CN107155054B - Imaging device component and electronic device - Google Patents
Imaging device component and electronic device Download PDFInfo
- Publication number
- CN107155054B CN107155054B CN201710520035.1A CN201710520035A CN107155054B CN 107155054 B CN107155054 B CN 107155054B CN 201710520035 A CN201710520035 A CN 201710520035A CN 107155054 B CN107155054 B CN 107155054B
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- China
- Prior art keywords
- imaging device
- face
- camera shooting
- sheet
- installation sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of imaging device component and electronic devices.Imaging device component includes mounting shell, imaging device, electric conductor and cooling fin.Mounting shell includes substrate, substrate include camera shooting installation sheet and with the camera shooting spaced connection sheet of installation sheet, camera shooting installation sheet and connection sheet are metal sheet, and camera shooting installation sheet includes opposite the first face and the second face.Imaging device is arranged in the first face, and imaging device is electrically connected with the first face.Electric conductor connects the second face and connection sheet, so that imaging device is grounded.Cooling fin connects the second face and connection sheet, cooling fin connect the second face with electric conductor side by side.In above-mentioned imaging device component and electronic device, cooling fin can reduce the heat for passing to the outer surface of electronic device by installation sheet by imaging device, improve user experience.In addition, electric conductor is grounded imaging device, avoids imaging device from generating electrostatic and influence the antenna normal transmission of electronic device and receive signal.
Description
Technical field
The present invention relates to field of terminal more particularly to a kind of imaging device components and electronic device.
Background technique
Mobile phone etc. have shooting function electronic device in, camera generate heat concentrate so that electronic device with
The temperature of the corresponding outer surface of camera is higher, influences user experience.In addition, camera is easy to produce electrostatic and influences mobile phone
Antenna normal transmission and reception signal.
Summary of the invention
The present invention provides a kind of imaging device component and electronic device.
The imaging device component of embodiment of the present invention includes mounting shell, imaging device, electric conductor and cooling fin.The peace
Fill shell include substrate, the substrate include camera shooting installation sheet and with the spaced connection sheet of the camera shooting installation sheet, it is described to take the photograph
As installation sheet and the connection sheet are metal sheet, the camera shooting installation sheet includes opposite the first face and the second face.Imaging
Device is arranged in first face, and the imaging device is electrically connected with first face.The electric conductor connects second face
And the connection sheet, so that the imaging device is grounded.The cooling fin connects second face and the connection sheet, described to dissipate
Backing connect second face with the electric conductor side by side.
In some embodiments, the size of the camera shooting installation sheet is less than the size of the connection sheet, the camera shooting peace
Load is located at the corner location of the substrate, and the connection sheet is located at the middle position of the substrate.
In some embodiments, in the form of sheets, the electric conductor and the camera shooting installation sheet pass through welding to the electric conductor
Mode be fixedly connected.
In some embodiments, the cooling fin is graphite flake or graphene film.
In some embodiments, the imaging device includes:
Shell, the shell are electrically connected with first face；With
The camera mould group being contained in the shell.
In some embodiments, the shell includes the side plate that bottom plate and the edge from the bottom plate extend, the bottom
Plate is oppositely arranged with first face, and the side plate is fixedly connected with the camera mould group.
In some embodiments, the imaging device includes that the electricity on the bottom plate and being located in the shell is arranged in
Road plate, the camera mould group include:
Imaging sensor on the circuit board is set；
Camera lens above described image sensor is set；With
Voice coil motor, the camera lens are arranged in the voice coil motor.
In some embodiments, the imaging device includes connecting the circuit board and reaching soft outside the shell
Property circuit board.
In some embodiments, the imaging device includes the connector being arranged on the flexible circuit board.
The electronic device of embodiment of the present invention includes the imaging device component and display screen of any of the above embodiment.It is aobvious
Display screen is arranged on mounting shell, the display screen and the imaging device two sides that be located at the mounting shell opposite.
In the imaging device component and electronic device of embodiment of the present invention, cooling fin can be passed to the heat of installation sheet
Other positions avoid electronics so as to reduce the heat for the outer surface for passing to electronic device by installation sheet by imaging device
The temperature of device outer surface corresponding with imaging device is excessively high, improves user experience.In addition, electric conductor connects imaging device
Ground avoids imaging device from generating electrostatic and influences the antenna normal transmission of electronic device and receive signal.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the imaging device component of embodiment of the present invention；
Fig. 2 is another floor map of the imaging device component of embodiment of the present invention；
Fig. 3 is the diagrammatic cross-section of the electronic device of embodiment of the present invention；
Fig. 4 is the front schematic view of the electronic device of embodiment of the present invention；
Fig. 5 is the side schematic view of the electronic device of embodiment of the present invention.
Main element symbol description:
Imaging device 100；
Shell 10, bottom plate 11, side plate 12, camera mould group 20, imaging sensor 21, camera lens 22, voice coil motor 23, circuit board
30, flexible circuit board 40, connector 50；
Imaging device component 200, mounting shell 210, substrate 211, camera shooting installation sheet 2111, connection sheet 2112, the first face
2113, the second face 2114, side wall 212, electric conductor 220, cooling fin 230；
Electronic device 300, display screen 310, receiver 320.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Also referring to Fig. 1-Fig. 3, the imaging device component 200 of embodiment of the present invention includes mounting shell 210, imaging dress
Set 100, electric conductor 220 and cooling fin 230.Mounting shell 210 includes substrate 211, and substrate 211 includes camera shooting installation sheet 2111 and connects
Contact pin 2112, connection sheet 2112 and camera shooting installation sheet 2111 interval are arranged.
It images installation sheet 2111 and connection sheet 2112 is metal sheet, camera shooting installation sheet 2111 includes the first opposite face
2113 and second face 2114.Imaging device 100 is arranged in the first face 2113, and imaging device 100 is electrically connected with the first face 2113.
Electric conductor 220 connects the second face 2114 and connection sheet 2112, so that imaging device 100 is grounded.Cooling fin 230 connects
Second face 2114 and connection sheet 2112, cooling fin 230 connect the second face 2114 with electric conductor 220 side by side.
In the imaging device component 200 of embodiment of the present invention, cooling fin 230 can will image the heat of installation sheet 2111
Other positions are passed to, so as to reduce the appearance for passing to electronic device 300 by imaging installation sheet 2111 by imaging device 100
The heat in face avoids the temperature of the outer surface corresponding with imaging device 100 of electronic device 300 excessively high, improves user experience.Separately
Outside, electric conductor 220 is grounded imaging device 100, avoids imaging device 100 from generating electrostatic and influences the day of electronic device 300
Line normal transmission and reception signal.
Specifically, substrate 211 can be made up of embedding and injection molding moulding process.For example, can first will camera shooting installation sheet 2111 and
Connection sheet 2112 is put into mold, and the plastics of melting are then injected into mold so that plastics surround camera shooting installation sheet 2111 and connect
Contact pin 2112 obtains substrate 211 after plastics solidification, and substrate 211 is structure as a whole.Image the material of installation sheet 2111 for example
For stainless steel, the material of connection sheet 2112 is, for example, magnesium alloy.
Connection sheet 2112 is equivalent to earth polar, and when imaging device 100 forms electrostatic, imaging device 100 can be pacified by camera shooting
Load 2111 and electric conductor 220 are by static guiding to connection sheet 2112.Imaging device 100 can be contacted with the first face 2113 to be electrically connected
The first face 2113 is connect, the first face 2113 can also be connected by conductive material to be electrically connected the first face 2113.For example, imaging device
100 can pass through conductive the first face of glue connection 2113.
Imaging device 100 can produce heat in the course of work, and heat is easy to pass on camera shooting installation sheet 2111, cooling fin
230 can lead the heat for imaging installation sheet 2111 in connection sheet 2112, avoid the heat of camera shooting installation sheet 2111 from concentrating, temperature
It rises excessive.
Preferably, the area that camera shooting installation sheet 2111 is connect with cooling fin 230 is greater than camera shooting installation sheet 2111 and electric conductor
The area of 220 connections so that the heat of camera shooting installation sheet 2111 can pass to connection sheet 2112 quickly, and will not influence into
As the ground connection performance of device 100.
Incorporated by reference to Fig. 4 and Fig. 5, above-mentioned imaging device component 200 be can be applied in electronic device 300, electronic device 300
The for example, terminal with shooting function such as mobile phone, tablet computer.In present embodiment, electronic device 300 includes imaging device
Component 200 and display screen 310.Display screen 310 is arranged on mounting shell 210, and display screen 310 is located at imaging device 100
The opposite two sides of mounting shell 210.Therefore, in present embodiment, imaging device 100 is postposition imaging device.
Since the heat that imaging device 100 generates passes to connection sheet 2112 by imaging installation sheet 2111, with camera shooting
The temperature of the outer surface of the corresponding electronic device 300 of installation sheet 2111 is lower, is conducive to user experience.For example, electronic device 300
Including receiver 320, receiver 320 is arranged close to imaging device 100.User imaging device 100 shoot after the completion of immediately into
When row voice communication, display screen 310 is towards user, and the ear of user can be attached to by receiver 320, due to electronic device 300
Hull-skin temperature is lower, and user can carry out extended telephone conversation, ensure that speech quality.
In present embodiment, mounting shell 210 is the center of electronic device 300.It is, therefore, to be understood that electronic device 300
The elements such as battery, main circuit board are installed on mounting shell 210.Mounting shell 210 further includes the side that the edge of self-reference substrate 211 extends
Wall 212, side wall 212 make the elements such as rear cover and the side switch of electronic device 300 easy for installation.
Referring to Fig. 1-Fig. 3, in some embodiments, the size of camera shooting installation sheet 2111 is less than connection sheet 2112
Size, camera shooting installation sheet 2111 is located at the corner location of substrate 211, and connection sheet 2112 is located at the middle position of substrate 211.
In this way, the position of camera shooting installation sheet 2111 is conducive to install imaging device 100, imaging device 100 and electronics are avoided
Other components of device 300 are interfered.The middle position that connection sheet 2112 is located at substrate 211 allows connection sheet 2112 for electricity
Biggish components provide support to main circuit board, the battery of sub-device 100 in equal volume.
In some embodiments, in the form of sheets, electric conductor 220 and camera shooting installation sheet 2111 pass through welding to electric conductor 220
Mode is fixedly connected.
For example, electric conductor 220 and camera shooting installation sheet 2111 material be stainless steel so that electric conductor 220 with take the photograph
As installation sheet 2111 can weld together.Make electric conductor 220 and the connection imaged between installation sheet 2111 more steady in this way
It is fixed, reliable.
In some embodiments, cooling fin 230 is graphite flake or graphene film.Cooling fin 230 can be improved in this way
Heat transfer efficiency, so that the heat for imaging installation sheet 2111 can be rapidly transmitted in connection sheet 2112 by cooling fin 230.
In one example, cooling fin 230 can be adhesively fixed by colloid and camera shooting installation sheet 2111 and connection sheet 2112
Together.
In some embodiments, imaging device 100 includes shell 10 and camera mould group 20.Shell 10 and the first face 2113
Electrical connection.Camera mould group 20 is contained in shell 10.
In this way, imaging device 100 is grounded by shell 10, so that imaging device 100 and the first face 2113 are easy to connect.Separately
Outside, the electrostatic easy to form of shell 10, the ground connection of shell 10 is conducive to will be on the static guiding of shell 10 to connection sheet 2112.
In some embodiments, shell 10 includes the side plate 12 that bottom plate 11 and the edge from bottom plate 11 extend, bottom plate 11
It is oppositely arranged with the first face 2113, side plate 12 is fixedly connected with camera mould group 20.
It is fixed together for example, camera mould group 20 and side plate 12 such as can be bonded or welded at the modes by viscose glue, therefore, outside
Shell 10 can reduce the impact that camera mould group 20 is subject to, avoid the optical axis of camera mould group 20 inclined when imaging device 100 falls
It moves, to guarantee that camera mould group 20 can normally work.
In some embodiments, imaging device 100 includes the circuit board for being arranged on bottom plate 11 and being located in shell 10
30 (Printed Circuit Board, PCB), camera mould group 20 include imaging sensor 21, camera lens 22 and voice coil motor 23.
Imaging sensor 21 is arranged on circuit board 30.Camera lens 22 is arranged above imaging sensor 21 and is arranged in voice coil motor 23
In.
In this way, imaging sensor 21 can sense the light outside camera mould group 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferable image.Voice coil motor 23
Camera lens 22 can be driven to move along the optical axis direction of camera lens 22 to adjust the distance between camera lens 22 and imaging sensor 21, in turn
The auto-focusing of camera mould group 20 is realized, so that camera mould group 20 be made to obtain the preferable image of quality.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) Image Sensor or charge coupled cell (Charge-coupled Device,
CCD) Image Sensor.Imaging sensor 21 can produce a large amount of heat at work, and heat passes on circuit board 30, then leads to
Oversampling circuit plate 30 passes on shell 10.Since shell 10 and mounting shell 210 are spaced, so that heat is difficult to pass to mounting shell
On 210.
In some embodiments, imaging device 100 includes flexible circuit board 40, and flexible circuit board 40 connects circuit board 30
And it reaches outside shell 10.
In this way, flexible circuit board 40 can make imaging device 100 and outer member realize data transmission.For example, image
The picture signal that sensor 21 can will acquire is transferred to outer member (such as processor) by flexible circuit board 40, external member
Part is to can obtain external image after image signal process.For another example, external element can control image by flexible circuit board 40
Sensor 21 is photosensitive to obtain external image.
Shell 10 can offer the aperture passed through for flexible circuit board 40, so that flexible circuit board 40 reaches shell 10
Outside.
It may be provided with connector 50 on flexible circuit board 40, connector 50 can be connected to the main circuit board of electronic device 300
On, so that imaging device 100 can realize data transmission with outer member.For example, on the main circuit board of electronic device 300
It is provided with connector interface corresponding with connector 50, connector 50, which is inserted into connector interface, can be completed connector 50 and master
Circuit board connection.
In some embodiments, circuit board 30 is structure as a whole with flexible circuit board 40.For example, circuit board 30 and flexibility
Circuit board 40 is respectively a part of Rigid Flex.Circuit board 30 is the hardboard part of Rigid Flex, flexible circuit board 40
For the soft board part of Rigid Flex.
In this way, the structure between circuit board 30 and flexible circuit board 40 is simple, and the zero of imaging device 100 can be reduced
The quantity of component, so as to reduce the assembling procedure of imaging device 100, to reduce the assembling cost of imaging device 100.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (10)
1. a kind of imaging device component characterized by comprising
Mounting shell, the mounting shell include substrate, and the substrate includes camera shooting installation sheet and sets with the camera shooting installation sheet interval
The connection sheet set, the camera shooting installation sheet and the connection sheet are metal sheet, and the camera shooting installation sheet includes opposite the
On one side with the second face；
The imaging device in first face is set, and the imaging device is electrically connected with first face；
Electric conductor, the electric conductor connect second face and the connection sheet, so that the imaging device is grounded；
Cooling fin, the cooling fin connect second face and the connection sheet, the cooling fin and the electric conductor side by side and
It is controlled at intervals between second face and the connection sheet, the area that the camera shooting installation sheet is connect with the cooling fin is big
In the area that the camera shooting installation sheet is connect with the electric conductor.
2. imaging device component as described in claim 1, which is characterized in that the size of the camera shooting installation sheet is less than the company
The size of contact pin, the camera shooting installation sheet are located at the corner location of the substrate, and the connection sheet is located at the centre of the substrate
Position.
3. imaging device component as described in claim 1, which is characterized in that the electric conductor in the form of sheets, the electric conductor with
The camera shooting installation sheet is fixedly connected by welding.
4. imaging device component as described in claim 1, which is characterized in that the cooling fin is graphite flake or graphene film.
5. imaging device component as described in claim 1, which is characterized in that the imaging device includes:
Shell, the shell are electrically connected with first face；With
The camera mould group being contained in the shell.
6. imaging device component as claimed in claim 5, which is characterized in that the shell includes bottom plate and from the bottom plate
The side plate that edge extends, the bottom plate are oppositely arranged with first face, and the side plate is fixedly connected with the camera mould group.
7. imaging device component as claimed in claim 6, which is characterized in that the imaging device includes being arranged in the bottom plate
Circuit board that is upper and being located in the shell, the camera mould group include:
Imaging sensor on the circuit board is set；
Camera lens above described image sensor is set；With
Voice coil motor, the camera lens are arranged in the voice coil motor.
8. imaging device component as claimed in claim 7, which is characterized in that the imaging device includes connecting the circuit board
And reach the flexible circuit board outside the shell.
9. imaging device component as claimed in claim 8, which is characterized in that the imaging device includes being arranged in the flexibility
Connector on circuit board.
10. a kind of electronic device characterized by comprising
Imaging device component described in any one of claim 1-9；With
Display screen on the mounting shell is set, and it is opposite that the display screen with the imaging device is located at the mounting shell
Two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520035.1A CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520035.1A CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107155054A CN107155054A (en) | 2017-09-12 |
| CN107155054B true CN107155054B (en) | 2019-08-09 |
Family
ID=59795443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710520035.1A Active CN107155054B (en) | 2017-06-30 | 2017-06-30 | Imaging device component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107155054B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108377276A (en) * | 2018-01-02 | 2018-08-07 | 信利光电股份有限公司 | A kind of high display terminal for accounting for screen ratio |
| CN110072037B (en) * | 2018-01-23 | 2020-09-22 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
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| CN1979308A (en) * | 2005-12-08 | 2007-06-13 | 统宝光电股份有限公司 | Systems for displaying images and liquid crystal display modules |
| CN202587091U (en) * | 2012-06-13 | 2012-12-05 | 广东欧珀移动通信有限公司 | Structure for reducing temperature rise of cell phone camera |
| CN105050360A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal provided with camera cooling structure and ESD (Electro-Static Discharge) interference resistant structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100629517B1 (en) * | 2005-03-07 | 2006-09-28 | 삼성전자주식회사 | Portable apparatus |
| US20080012436A1 (en) * | 2006-07-13 | 2008-01-17 | Encap Technologies Inc. | Electromagnetic device with encapsulated heat transfer fluid confinement member |
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2017
- 2017-06-30 CN CN201710520035.1A patent/CN107155054B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979308A (en) * | 2005-12-08 | 2007-06-13 | 统宝光电股份有限公司 | Systems for displaying images and liquid crystal display modules |
| CN202587091U (en) * | 2012-06-13 | 2012-12-05 | 广东欧珀移动通信有限公司 | Structure for reducing temperature rise of cell phone camera |
| CN105050360A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Mobile terminal provided with camera cooling structure and ESD (Electro-Static Discharge) interference resistant structure |
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| CN107155054A (en) | 2017-09-12 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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