CN1925128A - 复合晶片结构的制造方法 - Google Patents
复合晶片结构的制造方法 Download PDFInfo
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- CN1925128A CN1925128A CN 200510099630 CN200510099630A CN1925128A CN 1925128 A CN1925128 A CN 1925128A CN 200510099630 CN200510099630 CN 200510099630 CN 200510099630 A CN200510099630 A CN 200510099630A CN 1925128 A CN1925128 A CN 1925128A
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Application Number | Priority Date | Filing Date | Title |
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CNB200510099630XA CN100399540C (zh) | 2005-08-30 | 2005-08-30 | 复合晶片结构的制造方法 |
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CNB200510099630XA CN100399540C (zh) | 2005-08-30 | 2005-08-30 | 复合晶片结构的制造方法 |
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CN1925128A true CN1925128A (zh) | 2007-03-07 |
CN100399540C CN100399540C (zh) | 2008-07-02 |
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CNB200510099630XA Expired - Fee Related CN100399540C (zh) | 2005-08-30 | 2005-08-30 | 复合晶片结构的制造方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101673679A (zh) * | 2008-09-08 | 2010-03-17 | 半导体元件工业有限责任公司 | 薄型半导体晶片和减薄半导体晶片的方法 |
CN102381677A (zh) * | 2010-08-27 | 2012-03-21 | 台湾积体电路制造股份有限公司 | 复合晶片半导体元件及其形成方法 |
CN101878092B (zh) * | 2007-11-30 | 2013-07-10 | 浜松光子学株式会社 | 加工对象物研磨方法 |
CN109509809A (zh) * | 2017-09-14 | 2019-03-22 | 北京弘芯科技有限公司 | 一种红外焦平面探测器及其制备方法 |
CN110421411A (zh) * | 2019-07-23 | 2019-11-08 | 浙江新泰通讯科技有限公司 | 一种铌酸锂晶体薄片生产工艺 |
WO2019233174A1 (zh) * | 2018-06-06 | 2019-12-12 | 深圳光峰科技股份有限公司 | 一种发光元件及发光元件的高能粒子辐射方法、抛光方法 |
CN111276397A (zh) * | 2018-12-04 | 2020-06-12 | 株式会社迪思科 | 晶片的加工方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10140133A1 (de) * | 2001-08-16 | 2003-03-13 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Herstellen einer klebenden Verbindung zwischen einer Halbleiterscheibe und einer Trägerplatte |
US6638835B2 (en) * | 2001-12-11 | 2003-10-28 | Intel Corporation | Method for bonding and debonding films using a high-temperature polymer |
JP2004134672A (ja) * | 2002-10-11 | 2004-04-30 | Sony Corp | 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置 |
JP4554901B2 (ja) * | 2003-08-12 | 2010-09-29 | 株式会社ディスコ | ウエーハの加工方法 |
-
2005
- 2005-08-30 CN CNB200510099630XA patent/CN100399540C/zh not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101878092B (zh) * | 2007-11-30 | 2013-07-10 | 浜松光子学株式会社 | 加工对象物研磨方法 |
US8523636B2 (en) | 2007-11-30 | 2013-09-03 | Hamamatsu Photonics K.K. | Working object grinding method |
CN101673679A (zh) * | 2008-09-08 | 2010-03-17 | 半导体元件工业有限责任公司 | 薄型半导体晶片和减薄半导体晶片的方法 |
CN102381677A (zh) * | 2010-08-27 | 2012-03-21 | 台湾积体电路制造股份有限公司 | 复合晶片半导体元件及其形成方法 |
CN102381677B (zh) * | 2010-08-27 | 2014-07-09 | 台湾积体电路制造股份有限公司 | 复合晶片半导体元件及其形成方法 |
CN109509809A (zh) * | 2017-09-14 | 2019-03-22 | 北京弘芯科技有限公司 | 一种红外焦平面探测器及其制备方法 |
CN109509809B (zh) * | 2017-09-14 | 2022-03-18 | 浙江英孚莱德光电科技有限公司 | 一种红外焦平面探测器及其制备方法 |
WO2019233174A1 (zh) * | 2018-06-06 | 2019-12-12 | 深圳光峰科技股份有限公司 | 一种发光元件及发光元件的高能粒子辐射方法、抛光方法 |
CN111276397A (zh) * | 2018-12-04 | 2020-06-12 | 株式会社迪思科 | 晶片的加工方法 |
CN111276397B (zh) * | 2018-12-04 | 2024-04-05 | 株式会社迪思科 | 晶片的加工方法 |
CN110421411A (zh) * | 2019-07-23 | 2019-11-08 | 浙江新泰通讯科技有限公司 | 一种铌酸锂晶体薄片生产工艺 |
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Publication number | Publication date |
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CN100399540C (zh) | 2008-07-02 |
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C06 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Kunshan Zhongchen Silicon Crystal Co., Ltd. Assignor: Sino-American Silicon Products Inc. Contract fulfillment period: 2008.10.30 to 2014.10.29 Contract record no.: 2008990001176 Denomination of invention: Technology for making composite crystal structure Granted publication date: 20080702 License type: Exclusive license Record date: 20081111 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.10.30 TO 2014.10.29; CHANGE OF CONTRACT Name of requester: KUNSHAN ZHONGCHEN SILICON WAFER CO., LTD. Effective date: 20081111 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080702 Termination date: 20200830 |