CN1707802A - 背栅FinFET SRAM - Google Patents
背栅FinFET SRAM Download PDFInfo
- Publication number
- CN1707802A CN1707802A CNA2005100562989A CN200510056298A CN1707802A CN 1707802 A CN1707802 A CN 1707802A CN A2005100562989 A CNA2005100562989 A CN A2005100562989A CN 200510056298 A CN200510056298 A CN 200510056298A CN 1707802 A CN1707802 A CN 1707802A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 125000006850 spacer group Chemical group 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 19
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1211—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/709,998 US7084461B2 (en) | 2004-06-11 | 2004-06-11 | Back gate FinFET SRAM |
US10/709,998 | 2004-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1707802A true CN1707802A (zh) | 2005-12-14 |
CN100367505C CN100367505C (zh) | 2008-02-06 |
Family
ID=35459641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100562989A Active CN100367505C (zh) | 2004-06-11 | 2005-04-05 | 背栅FinFET SRAM |
Country Status (2)
Country | Link |
---|---|
US (2) | US7084461B2 (zh) |
CN (1) | CN100367505C (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103985750A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN103985753A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN103985748A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体设置及其制造方法 |
WO2014121540A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
WO2014121539A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN104134456A (zh) * | 2014-06-30 | 2014-11-05 | 上海集成电路研发中心有限公司 | 一种stt-mram存储单元 |
CN101506957B (zh) * | 2006-08-22 | 2015-11-25 | 美光科技公司 | 用于制造鳍式场效应晶体管的***及方法 |
CN107591371A (zh) * | 2016-07-08 | 2018-01-16 | 格罗方德半导体公司 | 形成sadp于sram上及saqp于逻辑上的装置及方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7348641B2 (en) * | 2004-08-31 | 2008-03-25 | International Business Machines Corporation | Structure and method of making double-gated self-aligned finFET having gates of different lengths |
US7227183B2 (en) * | 2004-09-17 | 2007-06-05 | International Business Machines Corporation | Polysilicon conductor width measurement for 3-dimensional FETs |
US7323374B2 (en) * | 2005-09-19 | 2008-01-29 | International Business Machines Corporation | Dense chevron finFET and method of manufacturing same |
WO2007138517A1 (en) * | 2006-05-30 | 2007-12-06 | Nxp B.V. | Array configuration for dram memory with double-gate floating-body finfet cells |
US7772656B2 (en) * | 2006-12-14 | 2010-08-10 | International Business Machines Corporation | Combination planar FET and FinFET device |
US7772048B2 (en) * | 2007-02-23 | 2010-08-10 | Freescale Semiconductor, Inc. | Forming semiconductor fins using a sacrificial fin |
US7408800B1 (en) * | 2007-05-03 | 2008-08-05 | International Business Machines Corporation | Apparatus and method for improved SRAM device performance through double gate topology |
US20080273366A1 (en) * | 2007-05-03 | 2008-11-06 | International Business Machines Corporation | Design structure for improved sram device performance through double gate topology |
US7710765B2 (en) * | 2007-09-27 | 2010-05-04 | Micron Technology, Inc. | Back gated SRAM cell |
US7915691B2 (en) * | 2007-10-30 | 2011-03-29 | International Business Machines Corporation | High density SRAM cell with hybrid devices |
CN101939830A (zh) * | 2008-02-11 | 2011-01-05 | Nxp股份有限公司 | 具有分立栅极的FinFET及其制造方法 |
US8621398B2 (en) * | 2010-05-14 | 2013-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Automatic layout conversion for FinFET device |
US8735972B2 (en) * | 2011-09-08 | 2014-05-27 | International Business Machines Corporation | SRAM cell having recessed storage node connections and method of fabricating same |
US8609480B2 (en) | 2011-12-21 | 2013-12-17 | Globalfoundries Inc. | Methods of forming isolation structures on FinFET semiconductor devices |
US8766364B2 (en) * | 2012-08-31 | 2014-07-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin field effect transistor layout for stress optimization |
KR102054302B1 (ko) | 2013-06-21 | 2019-12-10 | 삼성전자 주식회사 | 반도체 장치 및 그 제조 방법 |
CN104282748B (zh) * | 2013-07-03 | 2017-09-08 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
US9799660B1 (en) | 2016-05-11 | 2017-10-24 | Globalfoundries Inc. | Stable and reliable FinFET SRAM with improved beta ratio |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6472767B1 (en) * | 1999-04-30 | 2002-10-29 | Infineon Technologies Ag | Static random access memory (SRAM) |
US6228706B1 (en) * | 1999-08-26 | 2001-05-08 | International Business Machines Corporation | Vertical DRAM cell with TFT over trench capacitor |
JP2001203763A (ja) * | 2000-01-24 | 2001-07-27 | Nec Ic Microcomput Syst Ltd | 信号伝送方法および装置、データ処理装置 |
US6391782B1 (en) * | 2000-06-20 | 2002-05-21 | Advanced Micro Devices, Inc. | Process for forming multiple active lines and gate-all-around MOSFET |
US6413802B1 (en) * | 2000-10-23 | 2002-07-02 | The Regents Of The University Of California | Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture |
US6458662B1 (en) * | 2001-04-04 | 2002-10-01 | Advanced Micro Devices, Inc. | Method of fabricating a semiconductor device having an asymmetrical dual-gate silicon-germanium (SiGe) channel MOSFET and a device thereby formed |
US6870225B2 (en) * | 2001-11-02 | 2005-03-22 | International Business Machines Corporation | Transistor structure with thick recessed source/drain structures and fabrication process of same |
US6433609B1 (en) * | 2001-11-19 | 2002-08-13 | International Business Machines Corporation | Double-gate low power SOI active clamp network for single power supply and multiple power supply applications |
US6610576B2 (en) * | 2001-12-13 | 2003-08-26 | International Business Machines Corporation | Method for forming asymmetric dual gate transistor |
US6583469B1 (en) | 2002-01-28 | 2003-06-24 | International Business Machines Corporation | Self-aligned dog-bone structure for FinFET applications and methods to fabricate the same |
US20030151077A1 (en) * | 2002-02-13 | 2003-08-14 | Leo Mathew | Method of forming a vertical double gate semiconductor device and structure thereof |
US6800910B2 (en) * | 2002-09-30 | 2004-10-05 | Advanced Micro Devices, Inc. | FinFET device incorporating strained silicon in the channel region |
US6611029B1 (en) * | 2002-11-08 | 2003-08-26 | Advanced Micro Devices, Inc. | Double gate semiconductor device having separate gates |
WO2004049406A1 (en) * | 2002-11-25 | 2004-06-10 | International Business Machines Corporation | Strained finfet cmos device structures |
US6800885B1 (en) * | 2003-03-12 | 2004-10-05 | Advance Micro Devices, Inc. | Asymmetrical double gate or all-around gate MOSFET devices and methods for making same |
CN1194415C (zh) * | 2003-05-29 | 2005-03-23 | 北京大学 | 背栅mos晶体管及其制作方法和静态随机存储器 |
US6924560B2 (en) * | 2003-08-08 | 2005-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Compact SRAM cell with FinFET |
JP2005142289A (ja) * | 2003-11-05 | 2005-06-02 | Toshiba Corp | 半導体記憶装置 |
US7049654B2 (en) * | 2004-03-31 | 2006-05-23 | Intel Corporation | Memory with split gate devices and method of fabrication |
-
2004
- 2004-06-11 US US10/709,998 patent/US7084461B2/en active Active
-
2005
- 2005-04-05 CN CNB2005100562989A patent/CN100367505C/zh active Active
-
2006
- 2006-04-11 US US11/401,786 patent/US7491589B2/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101506957B (zh) * | 2006-08-22 | 2015-11-25 | 美光科技公司 | 用于制造鳍式场效应晶体管的***及方法 |
WO2014121537A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体设置及其制造方法 |
CN103985748A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体设置及其制造方法 |
CN103985750A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
WO2014121540A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
WO2014121545A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
WO2014121539A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
WO2014121543A1 (zh) * | 2013-02-08 | 2014-08-14 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN103985753A (zh) * | 2013-02-08 | 2014-08-13 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN103985750B (zh) * | 2013-02-08 | 2016-12-28 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
CN103985748B (zh) * | 2013-02-08 | 2016-12-28 | 中国科学院微电子研究所 | 半导体设置及其制造方法 |
CN104134456A (zh) * | 2014-06-30 | 2014-11-05 | 上海集成电路研发中心有限公司 | 一种stt-mram存储单元 |
CN107591371A (zh) * | 2016-07-08 | 2018-01-16 | 格罗方德半导体公司 | 形成sadp于sram上及saqp于逻辑上的装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
US7084461B2 (en) | 2006-08-01 |
US20050275040A1 (en) | 2005-12-15 |
US20060183289A1 (en) | 2006-08-17 |
US7491589B2 (en) | 2009-02-17 |
CN100367505C (zh) | 2008-02-06 |
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Effective date of registration: 20171204 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171204 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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