CN1751549A - 用来在基片上安装电气元器件的抓取单元 - Google Patents
用来在基片上安装电气元器件的抓取单元 Download PDFInfo
- Publication number
- CN1751549A CN1751549A CNA2004800045488A CN200480004548A CN1751549A CN 1751549 A CN1751549 A CN 1751549A CN A2004800045488 A CNA2004800045488 A CN A2004800045488A CN 200480004548 A CN200480004548 A CN 200480004548A CN 1751549 A CN1751549 A CN 1751549A
- Authority
- CN
- China
- Prior art keywords
- anchor clamps
- placement unit
- coupling
- components
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 230000008878 coupling Effects 0.000 claims abstract description 32
- 238000010168 coupling process Methods 0.000 claims abstract description 32
- 238000005859 coupling reaction Methods 0.000 claims abstract description 32
- 238000009434 installation Methods 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 235000019788 craving Nutrition 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53196—Means to apply magnetic force directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manipulator (AREA)
- Clamps And Clips (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10341069 | 2003-09-05 | ||
DE10341069.4 | 2003-09-05 | ||
PCT/EP2004/051521 WO2005025287A1 (de) | 2003-09-05 | 2004-07-16 | Greifereinheit zum bestücken von substraten mit elektrischen bauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1751549A true CN1751549A (zh) | 2006-03-22 |
CN100484388C CN100484388C (zh) | 2009-04-29 |
Family
ID=34258444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800045488A Expired - Fee Related CN100484388C (zh) | 2003-09-05 | 2004-07-16 | 用来在基片上安装电气元器件的抓取单元 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7426781B2 (zh) |
EP (1) | EP1570714B1 (zh) |
JP (1) | JP2006514444A (zh) |
KR (1) | KR20060123672A (zh) |
CN (1) | CN100484388C (zh) |
DE (1) | DE502004001596D1 (zh) |
WO (1) | WO2005025287A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103188926A (zh) * | 2011-12-27 | 2013-07-03 | 三星泰科威株式会社 | 用于表面贴装器件的吸附头及其装配和维修方法 |
CN106969003A (zh) * | 2017-04-12 | 2017-07-21 | 上海与德科技有限公司 | 用于射频电路匹配调试的辅助装置 |
CN113099713A (zh) * | 2019-12-23 | 2021-07-09 | 先进装配***有限责任两合公司 | 具弹性弹簧件和气动通道***的元件保持装置、装配头、装配机及用于装配元件载体的方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006002367B3 (de) * | 2006-01-17 | 2007-10-04 | Mühlbauer Ag | Vorrichtung und Verfahren zur Übertragung einer Mehrzahl von Chips von einem Wafer auf ein Substrat |
US8167524B2 (en) * | 2007-11-16 | 2012-05-01 | Asm Assembly Automation Ltd | Handling system for inspecting and sorting electronic components |
DE102008020585B4 (de) * | 2008-04-24 | 2011-03-24 | Multitest Elektronische Systeme Gmbh | Plunger mit Schnellverriegelungssystem |
WO2011042034A1 (de) * | 2009-10-06 | 2011-04-14 | Aerolas Gmbh | Bestückungskopf zum handhaben elektrischer oder elektronischer bauelemente |
CN104670892B (zh) * | 2013-11-29 | 2017-02-08 | 鸿富锦精密工业(深圳)有限公司 | 取放料装置 |
CN104816310A (zh) * | 2014-02-04 | 2015-08-05 | 精工爱普生株式会社 | 机器人手、机器人、以及机器人手的制造方法 |
NL2013584B1 (nl) * | 2014-10-07 | 2017-01-27 | Assembléon B V | Componentplaatsingsinrichting alsmede werkwijze voor het opnemen van een component en het plaatsen van een component op een substraat. |
SG11201810084WA (en) * | 2016-06-28 | 2018-12-28 | Akribis Systems Pte Ltd | Pick-and-place device having force measurement capability |
KR102545230B1 (ko) * | 2016-11-02 | 2023-06-19 | 삼성전자주식회사 | 피커 어셈블리 및 이를 구비하는 추출장치 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3938088A1 (de) | 1989-11-16 | 1991-05-23 | Bosch Gmbh Robert | Bestueckkopf fuer elektronische bauelemente |
US5029383A (en) * | 1990-06-07 | 1991-07-09 | Universal Instruments Corporation | Articulating tip for pick and place head |
US5285946A (en) * | 1991-10-11 | 1994-02-15 | Sanyo Electric Co., Ltd. | Apparatus for mounting components |
KR930017478A (ko) | 1992-01-21 | 1993-08-30 | 스펜서 티이 스미스 | 표면 장착형 전자 부품들을 인쇄회로 기판상에 배치시키는 기계 |
US5308132A (en) * | 1992-10-05 | 1994-05-03 | Motorola, Inc. | Circuit assembly device for programmably controlling placement force and method thereto |
US5410801A (en) * | 1993-02-08 | 1995-05-02 | Automated Production Systems | Apparatus for manually controlled placement of components on circuit boards |
US5422554A (en) * | 1993-03-05 | 1995-06-06 | Motorola, Inc. | Vacuum nozzle capable of adjustable placing force |
DE19514686A1 (de) | 1995-04-20 | 1996-10-24 | Samsung Electronics Co Ltd | Zentrierapparat für eine Vorrichtung zum Anbringen von Bausteinen |
US5644279A (en) * | 1996-04-03 | 1997-07-01 | Micron Technology, Inc. | Actuator assembly |
JPH1027996A (ja) * | 1996-07-10 | 1998-01-27 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
US6298547B1 (en) * | 1997-09-25 | 2001-10-09 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding component, apparatus for mounting component, and method for mounting component |
US6895662B2 (en) * | 1997-09-25 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding and mounting a component |
US6276051B1 (en) * | 1998-01-29 | 2001-08-21 | Fuji Machine Mfg. Co., Ltd. | Electric-component transferring apparatus |
DE19919917A1 (de) * | 1999-04-30 | 2000-11-16 | Siemens Ag | Verfahren und Vorrichtung zum Bestücken von Substraten mit Bauelementen |
JP2001047385A (ja) * | 1999-08-05 | 2001-02-20 | Fuji Mach Mfg Co Ltd | 電気部品装着ヘッド |
JP2001053496A (ja) * | 1999-08-06 | 2001-02-23 | Matsushita Electric Ind Co Ltd | 電子部品実装方法 |
KR100344905B1 (ko) * | 2000-09-09 | 2002-07-20 | 미래산업 주식회사 | 표면실장장치에서 모듈헤드의 부품흡착장치 |
EP1240813B1 (en) | 2000-09-13 | 2008-05-21 | Koninklijke Philips Electronics N.V. | Device for placing components on a carrier |
AT411855B (de) | 2001-06-26 | 2004-06-25 | Datacon Semiconductor Equip | Einrichtung zum positionieren |
-
2004
- 2004-07-16 EP EP04741999A patent/EP1570714B1/de not_active Expired - Lifetime
- 2004-07-16 CN CNB2004800045488A patent/CN100484388C/zh not_active Expired - Fee Related
- 2004-07-16 DE DE502004001596T patent/DE502004001596D1/de not_active Expired - Lifetime
- 2004-07-16 JP JP2005518429A patent/JP2006514444A/ja active Pending
- 2004-07-16 WO PCT/EP2004/051521 patent/WO2005025287A1/de active IP Right Grant
- 2004-07-16 KR KR1020057014933A patent/KR20060123672A/ko not_active Application Discontinuation
- 2004-07-16 US US10/545,615 patent/US7426781B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103188926A (zh) * | 2011-12-27 | 2013-07-03 | 三星泰科威株式会社 | 用于表面贴装器件的吸附头及其装配和维修方法 |
CN103188926B (zh) * | 2011-12-27 | 2017-08-04 | 韩华泰科株式会社 | 用于表面贴装器件的吸附头及其装配和维修方法 |
CN106969003A (zh) * | 2017-04-12 | 2017-07-21 | 上海与德科技有限公司 | 用于射频电路匹配调试的辅助装置 |
CN113099713A (zh) * | 2019-12-23 | 2021-07-09 | 先进装配***有限责任两合公司 | 具弹性弹簧件和气动通道***的元件保持装置、装配头、装配机及用于装配元件载体的方法 |
CN113099713B (zh) * | 2019-12-23 | 2022-10-14 | 先进装配***有限责任两合公司 | 元件保持装置、装配头、装配机及装配元件载体的方法 |
Also Published As
Publication number | Publication date |
---|---|
DE502004001596D1 (de) | 2006-11-09 |
WO2005025287A1 (de) | 2005-03-17 |
US20060242821A1 (en) | 2006-11-02 |
JP2006514444A (ja) | 2006-04-27 |
CN100484388C (zh) | 2009-04-29 |
US7426781B2 (en) | 2008-09-23 |
EP1570714A1 (de) | 2005-09-07 |
EP1570714B1 (de) | 2006-09-27 |
KR20060123672A (ko) | 2006-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090925 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Munich, Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 |