CN1979308A - Systems for displaying images and liquid crystal display modules - Google Patents
Systems for displaying images and liquid crystal display modules Download PDFInfo
- Publication number
- CN1979308A CN1979308A CN 200610162026 CN200610162026A CN1979308A CN 1979308 A CN1979308 A CN 1979308A CN 200610162026 CN200610162026 CN 200610162026 CN 200610162026 A CN200610162026 A CN 200610162026A CN 1979308 A CN1979308 A CN 1979308A
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- heat
- image display
- display system
- conductor
- circuit board
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Abstract
Systems for displaying images are provided. An embodiment of a system comprises a liquid crystal display module, and the liquid crystal display module comprises a backlight assembly. The backlight module primarily includes a circuit board and at least an LED disposed on a first planar side of the circuit board. The circuit board comprises at least a hole and a heat conductor extending through the hole. Heat from the LED on the first planar side is dissipated to a second planar side of the circuit board by the heat conductor through the hole.
Description
Technical field
The present invention relates to a kind of LCD Technology, particularly a kind of image display system of promoting radiating efficiency.
Background technology
Along with semiconductor and flat-panel screens improvement of Manufacturing Technology, traditional cathode ray tube (CRT) display flat-panel screens little by volume gradually and low radiation replaces (for example LCD).In traditional LCD, mostly utilize fluorescent tube as backlight, yet fluorescent tube often have the problem that volume is excessive and serviceable life is short.
For effective utilization and the life-span that promotes backlight, also have at present and utilize volume is less and weight is lighter light emitting diode as Backlight For Liquid Crystal Display Panels, yet because variation of temperature can have a strong impact on the brightness and the serviceable life of light emitting diode, thus the heat radiation of the backlight beginning become important problem.
Summary of the invention
The invention provides a kind of image display system, comprise LCD MODULE, and above-mentioned LCD MODULE comprises back-light mechanism.Above-mentioned back-light mechanism couples LCD MODULE, and has circuit board and light emitting diode.The foregoing circuit plate has first, second, conductor and at least one connecting hole, and wherein connecting hole connects first and second.Above-mentioned conductor extends to first by second through connecting hole.Above-mentioned light emitting diode is arranged at first, and wherein the heat energy that light emitting diode produced is passed to second by first through conductor.
In a preferred embodiment, aforementioned back-light mechanism comprises a plurality of light emitting diodes, and the aforementioned circuit plate has a plurality of connecting holes, and aforementioned connecting hole is between aforementioned light emitting diode.
In a preferred embodiment, aforementioned conductor electricity connects aforementioned light emitting diode.
In a preferred embodiment, aforementioned conductor forms a part of circuit on the circuit board.
In a preferred embodiment, aforementioned conductor contains copper.
In a preferred embodiment, aforementioned image display system more comprises heat-conductive assembly, the conductor on connecting second.
In a preferred embodiment, aforementioned heat-conductive assembly have at least pottery, resin material or heat-conducting glue one of them.
In a preferred embodiment, aforementioned back-light mechanism has more housing, connects heat-conductive assembly, makes heat energy be passed to housing via heat-conductive assembly.
In a preferred embodiment, aforementioned housing contains copper or aluminium.
In a preferred embodiment, aforementioned heat-conductive assembly has heat-conducting layer and two electric insulation layers, and above-mentioned heat-conducting layer is between two electric insulation layers.
In a preferred embodiment, the aforementioned electric insulation course contains silicon.
In a preferred embodiment, aforementioned heat-conducting layer contains metal material.
In a preferred embodiment, aforementioned heat-conducting layer contains stupalith.
In a preferred embodiment, the diameter of aforementioned connecting hole is at least 0.3mm.
In a preferred embodiment, the aforementioned circuit plate has a plurality of connecting holes, and between the above-mentioned connecting hole at least at a distance of 0.3mm.
In a preferred embodiment, aforementioned image display system comprises LCD and controller, above-mentioned LCD comprises the foregoing liquid crystal display module, and above-mentioned controller couples the foregoing liquid crystal display, in order to the control LCD MODULE according to view data and output image.
In a preferred embodiment, aforementioned image display system comprises electronic installation, and above-mentioned electronic installation comprises the foregoing liquid crystal display.
In a preferred embodiment, aforementioned electronic is mobile computer, mobile phone, digital camera, PDA, desktop PC, TV, automobile-used display or Portable DVD player.
The present invention more provides a kind of LCD MODULE, comprises back-light mechanism.Above-mentioned back-light mechanism couples the foregoing liquid crystal display module, comprises a plurality of light emitting diodes and circuit board.Aforementioned light emitting diode is adopted the linear fashion arrangement and is connected with circuit board.The aforementioned circuit plate has first, second, conductor and a plurality of connecting hole that is arranged, aforementioned connecting hole is between light emitting diode, and connect aforementioned first and second, aforementioned conductor has high heat conductance and fills up aforementioned connecting hole, wherein conductor does not connect any electronic package on first, and heat energy can be conducted to second by first through connecting hole.
Description of drawings
Fig. 1 represents the synoptic diagram of LCD MODULE among the present invention;
In Fig. 2 presentation graphs 1 along the sectional view of A-A ';
Fig. 3 represents that back-light mechanism is along the side view of Y direction among the present invention;
In Fig. 4 presentation graphs 3 along the sectional view of B-B ';
In Fig. 5 presentation graphs 4 along the sectional view of C-C '; And
Fig. 6 represents the synoptic diagram of image display system among the present invention.
Reference numeral
Terminal 41 light guide plate 50
First 101 second 102
Connecting hole H conductor M
Back-light mechanism 300 LCD 400
Controller 500 electronic installations 600
Embodiment
The present invention mainly provides a kind of image display system, and it comprises LCD MODULE 100 as shown in Figure 1.Above-mentioned LCD MODULE 100 comprises display panels 200 and back-light mechanism 300, wherein back-light mechanism 300 is adjacent to display panels 200 downside surfaces, see through back-light mechanism 300 and can launch light, present digital picture thus to display panels 200.
See also Fig. 1,2, aforementioned back-light mechanism 300 mainly comprises circuit board 10, heat-conductive assembly 20, housing 30, at least one light emitting diode 40 and light guide plate 50, and wherein light emitting diode 40 can take straight line or matrix-style to arrange (as shown in Figure 1).In the present embodiment, aforementioned heat-conductive assembly 20 is connected between circuit board 40 and the housing 30,50 of aforementioned light guide plate are fixed in (as shown in Figure 2) on the housing 30, this UV light-emitting diode 40 is arranged on first 101 of circuit board 10, launches light into thus in the light guide plate 50 (shown in the arrow among Fig. 2).
Because the heat energy that light emitting diode 40 is produced can be accumulated between circuit board 10 and the light guide plate 50, therefore the present invention is by between circuit board 40 and housing 30 heat-conductive assembly 20 being set, be beneficial to heat energy promptly is passed to outside housing 30 (for example heat sink of copper or aluminum) by circuit board 40, to prevent that back-light mechanism 300 is because of overheated its usefulness that influences.
Then see also Fig. 3,4, aforementioned circuit plate 10 has a plurality of connecting hole H (as shown in Figure 3) that are arranged, above-mentioned connecting hole H penetrates circuit board 10 and first 101 and second 102 of conductings (as shown in Figure 4), and wherein second 102 in contrast to first 101.In particular, a plurality of conductor M (for example metal) are laid on second 102 of circuit board 10, and be connected with aforementioned heat-conductive assembly 20 (as shown in Figure 4).
Please continue to consult Fig. 3,4, aforementioned connecting hole H is between adjacent light emitting diode 40, and in a preferred embodiment, connecting hole H diameter is at least 0.3mm, between the connecting hole H then at least at a distance of 0.3mm.In particular, aforementioned conductor M fills up aforementioned connecting hole H and by second 102 first 101 (as shown in Figure 4) that extends to circuit board 10 of circuit board 10.Because conductor M in the present embodiment adopts the material with high heat conductance, so the heat energy that light emitting diode 40 produced can promptly be passed to second 102 by first 101 process conductor M of circuit board 10.What need to specify is, aforementioned conductor M passes connecting hole H and is exposed to first 101 of circuit board 10, and the end that is exposed to first 101 conductor M does not connect any other electronic package (for example electric capacity, chip etc.); That is the conductor in the connecting hole H is only in order to first 101 thermal energy conduction to the second 102 on the circuit board 10.Further, the conductor M that is exposed on first 101 also can be connected with other heat conductor (not shown), to promote radiating efficiency.
In the present embodiment, aforementioned each conductor M (conductive plate for example made of copper) but the also a part of circuit on the forming circuit plate 10 for example can connect the terminal 41 (as shown in Figure 4) of two adjacent light emitting diodes 40 in order to electricity; Yet aforementioned conductor M also can not be connected with light emitting diode 40 and only as the usefulness of heat radiation.See also the 5th figure again, be connected with heat-conductive assembly 20, so can help to promote the radiating efficiency of back-light mechanism 300 because aforementioned conductor M sees through bigger surface of contact at second 102 of circuit board 10.
In addition, aforementioned heat-conductive assembly 20 can adopt heat-conducting glue, pottery or the resin material with high heat conductance, promptly heat energy is passed to housing 30 by circuit board 10 thus.In a preferred embodiment, aforementioned heat-conductive assembly 20 has the characteristic of electrical isolation more simultaneously, and isolated aforementioned circuit plate 10 of electricity and housing 30 (for example being metal material) are to avoid short circuit thus.For example, aforementioned heat-conductive assembly 20 can be coincided by three layer structures with high heat conductance and form, wherein the superiors and orlop structure are electric insulation layer (for example being silicon materials), thus that circuit board 10 and housing 30 electricity are isolated, the heat-conducting layer of position in the middle of two electric insulation layers then can adopt metal or stupalith in addition, to promote heat conduction efficiency.
Then see also Fig. 6, the figure shows the synoptic diagram of image display system.Image display system in the present invention can be realized the purpose that image is exported by LCD 400 or by the electronic installation 600 that comprises this LCD 400, and wherein aforementioned electronic 600 for example is mobile computer, mobile phone, digital camera, PDA, desktop PC, TV, automobile-used display or Portable DVD player.As shown in Figure 6, aforementioned electronic 600 more comprises controller 500, wherein stating controller 500 couples with LCD 400, and see through controller 500 and can transmit input signal (view data) or control signal to LCD 400 (comprising LCD MODULE 100), in order to control foregoing liquid crystal display module 100 according to this view data and output image.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to qualification the present invention, those skilled in the art, without departing from the spirit and scope of the invention; when can doing a little change and retouching, so protection scope of the present invention is when by being as the criterion that claim defined.
Claims (10)
1. image display system comprises:
LCD MODULE comprises:
Back-light mechanism couples this LCD MODULE, comprising:
Circuit board has first, second, conductor and at least one connecting hole, and wherein this connecting hole connects this first and this second, and this conductor extends to this first by this second this connecting hole of process; And
Light emitting diode is arranged at this first, and wherein the heat energy that this light emitting diode produced is passed to this second by this first this conductor of process.
2. image display system as claimed in claim 1, wherein this back-light mechanism comprises a plurality of light emitting diodes, this circuit board has a plurality of connecting holes, and described a plurality of connecting hole is between described a plurality of light emitting diodes.
3. image display system as claimed in claim 2, wherein this conductor electricity connects described a plurality of light emitting diode.
4. image display system as claimed in claim 1, wherein this conductor forms a part of circuit on this circuit board.
5. image display system as claimed in claim 1, wherein this image display system more comprises heat-conductive assembly, connects this conductor on this second.
6. image display system as claimed in claim 1, wherein this heat-conductive assembly have at least pottery, resin material or heat-conducting glue one of them.
7. image display system as claimed in claim 6, wherein this back-light mechanism has more housing, connects this heat-conductive assembly, makes heat energy be passed to this housing via this heat-conductive assembly.
8. image display system as claimed in claim 1, wherein this heat-conductive assembly has heat-conducting layer and two electric insulation layers, and this heat-conducting layer is between described a plurality of electric insulation layers.
9. image display system as claimed in claim 8, wherein this electric insulation layer contains silicon.
10. image display system as claimed in claim 8, wherein this heat-conducting layer contains metal material or stupalith.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74881405P | 2005-12-08 | 2005-12-08 | |
| US60/748,814 | 2005-12-08 | ||
| US11/508,056 | 2006-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979308A true CN1979308A (en) | 2007-06-13 |
| CN100538473C CN100538473C (en) | 2009-09-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101620261A Expired - Fee Related CN100538473C (en) | 2005-12-08 | 2006-12-08 | Image display system and LCD MODULE thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100538473C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010130212A1 (en) * | 2009-05-14 | 2010-11-18 | 浙江西子光电科技有限公司 | Led illuminator and led module |
| CN102023410A (en) * | 2009-09-11 | 2011-04-20 | 日立民用电子株式会社 | Liquid crystal display device |
| CN102661554A (en) * | 2012-02-10 | 2012-09-12 | 友达光电股份有限公司 | Backlight module and heat dissipation design thereof |
| CN102954398A (en) * | 2011-08-24 | 2013-03-06 | Lg伊诺特有限公司 | Light emitting module and backlight unit having the same |
| CN103003620A (en) * | 2010-06-30 | 2013-03-27 | 夏普株式会社 | Lighting apparatus and image display apparatus provided therewith |
| CN103216766A (en) * | 2012-01-18 | 2013-07-24 | G&Cs株式会社 | Backlight assembly and display device including the same |
| CN103574400A (en) * | 2012-08-06 | 2014-02-12 | 三星显示有限公司 | Light source module and backlight assembly having same |
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN107155054A (en) * | 2017-06-30 | 2017-09-12 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
-
2006
- 2006-12-08 CN CNB2006101620261A patent/CN100538473C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010130212A1 (en) * | 2009-05-14 | 2010-11-18 | 浙江西子光电科技有限公司 | Led illuminator and led module |
| CN102023410A (en) * | 2009-09-11 | 2011-04-20 | 日立民用电子株式会社 | Liquid crystal display device |
| CN103003620A (en) * | 2010-06-30 | 2013-03-27 | 夏普株式会社 | Lighting apparatus and image display apparatus provided therewith |
| CN102954398A (en) * | 2011-08-24 | 2013-03-06 | Lg伊诺特有限公司 | Light emitting module and backlight unit having the same |
| CN103216766A (en) * | 2012-01-18 | 2013-07-24 | G&Cs株式会社 | Backlight assembly and display device including the same |
| CN102661554A (en) * | 2012-02-10 | 2012-09-12 | 友达光电股份有限公司 | Backlight module and heat dissipation design thereof |
| CN102661554B (en) * | 2012-02-10 | 2014-03-05 | 友达光电股份有限公司 | Backlight module and heat dissipation design thereof |
| US8919985B2 (en) | 2012-02-10 | 2014-12-30 | Au Optronics Corporation | Backlight module and thermal design thereof |
| CN103574400A (en) * | 2012-08-06 | 2014-02-12 | 三星显示有限公司 | Light source module and backlight assembly having same |
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN107155054A (en) * | 2017-06-30 | 2017-09-12 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107155054B (en) * | 2017-06-30 | 2019-08-09 | Oppo广东移动通信有限公司 | Imaging device component and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100538473C (en) | 2009-09-09 |
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Granted publication date: 20090909 Termination date: 20181208 |