CN1853934B - 喷墨打印头基板和制造方法、喷墨打印头、喷墨打印设备 - Google Patents
喷墨打印头基板和制造方法、喷墨打印头、喷墨打印设备 Download PDFInfo
- Publication number
- CN1853934B CN1853934B CN200610076517.4A CN200610076517A CN1853934B CN 1853934 B CN1853934 B CN 1853934B CN 200610076517 A CN200610076517 A CN 200610076517A CN 1853934 B CN1853934 B CN 1853934B
- Authority
- CN
- China
- Prior art keywords
- ink
- fuse element
- jet printing
- head substrate
- printing head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000007641 inkjet printing Methods 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 46
- 238000002844 melting Methods 0.000 claims abstract description 30
- 230000008018 melting Effects 0.000 claims abstract description 23
- 239000000976 ink Substances 0.000 claims description 98
- 239000010410 layer Substances 0.000 claims description 63
- 238000010438 heat treatment Methods 0.000 claims description 45
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 24
- 230000003628 erosive effect Effects 0.000 claims description 12
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000002309 gasification Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 239000012044 organic layer Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 abstract description 31
- 238000007664 blowing Methods 0.000 abstract 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 45
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 23
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 21
- 229920005591 polysilicon Polymers 0.000 description 21
- 238000000034 method Methods 0.000 description 13
- 238000001259 photo etching Methods 0.000 description 13
- 238000005530 etching Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
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- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 241001269238 Data Species 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910004200 TaSiN Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- 239000012528 membrane Substances 0.000 description 2
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- 229920002614 Polyether block amide Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
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- 230000008901 benefit Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
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- 230000014509 gene expression Effects 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- 238000004528 spin coating Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/17—Readable information on the head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-132315 | 2005-04-28 | ||
JP2005132315 | 2005-04-28 | ||
JP2005132315 | 2005-04-28 | ||
JP2006075236 | 2006-03-17 | ||
JP2006-075236 | 2006-03-17 | ||
JP2006075236A JP2006327180A (ja) | 2005-04-28 | 2006-03-17 | インクジェット記録ヘッド用基板、インクジェット記録ヘッド、インクジェット記録装置、およびインクジェット記録ヘッド用基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1853934A CN1853934A (zh) | 2006-11-01 |
CN1853934B true CN1853934B (zh) | 2010-05-12 |
Family
ID=37418705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610076517.4A Expired - Fee Related CN1853934B (zh) | 2005-04-28 | 2006-04-28 | 喷墨打印头基板和制造方法、喷墨打印头、喷墨打印设备 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7533969B2 (ja) |
JP (1) | JP2006327180A (ja) |
CN (1) | CN1853934B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1697815A4 (en) * | 2003-11-20 | 2008-05-14 | Tekelec Us | METHODS AND SYSTEMS FOR MTP LOAD DISTRIBUTION IMPLEMENTING MTP LOAD DISTRIBUTION GROUPS |
US7825490B2 (en) * | 2007-07-18 | 2010-11-02 | International Business Machines Corporation | Electrical fuse having a cavity thereupon |
WO2009064271A1 (en) * | 2007-11-14 | 2009-05-22 | Hewlett-Packard Development Company, L.P. | An inkjet print head with shared data lines |
JP5679825B2 (ja) * | 2010-01-21 | 2015-03-04 | キヤノン株式会社 | 液体吐出装置、および液体吐出ヘッドの異常検知方法 |
TWI437432B (zh) * | 2011-10-31 | 2014-05-11 | Kinpo Elect Inc | 碳粉匣及其所應用的印表機與相關聯的保護管理方法 |
WO2015188307A1 (en) * | 2014-06-09 | 2015-12-17 | Empire Technology Development Llc | Fused filament fabrication materials and methods of use thereof |
US20200003601A1 (en) * | 2017-02-23 | 2020-01-02 | Hewlett-Packard Development Company, L.P. | Fluid level sensor |
US10479075B2 (en) * | 2017-05-09 | 2019-11-19 | Canon Kabushiki Kaisha | Print head substrate and method of manufacturing the same, and semiconductor substrate |
JP7183049B2 (ja) * | 2018-02-22 | 2022-12-05 | キヤノン株式会社 | 液体吐出ヘッド用基板および液体吐出ヘッド |
US10730294B2 (en) * | 2018-02-22 | 2020-08-04 | Canon Kabushiki Kaisha | Liquid-discharge-head substrate, liquid discharge head, and method for manufacturing liquid-discharge-head substrate |
JP7159060B2 (ja) * | 2018-02-22 | 2022-10-24 | キヤノン株式会社 | 液体吐出ヘッド用基板、液体吐出ヘッド、液体吐出ヘッド用基板の製造方法 |
US10913269B2 (en) | 2018-02-22 | 2021-02-09 | Canon Kabushiki Kaisha | Liquid discharge head substrate and liquid discharge head |
JP7191669B2 (ja) | 2018-12-17 | 2022-12-19 | キヤノン株式会社 | 液体吐出ヘッド用基板およびその製造方法 |
JP7427367B2 (ja) | 2019-04-26 | 2024-02-05 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
US11577011B2 (en) | 2020-04-30 | 2023-02-14 | Robert Harder | Chest valve for treating pneumothorax |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5363134A (en) * | 1992-05-20 | 1994-11-08 | Hewlett-Packard Corporation | Integrated circuit printhead for an ink jet printer including an integrated identification circuit |
US5660739A (en) * | 1994-08-26 | 1997-08-26 | Canon Kabushiki Kaisha | Method of producing substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus |
CN1214549A (zh) * | 1997-09-12 | 1999-04-21 | 西门子公司 | 改进的激光熔丝连接及其制造方法 |
US6390589B1 (en) * | 1998-10-27 | 2002-05-21 | Canon Kabushiki Kaisha | Head substrate, ink jet head, and ink jet printer |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2862287B2 (ja) | 1989-10-12 | 1999-03-03 | キヤノン株式会社 | 画像記録装置 |
EP0421806B1 (en) | 1989-10-05 | 1999-03-17 | Canon Kabushiki Kaisha | An image forming apparatus |
US5504507A (en) | 1992-10-08 | 1996-04-02 | Xerox Corporation | Electronically readable performance data on a thermal ink jet printhead chip |
KR100294026B1 (ko) * | 1993-06-24 | 2001-09-17 | 야마자끼 순페이 | 전기광학장치 |
JPH10774A (ja) | 1996-06-14 | 1998-01-06 | Canon Inc | インクジェット記録ヘッド用基板及びこれを備えたインクジェット記録ヘッド |
JP3576888B2 (ja) | 1999-10-04 | 2004-10-13 | キヤノン株式会社 | インクジェットヘッド用基体、インクジェットヘッド及びインクジェット装置 |
JP3720689B2 (ja) | 2000-07-31 | 2005-11-30 | キヤノン株式会社 | インクジェットヘッド用基体、インクジェットヘッド、インクジェットヘッドの製造方法、インクジェットヘッドの使用方法およびインクジェット記録装置 |
KR100436760B1 (ko) * | 2001-12-20 | 2004-06-23 | 삼성전자주식회사 | 잉크젯 프린터의 헤드 및 그 제조방법 |
KR100453058B1 (ko) | 2002-10-30 | 2004-10-15 | 삼성전자주식회사 | 잉크젯 프린트헤드 |
JP4078295B2 (ja) | 2002-12-27 | 2008-04-23 | キヤノン株式会社 | インクジェットヘッド用基体およびこれを用いるインクジェットヘッドとその製造方法 |
-
2006
- 2006-03-17 JP JP2006075236A patent/JP2006327180A/ja active Pending
- 2006-04-21 US US11/407,980 patent/US7533969B2/en active Active
- 2006-04-28 CN CN200610076517.4A patent/CN1853934B/zh not_active Expired - Fee Related
-
2009
- 2009-03-19 US US12/407,012 patent/US7669981B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5363134A (en) * | 1992-05-20 | 1994-11-08 | Hewlett-Packard Corporation | Integrated circuit printhead for an ink jet printer including an integrated identification circuit |
US5660739A (en) * | 1994-08-26 | 1997-08-26 | Canon Kabushiki Kaisha | Method of producing substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus |
CN1214549A (zh) * | 1997-09-12 | 1999-04-21 | 西门子公司 | 改进的激光熔丝连接及其制造方法 |
US6390589B1 (en) * | 1998-10-27 | 2002-05-21 | Canon Kabushiki Kaisha | Head substrate, ink jet head, and ink jet printer |
Non-Patent Citations (2)
Title |
---|
JP平3-126560A 1991.05.29 |
JP特开平10-138482A 1998.05.26 |
Also Published As
Publication number | Publication date |
---|---|
US20060256160A1 (en) | 2006-11-16 |
US7533969B2 (en) | 2009-05-19 |
US7669981B2 (en) | 2010-03-02 |
US20090179938A1 (en) | 2009-07-16 |
CN1853934A (zh) | 2006-11-01 |
JP2006327180A (ja) | 2006-12-07 |
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