CN2850204Y - Integrated film sticking machine - Google Patents
Integrated film sticking machine Download PDFInfo
- Publication number
- CN2850204Y CN2850204Y CN 200520068116 CN200520068116U CN2850204Y CN 2850204 Y CN2850204 Y CN 2850204Y CN 200520068116 CN200520068116 CN 200520068116 CN 200520068116 U CN200520068116 U CN 200520068116U CN 2850204 Y CN2850204 Y CN 2850204Y
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- China
- Prior art keywords
- copper foil
- film sticking
- film
- laminator
- feedway
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Laminated Bodies (AREA)
Abstract
The utility model discloses an integrated film sticking machine, which is used for the film sticking of flexible circuit board photosensitive resist film. The integrated film sticking machine comprises a copper foil supplying device, a dry film supplying device, a hot pressure film sticking device and a humidifying device, wherein the copper foil supplying device and the dry film supplying device are arranged on the upper stream of the hot pressure film sticking device, and are respectively used for providing and conveying copper foil and dry film to the hot pressure film sticking device; the hot pressure film sticking device is used for carrying out the operation of the film sticking; the humidifying device is arranged between the copper foil supplying device and the hot pressure film sticking device, and is used for carrying out humidifying treatment for the copper foil before the copper foil is fed into the hot pressure film sticking device. The integrated film sticking machine also comprises a warming device which is arranged between the copper foil supplying device and the humidifying device. The warming device is used for carrying out warming treatment for the copper foil before the copper foil is fed into the humidifying device. Through the additional arrangement of the warming device, the utility model can conveniently carry out the technological film sticking operation of warm water wet spinning and simultaneously can carry out various modes of film sticking operation.
Description
Affiliated technical field
The utility model relates to a kind of laminator, relates in particular to a kind of integrated laminator of realizing multiple pad pasting mode.
Background technology
Along with high density flexible wiring board high speed development in recent years, the continuous increase of line density and variation, the multiple stratification of interlayer structure make traditional line manufacturing process in the face of more challenge.Correspond to the manufacture craft of traditional circuit plate, the technology difficulty of high density flexible wiring board, complexity can be described as and be multiplied.Pad pasting is the one procedure during flexible circuit board is made, film process handle the fine or not quality that directly has influence on the pad pasting effect, also can produce very big influence to subsequent handling (operations such as sensitization, development, etching).
The most traditional film coating process is a normal temperature dry doubling embrane method, promptly adopts laminator that the Copper Foil of the flexible PCB that is in normal temperature is pasted dry film.This traditional laminator mainly is to be made of Copper Foil feedway, dry film feedway and hot pressing film sticking apparatus etc.The Copper Foil feedway is used for Copper Foil is sent to hot pressing film sticking apparatus place, and the dry film feedway is used for dry film is sent to the hot-press arrangement place, and hot-press arrangement is used under the condition of HTHP dry film being fitted in copper foil surface.
In the laminator of the most traditional above-mentioned use normal-temperature dry film coating process, if general pad pasting temperature is too high, the dry film image can become fragile so, causes corrosion resisting property poor.If the pad pasting temperature is low excessively, then the adhesion of dry film and copper foil surface is not firm, and in follow-up development or etching process, dry film easily warps even comes off.Usually control pad pasting temperature is about 100 ℃.In addition, Copper Foil is relevant with the pad pasting temperature usually with the transfer rate of dry film, the temperature height, and transfer rate can be hurry up, and temperature is low then transfers transfer rate slowly.Usually transfer rate be 0.9-1.8 rice/minute.
Yet usually when producing flexible PCB in enormous quantities, under desired transfer rate, the hot pressing film sticking apparatus of laminator (hot pressing roller) is difficult to the heat that provides enough, can't make the pad pasting temperature stabilization about 100 ℃.So industry proposes a kind of dry-method film coating process of heating on the basis of normal-temperature dry film coating process, need to be about to the Copper Foil of pad pasting to put into the baking oven dried, carry out cooling off a little after the preheating, then send into again and carry out pad pasting in traditional laminator.
Subsequently, in order to adapt to the Copper Foil of production fine wire, industry and then propose a kind of normal temperature wet film coating process.This technology promptly is to utilize special-purpose laminator, forms water membrane in copper foil surface before pad pasting.Utilize moisture film to combine the flowability that forms with the solubility dry film, under extruding, remove the gas at Copper Foil depression position, thereby can on copper foil surface, form the coating performance similar to the liquid photoresist.
Usually the special-purpose laminator that adopts this kind wet film coating process is to give damping roller in the hot pressing roller front end interpolation one of dry-method film coating machine, to arranging sponge on the damping roller.When Copper Foil by to damping roller the time, the outside comes water to be ejected on the sponge to damping roller, is absorbed by sponge, then evenly be squeezed on the Copper Foil, thereby the moisture film on the above-mentioned Copper Foil of formation on the Copper Foil.
Yet above-mentioned wet film coating process is analyzed, can find, there is following weak point in it, promptly when pad pasting, the dry film pressure roller heat temperature raising that is heated will be higher than room temperature (room temperature under normal circumstances can not surpass 37 ℃ of human body temperature, typically refer to the temperature about 20 ℃), and Copper Foil and moisture film still keep room temperature, therefore high temperature dry film down is affixed on room temperature when having on the Copper Foil of moisture film, has bigger temperature difference, makes that the applying between dry film and the Copper Foil is stablized inadequately, complete.
So another adopts the technology of warm water wet film coating to arise at the historic moment.This technology is at first put into Copper Foil warm water and is heated, adds wet process, makes the Copper Foil self-temperature raise, and form the warm water film on copper foil surface.Then will heat up and Copper Foil that the surface has a warm water film is sent into the laminator that carries out dry-method film coating process of aforementioned conventional.Last laminator is affixed on dry film and heats up and carry on the surface of Copper Foil of warm water film, thereby finishes the pad pasting operation.
Yet above-mentioned warm water wet film coating process is by the reflux cycle heater pure water in one container to be heated into warm water, then Copper Foil is put into container and soaks, and makes its intensification, and forms the warm water film in copper foil surface.This technology designs laminator and container split, artificially get involved more, and it is consuming time longer to use warm water that Copper Foil is heated, and makes operation inconvenient, and speed is slower.
In addition, above-mentioned various traditional laminators only have single pad pasting mode of operation, do not have versatility, the different demands in the time of can not tackling different situations.
The utility model content
The purpose of this utility model provides a kind of integrated laminator, can make things convenient for the operation of warm water wet film coating process, quickens the heating of Copper Foil, humidification, simultaneously and can be fit to the pad pasting operation of other multiple pad pasting mode of operation.
For achieving the above object, the utility model provides a kind of multifunctional all laminator, this multifunctional all laminator comprises Copper Foil feedway, dry film feedway, hot pressing film sticking apparatus and damping device, Copper Foil feedway and dry film feedway all are arranged at the upstream of hot pressing film sticking apparatus independently, and damping device is arranged between Copper Foil feedway and the hot pressing film sticking apparatus; It is characterized in that: this integrated laminator also comprises a heating apparatus, is arranged between Copper Foil feedway and the damping device, so that Copper Foil is heated.
As mentioned above, the integrated laminator of the utility model is provided with heating apparatus, damping device by collocation, and the operation of traditional warm water wet film coating process is simplified, and speed is improved, and also can be fit to other multiple pad pasting mode of operations simultaneously.
Description of drawings
Below in conjunction with drawings and Examples the utility model is described in further detail.
Fig. 1 is the schematic diagram of the integrated laminator of the utility model.
The description of reference numerals of each element is as follows among the figure: 1. integrated laminator, 2. Copper Foil, 3. dry film, 11. Copper Foil feedwaies; 12. the dry film feedway, 13. hot pressing film sticking apparatus, 14. heating apparatuss; 15. damping device, 16. de-watering apparatus, 111. Copper Foil donor rollers; 121. the dry film roller, 122. dry film transfer rollers, 123. diaphragm wind-up rolls; 131. the hot pressing roller, 141. Copper Foil transfer rollers, 142. control elements; 151. give damping roller, 152. control elements, 161. remove damping roller.
Embodiment
By describing technology contents of the present utility model in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, the integrated laminator 1 of the utility model comprises Copper Foil feedway 11, dry film feedway 12, hot pressing film sticking apparatus 13 and damping device 15.Copper Foil feedway 11 and dry film feedway 12 are arranged at the upstream of hot pressing film sticking apparatus 13 independently of one another, are respectively applied for thermotropism and overlay film device 13 and provide and transmit Copper Foil 2 and dry film 3.Hot pressing film sticking apparatus 13 is used to carry out the pad pasting operation.Damping device 15 is arranged between Copper Foil feedway 11 and the hot pressing film sticking apparatus 13, is used for before Copper Foil 2 is admitted to hot pressing film sticking apparatus 13 Copper Foil 2 being added wet process.This integrated laminator 1 also comprises a heating apparatus 14, is arranged between Copper Foil feedway 11 and the damping device 15, and this heating apparatus 14 was used for before Copper Foil 2 is admitted to damping device 15 Copper Foil 2 processing of heating.This integrated laminator 1 also comprises a de-watering apparatus 16, is arranged at hot pressing film sticking apparatus 13 downstreams, after being used to remove pad pasting and finishing, and residual water on the Copper Foil 2.
Wherein, Copper Foil feedway 11 is a pair of Copper Foil donor rollers 111, is used for Copper Foil 2 is sent in the heating apparatus 14.
Wherein, heating apparatus 14 is a baking oven, is provided with Copper Foil passage and serial Copper Foil transfer roller 141 in this baking oven.Copper Foil transfer roller 141 is along Copper Foil channel transfer Copper Foil 2, and baking oven is heated to Copper Foil 2 simultaneously.This baking oven also has a control element 142, and the temperature that this baking oven is heated Copper Foil 2 is controlled.
Wherein, damping device 15 is used for the process of being sent by heating apparatus 14 Copper Foil of handling 2 of heating is added wet process, makes to go up in Copper Foil 2 surfaces to form the warm water films.These damping device 15 inside are provided with the Copper Foil passage and series is given damping roller 151, these are provided with sponge for damping roller 151, absorbed for the water of damping roller 151 ejections by sponge, thereby giving damping roller 151 in Copper Foil channel transfer Copper Foil 2, equably water is squeezed on Copper Foil 2 surfaces, thereby forms moisture film on Copper Foil 2 surfaces.This damping device 15 also has a control element 152, and whether control adds wet process to Copper Foil 2 for damping roller 151, and when adding wet process to the water temperature of Copper Foil 2 humidifications.
Wherein, dry film feedway 12 comprises dry film roller 121, dry film transfer roller 122 and diaphragm wind-up roll 123, and these rollers 121,122 and 123 are disposed in order along the dry film direction of transfer.Be wound with certain thickness preparation on the dry film roller 121 and be attached at Copper Foil 2 lip-deep dry films 3.Dry film transfer roller 122 receive the dry film 3 sent by dry film roller 121 and and then be sent in the hot pressing film sticking apparatus 13, dry film 3 is being sent to hot pressing film sticking apparatus 13 midway, diaphragm wind-up roll 123 is with the diaphragm rolling of dry film 3.
Wherein, hot pressing film sticking apparatus 13 has a pair of hot pressing roller 131, is used for carrying out under the condition of heating, pressurization the pad pasting operation.When Copper Foil 2 was sent to hot pressing film sticking apparatus 13 via damping device 15, dry film 3 also was admitted between the two hot pressing rollers 131 and continuously and transmits in the thermotropism pressure roller 131.When hot pressing roller 131 rotates, dry film 3 and Copper Foil 2 are heated simultaneously, pressurize, thereby dry film 3 is close on Copper Foil 2 surfaces.
Wherein, de-watering apparatus 16 comprises the serial damping roller 161 that removes, and each removes damping roller 161 and is provided with some aperture (not shown), when removing damping roller 161 transmission Copper Foils, and residual water on the Copper Foil 2 behind the absorption pad pasting.
In order to understand the beneficial effect of the utility model multifunctional all laminator 1 better, below to using the heat process of wet combining film of the multi-functional laminator 1 of the utility model to do one and simply describe.
At first, the control element 142 of regulating heating apparatus 14 makes heating apparatus 14 be in the suitable temperature of heating, and the control element 152 of regulating damping device 15 makes damping device 15 be continuously 45 ℃～65 ℃ warm water is provided to damping roller 151, drive simultaneously dry film feedway 12 with dry film 3 continuously thermotropism overlay in the film device 13 and transmit.Then, Copper Foil 2 is sent in the laminator 1 by Copper Foil feedway 11, heating apparatus 14 heats when transmitting Copper Foil 2 and to Copper Foil 2, make Copper Foil 2 temperature be elevated to 60 ℃～80 ℃, damping device 15 carries out humidification to Copper Foil 2 when transmitting Copper Foil 2, Copper Foil 2 surfaces are gone up form the warm water film.Then, the Copper Foil 2 that carries the warm water film is sent to and carries out hot-pressing processing in the hot pressing film sticking apparatus 13, makes dry film 3 tightly spread on Copper Foil 2 surfaces.At last, the Copper Foil 2 of finishing pad pasting is sent to de-watering apparatus 16 places, and de-watering apparatus 16 is removed the Copper Foil 2 that will finish pad pasting behind the water that remains on the Copper Foil 2 and sent laminator 1.
Heating apparatus 14 that is provided with in the integrated laminator 1 of the utility model and damping device 15 are when thermotropism overlays film device 13 transmission Copper Foils 2, wet process is heated, added to order to Copper Foil 2, make Copper Foil 2 self temperature before accepting pad pasting raise, and form the warm water films in Copper Foil 2 surfaces.This integrated laminator 1 is easy to operate, makes artificially to get involved fewly, and the speed of Copper Foil 2 being carried out heating and moistening is very fast.
In addition, the heating apparatus 14 and the damping device 15 of the integrated laminator 1 of the utility model are adjustable device.By the control to control element 142, the temperature that can to this heating apparatus 14 Copper Foil 2 be heated is effectively controlled; By the control to control element 152, whether the damping roller 151 of giving that can control this damping device 15 effectively adds wet process to Copper Foil 2, and when adding wet process to the water temperature of Copper Foil 2 humidifications.Thereby, heating apparatus 14 and damping device 15 are controlled respectively, just can operate so that this integrated laminator 1 can be finished the pad pasting of following various modes:
(1) normal temperature dry doubling film: by regulating the control element 142 of heating apparatus 14, the temperature that makes 14 pairs of Copper Foils 2 of heating apparatus heat remains on room temperature (about 20 ℃), by regulating the control element 152 of damping device 15, make 15 pairs of Copper Foils 2 of damping device not add wet process.So, behind Copper Foil 2 process heating apparatuss 14 and the damping device 15, just in hot pressing film sticking apparatus 13, carry out normal temperature dry doubling membrane operations.
(2) the dry doubling film of heating: by regulating the control element 142 of heating apparatus 14, the temperature that makes 14 pairs of Copper Foils 2 of heating apparatus heat remains on 60 ℃～80 ℃, by regulating the control element 152 of damping device 15, make 15 pairs of Copper Foils 2 of damping device not add wet process.So, behind Copper Foil 2 process heating apparatuss 14 and the damping device 15, the dry doubling membrane operations of just in hot pressing film sticking apparatus 13, heating.
(3) normal temperature wet combining film: by regulating the control element 142 of heating apparatus 14, the temperature that makes 14 pairs of Copper Foils 2 of heating apparatus heat remains on room temperature (about 20 ℃), by regulating the control element 152 of damping device 15, make 15 pairs of Copper Foils 2 of damping device add wet process.So, behind Copper Foil 2 process heating apparatuss 14 and the damping device 15, just in hot pressing film sticking apparatus 13, carry out normal temperature wet combining membrane operations.
(4) the wet combining film of heating: by regulating the control element 142 of heating apparatus 14, the temperature that makes 14 pairs of Copper Foils 2 of heating apparatus heat remains on 60 ℃～80 ℃, by regulating the control element 152 of damping device 15, make 15 pairs of Copper Foils 2 of damping device add wet process.So, behind Copper Foil 2 process heating apparatuss 14 and the damping device 15, the wet combining membrane operations of just in hot pressing film sticking apparatus 13, heating.
In sum, the integrated laminator 1 of the utility model is provided with heating apparatus 14, damping device 15 by collocation, makes that not only the operation of traditional warm water wet film coating process is improved, and also can be fit to other multiple pad pasting mode of operations simultaneously.
Claims (6)
1. integrated laminator, comprise Copper Foil feedway, dry film feedway, hot pressing film sticking apparatus and damping device, Copper Foil feedway and dry film feedway all are arranged at the upstream of hot pressing film sticking apparatus independently, and damping device is arranged between Copper Foil feedway and the hot pressing film sticking apparatus; It is characterized in that: this integrated laminator also comprises a heating apparatus, is arranged between Copper Foil feedway and the damping device, so that Copper Foil is heated.
2. integrated laminator as claimed in claim 1 is characterized in that: described heating apparatus is a baking oven, is provided with Copper Foil passage and Copper Foil transfer roller in this baking oven, and the Copper Foil transfer roller is along Copper Foil channel transfer Copper Foil.
3. integrated laminator as claimed in claim 2 is characterized in that: described baking oven also has a control element, and the temperature that this baking oven is heated Copper Foil is controlled.
4. integrated laminator as claimed in claim 1 is characterized in that: be provided with the Copper Foil passage in the described damping device and give damping roller, also can add wet process to Copper Foil along Copper Foil channel transfer Copper Foil for damping roller.
5. integrated laminator as claimed in claim 4 is characterized in that: described damping device also has a control element, control the described damping roller of giving and whether Copper Foil added wet process, and when adding wet process to the water temperature of Copper Foil humidification.
6. integrated laminator as claimed in claim 1 is characterized in that: this integrated laminator also has a de-watering apparatus, is arranged at the downstream of hot pressing film sticking apparatus, and this de-watering apparatus comprises that series is except that damping roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520068116 CN2850204Y (en) | 2005-11-18 | 2005-11-18 | Integrated film sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520068116 CN2850204Y (en) | 2005-11-18 | 2005-11-18 | Integrated film sticking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2850204Y true CN2850204Y (en) | 2006-12-20 |
Family
ID=37522671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520068116 Expired - Fee Related CN2850204Y (en) | 2005-11-18 | 2005-11-18 | Integrated film sticking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2850204Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101575176B (en) * | 2009-06-19 | 2011-01-26 | 江苏蓝星玻璃有限公司 | Novel film laminator |
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102161251A (en) * | 2010-11-30 | 2011-08-24 | 梅州市志浩电子科技有限公司 | Film sticking equipment and film sticking process using same |
| CN102423951A (en) * | 2011-10-20 | 2012-04-25 | 番禺南沙殷田化工有限公司 | Method for attaching protective film to fine-pitch film circuit |
| CN104540324A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Printed circuit board outer dry film sticking machine |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
-
2005
- 2005-11-18 CN CN 200520068116 patent/CN2850204Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101575176B (en) * | 2009-06-19 | 2011-01-26 | 江苏蓝星玻璃有限公司 | Novel film laminator |
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102079158B (en) * | 2010-11-11 | 2013-06-19 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102161251A (en) * | 2010-11-30 | 2011-08-24 | 梅州市志浩电子科技有限公司 | Film sticking equipment and film sticking process using same |
| CN102423951A (en) * | 2011-10-20 | 2012-04-25 | 番禺南沙殷田化工有限公司 | Method for attaching protective film to fine-pitch film circuit |
| CN104540324A (en) * | 2014-12-24 | 2015-04-22 | 昆山元茂电子科技有限公司 | Printed circuit board outer dry film sticking machine |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN112020233B (en) * | 2020-08-28 | 2021-11-05 | 李钟波 | Film coating module for PCB micro-defect plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 1089 Jinqiao Road, Jinqiao Export Processing Zone, Shanghai, Pudong New Area: 201206 Patentee after: Fuzhan Electron (Shanghai) Co., Ltd. Address before: 1089 Jinqiao Road, Jinqiao Export Processing Zone, Shanghai, Pudong New Area: 201206 Patentee before: Shanghai Huashide Circuit Technology Co., Ltd. |
|
| C56 | Change in the name or address of the patentee |
Owner name: FUZHAN ELECTRONIC (SHANGHAI) CO., LTD. Free format text: FORMER NAME: SHANGHAI HUASHIDE CIRCUIT TECHNOLOGY CO., LTD. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061220 Termination date: 20131118 |