CN1897263A - 多边形、圆弧形和圆形倒装芯片球栅阵列板 - Google Patents

多边形、圆弧形和圆形倒装芯片球栅阵列板 Download PDF

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CN1897263A
CN1897263A CNA2006100833970A CN200610083397A CN1897263A CN 1897263 A CN1897263 A CN 1897263A CN A2006100833970 A CNA2006100833970 A CN A2006100833970A CN 200610083397 A CN200610083397 A CN 200610083397A CN 1897263 A CN1897263 A CN 1897263A
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曹承铉
曹淳镇
李在浚
吴世宗
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Samsung Electro Mechanics Co Ltd
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Abstract

本发明涉及一种倒装芯片BGA板，其中去除板的每个角，以使其在制造过程中由于受热而产生的翘曲降低到最小程度。本发明的实施例通过防止板的翘曲而允许制造薄板，并且由于降低了芯片与板分离的危险，可提供高可靠性的板。

Description

多边形、圆弧形和圆形倒装芯片球栅阵列板
相关申请
本申请要求2005年7月11日提交韩国工业产权局的韩国专利申请No.2005-62274的优先权，该申请在此引用作为参考文献。
技术领域
本发明涉及倒装芯片球栅阵列(下面称为“倒装芯片BGA”)板，特别涉及一种通过均匀去除四边形板的角而使热变形最小化的倒装芯片BGA板。
背景技术
传统封装是将芯片贴在引线框架上，将芯片的焊盘与引线连接，并用树脂密封，这种封装大且重，并且其安装需要相当长的连线。作为这些问题的解决方案，开发了倒装芯片BGA封装，其中将芯片贴在环氧树脂或陶瓷板上，并使用圆焊料球(round solder ball)作为引线。
下面参考图1(a)到1(h)描述典型倒装芯片BGA封装的制造方法。
(a)在半导体芯片1上形成铝焊盘2，半导体芯片1覆盖有保护层3。(b)通过溅射形成金属层4，并连接焊盘2。(c)涂覆光致抗蚀剂5，从而仅露出焊盘2的区域。(d)将引线涂层6涂覆于未被光致抗蚀剂5掩盖的焊盘2区域。(e)去除重叠的光致抗蚀剂5。(f)通过刻蚀除了涂覆有引线涂层6以外的区域去除金属层4。(g)加热使引线涂层6变成圆形。(h)将上述制造的凸起片接合到倒装芯片BGA板8上。接合方法包括在回流设备中沉积，将板8加热到高温使引线涂层熔化，并且使倒装芯片BGA板8的接触焊盘10接触芯片1的焊盘2。然后，在倒装芯片BGA板8与芯片1之间通过欠装(underfilling)工艺填充树脂。
如上所述，制造倒装芯片BGA，在步骤(g)的引线6变圆过程以及步骤(h)的回流过程中，需要大量热量。特别是在回流过程中，由于需要熔化引线涂层6，一般使用约225℃的高温，这将导致倒装芯片BGA板8的翘曲。
图2是传统倒装芯片BGA封装的透视图。传统倒装芯片BGA板8一般为四边形。
图3表示制造完成后倒装芯片BGA板8形成的翘曲程度。如图3所示，翘曲程度在倒装芯片BGA板8的边缘最大，因此加热后翘曲成下凹形状。这种图3所示的加热翘曲对于像UTFCB(超薄挠性电路板)之类的中心厚度等于或小于0.4mm的薄板特别明显。
倒装芯片BGA板8越薄，翘曲程度越大。这样，尽管电路板的最近发展趋势是尺寸更小和功能更加复杂，但这种加热造成的翘曲不但使其难以装在芯片上，而且使芯片从板上剥离。而且，这种翘曲成为制作薄板的障碍。
发明内容
作为现有技术中上述问题的解决方案，本发明的一个方面是提供一种倒装芯片BGA板，它制成多边形、圆弧形或圆形，以将加热产生的变形减小到最低程度。
本发明的另外方面和优点，部分在下面的描述中给出，部分将从描述中明显看出，或者可以从实施本发明中获知。
根据本发明第一种实施方式，倒装芯片BGA封装中使用的倒装芯片BGA板，可以使板的角均匀去除形成多边形。这样，通过去除传统倒装芯片BGA板的每个角，可以使加热产生的板翘曲减小到最低程度。电路板可以形成多种形状，例如六边形或八边形。
在本发明的第二种实施方式中，倒装芯片BGA封装中使用的倒装芯片BGA板可以使板的角形成等曲率半径的圆弧。
在本发明的第三种实施方式中，倒装芯片BGA封装中使用的倒装芯片BGA板可以是圆形的。
附图说明
结合附图，从以下实施方式的说明中，本发明的这些和/或其它方面和优点将变得清楚和更加容易理解。在附图中：
图1(a)到1(h)是表示典型倒装芯片BGA封装制造过程的剖视图；
图2表示由于受热而在传统板上产生的翘曲的分布；
图3表示由于受热而在传统薄倒装芯片球栅阵列板上产生的翘曲的分布；
图4是表示根据本发明的实施方式的圆弧形倒装芯片球栅阵列板的示意图；
图5是表示根据本发明实施方式的多边形倒装芯片球栅阵列的示意图；
图6是表示根据本发明实施方式的圆形倒装芯片球栅阵列板的示意图；
图7a表示根据本发明实施方式，由于受热而在圆弧形倒装芯片球栅阵列板上产生的翘曲的分布；
图7b表示根据本发明实施方式，由于受热而在多边形倒装芯片球栅阵列板上产生的翘曲的分布；
图7c表示根据本发明实施方式，由于受热而在圆形倒装芯片球栅阵列板上产生的翘曲的分布。
具体实施方式
下面将参考附图，更加详细地描述根据本发明实施方式的去除角的板。
图4表示根据本发明实施方式的圆弧形倒装芯片BGA板10。倒装芯片BGA板10的四个角的每一个具有相同的圆弧形。优选地，每个角具有相同的曲率半径，或者非常相近，以尽可能地防止由于受热而产生的翘曲。这里，使曲率半径增大，从而使板尽可能地接近圆形，能更加有效地防止翘曲，下面将参考实验结果对此进行解释。倒装芯片BGA板10可以是BOC(Boardon Chip)、CSP(芯片级封装)和UTFCB(超薄挠性电路板)技术中使用的板。而且，板10可以形成6层或更多层的多层结构。
图5表示根据本发明另一个实施方式的多边形倒装芯片BGA板20。图5所示的倒装芯片BGA板20是六边形的。当然，本发明并不限于六边形，可以是任何形状，例如八边形或十二边形，从而尽可能多地去除板的角，以使受热产生的变形降低到最小程度。而且，优选地，使用具有尽可能多的侧边的形状，从而使板的形状尽可能接近圆形。
图6表示根据本发明另一个实施方式的圆形倒装芯片BGA板30。如图6所示，去除角形成圆形的板，从而使受热产生的变形降低到最小程度。
将倒装芯片BGA板10、20、30去除角的典型方法包括使用锯子或刳刨工具。特别是，在形成如同上述实施方式中的多边形、圆弧形或圆形的倒装芯片BGA板10、20、30时，优选的是刳刨工具。而且，当板薄时，优选使用利用模具的冲压。
下面将参考实验结果解释本发明上述实施例中由于受热产生的翘曲。
实验：受热产生的变形与板形状的关系
实验条件
中心厚度为0.1mm，尺寸为37.5mm×37.5mm的聚合物型倒装芯片BGA板，堆叠为六层，并且温度从175℃下降到25℃。
实施例1-3
对于实施例1的圆弧形倒装芯片BGA板10、实施例2的多边形倒装芯片BGA板20以及实施例3的圆形倒装芯片BGA板30，测量板随受热变化的翘曲。
对比例
使用诸如图2所示的正方形倒装芯片BGA板，测量受热产生的板的翘曲。
实验结果
每种实施例中板的翘曲均表示在图7a到7c中。对比例的传统板受热翘曲表示在图3中。在图3和图7a到7c中，符号(+)表示向上的板的翘曲，符号(-)表示向下的板的翘曲。
如图1所示的实施例，对于传统的四边形板，翘曲主要形成在每个角上。
参看图7a到7c，多边形板(实施例2)受热变形小于圆弧形板(实施例1)。而且，圆形板(实施例3)受热变形小于多边形板(实施例2)。
实施例1到3相对于对比例的相对翘曲百分数列在下面的表1中。
                  表1
 板形状   相对于四边形板的翘曲程度
 圆弧形(实验例1)   17.81％
 多边形(实验例2)   13.05％
 圆形(实验例3)   12.61％
如表1所示，可以发现，从圆弧形板到多边形板到圆形板，翘曲程度随着板的角去除程度而减小。
根据如上所述构成的本发明，提供一种倒装芯片BGA板，将其角均匀去除，使受热变形达到最小程度。
使用根据本发明的倒装芯片BGA板，由于受热变形降低到最小程度，从而可以制备较薄的板。而且根据本发明，由于芯片与板分离的危险降低，从而倒装芯片BGA板具有较高的可靠性。
虽然已经图示和说明了本发明的几个实施方式，但本领域普通技术人员应该理解的是，在不偏离本发明原理和精神的情况下，其范围受到权利要求及其等价条款限定，可以对这些实施方式进行变化。

Claims (4)

1.一种倒装芯片球栅阵列封装中使用的倒装芯片球栅阵列板，其中均匀地去除所述板的角，以形成多边形的形状。
2.根据权利要求1所述的倒装芯片球栅阵列板，其中倒装芯片球栅阵列板是六边形。
3.一种倒装芯片球栅阵列封装中使用的倒装芯片球栅阵列板，其中所述板的角是具有相同曲率半径的圆弧形。
4.一种倒装芯片球栅阵列封装中使用的倒装芯片球栅阵列板，其中板是圆形的。
CNA2006100833970A 2005-07-11 2006-06-08 多边形、圆弧形和圆形倒装芯片球栅阵列板 Pending CN1897263A (zh)

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