CN101626665B - Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board - Google Patents
Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board Download PDFInfo
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- CN101626665B CN101626665B CN2009101015287A CN200910101528A CN101626665B CN 101626665 B CN101626665 B CN 101626665B CN 2009101015287 A CN2009101015287 A CN 2009101015287A CN 200910101528 A CN200910101528 A CN 200910101528A CN 101626665 B CN101626665 B CN 101626665B
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- supporting plate
- circuit board
- water
- sided flexible
- photocuring
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Abstract
The invention relates to a processing technology of a single-sided flexible printed circuit board for an automobile instrument, in particular to a photocuring water-cooling process and a fabricating method of a single-sided flexible printed circuit board. The printed circuit board adopting the photocuring water-cooling process comprises a conductive graph layer and a supporting board. The process is characterized by comprising the following steps: selecting the supporting board; drilling on the supporting board; placing the supporting board in water for soaking; placing the condutive graph layer screen-printed with photocuring ink on the supporting board storing water and then developing; photocuring by a photocuring machine; and producing the finished product. The fabricating method is feasible. The invention solves the technical problems of easy distortion, circumnutation and unevenness of the photocured single-sided flexible printed circuit board, has even produced singled-sided flexible printed circuit board and convenient and rapid operation, and is suitable to renovate the technology of the single-sided flexible printed circuit board for the automobile instrument.
Description
Technical field
The present invention relates to the process technology of automobile instrument with single-sided flexible circuit board, is a kind of single-sided flexible circuit board photocuring water-cooling process and manufacture method.
Background technology
Single-sided flexible circuit board, coiling both flexible, folding because of its circuit board, and in three dimensions random mobile and flexible, perfect heat-dissipating, can utilize the FPC reduced volume again, realize lightweight, miniaturization, slimming, reach component arrangement and be connected integrated with lead.And single-sided flexible plate cost is low, the conductive pattern that one deck chemical etching that is had goes out, and the conductive pattern layer on the flexible insulation substrate surface is a rolled copper foil.Insulating substrate can easily be selected polyimides, PETG, aramid fiber ester and polyvinyl chloride; So the single-sided flexible circuit board is extensively used in the industry at automobile instrument.Because the single-sided flexible circuit board is soft, make the product behind the photocuring be easy to generate distortion, circumnutate, out-of-flatness, producing to later process increases workload, influences production efficiency.
Summary of the invention
For overcoming above-mentioned deficiency, the objective of the invention is provides a kind of single-sided flexible circuit board photocuring water-cooling process and manufacture method to this area, make it solve existing single-sided flexible circuit board photocuring after, yielding, circumnutate, irregular technical problem.The objective of the invention is to be achieved through the following technical solutions.
A kind of single-sided flexible circuit board photocuring water-cooling process, this single-sided flexible circuit board comprises conductive pattern layer and supporting plate, and its main points are that the technological process that this single-sided flexible circuit board solidifies water-cooling process is: select that supporting plate → boring → supporting plate develops → consolidates → finished product through photo solidification machine light above being positioned in the water supporting plate that soaks into → the conductive pattern layer behind the solid printing ink of silk-screen light is placed on water on supporting plate.
The epoxy polyester plate that described supporting plate thickness is 1.2～1.8mm.
Described on supporting plate the hole of bore diameter φ 1.2～1.8mm, it is 75～85% that the solid printing ink of silk-screen light spreads all over the supporting plate area.
A kind of single-sided flexible circuit board manufacture method, its main points are selection and making:
Selecting supporting plate thickness for use is that the epoxy polyester plate of 1.2～1.8mm is a base, and with the hole of supporting plate bore diameter φ 1.2～1.8mm, it is 75～85% that the solid printing ink of silk-screen light spreads all over the supporting plate area, makes supporting plate face water easy-storing; The effect of water is that the conductive pattern layer is adsorbed on the supporting plate.
With supporting plate put soak into to the water after, pick up supporting plate with left hand again, the single-sided flexible circuit board after the right hand is finished the solid printing ink operation of silk-screen light is placed on the supporting plate of water and maintains an equal level, and puts thereafter that to carry out light to the photo solidification machine conveyer belt solid; Described light is about to conductive pattern layer and supporting plate curing admittedly, and its principle of solidification is, some material is very sensitive to the light of specific wavelength, be subjected to the rayed of this wavelength after, photo-curing material will solidify.
Detect: the finished product behind the photocuring is estimated its shape whether is out of shape, scrape its light with the 4H pencil and consolidate printing ink hardness and degree of adhesion, with do not rise printing ink and indeformable be qualified product.
Single-sided flexible circuit board possesses the flexibility and the reliability of flexible circuit, and at present flexible circuit is provided with: single face, two-sided, multi-layer flexible sheet and just four kinds of flexible boards, its photocuring water-cooling process and manufacture method are equal to.
The invention solves behind single-sided flexible circuit board photocuring, yielding, circumnutate, irregular technical problem, it is smooth indeformable to produce single-sided flexible circuit board, and convenient to operation.Be applicable to automobile instrument renovating with the single-sided flexible circuit board technology.
Description of drawings
Fig. 1 is a process chart of the present invention.
Fig. 2 is a single-sided flexible circuit board finished product plane graph of the present invention.
Embodiment
Now in conjunction with Fig. 1, Fig. 2, this single-sided flexible circuit board photocuring water-cooling process, this single-sided flexible circuit board comprises conductive pattern layer and supporting plate, and the technological process that single-sided flexible circuit board solidifies water-cooling process is: the selection supporting plate → boring → supporting plate develops → consolidates → finished product through photo solidification machine light above being positioned in the water supporting plate that soaks into → the conductive pattern layer behind the solid printing ink of silk-screen light is placed on water on supporting plate.Single-sided flexible circuit board is selected supporting plate thickness for use when making be that the epoxy polyester plate of 1.5mm is a base, and with the hole of supporting plate bore diameter φ 1.5mm, it is 80% that the solid printing ink of silk-screen light spreads all over the supporting plate area, supporting plate face water easy-storing; The course of processing: earlier supporting plate is put soak into to the water after, pick up supporting plate with left hand again, the semi-finished product after the right hand is finished the solid printing ink operation of silk-screen light are placed on the supporting plate of water and maintain an equal level, and put thereafter that to carry out light to the photo solidification machine conveyer belt solid; During detection the finished product behind the photocuring is estimated its shape and whether is out of shape, scrape solid printing ink hardness of its light and degree of adhesion with the 4H pencil, with do not rise printing ink and indeformable be standard, regard as qualified product.
Claims (2)
1. single-sided flexible circuit board photocuring water-cooling process, this single-sided flexible circuit board comprises conductive pattern layer and supporting plate, and the technological process that this single-sided flexible circuit board solidifies water-cooling process is: select supporting plate → boring on supporting plate → to be positioned in the water above the supporting plate that soaks into → the conductive pattern layer behind the solid printing ink of silk-screen light is placed on water to develop with supporting plate → through photo solidification machine light solid → finished product; It is characterized in that described supporting plate is that thickness is the epoxy polyester plate of 1.2～1.8mm; Described bore dia is φ 1.2～1.8mm, and it is 75～85% that the solid printing ink of silk-screen light spreads all over the supporting plate area.
2. single-sided flexible circuit board manufacture method is characterized in that:
Selection and making: selecting supporting plate for use is that thickness is that the epoxy polyester plate of 1.2～1.8mm is a base, and with the hole of supporting plate drill diameter φ 1.2～1.8mm, it is 75～85% that the solid printing ink of silk-screen light spreads all over the supporting plate area, supporting plate face water easy-storing;
With supporting plate put soak into to the water after, pick up supporting plate with left hand again, the single-sided flexible circuit board after the right hand is finished the solid printing ink operation of silk-screen light is placed on the supporting plate of water and maintains an equal level, and puts thereafter that to carry out light to the photo solidification machine conveyer belt solid;
Detect: the finished product behind the photocuring is estimated its shape whether is out of shape, scrape its light with the 4H pencil and consolidate printing ink hardness and degree of adhesion, with do not rise printing ink and indeformable be qualified product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101015287A CN101626665B (en) | 2009-08-07 | 2009-08-07 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101015287A CN101626665B (en) | 2009-08-07 | 2009-08-07 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101626665A CN101626665A (en) | 2010-01-13 |
| CN101626665B true CN101626665B (en) | 2011-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101015287A Expired - Fee Related CN101626665B (en) | 2009-08-07 | 2009-08-07 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
Country Status (1)
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| CN (1) | CN101626665B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1968575A (en) * | 2005-11-17 | 2007-05-23 | 上海华仕德电路技术有限公司 | Wet film coating process for flexible circuit board |
| CN101175374A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Fixing method of flexible circuit board |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
-
2009
- 2009-08-07 CN CN2009101015287A patent/CN101626665B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1968575A (en) * | 2005-11-17 | 2007-05-23 | 上海华仕德电路技术有限公司 | Wet film coating process for flexible circuit board |
| CN101175374A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Fixing method of flexible circuit board |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
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| Publication number | Publication date |
|---|---|
| CN101626665A (en) | 2010-01-13 |
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Granted publication date: 20110126 Termination date: 20160807 |