CN1654518A - 一种挠性印刷线路板用聚酰亚胺薄膜的制备方法 - Google Patents
一种挠性印刷线路板用聚酰亚胺薄膜的制备方法 Download PDFInfo
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- CN1654518A CN1654518A CN200510038294.8A CN200510038294A CN1654518A CN 1654518 A CN1654518 A CN 1654518A CN 200510038294 A CN200510038294 A CN 200510038294A CN 1654518 A CN1654518 A CN 1654518A
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- kapton
- dianhydride
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- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 229920001721 polyimide Polymers 0.000 title claims abstract description 18
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 12
- 150000004985 diamines Chemical class 0.000 claims abstract description 10
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 239000004014 plasticizer Substances 0.000 claims abstract description 6
- 239000003880 polar aprotic solvent Substances 0.000 claims abstract description 5
- 230000002194 synthesizing effect Effects 0.000 claims abstract description 5
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 35
- 239000004902 Softening Agent Substances 0.000 claims description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 8
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 8
- 230000000087 stabilizing effect Effects 0.000 claims description 6
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 4
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000005357 flat glass Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical compound NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- -1 amido benzene Chemical compound 0.000 claims description 3
- 150000004984 aromatic diamines Chemical class 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical group C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- 150000005690 diesters Chemical class 0.000 claims description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 2
- 125000005498 phthalate group Chemical class 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical class [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 2
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical group C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims 1
- OHQOKJPHNPUMLN-UHFFFAOYSA-N n,n'-diphenylmethanediamine Chemical class C=1C=CC=CC=1NCNC1=CC=CC=C1 OHQOKJPHNPUMLN-UHFFFAOYSA-N 0.000 claims 1
- 238000001291 vacuum drying Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000009396 hybridization Methods 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- 241000370738 Chlorion Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 125000004427 diamine group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- ICAKDTKJOYSXGC-UHFFFAOYSA-K lanthanum(iii) chloride Chemical compound Cl[La](Cl)Cl ICAKDTKJOYSXGC-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- CXVGEDCSTKKODG-UHFFFAOYSA-N sulisobenzone Chemical compound C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 CXVGEDCSTKKODG-UHFFFAOYSA-N 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102952511A (zh) * | 2011-08-16 | 2013-03-06 | 通用电气公司 | 环氧树脂封装和层压粘合剂及其制备方法 |
CN103145985A (zh) * | 2012-12-09 | 2013-06-12 | 上海飞凯光电材料股份有限公司 | 聚酰亚胺树脂的制备及其在耐高温光纤涂料中的应用 |
CN103374130A (zh) * | 2012-04-20 | 2013-10-30 | 达迈科技股份有限公司 | 芳香族聚酰亚胺膜、其制备方法、及其应用 |
CN103732405A (zh) * | 2011-06-14 | 2014-04-16 | 宇部兴产株式会社 | 制备聚酰亚胺层压制品的方法以及该聚酰亚胺层压制品 |
WO2015080139A1 (ja) * | 2013-11-27 | 2015-06-04 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
CN106047373A (zh) * | 2015-04-14 | 2016-10-26 | Jsr株式会社 | 液晶取向剂、液晶取向膜及液晶元件 |
CN109401313A (zh) * | 2018-10-31 | 2019-03-01 | 株洲时代新材料科技股份有限公司 | 一种聚酰亚胺薄膜及其制备方法 |
CN110253904A (zh) * | 2019-07-18 | 2019-09-20 | 桂林电器科学研究院有限公司 | 一种聚酰亚胺厚膜或超厚膜及其制备方法 |
CN110343275A (zh) * | 2019-07-18 | 2019-10-18 | 桂林电器科学研究院有限公司 | 一种聚酰亚胺超薄膜的制备方法 |
CN110437614A (zh) * | 2019-07-26 | 2019-11-12 | 宁波今山新材料有限公司 | 可成型聚酰亚胺薄膜的制备方法 |
CN114026179A (zh) * | 2019-06-24 | 2022-02-08 | 株式会社钟化 | 透明聚酰亚胺薄膜及其制造方法 |
CN114286835A (zh) * | 2019-08-29 | 2022-04-05 | 聚酰亚胺先端材料有限公司 | 聚酰亚胺薄膜及其制备方法 |
CN114616269A (zh) * | 2019-11-07 | 2022-06-10 | 聚酰亚胺先端材料有限公司 | 低介电质的聚酰亚胺薄膜及其制备方法 |
-
2005
- 2005-01-31 CN CN200510038294.8A patent/CN1288194C/zh active Active
Cited By (23)
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CN103732405A (zh) * | 2011-06-14 | 2014-04-16 | 宇部兴产株式会社 | 制备聚酰亚胺层压制品的方法以及该聚酰亚胺层压制品 |
CN102952511A (zh) * | 2011-08-16 | 2013-03-06 | 通用电气公司 | 环氧树脂封装和层压粘合剂及其制备方法 |
CN103374130B (zh) * | 2012-04-20 | 2016-01-20 | 达迈科技股份有限公司 | 芳香族聚酰亚胺膜、其制备方法、及其应用 |
CN103374130A (zh) * | 2012-04-20 | 2013-10-30 | 达迈科技股份有限公司 | 芳香族聚酰亚胺膜、其制备方法、及其应用 |
CN103145985A (zh) * | 2012-12-09 | 2013-06-12 | 上海飞凯光电材料股份有限公司 | 聚酰亚胺树脂的制备及其在耐高温光纤涂料中的应用 |
CN105764990B (zh) * | 2013-11-27 | 2018-03-20 | 宇部兴产株式会社 | 聚酰亚胺前体组合物、聚酰亚胺的制造方法、聚酰亚胺、聚酰亚胺膜和基板 |
KR20160091935A (ko) * | 2013-11-27 | 2016-08-03 | 우베 고산 가부시키가이샤 | 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 폴리이미드, 폴리이미드 필름, 및 기판 |
JPWO2015080139A1 (ja) * | 2013-11-27 | 2017-03-16 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
WO2015080139A1 (ja) * | 2013-11-27 | 2015-06-04 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
CN105764990A (zh) * | 2013-11-27 | 2016-07-13 | 宇部兴产株式会社 | 聚酰亚胺前体组合物、聚酰亚胺的制造方法、聚酰亚胺、聚酰亚胺膜和基板 |
KR102188483B1 (ko) | 2013-11-27 | 2020-12-08 | 우베 고산 가부시키가이샤 | 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 폴리이미드, 폴리이미드 필름, 및 기판 |
CN106047373B (zh) * | 2015-04-14 | 2020-10-09 | Jsr株式会社 | 液晶取向剂 |
CN106047373A (zh) * | 2015-04-14 | 2016-10-26 | Jsr株式会社 | 液晶取向剂、液晶取向膜及液晶元件 |
CN109401313A (zh) * | 2018-10-31 | 2019-03-01 | 株洲时代新材料科技股份有限公司 | 一种聚酰亚胺薄膜及其制备方法 |
CN109401313B (zh) * | 2018-10-31 | 2021-06-15 | 株洲时代华鑫新材料技术有限公司 | 一种聚酰亚胺薄膜及其制备方法 |
CN114026179A (zh) * | 2019-06-24 | 2022-02-08 | 株式会社钟化 | 透明聚酰亚胺薄膜及其制造方法 |
CN114026179B (zh) * | 2019-06-24 | 2023-11-24 | 株式会社钟化 | 透明聚酰亚胺薄膜及其制造方法 |
CN110343275A (zh) * | 2019-07-18 | 2019-10-18 | 桂林电器科学研究院有限公司 | 一种聚酰亚胺超薄膜的制备方法 |
CN110253904A (zh) * | 2019-07-18 | 2019-09-20 | 桂林电器科学研究院有限公司 | 一种聚酰亚胺厚膜或超厚膜及其制备方法 |
CN110437614A (zh) * | 2019-07-26 | 2019-11-12 | 宁波今山新材料有限公司 | 可成型聚酰亚胺薄膜的制备方法 |
CN114286835A (zh) * | 2019-08-29 | 2022-04-05 | 聚酰亚胺先端材料有限公司 | 聚酰亚胺薄膜及其制备方法 |
CN114616269A (zh) * | 2019-11-07 | 2022-06-10 | 聚酰亚胺先端材料有限公司 | 低介电质的聚酰亚胺薄膜及其制备方法 |
CN114616269B (zh) * | 2019-11-07 | 2024-02-13 | 聚酰亚胺先端材料有限公司 | 低介电质的聚酰亚胺薄膜及其制备方法 |
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