CN1814411A - Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device - Google Patents
Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device Download PDFInfo
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- CN1814411A CN1814411A CN 200510004978 CN200510004978A CN1814411A CN 1814411 A CN1814411 A CN 1814411A CN 200510004978 CN200510004978 CN 200510004978 CN 200510004978 A CN200510004978 A CN 200510004978A CN 1814411 A CN1814411 A CN 1814411A
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- adsorption sheet
- porous property
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Abstract
The invention relates to a manufacture method for absorbing sheet material that includes the following steps: supplying a carrier to form a coating layer of polyurethane resin on it, concreting, washing, drying the coating layer to make a interconnected porosity sheet material, smoothing the surface of the surface of the sheet material to make the material. The inequality of the sheet material is less than 10 micron.
Description
Technical field
The invention relates to a kind of adsorption sheet, more be particularly to a kind of connected porous property adsorption sheet, its surface has good flatness and high adsorption.
Background technology
With reference to figure 1, it shows known burnishing device 2, in order to polish the surface of various polished base materials, such as the surface of semiconductor substrate or glass substrate.Specifically, connected porous property (continuous porous) sheet material 13 is made by resin (resin), and is fixed on the lower platform 11 by viscose glue 12.One template (template) the 14th is fixed on this connected porous property sheet material 13, and has one and run through opening 15, can locate this polished base material 20 in order to hold this polished base material 20.One grinding pad 17 is to be disposed on the upper mounting plate 16, and towards the connected porous property sheet material 13 of this lower platform 11.
Before carrying out the polishing processing procedure of polished base material 20, earlier polished base material 20 is inserted running through in the opening 15 of this template 14, and this polished base material 20 is fixed on the connected porous property sheet material 13 of this lower platform 11.Then, this upper mounting plate 16 and this lower platform 11 are to rotate in the opposite direction, and these upper mounting plate 16 declines, make the polished base material 20 of these grinding pad 17 contacts.The lapping liquid (aqueous solution) 21 that contains polishing particles is used between this grinding pad 17 and the polished base material 20.At last, by setting relative fricting movement and the time of this grinding pad 17, to carry out the polishing processing procedure with polished base material 20.
Yet known electro-optical device is by the polished base material 20 in additional template 14 location, utilize again water should connected porous property sheet material 13 and polished base material 20 between produce surface tension, with the polished base material 20 of adsorbed close.Perhaps, earlier in the external mode that vacuumizes, again should connected porous property sheet material 13 and polished base material 20 between produce adsorbed close.Therefore, known burnishing device has following shortcoming: the first, abutment surface tension force absorption between this connected porous property sheet material and the polished base material, if absorption affinity is smaller than in the polishing process because the downforce of relative motion and upper mounting plate, the deflection pressure that produces is this connected porous property sheet material polished base material of adsorbed close fully then, and the easy and template of then polished base material bumps and causes damage; The second, the uneven degree of this connected porous property sheet surface is big, will make lapping liquid infiltrate and cause the flatness of the damage of polished base material and grinding poor; Three, the use mode that vacuumizes is difficult for comprehensively evenly, and control is difficult, so the polished base material of polishing process easy damaged; And the 4th, the size of template must change with the specification size of polished base material, effectiveness of operation is not high.
Moreover, United States Patent (USP) the 5th, 871, No. 393, title is " fixation kit that is used to polish (Mounting Member For Polishing) ", disclose a kind of fixation kit that is used to polish and be located at a platform, and this fixation kit comprises connected porous property (continuous porous) sheet material, incorporate this paper reference in this.This connected porous property sheet material is made by resin (resin), and the surperficial cortex with a fine porous property, wherein the surperficial cortex of this connected porous property sheet material have a water resisting property (water repellence).Yet,, still can influence the polished base material of surperficial cortex adsorbed close of this connected porous property sheet material if the surperficial cortex unevenness degree of this connected porous property sheet material is big.
Therefore, just having to provide a kind of adsorption sheet and manufacture method thereof, can solve aforesaid shortcoming.
Summary of the invention
One of the present invention purpose is to provide a kind of connected porous property adsorption sheet, and the uneven degree on its surface is less than 10 μ m, and has good flatness and high adsorption.
For reaching above-mentioned purpose, the present invention provides a kind of adsorption sheet manufacture method, comprises the following step: a carrier is provided, and formation has a coating layer of polyurethane resin on this carrier, solidify then, wash and dry this coating layer, to make a connected porous property sheet material; And give planarization by the surface that a planarization processing procedure will this connected porous property sheet material, to make a connected porous property adsorption sheet, wherein the uneven degree of this sheet surface is less than 10 μ m.
Other has a burnishing device that utilizes adsorption sheet of the present invention, in order to polish the surface of various polished base materials, such as the surface of semiconductor substrate or glass substrate.Burnishing device of the present invention includes a upper mounting plate, a lower platform, an and grinding pad, wherein aforesaid this adsorption sheet, and it is to be fixed on this lower platform by viscose glue, this grinding pad is to be fixed on this upper mounting plate, and towards this adsorption sheet of this lower platform.
Compared to prior art, adsorption sheet of the present invention, the uneven degree on its surface be less than 10 μ m, and have good flatness and high adsorption, therefore when carrying out polishing, but the polished base material of adsorption sheet adsorbed close of the present invention.
In order to allow above and other objects of the present invention, feature and the advantage can be more obvious, hereinafter will cooperate appended icon, be described in detail below.
Description of drawings
Fig. 1 is the cut-away section schematic diagram of the burnishing device of prior art;
Fig. 2 is the flow chart of the adsorption sheet manufacture method of one of the present invention embodiment;
Fig. 3 is the generalized section according to connected porous property sheet material of the present invention;
Fig. 4-6 is the generalized section according to the first planarization processing procedure of connected porous property sheet material of the present invention;
Fig. 7-8 is the generalized section according to the second planarization processing procedure of connected porous property sheet material of the present invention;
Fig. 9 is the generalized section of tester table;
Figure 10 is the generalized section of burnishing device of the present invention.
[figure number explanation]
2 electro-optical devices, 11 lower platforms
12 viscose glues, 13 connected porous property sheet materials
14 templates 15 run through opening
16 upper mounting plates, 17 grinding pads
20 polishing substrates
100 burnishing devices, 111 lower platforms
112 viscose glues, 113 adsorption sheets
The 113b adsorption sheet
113c adsorption sheet 115 runs through opening
116 upper mounting plates, 117 grinding pads
120 polishing substrates
202 provide carrier 204 coatings
206 solidify 208 washings
212 oven dry, 214 sheet materials
232 applying flatness films 234 tear the flatness film off
236 adsorption sheets, 242 high temperature plate
244 adsorption sheets
300 connected porous property sheet material 302 connected porous property layers
304 carriers, 312 flatness films
314 surperficial 322 flat mirror wheels
400 tester tables, 402 puller systems
404 test samples, 406 glass desk-tops
408 backguys
The specific embodiment
With reference to figure 2, the adsorption sheet manufacture method of embodiment at first provides a carrier, as a coated substrates (step 202) one of according to the present invention.The coating materials that polyurethane resin (PU Resin), colorant, interface agent and dimethyl amide (DMF) are formed are coated with on this coated substrates to form a coating layer (step 204).This coating layer is solidified (step 206), washing (step 208) and oven dry processing such as (steps 212) to form connected porous property sheet material 300 (steps 214), as shown in Figure 3.Then, by the surface of smooth this connected porous property sheet material 300 of a planarization processing procedure, to make a connected porous property adsorption sheet.This connected porous property adsorption sheet comprises the connected porous property layer 302 that polyurethane resin is formed, wherein the uneven degree on one of this connected porous property adsorption sheet surface so makes this connected porous property adsorption sheet have good flatness and high adsorption less than 10 μ m.
The definition of unevenness degree is sweep electron microscope (SEM) sectional drawing by this connected porous property adsorption sheet, and regional extent please be set and choose 5 higher point height and 5 than the low spot height, in order to calculate average height.Then, the maximum difference of peak height or minimum point height and this average height is to be " uneven degree ".
The persond having ordinary knowledge in the technical field of the present invention as can be known, manufacture method of the present invention adopts and produces adsorption sheet in the continous way mode.That is this carrier, this coating layer, this connected porous property sheet material and this connected porous property adsorption sheet all have whole volume continuous profile in manufacture process, in order to a large amount of productions.
With reference to figure 4 to Fig. 6, this planarization processing procedure can be the first planarization processing procedure, comprise by high temperature and pressurization one flatness film 312 is fitted on these connected porous property layer 302 surfaces 314 (step 232), tear this flatness film 312 (the uneven degree of flatness film is less than 10 μ m) at last off and should connected porous property sheet material 300 release (step 234), so to make a connected porous property adsorption sheet 113b (step 236), wherein the uneven degree on the surface 314 of this connected porous property adsorption sheet 113b is less than 10 μ m, as shown in Figure 6.Perhaps, with reference to figure 7 and Fig. 8, this planarization processing procedure can be the second planarization processing procedure, comprise by a high temperature and flatten instrument, such as flat mirror wheel 322, the smooth degree of cross section air spots of this flat mirror wheel is less than 10 μ m, execute a suitable pressure in sheet surface with this high temperature pressing instrument, temperature and pressure are then looked the softening temperature of porous material and are adjusted during execution, porous sheet material heatproof is higher, then need for it with higher temperature, with the surface 314 surperficial high temperature of the connected porous property layer 302 of this connected porous property sheet material 300 plate (step 242), to make a connected porous property adsorption sheet 113c (step 244), wherein the uneven degree on the surface 314 of this connected porous property adsorption sheet 113c is less than 10 μ m, as shown in Figure 9.
With regard to an experimental example, according to adsorption sheet manufacture method of the present invention, at first with a flatness carrier, such as polypropylene film, PETG (PET Film), poly-acryl film, polyolefin film, weave cotton cloth or glass fibre as coated substrates.Evenly the coating of mixed weight percentage 19.9% is prepared into coating materials with the colorant of polyurethane resin (polyurethane resin), percentage by weight 6.6%, the interface agent and the 71%DMF solvent of percentage by weight 2.5%.Then, should be coated with materials and coat on the coated substrates, to form a coating layer.This coating layer is solidified, and the concentration 10% of its dimethyl amide (DMF) in coagulating basin exchanges solidifies.This coating layer is washed 70 ℃ of its washing temperature.This coating layer is dried, and 110 ℃ of its bake out temperatures make the polyurethane resin sheet material (PU Sheet) of a connected porous property.Then, carry out the first planarization processing procedure, utilize 150 ℃ high temperature and the pressurization with a flatness film, thickness 0.03mm PETG (PET Film) fits in this polyurethane resin sheet surface, tear this flatness film at last off and make the splendid flatness of this polyurethane resin sheet material tool, to make a connected porous based polyurethane resin adsorption sheet material.Perhaps, carry out the second planarization processing procedure, by a ultra tiny flat mirror wheel, its temperature is 170 ℃, is plated in the surface of this polyurethane resin sheet material, to make a connected porous based polyurethane resin adsorption sheet material.
The prepared connected porous property sheet material of prepared connected porous based polyurethane resin adsorption sheet material of first experimental example according to the present invention and prior art is adsorptivity such as following table relatively:
| Without the planarization processing procedure | Experimental example (the first planarization processing procedure) | Experimental example (the second planarization processing procedure) | No. the 5871393rd, prior art United States Patent (USP) | |
| Glass adsorptivity (pulling force numerical value) | 0.06kgf | 4.02kgf | 4.55kgf | 0.10kgf |
Wherein, the adsorptivity testing procedure is as follows:
Step 1: a tester table 400 (as shown in Figure 9) is provided, and it comprises a puller system 402, in order to show pulling force numerical value.
Step 2: a test sample 404 is provided, that is the sheet material of adsorption sheet of the present invention and prior art, its size is 2.54cm * 1.5cm.
Step 3: this test sample 404 is placed on the glass desk-top 406, and with this test sample of 5kg weight static pressure 5 minutes.Wherein, adsorption sheet of the present invention directly with the test of fitting of tested glass desktop, the sheet material of prior art is the surface tension absorption that utilizes water, so palpus elder generation in surface is with the water-wet tested glass desktop of fitting again.
Step 4: remove this 5kg weight, connect a backguy 408, start this puller system 402 then, up to this test sample 404 and this glass desk-top 406 break away from stop between, record institute must pulling force numerical value.Test three times pulling force numerical value, and calculate its mean value.
As previously mentioned, the pulling force numerical value of the adsorption sheet of experimental example of the present invention (first and second planarization processing procedure) be for 4.02kgf and 4.55kgf all greater than the pulling force numerical value of prior art sheet material (0.06 and 0.10kgf).Therefore, the glass adsorptivity of adsorption sheet of the present invention is greater than the glass adsorptivity of prior art sheet material.
With reference to Figure 10, it one of shows according to the present invention the burnishing device 100 of embodiment, in order to polish the surface of various polished base materials, such as the surface of semiconductor substrate or glass substrate.Adsorption sheet 113 of the present invention is to be fixed on the lower platform 111 by viscose glue 112.One grinding pad 117 is to be fixed on the upper mounting plate 116, and towards the adsorption sheet 113 of this lower platform 111.
Before carrying out the polishing processing procedure of polished base material 120, earlier this polished base material 120 is fixed on the connected porous property adsorption sheet 113 of this lower platform 111.Then, this upper mounting plate 116 and this lower platform 111 are to rotate in the opposite direction, and these upper mounting plate 116 declines, make the polished base material 120 of these grinding pad 117 contacts.The lapping liquid (aqueous solution) 121 that contains polishing particles is used between this grinding pad 117 and the polished base material 120.At last, by setting relative fricting movement and the time of this grinding pad 117, to carry out the polishing processing procedure with polished base material 120.
Compared to prior art, adsorption sheet of the present invention, the uneven degree on its surface be less than 10 μ m, and have good flatness and high adsorption, therefore when carrying out the processing procedure of the polished base material of polishing, but the polished base material of adsorption sheet adsorbed close of the present invention.
Though the present invention discloses with previous embodiment, so it is not in order to qualification the present invention, any persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore protection scope of the present invention defines and is as the criterion when looking accompanying claim.
Claims (8)
1, a kind of adsorption sheet manufacture method in order to fixing polishing substrate is characterized in that: comprise the following step:
A., one carrier is provided, forms and to have one of polyurethane resin coating layer on this carrier, solidify then, wash and dry this coating layer, to make a connected porous property sheet material; And
B. by a planarization processing procedure will this connected porous property sheet material the surface give planarization, to make a connected porous property adsorption sheet, wherein the uneven degree of this sheet surface is less than 10 μ m.
2, adsorption sheet manufacture method as claimed in claim 1, wherein this planarization processing procedure comprises the following step:
C. by high temperature and pressurization one flatness film is fitted in this connected porous property sheet surface; And
D. tear this flatness film off and should connected porous property sheet material release.
3, adsorption sheet manufacture method as claimed in claim 1, wherein this planarization processing procedure comprises the following step:
C '. flatten instrument by a high temperature, plated in the surface of this connected porous property sheet material.
4, adsorption sheet manufacture method as claimed in claim 3, wherein this high temperature pressing instrument is a flat mirror wheel.
5, adsorption sheet manufacture method as claimed in claim 1, wherein this carrier be by polypropylene screen, PETG film PET Film, poly-acryl film, polyolefin film, weave cotton cloth or the group of glass fibre in select.
6, a kind of adsorption sheet in order to fixing polishing substrate is characterized in that it comprises:
Have a connected porous property layer of polyurethane resin, wherein the uneven degree on this connected porous property adsorption sheet surface is less than 10 μ m.
7, a kind of burnishing device, it is characterized in that in order to polish a polishing substrate: this burnishing device comprises:
One upper mounting plate and a lower platform, wherein this lower platform is with respect to this upper mounting plate;
One adsorption sheet is fixed on this lower platform, and wherein this adsorption sheet comprises the connected porous property layer with polyurethane resin, in order to this polishing substrate of adsorbed close; And
One grinding pad is fixed on this upper mounting plate, and towards the adsorption sheet of this lower platform.
8, burnishing device as claimed in claim 7, wherein the uneven degree on this adsorption sheet surface is less than 10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100049786A CN100551624C (en) | 2005-01-31 | 2005-01-31 | Adsorption sheet and manufacture method and burnishing device in order to fixing polishing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100049786A CN100551624C (en) | 2005-01-31 | 2005-01-31 | Adsorption sheet and manufacture method and burnishing device in order to fixing polishing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1814411A true CN1814411A (en) | 2006-08-09 |
| CN100551624C CN100551624C (en) | 2009-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100049786A Expired - Fee Related CN100551624C (en) | 2005-01-31 | 2005-01-31 | Adsorption sheet and manufacture method and burnishing device in order to fixing polishing substrate |
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| CN (1) | CN100551624C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412201B (en) * | 2007-10-17 | 2012-04-18 | 硅电子股份公司 | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| CN101244534B (en) * | 2007-02-15 | 2012-05-23 | 三芳化学工业股份有限公司 | Bearing film used for fixing polished workpiece and its manufacturing method |
| CN102548709A (en) * | 2009-07-06 | 2012-07-04 | 旭硝子株式会社 | Grinding machine for plate-like bodies and method of grinding plate-like bodies |
| CN104339280A (en) * | 2014-11-13 | 2015-02-11 | 无锡市福吉电子科技有限公司 | Polishing disk device |
| CN105415168A (en) * | 2015-10-30 | 2016-03-23 | 佛山市金辉高科光电材料有限公司 | Composite polishing pad and preparation method thereof |
| CN107073681A (en) * | 2014-09-10 | 2017-08-18 | 丸石产业株式会社 | Keep pad |
-
2005
- 2005-01-31 CN CNB2005100049786A patent/CN100551624C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101244534B (en) * | 2007-02-15 | 2012-05-23 | 三芳化学工业股份有限公司 | Bearing film used for fixing polished workpiece and its manufacturing method |
| CN101412201B (en) * | 2007-10-17 | 2012-04-18 | 硅电子股份公司 | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| CN102548709A (en) * | 2009-07-06 | 2012-07-04 | 旭硝子株式会社 | Grinding machine for plate-like bodies and method of grinding plate-like bodies |
| CN107073681A (en) * | 2014-09-10 | 2017-08-18 | 丸石产业株式会社 | Keep pad |
| CN104339280A (en) * | 2014-11-13 | 2015-02-11 | 无锡市福吉电子科技有限公司 | Polishing disk device |
| CN105415168A (en) * | 2015-10-30 | 2016-03-23 | 佛山市金辉高科光电材料有限公司 | Composite polishing pad and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100551624C (en) | 2009-10-21 |
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