CN107155054A - Imaging device component and electronic installation - Google Patents
Imaging device component and electronic installation Download PDFInfo
- Publication number
- CN107155054A CN107155054A CN201710520035.1A CN201710520035A CN107155054A CN 107155054 A CN107155054 A CN 107155054A CN 201710520035 A CN201710520035 A CN 201710520035A CN 107155054 A CN107155054 A CN 107155054A
- Authority
- CN
- China
- Prior art keywords
- imaging device
- face
- sheet
- shell
- device component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of imaging device component and electronic installation.Imaging device component includes mounting shell, imaging device, electric conductor and fin.Mounting shell includes substrate, and substrate includes shooting installation sheet and with imaging the spaced connection sheet of installation sheet, and shooting installation sheet and connection sheet are metal sheet, and shooting installation sheet includes the first face and the second face opposite to each other.Imaging device is arranged on the first face, and imaging device is electrically connected with the first face.Electric conductor connects the second face and connection sheet, so that imaging device is grounded.Fin connects the second face and connection sheet, and fin is connected the second face with electric conductor side by side.In above-mentioned imaging device component and electronic installation, fin can reduce the heat for the outer surface for passing to electronic installation by installation sheet by imaging device, improve Consumer's Experience.In addition, electric conductor causes imaging device to be grounded, it is to avoid imaging device produces electrostatic and influences the antenna normal transmission of electronic installation and receive signal.
Description
Technical field
The present invention relates to field of terminal, more particularly to a kind of imaging device component and electronic installation.
Background technology
Mobile phone etc. have shoot function electronic installation in, camera produce heat concentrate so that electronic installation with
The temperature of the corresponding outer surface of camera is higher, influences Consumer's Experience.In addition, camera easily produces electrostatic and influences mobile phone
Antenna normal transmission and reception signal.
The content of the invention
The present invention provides a kind of imaging device component and electronic installation.
The imaging device component of embodiment of the present invention includes mounting shell, imaging device, electric conductor and fin.The peace
Fill shell include substrate, the substrate include shooting installation sheet and with it is described shooting the spaced connection sheet of installation sheet, it is described to take the photograph
As installation sheet and the connection sheet are metal sheet, the shooting installation sheet includes opposite the first face and the second face.Imaging
Device is arranged on first face, and the imaging device is electrically connected with first face.The electric conductor connects second face
And the connection sheet, so that the imaging device is grounded.The fin connects second face and the connection sheet, described to dissipate
Backing is connected second face side by side with the electric conductor.
In some embodiments, the size of the shooting installation sheet is less than the size of the connection sheet, the shooting peace
Load is located at the corner location of the substrate, and the connection sheet is located at the centre position of the substrate.
In some embodiments, in the form of sheets, the electric conductor passes through welding to the electric conductor with the shooting installation sheet
Mode be fixedly connected.
In some embodiments, the fin is graphite flake or graphene film.
In some embodiments, the imaging device includes：
Shell, the shell is electrically connected with first face；With
It is contained in the camera module in the shell.
In some embodiments, the shell includes the side plate that bottom plate and the edge from the bottom plate extend, the bottom
Plate is oppositely arranged with first face, and the side plate is fixedly connected with the camera module.
In some embodiments, the imaging device includes being arranged on the electricity on the bottom plate and in the shell
Road plate, the camera module includes：
It is arranged on the imaging sensor on the circuit board；
It is arranged on the camera lens above described image sensor；With
Voice coil motor, the camera lens is arranged in the voice coil motor.
In some embodiments, the imaging device includes connecting the circuit board and reached soft outside the shell
Property circuit board.
In some embodiments, the imaging device includes the connector being arranged on the flexible PCB.
The electronic installation of embodiment of the present invention includes the imaging device component and display screen of any of the above embodiment.It is aobvious
Display screen is arranged on mounting shell, and the display screen and the imaging device are located at the opposite both sides of the mounting shell respectively.
In the imaging device component and electronic installation of embodiment of the present invention, fin can pass to the heat of installation sheet
Other positions, so as to reduce the heat for the outer surface for passing to electronic installation by installation sheet by imaging device, it is to avoid electronics
The temperature of device outer surface corresponding with imaging device is too high, improves Consumer's Experience.In addition, electric conductor causes imaging device to connect
Ground, it is to avoid imaging device produces electrostatic and influences the antenna normal transmission of electronic installation and receive signal.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the imaging device component of embodiment of the present invention；
Fig. 2 is another floor map of the imaging device component of embodiment of the present invention；
Fig. 3 is the diagrammatic cross-section of the electronic installation of embodiment of the present invention；
Fig. 4 is the front schematic view of the electronic installation of embodiment of the present invention；
Fig. 5 is the side schematic view of the electronic installation of embodiment of the present invention.
Main element symbol description：
Imaging device 100；
Shell 10, bottom plate 11, side plate 12, camera module 20, imaging sensor 21, camera lens 22, voice coil motor 23, circuit board
30th, flexible PCB 40, connector 50；
Imaging device component 200, mounting shell 210, substrate 211, shooting installation sheet 2111, connection sheet 2112, the first face
2113rd, the second face 2114, side wall 212, electric conductor 220, fin 230；
Electronic installation 300, display screen 310, receiver 320.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Also referring to Fig. 1-Fig. 3, the imaging device component 200 of embodiment of the present invention includes mounting shell 210, imaging dress
Put 100, electric conductor 220 and fin 230.Mounting shell 210 includes substrate 211, and substrate 211 includes shooting installation sheet 2111 and connected
Contact pin 2112, connection sheet 2112 is arranged at intervals with shooting installation sheet 2111.
It is metal sheet that installation sheet 2111, which is imaged, with connection sheet 2112, and shooting installation sheet 2111 includes the first opposite face
2113 and second face 2114.Imaging device 100 is arranged on the first face 2113, and imaging device 100 is electrically connected with the first face 2113.
Electric conductor 220 connects the second face 2114 and connection sheet 2112, so that imaging device 100 is grounded.Fin 230 is connected
Second face 2114 and connection sheet 2112, fin 230 are connected the second face 2114 side by side with electric conductor 220.
In the imaging device component 200 of embodiment of the present invention, fin 230 can will image the heat of installation sheet 2111
Other positions are passed to, so as to reduce the appearance for passing to electronic installation 300 by imaging installation sheet 2111 by imaging device 100
The heat in face, it is to avoid electronic installation 300 and the temperature of the corresponding outer surface of imaging device 100 are too high, improve Consumer's Experience.Separately
Outside, electric conductor 220 causes imaging device 100 to be grounded, it is to avoid imaging device 100 produces electrostatic and influences the day of electronic installation 300
Line normal transmission and reception signal.
Specifically, substrate 211 can be made up of embedding and injection molding moulding process.For example, can first will shooting installation sheet 2111 and
Connection sheet 2112 is put into mould, and the plastics of melting are then injected into mould so that plastics surround shooting installation sheet 2111 and connected
Contact pin 2112, after after plastics solidification, obtaining substrate 211, substrate 211 is structure as a whole.Image the material of installation sheet 2111 for example
For stainless steel, the material of connection sheet 2112 is, for example, magnesium alloy.
Connection sheet 2112 is equivalent to earth polar, and when the formation electrostatic of imaging device 100, imaging device 100 can be pacified by imaging
Load 2111 and electric conductor 220 are by static guiding to connection sheet 2112.Imaging device 100 can be contacted to be electrically connected with the first face 2113
The first face 2113 is connect, can also connect the first face 2113 to electrically connect the first face 2113 by conductive material.For example, imaging device
100 can pass through conductive the first face of gemel connection 2113.
Imaging device 100 can produce heat in the course of work, and heat is easily passed on shooting installation sheet 2111, fin
230 can lead the heat for imaging installation sheet 2111 in connection sheet 2112, it is to avoid the heat of shooting installation sheet 2111 is concentrated, temperature
Rise excessive.
It is preferred that the area that shooting installation sheet 2111 is connected with fin 230 is more than shooting installation sheet 2111 and electric conductor
The area of 220 connections, so that the heat of shooting installation sheet 2111 can pass to connection sheet 2112 quickly, and is not interfered with into
As the ground connection performance of device 100.
Incorporated by reference to Fig. 4 and Fig. 5, above-mentioned imaging device component 200 may apply in electronic installation 300, electronic installation 300
For example, mobile phone, tablet personal computer etc. have the terminal of shoot function.In present embodiment, electronic installation 300 includes imaging device
Component 200 and display screen 310.Display screen 310 is arranged on mounting shell 210, and display screen 310 is located at respectively with imaging device 100
The opposite both sides of mounting shell 210.Therefore, in present embodiment, imaging device 100 is rearmounted imaging device.
Because the heat that imaging device 100 is produced by imaging installation sheet 2111 passes to connection sheet 2112, therefore, with shooting
The temperature of the outer surface of the corresponding electronic installation 300 of installation sheet 2111 is relatively low, is conducive to Consumer's Experience.For example, electronic installation 300
Including receiver 320, receiver 320 is set close to imaging device 100.User enters immediately after the completion of the shooting of imaging device 100
During row voice call, display screen 310 is towards user, and the ear of user can be attached to by receiver 320, due to electronic installation 300
Hull-skin temperature is relatively low, and user can carry out extended telephone conversation, it is ensured that speech quality.
In present embodiment, mounting shell 210 is the center of electronic installation 300.It is, therefore, to be understood that electronic installation 300
The elements such as battery, main circuit board are installed on mounting shell 210.Mounting shell 210 also includes the side extended from the edge of substrate 211
Wall 212, side wall 212 make it that the elements such as the bonnet and side switch of electronic installation 300 are easy for installation.
Referring to Fig. 1-Fig. 3, in some embodiments, the size of shooting installation sheet 2111 is less than connection sheet 2112
Size, shooting installation sheet 2111 be located at substrate 211 corner location, connection sheet 2112 be located at substrate 211 centre position.
In this way, the position of shooting installation sheet 2111 is conducive to installing imaging device 100, it is to avoid imaging device 100 and electronics
Other parts interference of device 300.The centre position that connection sheet 2112 is located at substrate 211 allows connection sheet 2112 to be electricity
The isometric larger parts of main circuit board, battery of sub-device 100 provide support.
In some embodiments, in the form of sheets, electric conductor 220 passes through welding to electric conductor 220 with shooting installation sheet 2111
Mode is fixedly connected.
For example, the material of electric conductor 220 and shooting installation sheet 2111 is stainless steel, so that electric conductor 220 is with taking the photograph
As installation sheet 2111 can weld together.So make it that the connection between electric conductor 220 and shooting installation sheet 2111 is more steady
It is fixed, reliable.
In some embodiments, fin 230 is graphite flake or graphene film.Fin 230 can so be improved
Heat transfer efficiency, so that the heat for imaging installation sheet 2111 rapidly can be transmitted in connection sheet 2112 by fin 230.
In one example, fin 230 can be adhesively fixed by colloid with shooting installation sheet 2111 and connection sheet 2112
Together.
In some embodiments, imaging device 100 includes shell 10 and camera module 20.The face 2113 of shell 10 and first
Electrical connection.Camera module 20 is contained in shell 10.
In this way, imaging device 100 is grounded by shell 10 so that imaging device 100 and the first face 2113 are easy to connect.Separately
Outside, shell 10 easily forms electrostatic, and the ground connection of shell 10 is conducive on the static guiding of shell 10 to connection sheet 2112.
In some embodiments, shell 10 includes the side plate 12 that bottom plate 11 and the edge from bottom plate 11 extend, bottom plate 11
It is oppositely arranged with the first face 2113, side plate 12 is fixedly connected with camera module 20.
For example, camera module 20 and side plate 12 can the mode such as or welding Nian Jie by viscose glue be fixed together, therefore, outside
Shell 10 can reduce the impact that camera module 20 is subject to, it is to avoid the optical axis of camera module 20 is inclined when imaging device 100 falls
Move, to ensure that camera module 20 can normally work.
In some embodiments, imaging device 100 includes being arranged on the circuit board on bottom plate 11 and in shell 10
30 (Printed Circuit Board, PCB), camera module 20 includes imaging sensor 21, camera lens 22 and voice coil motor 23.
Imaging sensor 21 is arranged on circuit board 30.Camera lens 22 is arranged on the top of imaging sensor 21 and is arranged on voice coil motor 23
In.
In this way, imaging sensor 21 can sense the light outside camera module 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferably image.Voice coil motor 23
Optical axis direction of the camera lens 22 along camera lens 22 can be driven to move to adjust the distance between camera lens 22 and imaging sensor 21, and then
The auto-focusing of camera module 20 is realized, so that camera module 20 obtains quality preferably image.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device,
CCD) CIS.Imaging sensor 21 can operationally produce substantial amounts of heat, and heat is passed on circuit board 30, then led to
Oversampling circuit plate 30 is passed on shell 10.Because shell 10 is spaced with mounting shell 210, so that heat is difficult to pass to mounting shell
On 210.
In some embodiments, imaging device 100 includes flexible PCB 40, the connection circuit board 30 of flexible PCB 40
And reach outside shell 10.
In this way, flexible PCB 40 can cause imaging device 100 to realize data transfer with outer member.For example, image
The picture signal of acquisition by flexible PCB 40 can be transferred to outer member (such as processor) by sensor 21, outside member
Part after picture signal processing to that can obtain external image.And for example, external element can control image by flexible PCB 40
Sensor 21 is photosensitive to obtain external image.
Shell 10 can offer the perforate passed through for flexible PCB 40, so that flexible PCB 40 reaches shell 10
Outside.
Can be set on flexible PCB 40 has connector 50, and connector 50 may be connected to the main circuit board of electronic installation 300
On, so that imaging device 100 can realize data transfer with outer member.For example, on the main circuit board of electronic installation 300
Be provided with the corresponding connector interface of connector 50, connector 50 be inserted into connector interface can complete connector 50 with it is main
Circuit board is connected.
In some embodiments, circuit board 30 is structure as a whole with flexible PCB 40.For example, circuit board 30 and flexibility
Circuit board 40 is respectively a part for Rigid Flex.Circuit board 30 is the hardboard part of Rigid Flex, flexible PCB 40
For the soft board part of Rigid Flex.
In this way, it is simple in construction between circuit board 30 and flexible PCB 40, and the zero of imaging device 100 can be reduced
The quantity of part, so as to reduce the assembling procedure of imaging device 100, to reduce the assembly cost of imaging device 100.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (10)
1. a kind of imaging device component, it is characterised in that including：
Mounting shell, the mounting shell includes substrate, and the substrate includes shooting installation sheet and set with the shooting installation sheet interval
The connection sheet put, the shooting installation sheet and the connection sheet are metal sheet, and the shooting installation sheet includes opposite the
Simultaneously with the second face；
The imaging device in first face is arranged on, the imaging device is electrically connected with first face；
Electric conductor, the electric conductor connects second face and the connection sheet, so that the imaging device is grounded；
Fin, the fin connects second face and the connection sheet, and the fin and the electric conductor are side by side
Connect second face.
2. imaging device component as claimed in claim 1, it is characterised in that the size of the shooting installation sheet is less than the company
The size of contact pin, the shooting installation sheet is located at the corner location of the substrate, and the connection sheet is located at the centre of the substrate
Position.
3. imaging device component as claimed in claim 1, it is characterised in that the electric conductor in the form of sheets, the electric conductor with
The shooting installation sheet is fixedly connected by way of welding.
4. imaging device component as claimed in claim 1, it is characterised in that the fin is graphite flake or graphene film.
5. imaging device component as claimed in claim 1, it is characterised in that the imaging device includes：
Shell, the shell is electrically connected with first face；With
It is contained in the camera module in the shell.
6. imaging device component as claimed in claim 5, it is characterised in that the shell includes bottom plate and from the bottom plate
The side plate of edge extension, the bottom plate is oppositely arranged with first face, and the side plate is fixedly connected with the camera module.
7. imaging device component as claimed in claim 6, it is characterised in that the imaging device includes being arranged on the bottom plate
Circuit board upper and in the shell, the camera module includes：
It is arranged on the imaging sensor on the circuit board；
It is arranged on the camera lens above described image sensor；With
Voice coil motor, the camera lens is arranged in the voice coil motor.
8. imaging device component as claimed in claim 7, it is characterised in that the imaging device includes connecting the circuit board
And reach the flexible PCB outside the shell.
9. imaging device component as claimed in claim 8, it is characterised in that the imaging device includes being arranged on the flexibility
Connector on circuit board.
10. a kind of electronic installation, it is characterised in that including：
Imaging device component described in claim 1-9 any one；With
The display screen on the mounting shell is arranged on, it is opposite that the display screen is located at the mounting shell with the imaging device respectively
Both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520035.1A CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520035.1A CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107155054A true CN107155054A (en) | 2017-09-12 |
| CN107155054B CN107155054B (en) | 2019-08-09 |
Family
ID=59795443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710520035.1A Active CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107155054B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108377276A (en) * | 2018-01-02 | 2018-08-07 | 信利光电股份有限公司 | A kind of high display terminal for accounting for screen ratio |
| CN110072037A (en) * | 2018-01-23 | 2019-07-30 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
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| CN105050360A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal provided with camera cooling structure and ESD (Electro-Static Discharge) interference resistant structure |
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| US20060198102A1 (en) * | 2005-03-07 | 2006-09-07 | Samsung Electronics Co., Ltd. | Portable apparatus |
| CN1979308A (en) * | 2005-12-08 | 2007-06-13 | 统宝光电股份有限公司 | Systems for displaying images and liquid crystal display modules |
| US20080012436A1 (en) * | 2006-07-13 | 2008-01-17 | Encap Technologies Inc. | Electromagnetic device with encapsulated heat transfer fluid confinement member |
| CN202587091U (en) * | 2012-06-13 | 2012-12-05 | 广东欧珀移动通信有限公司 | Structure for reducing temperature rise of cell phone camera |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108377276A (en) * | 2018-01-02 | 2018-08-07 | 信利光电股份有限公司 | A kind of high display terminal for accounting for screen ratio |
| CN110072037A (en) * | 2018-01-23 | 2019-07-30 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN110072037B (en) * | 2018-01-23 | 2020-09-22 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107155054B (en) | 2019-08-09 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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