh) * | 1999-12-02 | 2004-07-07 | 阿西斯特技术公司 | 在接口容器和分配盒间传送工件载运器的传送机构和方法 |
KR100729986B1 (ko) * | 1999-12-20 | 2007-06-20 | 아시스트 신꼬, 인코포레이티드 | 자동반송시스템 |
US6364593B1 (en) * | 2000-06-06 | 2002-04-02 | Brooks Automation | Material transport system |
US6450318B1 (en) * | 2000-06-16 | 2002-09-17 | Tec Engineering Corporation | Overhead monorail system |
EP1202325A1 (en) * | 2000-10-25 | 2002-05-02 | Semiconductor300 GmbH & Co KG | Arrangement for transporting a semiconductor wafer carrier |
US6748282B2 (en) * | 2002-08-22 | 2004-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd | Flexible dispatching system and method for coordinating between a manual automated dispatching mode |
US6663340B1 (en) * | 2002-08-30 | 2003-12-16 | Motorola, Inc. | Wafer carrier transport system for tool bays |
FI20031259A (fi) * | 2003-09-04 | 2005-03-05 | Fastems Oy Ab | Usean hyllystöhissin järjestelmä ja menetelmä sen ohjaamiseksi |
JP2006096427A (ja) * | 2004-09-28 | 2006-04-13 | Murata Mach Ltd | 物品保管設備 |
-
2005
- 2005-12-06 US US11/164,793 patent/US20070128010A1/en not_active Abandoned
-
2006
- 2006-11-14 CN CNB2006101470955A patent/CN100501962C/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101648186B (zh) * | 2008-08-12 | 2013-05-15 | 中茂电子(深圳)有限公司 | 具承载装置搬移装置的太阳能晶圆分类*** |
CN101752284B (zh) * | 2008-12-08 | 2011-11-09 | 台湾积体电路制造股份有限公司 | 具有便携式储存器的自动化物料搬运***及其操作方法 |
CN103295944A (zh) * | 2012-02-22 | 2013-09-11 | 三星电子株式会社 | 载体传输器以及利用其传输基板载体的方法 |
TWI634384B (zh) * | 2017-04-26 | 2018-09-01 | 台灣積體電路製造股份有限公司 | 傳送盒與半導體製程元件傳輸系統 |
CN108807245A (zh) * | 2017-04-26 | 2018-11-13 | 台湾积体电路制造股份有限公司 | 传送盒与半导体制程元件传输*** |
CN108807245B (zh) * | 2017-04-26 | 2021-03-26 | 台湾积体电路制造股份有限公司 | 传送盒与半导体制程元件传输*** |
Also Published As
Publication number | Publication date |
---|---|
CN100501962C (zh) | 2009-06-17 |
US20070128010A1 (en) | 2007-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100501962C (zh) | 用于半导体制造设备内的晶片盒输送的装置和方法 | |
US9659801B2 (en) | High efficiency buffer stocker | |
US6643558B2 (en) | Installation for processing wafers | |
US10029338B2 (en) | Machine and cell for the assembly of valve seats and guides | |
TW201022113A (en) | A system with portable stocker and method thereof | |
CN105575853B (zh) | 基板处理***和基板处理装置的时效方法 | |
JP5454455B2 (ja) | 基板搬送装置、基板搬送方法及び記憶媒体 | |
US6283695B1 (en) | Tray conveying apparatus and method | |
CN101373723A (zh) | 用于键合装置的电子器件处理器 | |
JP2004515913A (ja) | 複数のマスクコンテナを含む組立体 | |
CN218859436U (zh) | 花篮收料机 | |
US6817602B2 (en) | Manufacturing system method for processing a lithography mask container | |
CN109081069B (zh) | 一种运料方法 | |
JP2005203498A (ja) | ウエハストッカ、半導体装置の搬送システムおよび搬送方法 | |
US8219242B2 (en) | Automated material handling system and method | |
US9145271B2 (en) | Optimization of conveyor belts used for workpiece processing | |
JPS60153307A (ja) | プリント板給排装置 | |
US20070160448A1 (en) | Receipt and delivery control system for front opening unified and reticle storage pods | |
CN208637397U (zh) | 传送半导体基板的工作站 | |
CN108605431A (zh) | 元件封装设备及其方法 | |
WO2024146425A1 (zh) | 分拣设备、柔性生产***、柔性生产方法及存储介质 | |
CN115458454A (zh) | 用于集成电路立式炉设备的晶圆传输方法及装置 | |
CA2646628A1 (en) | Linear machine for processing portable objects and method for processing portable objects | |
CN109081064B (zh) | 一种加工***及运料方法 | |
JP2013165177A (ja) | ストッカー装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: IBM (CHINA) CO., LTD. Free format text: FORMER OWNER: INTERNATIONAL BUSINESS MACHINES CORPORATION Effective date: 20121024 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121024 Address after: Pudong New Area Zhang Jiang high tech Park Keyuan Road 201203 Shanghai city 3 Transfer Certificate No. 99 Zhang Jiang Innovation Park 10 Building 7 layer Patentee after: International Business Machines (China) Co., Ltd. Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20171114 |