CN101244534B - Bearing film used for fixing polished workpiece and its manufacturing method - Google Patents
Bearing film used for fixing polished workpiece and its manufacturing method Download PDFInfo
- Publication number
- CN101244534B CN101244534B CN2007100974579A CN200710097457A CN101244534B CN 101244534 B CN101244534 B CN 101244534B CN 2007100974579 A CN2007100974579 A CN 2007100974579A CN 200710097457 A CN200710097457 A CN 200710097457A CN 101244534 B CN101244534 B CN 101244534B
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- substrate
- adhesive
- buffering
- surperficial
- elastomer
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G5/00—Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
- G09G5/34—Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators for rolling or scrolling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
- G06F3/0485—Scrolling or panning
Abstract
The invention relates to a bearing film for fixing the polishing piece, wherein the bearing film includes a surface substrate having a plurality of holes and a buffer substrate, and the materials of the surface substrate contain an elastomer. The buffer substrate contains a plurality of holes and the materials of the buffer substrate include the elastomer. The surface substrate and the buffer substrate are bonded by the adhesive contained in the elastomer. The invention also provides a method for manufacturing the bearing film. When polishing, the bearing film provides good impacting nature to conduct and release the down force applied on the polishing pieces.
Description
Technical field
The present invention relates to be used for fixing the carrier film and its manufacturing approach of polishing workpiece, and more particularly, relate to the carrier film that is used for fixing polishing workpiece and its manufacturing approach that in chemically mechanical polishing (CMP) processing procedure, use.
Background technology
Polishing generally refers in chemical mechanical polishing manufacture procedure the wear control for preliminary rough surface; It makes the slurries that contain particulate be evenly dispersed on the upper surface of polishing pad; And place polishing workpiece against said polishing pad simultaneously, and then with the said polishing workpiece of regular motion repeated friction.Polishing workpiece can be the for example object of semiconductor, medium substrate, integrated circuit, LCD flat panel glass, optical glass and photoelectric panel.During the polishing processing procedure, must use carrier film to carry and the fixing polishing workpiece, and the quality of carrier film directly influence the polishing effect of polishing workpiece.
Fig. 1 shows the sketch map of the burnishing device with conventional carrier film.Said burnishing device 1 comprises lower shoe 11, carrier film 12, polishing workpiece 13, upper plate 14, polishing pad 15 and slurries 16.Said carrier film 12 is adhered to said lower shoe 11 through adhesive layer 17, and is used for carrying and fixing polishing workpiece 13.Said polishing pad 15 is fixed on the said upper plate 14.
The operator scheme of burnishing device 1 is following.At first; Polishing workpiece 13 is fixed on the carrier film 12; And then rotate upper plate 14 and lower shoe 11 both; And move down upper plate 14 simultaneously so that the surface of polishing pad 15 contact polishing workpieces 13, and can through continuous supplementation slurries 16 with use polishing pad 15 be used for carrying out polishing operation to polishing workpiece 13.
Fig. 2 is the conventional carrier film of the first kind.The material of the conventional carrier film of the said first kind is the elastomer of foamed polyurethane for example.The surface of said carrier film is through polishing to form the surface of similar chamois leather.Carrier film only comprises a substrate, and the substrate bottom is more solid than substrate top.Because the thickness of substrate is restricted, thereby it only can provide small cushioning effect.In chemical mechanical polishing manufacture procedure, the upper plate of rotation moves down, and passes polishing pad generation downward force from upper plate, and said downward force is applied on the polishing workpiece.As a result, the downward force that is applied on the polishing workpiece can not be by even conduction and release, and this is because said conventional carrier film can not provide appropriate cushioning effect.This type of inhomogeneous power is pushed polishing workpiece usually and is made it break.
Developed the conventional carrier film of second type and in Fig. 3, showed.Said carrier film comprises surperficial substrate and at least one buffering substrate.The material of said surperficial substrate and said buffering substrate is the elastomer of foam Polyurethane for example.Said surface is bonding by contact adhesive (PSA) with the buffering substrate.An embodiment of said contact adhesive comprises the film that contains (for example) PET, and the adhesive that on the upside of said film and downside, has lazy flow, and said adhesive is called as the double-sided adhesive mixture.The thickness of said adhesive is usually greater than 20 μ m.Adhesive on the film upside is through being configured to be coupled to surperficial substrate, and the adhesive on the film downside will be coupled to the buffering substrate.The surface of carrier film is through polishing to form the surface of similar chamois leather.Through using said buffering substrate, downward force is able to conduction to a certain extent and discharges.Yet, because contact adhesive, surperficial substrate are different with shrinkage factor with the hardening ratio of buffering substrate, so thereby reduced cushioning effect.In addition, said pressure-sensitive adhesive film does not provide any cushioning effect.When polishing, said factor is also pushed said polishing workpiece and is made it break.
Summary of the invention
The object of the present invention is to provide a kind of carrier film that is used for fixing polishing workpiece.Said carrier film comprises surperficial substrate and buffering substrate.Said surperficial substrate comprises a plurality of holes, and the material of surperficial substrate comprises elastomer.Said buffering substrate comprises a plurality of holes, and the material of said buffering substrate comprises said elastomer.The surface substrate is bonding by comprising said elastomeric adhesive with the buffering substrate.When polishing, said carrier film provides comfort cushioning character to be applied to the downward force on the polishing workpiece with conduction and release.
Another object of the present invention is to provide a kind of method that is used to make the carrier film that is used for fixing polishing workpiece.Method of the present invention comprises following steps:
(a) the surperficial substrate that comprises a plurality of holes is provided, the material of said surperficial substrate comprises elastomer, and the buffering that comprises a plurality of holes substrate is provided, and the material of said buffering substrate comprises said elastomer; With
(b) use comprises next bonding said surperficial substrate of said elastomeric adhesive and said buffering substrate.
Description of drawings
Fig. 1 shows the sketch map of the burnishing device with conventional carrier film.
Fig. 2 shows the view of the conventional carrier film of the first kind under transmission electron microscope.
Fig. 3 shows the view of the second types of conventional carrier film under transmission electron microscope.
Fig. 4 shows the view (50X) of carrier film under transmission electron microscope of said instance.
Fig. 5 shows the view (100X) of carrier film under transmission electron microscope of said instance.
The specific embodiment
In order to obtain to have the carrier film that is used for fixing polishing workpiece of gratifying cushioning effect, the present invention provides a kind of novel carrier film.
Said carrier film comprises surperficial substrate and buffering substrate.Said surperficial substrate comprises a plurality of holes, and the material of said surperficial substrate comprises elastomer.Said buffering substrate comprises a plurality of holes, and the material of said buffering substrate comprises said elastomer.Said surperficial substrate and said buffering substrate are bonding by comprising said elastomeric adhesive.
Surperficial substrate according to the present invention comprises two surfaces, and it preferably has the first kind that the is used for fixing said polishing workpiece surface like chamois leather.The surface of said similar chamois leather provides big frictional force, and is designed to firmly fix said polishing workpiece.The second surface of said surperficial substrate preferably comprises first flat surfaces that is used to be adhered to said buffering substrate.Said first flat surfaces provides good interface to comprise said elastomeric adhesive and be adhered to said buffering substrate with use.
For better cushioning effect is provided, the thickness of said surperficial substrate preferably at 0.05mm between the 5.00mm.Said thickness range provides the optimized buffer effect, thereby avoids the existence like the solid bottom that in conventional carrier film, is observed.
In a preferred embodiment of the invention, said buffering substrate has second flat surfaces.If said second flat surfaces is positioned on the upper surface of said buffering substrate, it helps will to cushion substrate through comprising said elastomeric adhesive and is fastened to surperficial substrate so.On the other hand, if second flat surfaces is positioned on the lower surface of buffering substrate, it helps the lower shoe that cushions substrate and also whole carrier film is fastened to burnishing device so.
The surface substrate is continuous or discrete with the hole of buffering substrate.Said hole can be distributed in the substrate air, and the cooperation of the elastomer of air and substrate is to be provided for discharging and conducting the flexible structure of the downward force that in the polishing processing procedure, takes place.As used herein continuous hole refers to hole connected to one another.On the other hand, as used herein discontinuous hole refers to independently and is not connected to the hole in other hole.The diameter in said hole is preferably from 0.001 μ m to 1000 μ m.
The invention is characterized in that surperficial substrate is identical (being elastomer) with the material of buffering substrate, and use and to comprise said elastomeric adhesive and come adhesive surface substrate and buffering substrate.As used herein, term " elastomer " (being also referred to as " elastomeric polymer ") refers to one type of polymer that represents the rubber like quality.When polishing, elastomer serves as comfort cushioning character and is applied to the downward force on the polishing workpiece with conduction and release.In a preferred embodiment of the invention, said elastomer is a foamed resin.As used herein, term " foamed resin " refers to the material that contains thermoplastic resin and pyrolysis foaming agent.Preferably, said elastomer comprises at least one in Polyurethane (PU), polypropylene (PP), polyethylene (PE) or the polyvinyl chloride (PVC); More preferably, it comprises Polyurethane.
In a preferred embodiment of the invention, the said elastomeric adhesive that comprises that is used for adhesive surface substrate and buffering substrate is the adhesive of selecting from the group that is made up of following each thing: single composition adhesive, two composition adhesive and wet type solidification adhesive.Said adhesive can be penetrated in the surface of surperficial substrate and buffering substrate, and can bonding tightly these two substrates.In addition, the elastomer in the said adhesive has and surperficial substrate and identical hardening ratio and the shrinkage factor of buffering substrate, so that the conduction of the downward force that in the polishing processing procedure, is taken place and release all are improved.Said single composition adhesive refers to and comprises the adhesive that high molecular weight elastomer serves as adhesive.The said pair of composition adhesive refers to and comprises the adhesive that interacts or be cross-linked to each other with two components obtaining bonding effect.Two composition adhesives preferably comprise elastomer and PIC.Said wet type solidification adhesive (being also referred to as " moisture-curable adhesive ") refers to the adhesive that elastomer unit wherein is cross-linked to each other according to airborne moisture.The thickness that is used for the adhesive surface substrate and the adhesive of buffering substrate is preferably less than 1 μ m.Said thin adhesive provides quality interface between surperficial substrate and buffering substrate.On the other hand, the stress of adhesive that is used for adhesive surface substrate and buffering substrate is 5kg/cm
2To 500kg/cm
2
Can apply the adhesive that is used for adhesive surface substrate and buffering substrate in a number of ways.In a preferred embodiment of the invention, be used for the adhesive surface substrate and form a plurality of bonding projections, bonding film or a plurality of bounding point with the elastomer that cushions substrate.Said adhesive not only can bonding these two substrates, but also appropriate cushioning effect can be provided.
The present invention also provides a kind of method that is used to make the carrier film that is used for fixing polishing workpiece, and said method comprises following steps:
(a) the surperficial substrate that comprises a plurality of holes is provided, the material of said surperficial substrate comprises elastomer, and the buffering that comprises a plurality of holes substrate is provided, and the material of said buffering substrate comprises said elastomer; With
(b) use and to comprise said elastomeric adhesive and come adhesive surface substrate and buffering substrate.
The adhesive surface substrate changes according to binder form with the mode of buffering substrate.The adhesive that preferably will be used for adhesive surface substrate and buffering substrate through applying, spray or swiping is applied at least one surface of surperficial substrate and buffering substrate.
In a preferred embodiment of the invention, use wheel to carry out the coating of adhesive with 10 grid to 800 grids.Adhesive is applied at least one surface of surperficial substrate and buffering substrate through wheel, and forms bonding projection, thereby avoids too much adhesive.
In a preferred embodiment of the invention, use the nozzle of hole count between 1 and 10,000 to carry out the injection of adhesive, and hole dimension at 1 μ m between the 1000 μ m.Through said nozzle adhesive is applied at least one surface of surperficial substrate and buffering substrate,, thereby avoids too much adhesive with formation adhesive film or point.
In a preferred embodiment of the invention, use scraper to carry out the scraping of adhesive.Through scraper adhesive is applied at least one surface of surperficial substrate and buffering substrate,, thereby avoids too much adhesive with the formation adhesive film.
After applying adhesive, adhesive surface substrate and buffering substrate.Preferably at 0kg/cm
2To 10kg/cm
2Pressure under the adhesive surface substrate with the buffering substrate.On the other hand, adhesive surface substrate and buffering substrate under 0 ℃ to 300 ℃ temperature.
If necessary, process in accordance with the present invention (b) further comprises curing schedule.In some cases, adhesive needs said curing schedule to solidify and forms combination.The condition of said curing schedule and mode change according to employed adhesive.
Only provide following instance for purpose of explanation, and do not hope that it limits scope of the present invention.
Instance:
Surface substrate: on barrier paper, apply the Polyurethane (as elastomer) in the dimethyl formamide (as solvent), and then put it in the curing solution that comprises water so that shaping of said elastomer and formation comprise the surperficial substrate in a plurality of holes.
Surface treatment: said surperficial substrate receives the polishing processing procedure to form the surface of similar chamois leather.
Buffering substrate: on barrier paper, apply the Polyurethane (as elastomer) in the dimethyl formamide (as solvent), and then put it in the curing solution that comprises water so that shaping of said elastomer and formation comprise the buffering substrate in a plurality of holes.
Bonding: as, to use wheel to come surface with two composition Polyurethane adhesives coating buffering substrates with 150 grids after surperficial substrate and buffering substrate removal barrier paper.At 65 ℃ and 6.0kg/cm
2Following drying buffer substrate and it is adhered to surperficial substrate.Then, under 45 ℃, said substrate is solidified 48 hours to form carrier film.
The said carrier film of observation under transmission electron microscope, and in Fig. 4 (50X) and Fig. 5 (100X), show.Referring to Fig. 4 and Fig. 5, the thickness of bonding Polyurethane is less than 1 μ m.
Although explained and described some embodiment of the present invention, the those skilled in the art can make various modifications and improvement.Therefore, be not to have described the embodiment of the invention on the restrictive, sense in illustrative.Hope that the present invention can be not restricted to illustrated particular form, and all modifications of keeping spirit and scope of the invention belongs in the scope that appended claims defines.
Claims (6)
1. method that is used to make the carrier film that is used for fixing polishing workpiece, it comprises following steps:
(a) the surperficial substrate that comprises a plurality of holes and the buffering that comprises a plurality of holes substrate is provided, the material of said surperficial substrate comprises elastomer, and the material of said buffering substrate comprises said elastomer; With
(b) will be used for comprising of bonding said surperficial substrate and said buffering substrate of said elastomeric said adhesive through coating with comprising said elastomeric adhesive; Be applied at least one surface of said surperficial substrate or said buffering substrate; Come bonding said surperficial substrate and said buffering substrate, wherein use roller to carry out the coating of said adhesive with 10 grid to 800 grids.
2. method according to claim 1 wherein is used for comprising of bonding said surperficial substrate and said buffering substrate said elastomeric said adhesive and selects from the group that is made up of following each thing: single composition adhesive, two composition adhesive and wet type solidification adhesive.
3. method according to claim 2, wherein said pair of composition adhesive comprises said elastomer and PIC.
4. method according to claim 1 is wherein at 0kg/cm
2To 10kg/cm
2Pressure under bonding said surperficial substrate and said buffering substrate.
5. method according to claim 1, wherein bonding said surperficial substrate and said buffering substrate under 0 ℃ to 300 ℃ temperature.
6. method according to claim 1, wherein in said step (b) afterwards, said method further comprises curing schedule.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/706,206 US20080068403A1 (en) | 2006-09-19 | 2007-02-15 | Scroll control apparatus, scroll control method, and computer product |
| US11/706,206 | 2007-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101244534A CN101244534A (en) | 2008-08-20 |
| CN101244534B true CN101244534B (en) | 2012-05-23 |
Family
ID=46087688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100974579A Expired - Fee Related CN101244534B (en) | 2007-02-15 | 2007-04-29 | Bearing film used for fixing polished workpiece and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101244534B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3462326A (en) * | 1966-05-31 | 1969-08-19 | Uniroyal Inc | Method of making a leather-like microporous sheet material |
| US3827930A (en) * | 1970-03-09 | 1974-08-06 | Norwood Ind Inc | Production of polyurethane film/split leather laminate |
| US4218505A (en) * | 1976-04-01 | 1980-08-19 | Toyo Cloth Co., Ltd. | Production of polyurethane-split leather laminate |
| US5151240A (en) * | 1989-09-06 | 1992-09-29 | Kanebo, Ltd. | Leather-like material having excellent water vapor permeability and suppleness and its manufacture |
| CN1475330A (en) * | 2002-08-15 | 2004-02-18 | 三芳化学工业股份有限公司 | Production method of polishing material |
| CN1606133A (en) * | 2003-09-26 | 2005-04-13 | Cmp罗姆和哈斯电子材料控股公司 | Resilient polishing pad for chemical mechanical polishing |
| CN1814410A (en) * | 2005-02-02 | 2006-08-09 | 三芳化学工业股份有限公司 | Lapping sheet and its manufacturing method and polishing device |
| CN1814411A (en) * | 2005-01-31 | 2006-08-09 | 三芳化学工业股份有限公司 | Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device |
-
2007
- 2007-04-29 CN CN2007100974579A patent/CN101244534B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3462326A (en) * | 1966-05-31 | 1969-08-19 | Uniroyal Inc | Method of making a leather-like microporous sheet material |
| US3827930A (en) * | 1970-03-09 | 1974-08-06 | Norwood Ind Inc | Production of polyurethane film/split leather laminate |
| US4218505A (en) * | 1976-04-01 | 1980-08-19 | Toyo Cloth Co., Ltd. | Production of polyurethane-split leather laminate |
| US5151240A (en) * | 1989-09-06 | 1992-09-29 | Kanebo, Ltd. | Leather-like material having excellent water vapor permeability and suppleness and its manufacture |
| CN1475330A (en) * | 2002-08-15 | 2004-02-18 | 三芳化学工业股份有限公司 | Production method of polishing material |
| CN1606133A (en) * | 2003-09-26 | 2005-04-13 | Cmp罗姆和哈斯电子材料控股公司 | Resilient polishing pad for chemical mechanical polishing |
| CN1814411A (en) * | 2005-01-31 | 2006-08-09 | 三芳化学工业股份有限公司 | Adsorption sheet for fixing polishing substrate and its manufacturing method and polishing device |
| CN1814410A (en) * | 2005-02-02 | 2006-08-09 | 三芳化学工业股份有限公司 | Lapping sheet and its manufacturing method and polishing device |
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| Publication number | Publication date |
|---|---|
| CN101244534A (en) | 2008-08-20 |
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Granted publication date: 20120523 |
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