CN1650415A - Bonding method and bonding device - Google Patents

Bonding method and bonding device Download PDF

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Publication number
CN1650415A
CN1650415A CN 03809804 CN03809804A CN1650415A CN 1650415 A CN1650415 A CN 1650415A CN 03809804 CN03809804 CN 03809804 CN 03809804 A CN03809804 A CN 03809804A CN 1650415 A CN1650415 A CN 1650415A
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substrate
resin
installation elements
mentioned
temperature
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CN100375256C (en
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山内朗
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/838—Bonding techniques
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

According to the bonding apparatus of the present invention, in the process of packaging chips onto the substrate via resin, after heat-fixing chips on substrate with the head, air is supplied to the first passage disposed inside the head and cool down the ceramic heater located beneath said first passage to the glass transition point of the resin used in the chip package, After cooling, the head is returned to the upper wait position to release the pressure to the chip. Consequently in company with the cooling of the head, the resin itself is also cooled to the glass transition point and nearly completely hardened, and capable of preventing the void from happening due to the expansion of air containing inside the resin.

Description

Adhesion method and device thereof
Technical field
The present invention relates to be used for install on the substrate of resin substrate or glass substrate etc. the adhesion method and the device thereof of installation elements such as semiconductor element or surface mounted component, particularly high accuracy is installed the technology of installation elements to the substrate.
Background technology
In the past, in the manufacturing process of substrate (for example flat display board of liquid crystal, EL (Eletro Luminescence), plasma display etc.), installation elements (for example semiconductor chip etc.) was installed on the substrate.As installation elements (being designated hereinafter simply as " chip ") is installed in the adhesion method on the substrate, make resin, for example Anisotropically conductive film (ACF:Anisotropic Conductive Film) or non-conductive resin (NCP:Non-ConductivePaste) etc. are between substrate and chip, add the extruding of hot-extrudable means chip top from making, the resin that is heating and curing simultaneously adds hot pressing with chip and is attached to method on the substrate.
But, there are the following problems for such adhesion method: for example, also be heating and curing simultaneously at pressurization ACF and NCP etc., when being installed in chip on the substrate, if the words of cured resin under the high temperature, from resin, produce the degassing (out gas), shown in the sectional view that the chip of Figure 15 and 16 is installed, like that, produced the space (void) 32 (as shown in figure 15) of covering projection (bump) 31 peripheries and across the space 32 (as shown in figure 16) of 33 of projection 31 and electrode of substrate.The existence in such space 32 can cause that engaging force is low, and poor flow when temperature rises, can make problems such as these space 32 explosions.Also exist not only to produce the space, also produce be full of cracks and gap resistance value is increased, cause the problem of poor flow.
Sectional view shown in the A-A arrow of the sectional view of installing as the chip of Figure 17 and Figure 17 shown in Figure 180 is such, under the situation of a crimping of conducting particles, because removed pressurization in that resin full solidification (temperature is reduced to below the vitrification point) is preceding, so also exist resin softening, chip 4 come-ups, and projection 31 between produce gap 35, the problem that contact resistance increases.
Heating when installing by chip, chip 4 and substrate 2 both sides are heated.After this heating, when being cooled to normal temperature, poor because of the coefficient of linear expansion of two materials, substrate 2 is understood toward the top warpage shown in Figure 19 arrow self.At this moment, under the temperature more than the vitrification point, produce the gap between softening conducting particles 34 of resin and the projection 31, the bonding area of the conducting particles 34 that exists between electrode of substrate 33 and the projection 31 changes, and the resistance value between projection 31 and the electrode of substrate 33 increases.
This invention is the invention of finishing in view of aforesaid problem, and main purpose of the present invention provides a kind of high accuracy adhesion method and the device thereof of installation elements to the substrate is installed.
Summary of the invention
The reason that space when chip is installed in the past produces is considered to: the sneaking into of the degassing that resin generates or air.This is the general general knowledge of industry.Therefore, in the industry,, taked following countermeasure for preventing the generation in this space:
(1) countermeasure that takes place that prevents to outgas is to carry out the generation that resin solidification suppresses to outgas at low temperatures.
(2) countermeasure of sneaking into that prevents air is to improve the viscosity of resin, makes air be difficult to sneak in the resin.But,, still be in the present situation that can not fully prevent the generation in space even adopt above-mentioned countermeasure.
In order to prevent the generation in space, developed from the bottom and utilized microscope can observe the device of the solid state of the resin glass substrate adheres to, many-sided result who inquires into, the present inventor has obtained the reason that following phenomenon takes place.In test, the NCP and the ACF resin of 220 ℃ of curing temperatures, 120 ℃ of vitrification points have been used.
Add the attached means of hot pressing in utilization and continue to give 220 ℃ heat, chip is added hot pressing be attached in stage on the substrate, resin also is in soft state.If such resin does not solidify the pressurization that is disengaged the pressurization means with soft state, the moment of pressure relief, in resin inside, be in the air of pressured state can instantaneous expansion (tens times of ground expand), be identified and produced the space 32 (as shown in figure 15) that covers around the projection and across the space between projection and the projection 32 (shown in the 21st figure of the arrow directions X of the 20th figure and the 20th figure).There is the problem of short circuit and so in delay such as moisture in this space 32.
Under the situation of using ACF and ACP (Anisotropic Conductive Paste), because of pressurization from the chip top, be positioned at conducting particles (carrying out the material that the plating of gold and nickel etc. processes) the generation strain of jut at polymer surfaces, to submerge at the state of projection fixing the electrical connection.But because after just having removed the pressurization of pressurization means, resin also is in soft state, therefore substrate meeting warpage under these circumstances, makes its flattening through pressurization, but resin viscosity is lower than the substrate elastic stress that recovery produces, and forms the part that the gap increases between projection and electrode.Along with the increase in this gap, like that, the strain of conducting particles is restored shown in Figure 17 and 18.
Specifically, by producing the space between the recess of the formed jut that submerges of conducting particles and the conducting particles 34, perhaps resin flows into this space, and contact area reduces, and consequently resistance increases.That is, as can be known: the problem of the generation in space and particle crimped status causes by remove pressurization when preceding resin is in soft state in vitrification point (Tg temperature).
Promptly, when being heating and curing resin, after being cooled to resin below the Tg temperature, the releasing of pressurizeing again, even so that remove from the pressurization above the chip, can not make the air expansion that is contained in resin inside yet, and use under the situation of ACF etc. the elastic stress that recovery produced that resin viscosity can not be lower than when removing pressurization because of conducting particles.
Promptly, adhesion method of the present invention has following feature: resin is installed in installation elements between installation elements and substrate in the adhesion method on the substrate, be included in utilize the pressurization means that installation elements is added to utilize at least one side in heater means heating installation elements or the substrate in the process that is pressed on the substrate so that the resin hot curing add the attached operation of hot pressing; Under state to the installation elements pressurization, the refrigerating work procedure of cooling heater means; And remove the operation that above-mentioned pressurization means are pressurizeed to installation elements in above-mentioned heater means cooling back.
According to adhesion method of the present invention, make resin between installation elements (for example chip etc.) and substrate, utilize the pressurization means installation elements to be added in the process that is pressed on the substrate, utilize at least one side in heater means heating installation elements and the substrate, the resin that is heating and curing simultaneously adds hot pressing with installation elements and is attached on the substrate.If installation elements be heated press be attached on the substrate after, heater means is cooled, and removes the pressurization means institute applied pressure from the chip top thereafter.That is, along with the cooling of heater means, itself also is cooled resin.Thus, under the substantive state that solidifies of resin, remove from the pressurization above the chip, so can suppress to remove the caused expansion of external pressure that pressurized state is contained in the air of resin inside.Consequently: can prevent because of air expansion around the projection or the space that is produced between across projection and projection, so can prevent short circuit etc. between the bad and projection of the conduction of the projection that causes in the space and electrode of substrate.
In the refrigerating work procedure of adhesion method of the present invention, preferably be cooled near the vitrification point of used resin.
That is, in refrigerating work procedure, the cooling cooling way is cooled to vitrification point with the resin of bonded substrate and installation elements.Thus, the state that almost completely solidifies with resin is removed the pressurization of pressurization means, so can suppress to remove the expansion that external pressure that pressurized state is contained in the air of resin inside causes.Consequently: since can prevent because of air expansion cause around the projection and the space that produces between across projection and projection, so can prevent the projection that the space causes and the conduction between electrode of substrate is bad and projection between short circuit etc.
Adhesion method of the present invention, in the refrigerating work procedure, when better resin being cooled near the vitrification point, regulate the temperature of at least one side in substrate and the installation elements so that the temperature of resin near vitrification point and the thermal expansion amount from room temperature of substrate and installation elements close.
That is, in refrigerating work procedure, at least one side of substrate and installation elements is carried out adjustment, so that resin temperature reaches near the vitrification point, the thermal expansion amount that begins from room temperature of the substrate of this moment and installation elements is close.Thus, can avoid the joint that warpage produced of installation elements that the difference of the amount of contraction of substrate and installation elements causes and substrate bad and resistance value is bad.Here the thermal expansion amount of said substrate is meant corresponding to the thermal expansion amount as the substrate portion of the length of the chip of installation elements.
In adhesion method of the present invention, the adjusting of the temperature of substrate and installation elements better is carry out that adding of the cooling of installation elements or substrate pine at least a.
That is, directly heat from installation elements one side, when substrate is installed installation elements, with from the near order of heater means distance, that is, and with the order increase in temperature of installation elements, resin, substrate.Because heated substrates side not, so substrate self has radiating effect, the temperature difference of installation elements and substrate increases.At this moment, by cooling off installation elements one side energetically, or under the atmosphere opening state natural cooling or cooling base one side energetically, the while heated substrates, regulate the temperature of two parts, when resin temperature is near vitrification point, make installation elements and substrate not have thermal expansion difference thus.Therefore, can play and above-mentioned the same effect.
In adhesion method of the present invention, refrigerating work procedure better is the cooling heater means so that it reaches below vitrification point+20 ℃ of used resin.
That is, make resin between installation elements and substrate, utilize the pressurization means to pressurize, and utilize the heater means heating, simultaneously installation elements is added hot pressing and be attached on the substrate.After installation elements added hot pressing and be attached to substrate, heater means was cooled to below vitrification point+20 ℃ of used resin.Along with this cooling, itself also is cooled resin, reaches almost solid state.Therefore, can bring into play and above-mentioned the same effect.
Adhesion method of the present invention has following feature: make resin between installation elements and substrate, installation elements is installed in the adhesion method on the substrate, has the temperature that gas takes place because of heating with discontented resin self, the 1st heating process with the heating resin, and in the 1st heating process, behind the stipulated time heating resin, with the 2nd overheated operation of the temperature heating resin of the design temperature that is higher than the 1st heating process.
By adhesion method of the present invention,, behind the heating resin, resin is heating and curing with the temperature that is higher than this heating-up temperature with the temperature of discontented resin self because of the temperature of heating generation gas.Therefore, under the state that gas does not take place, resin is in almost solid state, improves temperature under the high state of viscosity.At this moment, even gas produces, because viscosity increased produces stress in gas, so can prevent the generation in space etc.
In adhesion method of the present invention, the design temperature of the 1st heating process is better less than 190 ℃, and the design temperature of the 2nd heating process is more fortunately more than 190 ℃.In 20 seconds stipulated time of the 1st heating process to the 2 heating processes more fortunately.
Like this, be set in less than 190 ℃ by temperature the 1st heating process, the temperature of the 2nd heating process is set in more than 190 ℃, perhaps with the time set of the 1st heating process to the 2 heating processes in 20 seconds, under the state that gas does not take place, resin becomes the state that almost solidifies, and improves temperature under the high state of viscosity.Consequently: even gas takes place, because viscosity is higher than gas generation stress, so can prevent the generation in space etc.
In adhesion method of the present invention, after the 2nd heating process, better resin is cooled near the vitrification point.
After the 2nd heating process, the resin after the heating is cooled to vitrification point.Therefore, can the full solidification resin, and can not make around the projection that is occurred when for example chip is as installation elements or expand when pressurization is removed in the space that produces between projection, perhaps strain causes that resin produces be full of cracks.
In adhesion method of the present invention, installation elements is being installed on the substrate, resin is heating and curing, installation elements is fixed in the process on the substrate, better be divided into and press the vacation that is attached on the substrate to press attached operation with installation elements is false, and resin is almost completely solidified, installation elements is attached to the attached operation of true pressure on the substrate, press attached operation to be decided to be the 1st heating process vacation, will really press attached operation to be decided to be the 2nd heating process.
Can boost productivity by being divided into false attached operation and the attached operation of true pressure of pressing.By will really pressing attached multiple pressure headization, and can reaching productivity ratio is further improved.
Adhesion method of the present invention has following feature: resin is installed in installation elements between installation elements and substrate in the adhesion method on the substrate, when on substrate, scribbling the regulation position installation installation elements of resin, comprise false attached operation and the attached operation of true pressure of pressing, wherein should vacation pressing attached operation is to heat the resin that is coated on above-mentioned position in advance, under softening state, attached operation is pressed in the vacation of the attached installation elements of false pressure; Should true press attached operation be the false resin of pressing attached installation elements junction surface of further heating, and it is solidified, and installation elements is fixed on the attached operation of true pressure on the substrate.
Heating under the state of resin that is coated on the substrate in advance, installation elements is installed.That is, resin is because of thermoplastic, installs in that installation elements is pressed against on the resin, and the air that is involved in during installation is run away from installation elements and interlaminar resin easily.Therefore, when the installation of installation elements, can reduce the air that is involved in.
In addition, in adhesion method of the present invention, better vacation is pressed the heating-up temperature of resin in the attached operation to be set in 60 ℃-120 ℃ the scope, the heating of the resin in the attached operation of false pressure is carried out from the inside side of substrate, perhaps false last direction resin blowing hot-air of pressing the heating of the resin in the attached operation from substrate, and have again continuously or attached operation and the attached operation of true pressure are pressed in the vacation that separates.
Adhesion method of the present invention has following feature: resin is installed in installation elements between installation elements and substrate in the adhesion method on the substrate, and the engaging speed when installation elements is installed at the regulation position that is coated with resin on aforesaid substrate is set at below the 10mm/s.
Adopt adhesion method of the present invention, the engaging speed that is bonded on the substrate with installation elements below the 10mm/s is being installed in installation elements the regulation position that is coated with resin on the substrate, installation elements is pressed to be attached on the resin at leisure, runs away easily so be involved in the air of installation elements and interlaminar resin in this pressure additive process.
In the adhesion method of the present invention, resin better is the resin of sneaking into conducting particles.
That is, when installation elements (for example chip) is added hot pressing and is attached on the substrate, be present in the projection of chip side and the conducting particles generation strain between electrode of substrate.Directly resin is cooled under this state, is almost solid state, thus can prevent the recovery of the strain of conducting particles, can the contact area of conducting particles and chip and substrate is fixing certain.
Adhering apparatus of the present invention is characterized in that, resin is installed in installation elements between installation elements and substrate in the adhering apparatus on the substrate, comprises the supporting station of mounting fixing base; Installation elements pressurization is installed in the pressurization means on the regulation position of the substrate that is fixed; The installation elements of heating pressured state, the heater means of the resin that is heating and curing; The cooling way that the heater means of pressurization installation elements state is cooled off.
That is, the regulation position on the substrate that institute's mounting on the supporting station is fixed by resin, utilizes pressurization means pressurization installation elements, and utilizes the heater means heating, installation elements is pressed to be attached on the substrate simultaneously.Heater means cooling to heating installation elements after the pressurization of installation elements removed thereafter.Therefore, cooling along with heater means, self also is cooled resin, almost completely solidify, can prevent because of air expansion around the projection and the space that produces between across projection and projection, so can prevent that the conducting that the space generates between caused projection and electrode of substrate is bad, perhaps short circuit between projection etc.
In adhering apparatus of the present invention, the temperature control device of the chilling temperature that better has a control cooling way below vitrification point+20 of used resin ℃.
That is, the cooling of cooling way, temperature is controlled in below vitrification point+20 ℃ of used resin, can bring into play above-mentioned effect.
Adopt adhering apparatus of the present invention, cooling way better is that the through hole that forms air flow circuit is set on above-mentioned heater means, from the air-supply means of outside blow air; Perhaps by the 1st stream that is arranged on heater means inside and provide air to constitute to the air supply means of the 1st stream; Or be installed in the cooling element of the heat transmission on the periphery of heater means; Perhaps by the 2nd stream that is arranged on heater means inside and provide cooling water to constitute to the cooling water supply mean of the 2nd stream; The 2nd stream is better towards the interior heater block that heating element (heat pattern) is housed.
In adhering apparatus of the present invention, have heater means in above-mentioned supporting station one side, and control the temperature of above-mentioned heater means, so that be fixed on substrate temperature on the above-mentioned supporting station below vitrification point+20 of used resin ℃.
That is, the substrate that mounting is fixed on supporting station is heated by the heater means that is arranged on supporting station one side.That is, supporting station is set at below vitrification point+20 ℃ that the used resin of installation elements is installed, so installation elements and substrate during cooling do not have temperature difference, can prevent the warpage of the caused substrate of difference of the coefficient of linear expansion of two parts.
In adhering apparatus of the present invention, better comprise the temperature control device of controlling the heater means of cooling way and supporting station one side according to the temperature of installation elements and substrate, in the time of near resin being cooled to vitrification point, adjust the temperature of at least one side in substrate and the installation elements, so that the temperature of resin is near vitrification point, and substrate and installation elements are almost equal from the thermal expansion amount that room temperature begins.
That is, in cooling procedure, the temperature of two parts is adjusted, so that resin temperature is near vitrification point, this moment, substrate and installation elements were almost equal from the thermal expansion amount of room temperature.Therefore, this temperature controlled method for example is to preestablish condition, so that control according to temperature deviation, temperature deviation wherein is that the measured value comparison that detects when each temperature of installation elements, substrate and resin being carried out resulting standard value of pretesting and cooling is tried to achieve.
Adhering apparatus of the present invention is characterized in that, resin is installed in installation elements between installation elements and substrate in the adhering apparatus on the substrate, comprises the fixedly supporting station of aforesaid substrate of mounting; Installation elements is positioned at the regulation position that is coated with resin is installed in seating means on the substrate that mounting is fixed on supporting station; The speed control means of engaging speed below 10mm/s of the seating means of installation elements on substrate the time regulate to be installed.
That is, the installation elements location and installation is being fixed in the regulation position that is coated with resin on the substrate of supporting station by seating means.When being installed in this installation elements on the substrate, utilize speed control means that the engaging speed of seating means is controlled at below the 10mm/s.Thus, can bring into play above-mentioned effect.
Description of drawings
Fig. 1 is the summary stereogram that the true pressure attaching of demonstration embodiment 1 is put structure,
Fig. 2 is the front view that the pressure head portion of demonstration embodiment 1 device wants cage structure,
Fig. 3 is the side view of wanting cage structure that shows the pressure head portion of embodiment 1 device,
Fig. 4 is the stereogram that the demonstration ceramic heater is wanted cage structure,
Fig. 5 is the flow chart that shows adhesion method,
Fig. 6 is the temperature control distribution map that shows pressure head portion,
Fig. 7 is the summary stereogram of structure that shows the adhering apparatus of embodiment 2 devices,
Fig. 8 is the front view that the pressure head portion of demonstration embodiment 2 wants the structure of portion on every side,
Fig. 9 is the flow chart that shows the adhesion method that uses embodiment 2 devices,
Figure 10 is the temperature control distribution map that shows pressure head portion,
Figure 11 is the stereogram of wanting cage structure that shows the pressure head portion of variation 1,
Figure 12 is the side view of wanting cage structure that shows the pressure head portion of variation 1,
Figure 13 is the front view of wanting cage structure that shows the pressure head portion of variation 2,
Figure 14 is the side view of wanting cage structure that shows the pressure head portion of variation 3,
Figure 15 utilizes in the past method with the sectional view of adhesive die attachment when the substrate,
Figure 16 utilizes in the past method with the sectional view of adhesive die attachment when the substrate,
Figure 17 utilizes in the past method with the sectional view of adhesive die attachment when the substrate,
Figure 18 is the sectional view of the A-A section of Figure 17,
Figure 19 utilizes in the past method with the sectional view of adhesive die attachment when the substrate,
Figure 20 utilizes in the past method with the sectional view of adhesive die attachment when the substrate,
Figure 21 utilizes in the past method with the longitudinal section when the arrow directions X is seen among adhesive die attachment Figure 20 when the substrate,
Figure 22 is the result of the test figure that utilizes embodiment device to carry out.
Embodiment
There is following execution mode in mode as solving problem points in the past.
With reference to accompanying drawing, one embodiment of the invention are described.
(embodiment 1)
In the present embodiment, use the heat-curing resin of ACP, ACF, NCP, NCF (Non-Conductive film) etc., employing describes the situation about being installed on the substrate of the chip of installation elements as embodiment.
As " installation elements " of the present invention, consider to show and substrate engage a side whole forms, stick to the adhesive die attachment on the smooth display panel, promptly, the adhesion of COG (Chip On Glass) or TCP and FPC, promptly, OLB (Out Lead Bonding), and irrelevant with kind and the size of for example IC chip, semiconductor chip, optical element, surface mounted component, chip, wafer, TCP (Tape Carrier Package), FPC (Flexible PrintedCircuit) etc.
" substrate " of the present invention is meant that with the kind of resin substrate, glass substrate, film substrate, chip, wafer etc. irrelevant and installation elements engages whole form of a side.
At first, with reference to accompanying drawing the used device of present embodiment is specifically described.
Fig. 1 has shown adhering apparatus of the present invention, promptly presses the summary stereogram of the structure that attaching puts.Fig. 2 is the front view of wanting cage structure that shows the pressure head part of embodiment device, and Fig. 3 is the side view of wanting cage structure that shows the pressure head part of embodiment device.
As shown in Figure 1, true pressure attaching of the present invention is put 1 and is not illustratedly pressed coupon unit to carry and the movable table 3 of the substrate 2 that comes, add the pressure head portion 5 of the chip 4 on the attached substrate of hot pressing, when adding the attached chip of hot pressing 4 to substrate 2, constitute from the glass support 6 of below support substrate 2 from vacation from having by horizontal fixed.
Movable table 3 as shown in Figure 1, has the substrate fixed platform 7 of absorption fixing base 2, this substrate fixed platform 7 constitute can horizontal twin shaft (X, Y) direction, (Z) direction and ring Z axle (θ) direction move freely respectively up and down.
Pressure head portion 5, as shown in Figure 2, the bottom of the body 8 that constitutes from metal instrument is made of ceramic fixture 9, ceramic heater 10 and the ceramic pressure head 11 of ceramic successively.On tool body 8, ceramic heater 10 and ceramic pressure head 11 sintering are on ceramic fixture 9 by bolt 12 devices for pottery fixture 9.
On ceramic pressure head 11, temperature detection means 13 are set, for example thermoelectric lotus root, temperature detecting resistance body etc.That is, utilize the temperature detection means to detect the heat that ceramic pressure head 11 is subjected to, this testing result is delivered to temperature control part 21 from ceramic heater 10.
Pottery fixture 9 as shown in Figure 3, is used for the 1st stream 15 that circulation of air the discharges length direction (directions X of Fig. 3) through the bottom of ceramic fixture 9 in the upper surface of the heating part of ceramic heater 10.At the 1st stream 15, and supply with streams 16 from the air fed air of tool body 8 and be communicated with.Supply with the other end of stream 16 at this air, as shown in Figure 2, by have be communicated with the valve V that connects pressure hose 17 from air supply means 18 air supplies.
That is,, supply with stream 16, air flow circuit 15 through air successively, discharge from the 15a of openings at two ends portion of the 1st stream 15 by the air that air supply means 18 is supplied with.Therefore, the heat that heat generating part 10a produced of ceramic heater 10 is taken away by air circulation, can be rapidly with ceramic heater 10 and 11 both coolings of ceramic pressure head.
Ceramic heater 10 as shown in Figure 4, forms the plate body that heat generating part 10a and portion of terminal 10b are configured to the specific thickness (for example being about 1mm) of T word shape.Ceramic heater 10 is for using electrical insulator material, and promptly ceramic material covers the structure of heater 19, and the terminal 20 of heater 19 is outstanding from portion of terminal 10b.
The ceramic material of pottery fixture 9, ceramic heater 10 and ceramic pressure head 11 all are made of the material of the glass that has added ormal weight in the silicon nitride etc.The coefficient of linear expansion of pottery fixture 9 coefficient of linear expansion better and ceramic heater 10 and ceramic pressure head 11 is equal.In addition, their thermal conductivity better is: with ceramic heater 10 is basic point, past more ceramic pressure head 11 to add pressure surface side (below of Fig. 2) big more, simultaneously, the fitting surface side of the ceramic fixture 9 of past more and its opposition side (top of Fig. 2) is more little.
In temperature control part 21, from there being illustrated external input device used resin is not imposed a condition accordingly in advance, for example heating time, as the inputs such as vitrification point of the chilling temperature of ceramic heater 10.Detect the result according to these initial conditions with from the temperature detection means, carry out the temperature control of ceramic heater 10.For example, the measured value that preestablishes the vitrification point of input and export from temperature detection means 13 is compared, according to the temperature of the temperature deviation control ceramic heater 10 of trying to achieve.Specifically, open valve V, air supply, temperature changes to Tg valve-off V when following, rising pressure head portion.
Below, utilize the foregoing description device, along the flow chart of Fig. 5 a series of actions that chip is installed on the substrate is described.In the present embodiment, in advance the resin solidification temperature is decided to be 220 ℃, vitrification point (Tg) is decided to be 120 ℃.In the present embodiment,, in advance the false vacation of pressing carrying under the state that is attached on the substrate and coming of chip is pressed substrate, the complete true situation about being attached on the substrate of pressing of chip is described as an example with chip so that the vacation of preceding operation is pressed in the attached operation.
(the location of step 1) substrate
The vacation of leading portion is pressed in the attached operation, between the false substrate 2 of pressing with chip 4 of resin, is transported to true pressure attaching by no illustrated Handling device and puts in 1.This substrate 4 is transferred load on the substrate supporting platform 7 of movable table 3, is adsorbed fixing.Substrate supporting platform 7 is by no illustrated driving mechanism, and forwards (the Y direction of Fig. 1) promptly, moves between pressure head portion 5 and the glass support 6, chip 4 is clipped in the middle from above-below direction with pressure head portion 5 and glass support 6, carries out the location of substrate 4.
(step 2) chip add the attached beginning of hot pressing
After finish the location of substrate 2, construct decline pressure head portion 5, with the glass support 6 that is positioned at the downside of substrate 2 chip 4 is sandwiched with this pressure head portion 5 by there being illustrated driving.Pressure head portion 5 begins that chip 4 is added hot pressing and is attached on the substrate 2.At this moment, the ceramic heater 10 that pressure head portion 5 has as shown in Figure 6, is set at 220 ℃ in the hot pressing attached zero hour (t0) that adds of chip 4 by temperature control part 21.Finish the stipulated time of (t1) constantly to heating the zero hour (t0) simultaneously from adding the attached beginning of hot pressing, by temperature control part 21 temperature of ceramic heater 10 is fixed on 220 ℃, simultaneously chip 4 is added hot pressing and be attached on the substrate 2, the result is: the heat conduction of chip 4 causes that resin begins to be heating and curing.
(step 3) cooling beginning
After arriving heating and finishing constantly (t1), be admitted in the temperature control part 21 from the heating shutdown signal of the M of major control portion, based on this signal, be imported into valve V from the command signal of temperature control part 21, valve V is open.By the opening of valve V, air supply means 18 beginning air supplies.Air is supplied with stream 16 through pressure hose 17, air and is flowed in the 1st stream 15.This leaked-in air flows and discharges towards the 15a of both ends open portion of the 1st stream 15.The result is: quench cooled is configured in the ceramic heater 10 and the ceramic pressure head 11 of the below of the 1st stream 15.
(whether step 4) arrives vitrification point
In the time of the cooling beginning, the temperature detection means 13 that are arranged on ceramic pressure head 11 detect the temperature of pressure head portion 5 successively, and this measured value is admitted to temperature control part 21.In temperature control part 21, carry out successively vitrification point that preestablishes input (Tg) and measured value as the chilling temperature of ceramic heater 10 are compared processing.Here,, repeat the comparison process of this Tg and measured value, continue cooling simultaneously, on the contrary,, enter step 5 when measured value reaches Tg (moment t2 shown in Figure 6) if testing result does not arrive vitrification point (Tg).
That is, be cooled to Tg by the temperature with ceramic heater 10, the chip 4 that is heated by pressure head portion 5 also is cooled, and then the resin that chip 4 is fixed on the substrate 2 also is cooled.Particularly along with the carrying out of this cooling, resin temperature is cooled to vitrification point (Tg), and resin almost completely is cured.
In the present embodiment, though the chilling temperature of ceramic heater 10 is set at the vitrification point (Tg) of resin,, this chilling temperature can also be set in by in the scope below the vitrification point that kind determined (Tg)+20 of used resin ℃.
(the step 5) pressurization is removed
When chilling temperature reaches Tg, remove pressurization to chip 4, allow pressure head portion 5 return to the top position of readiness.At this moment, the command signal valve V by temperature control part 21 is closed, and simultaneously, for next chip 4 is fixed on the substrate 2, carries out temperature control so that the temperature of ceramic heater 10 rises to 220 ℃ (moment t3 shown in Figure 6).
That is, resin is cooled to Tg, is under the state that almost completely solidifies, and removes the pressurization of chip 4 tops, so can prevent the air expansion in the resin.That is, resin solidification can suppress the expansion of air, can prevent the generation in the space that projection waits on every side.
The pressurization that can be suppressed at pressure head portion 5 by resin solidification causes strain, under the state of contact area expansion, and the elastic return of the conducting particles that exists between projection and electrode of substrate.That is, by resin solidification, resin viscosity rises, and the elastic stress the when strain that is higher than conducting particles is recovered can be kept the elastic deformation of conducting particles.The result is: can eliminate the space that takes place between projection and conducting particles.
(the taking-up of step 6) substrate
After the pressurization of pressure head portion 5 was disengaged, substrate supporting platform 7 moved on to the position that substrate transmits.Move on to the substrate 2 of delivering position, it is not transported in the substrate accomodating unit, put into substrate and reclaim box by there being illustrated board carrying structure.
More than, finished chip 4 and sticked on 1 plate base 2.
As mentioned above, add the attached chip 4 of hot pressing to substrate 2, after simultaneously resin being heating and curing, utilize the vitrification point (Tg) of air quench cooled ceramic heater 10 to used resin, make whole pressure head portion be cooled to Tg, and then the resin that chip 4 is attached on the substrate 2 also is cooled to Tg.Therefore, because of resin is in almost completely the state that solidifies, so by in the pressurization of removing under this state above the chip, can eliminate the reason that problem all the time that the present inventor confirms takes place.
Specifically, with in the past method, resin is under the soft state before solidifying, and pressure head portion 5 is risen when removing pressurization, is present in air in the resin and sharply expands and produce the space that covers around the projection.But, in the present embodiment, being in when removing pressurization under the state of curing at resin, resin viscosity can prevent the space that produces greater than the stress of air expansion.
Use ACF in the past or during ACP, the recovery of the strain of conducting particles is raised chip toward the top, produce the space between projection and conducting particles.But in the present embodiment, resin is under the solid state pressurization of removing from the chip top, so resin viscosity can be greater than the caused elastic stress of recovery of the strain of conducting particles, prevent between projection and electrode of substrate be connected bad.
(embodiment 2)
In the foregoing description 1, to adding the attached chip 4 of hot pressing, its almost completely fixing true pressure attaching is put describe at substrate 2, in the present embodiment,, can carry out false the pressure and echo the attached adhering apparatus of true pressure and describe chip 4 being installed to substrate 2.Adhering apparatus, describes different piece so same position is kept same label because of only pressure head portion structure on every side is different with the device of embodiment 1.
Fig. 7 is the summary stereogram that shows adhering apparatus structure of the present invention, and Fig. 8 shows the pressure head portion front view of wanting cage structure on every side.
As shown in Figure 8, adhering apparatus 100, by absorption fixed chip 4, be located and be installed in the regulation position that scribbles resin G on the substrate, add simultaneously the attached chip 4 of hot pressing add the movable table 3 of the attached structure 101 of hot pressing, horizontal fixed substrate 2 in the installation on the substrate 2, when pressing the resin portion of attached chip 4 on substrate 2 from below support substrate 2 glass support 6, heating glass support 6 heater 102, provide the nozzle 103 and 104 of air, the control part 106 of these structures of master control to constitute from the above and below to substrate 2 respectively.
Installation adds the attached structure 101 of hot pressing, has the pressure head portion 107 that its underpart is fixed in chip 4 absorption as shown in Figure 7, it about can move on the direction of (X) direction and level (Z).In pressure head portion inside, there is not diagram, have ceramic heater, also have the cooling way of this heater of cooling.For the structure of this pressure head portion, because of and embodiment 1 device much at one, so omitted detailed description thereof.As the structure of pressure head portion 107, unrestricted to its form, for example, also can adopt pressure head portion inside not have the structure of cooling way.
Movable table 3 has the substrate supporting platform 7 of absorption fixing base 2, this substrate supporting platform 7 can horizontal twin shaft (X, Y) direction, (Z) direction and ring Z axle (θ) direction can move freely respectively up and down.
Heater 102 is heating glass supports 6, and this heat is passed to resin G on substrate 2 and the substrate, the equipment that heats.This heater 102, as shown in Figure 8, the distance from substrate 2 regulation is installed on the sidewall of glass support 6, and the no illustrated voltage control of the control signal by accepting control part 106 is carried out temperature control.
Be configured in the nozzle 103 of substrate below, when being heating glass support 6, the equipment that the heat of the near zone of the contact portion of inhibition glass support 6 and substrate 2 is transmitted provides air to control to the substrate the inside.
Being configured in the nozzle 104 of substrate top, is the equipment that adds the attached chip of hot pressing 4 in order to cool off, by providing air towards the chip mounting portion.
Two nozzles, 103,104 control signals according to control part 106 by the switching manipulation of valve V, provide air from air supply source 109.
Control part 106, the adjustment of the adjusting of the engaging speed when installation is added the attached structure of hot pressing 101 chip 4 is installed to substrate 2, the heater 102 of heating glass support 6 and provide the adjusting etc. of air to carry out master control from the nozzle 103 and 104 of cooling base 2 and chip 4 usefulness.Each concrete one is controlled at hereinafter explanation.
Below, to utilizing above-mentioned adhering apparatus, chip is installed under the situation that scribbles resin (ACF) part on the substrate, regulate resin temperature before on substrate, chip being installed, simultaneously chip is installed on the substrate, thereafter, press attached operation, really press attached operation and refrigerating work procedure through vacation, the method that chip is fixed on the substrate describes.Below, along the flow chart of Fig. 9 and the temperature profile of Figure 10 concrete grammar is described.Temperature profile shown in Figure 10 for convenience of explanation, begins to show after chip is installed.
(the location of step 10) substrate
Substrate 2 is transported to true pressure attaching by no illustrated Handling device and puts in 100.This substrate 2 is transferred load on the substrate supporting platform 7 of movable table 3, is adsorbed fixing.Substrate supporting platform 7 is by no illustrated driving structure, and forwards (the Y direction of Fig. 7) promptly, moves between pressure head portion 107 and the glass support 6, between chip 4 being clipped in from above-below direction with pressure head portion 107 and glass support 6, carries out the location of substrate 2.
(the heating of step 11) resin
After finish the location, heater 102 work, heating glass support 6, this heat is delivered to the resin G on the substrate, makes resin G softening.The situation of present embodiment, because of resin is ACF, with resin temperature settings in 60-120 ℃ scope.It better is 80-100 ℃.When if resin temperature is lower than 60 ℃, soften because of resin G is insufficient, so when chip 4 was installed, the air that is involved in chip 4 and the resin G interface etc. was difficult to run away.The result becomes the space at residual air such as interfaces.If when resin temperature surpassed 120 ℃, resin G can solidify.
(the installation of step 12) chip
Utilize 107 absorption of pressure head portion to be fixed in the resin portion bit-by-bit installation of the chip 4 and the soft state on the substrate at regulation position.When being installed in chip 4 on this resin, this engaging speed is set in below the 10mm/s.Scope is 1-5mm/s preferably.Engaging speed is if surpass 10mm/s, chip 4 pressed when being attached on the resin position space that no air is run away.
When chip 4 is installed, stop the heating of heater 102.
(step 13) the 1st heating process
In the 1st heating process that is equivalent to the attached operation of false pressure, when heating corresponding to used resin G, with the design temperature that do not produce gas (following simply be called " degassing ") from resin G at the appointed time, press attached chip 4 with pressure head portion 107, the resin G that is heating and curing simultaneously is more than the viscosity that reaches regulation.Here so-called regulation viscosity is meant and can be suppressed in the 2nd following heating process viscosity of the generation stress of the degassing that produces during heat resin G.
The design temperature of the 1st heating process, for example when resin G is ACF, as shown in figure 10, between the 1st heating process of t0-t1, resin temperature is regulated the heter temperature in the pressure head portion less than 190 ℃ (among Figure 10 170 ℃).This design temperature is preferably 120-170 ℃.
If when design temperature was lower than 120 ℃, the curing rate of resin G was slack-off, can not obtain enough resin viscosities simultaneously.When opposite design temperature surpasses 190 ℃, the degassing is taken place.That is, the generation stress of the degassing rises, and surpasses the resin viscosity of uncured state, produces space etc. at the interface of chip 4 and substrate 2 etc.
Be set in 20 seconds the heating time of t0-t1 shown in Figure 10.More fortunately 1-5 second.Usually under the situation of ACF, when design temperature was 180-190 ℃, curing in 20 seconds was necessary, but to be less than the time of above-mentioned time, also can be cured tight.
For design temperature and heating time, suitably set change corresponding to condition of cure of used resin etc.
(step 14) the 2nd heating process
After being heating and curing of resin in the 1st heating process finished, next, between t1-t2 shown in Figure 10, with the temperature that is higher than the heating-up temperature in the 1st previous heating process resin that is heating and curing.The design temperature of this moment is being that purpose is regulated the heter temperature in the pressure head portion more than 190 ℃ with resin.This design temperature is more fortunately in 200-220 ℃ the scope.If when the 2nd heating-up temperature is lower than 190 ℃, can hinder the curing of resin to promote.
That is, in the 2nd heating process, because of having improved resin viscosity in formerly the 1st heating process in advance, so even improve temperature more than 190 ℃, resin produces the degassing, resin viscosity also can suppress the degassing stress takes place.The result is to prevent the generation in space etc.If design temperature surpasses 220 ℃, even more than 240 ℃, can go wrong on resin heat-resisting.
The setting-up time of the 2nd heating process of heating resin G is under the situation of present embodiment, for example can be set at for 2 seconds.
Also can be in 20 seconds with the time set of finishing (t2) since the 1st heating process (t0) to the 2nd heating process.In this case, but tight solidifies resin G.
The 2nd pressurization operation is equivalent to really press attached operation.
(step 15) cooling beginning
After the 2nd heating process is finished, begin constantly till resin temperature becomes vitrification point (moment of t3), to begin to cool down from the t2 of Figure 10.Specifically, cool off with following order.
At first, put equally with the true pressure attaching of embodiment 1, according to the heating signal that stops of control part 106, open no illustrated valve begins to provide air in the pressure head portion.Along with the supply of this air, ceramic heater in the pressure head portion and ceramic pressure head quench cooled.At this moment, resin G is subjected to the cooling of atmosphere opening state, energetically the cooling effect that reaches with heat transfer of cooling press head 107.
If reach the temperature of rated condition, stop the cooling of pressure head portion 107, control part 106 open operation valve V to chip 4 air supplies, simultaneously, utilize the temperature of heater 102 to regulate from the nozzle 104 of substrate top.Promptly.Temperature to chip 4 and substrate 2 is regulated, so that the temperature of resin G is near vitrification point, and the thermal expansion amount that substrate 2 and chip 4 begin from the room temperature state of atmosphere opening much at one.Therefore, can prevent the warpage that chip 4 and substrate 2 easily produce when shrinking because of cooling.
As the establishing method of these thermoregulator times and condition, utilize test in advance, Yi Bian measure each temperature of chip 4, substrate 2 and resin G, Yi Bian carry out condition enactment.
The thermal expansion amount of the substrate 2 of present embodiment is not meant the thermal expansion amount of whole base plate, is meant the thermal expansion amount of the substrate 2 in part that chip 4 is installed and the regulation zone that surrounds this part.This zone can at random be set according to size of chip 4 etc.
(step 16) pressurization is removed
When if chilling temperature reaches vitrification point, remove 107 pairs of pressurizations of pressure head portion at chip 4, pressure head portion 107 is returned to the position of top standby.
(step 17) substrate takes out
After the pressurization of pressure head portion 107 was disengaged, substrate supporting platform 7 moved to the position that substrate transmits.Move on to the substrate 2 of delivering position, it is not transported in the substrate accomodating unit, put into substrate and reclaim box by there being illustrated board carrying structure.
More than finished the adhesion of chip 4 on 1 plate base 2.
Below, the present inventor installs the engaging speed (pressure head portion speed) of chip on substrate time the and the situation occurred in the space during the resin softening temperature the during installation of change chip for the device that confirm to adopt embodiment 2, tests.Its result below is described.
(concrete example)
The crown glass that uses the high grade of transparency uses ACF as the resin that is coated on the electrode part on this substrate as glass substrate.The contained particle diameter of the ACF of this moment of coating thickness 35 μ m is 3.5 μ m, and the population of unit are is 1,000,000/mm 3Resin on glass substrate.
ACF recommends engaging condition, that is, the temperature that this used resin heating is not produced the degassing is decided to be less than 190 ℃, and the temperature that resin is almost completely solidified is decided to be 220 ℃.
Pressure head portion speed when chip is installed in substrate is decided to be 4 types of 1,3,5,10 (mm/s), with various engaging speeds and will install the resin temperature of chip on substrate the time be decided to be 150,170,180,200,220 respectively (℃) test.Each resin temperature heats till resin solidification consistently.Below, the result who obtains by test is presented among Figure 22.
As described belowly obtain counting under the various conditions.Confirm around the projection respectively by range estimation and in addition the space that the zone produced around the projection from the inside one side of substrate, a situation arises than be full of cracks that the space is big.Corresponding to these numbers, obtain and count.Specifically, in the time of can not confirming the space is arranged in each regulation zone, " 0 " point be stamped in this zone, can be confirmed under several the situation that " 1 " point is stamped in each zone, in the time of can confirming tens, stamp the space of " 2 ".For be full of cracks, also carry out same marking, space and be full of cracks count mutually that the Calais obtains.
As can be seen from Figure 22: resin temperature is that 5mm/s is installed in chip on the substrate with pressure head portion speed in the time of 170 ℃, and counting during cured resin is " 0 ", can confirm to realize not having fully the good chip in space to install.Mean that promptly the air that is involved in the interface of chip and resin etc. all was discharged from when chip was installed.In addition, recommending below 190 ℃ of engaging condition, is also to reduce the generation that air is involved in the space that causes etc. in the scope of 1-10mm/s with pressure head portion speed setting.
The softening temperature of resin more than 150 ℃ and 200 ℃ the time, space etc. count high the reasons are as follows described.
If the resin softening temperature is when being 150 ℃, recommend engaging condition much lower than ACF, resin self can not be fully softening, thus do not run away fully at the air that the interface was involved in of chip and resin, and be included in cause in this interface.
The resin softening temperature is more than 200 ℃ the time, because surpassed the recommendation engaging condition of ACF, that is, the temperature that does not outgas produces space etc. so cause the generation of the degassing.
As mentioned above, the resin G of the chip installation position on the heated substrates in advance, make it softening, simultaneously, engaging speed when being bonded on the resin G by control chip, discharge is involved in the air at the interface of chip 4 and resin G etc. when removing and installing, the result can prevent that air is involved in the generation in the space behind the resin solidification that causes etc.
In the 1st heating process after chip is installed, when heating corresponding to used resin G, not produce the temperature of the degassing, with the stipulated time resin G that is heating and curing in advance, thereafter the 2nd heating process that resin G is almost completely solidified through temperature with the temperature that is higher than the 1st heating process, in the moment of the 1st heating process, resin viscosity improves, the generation stress of the degassing that is produced greater than the 2nd heating process can prevent the space that produces because of the degassing and be full of cracks etc.
After the 2nd heating process, when resin G is cooled to vitrification point, by cooling off to chip 4 air supplies so that the temperature of resin G near vitrification point, and the thermal expansion amount that begins from room temperature of substrate 2 and chip 4 equates, utilize 102 pairs of heaters to be lower than substrate 2 heating of vitrification point simultaneously on one side, by regulating the temperature of two parts, can eliminate and not control the warpage that is produced when thermal expansion amount cools off two parts on one side.
Reach vitrification point, under the state that resin G almost completely solidifies, remove the pressurization of pressure head portion 107, so can further fully eliminate the warpage that the difference of the thermal expansion amount of substrate 2 and chip 4 causes.
The present invention is not limited to the above embodiments, can also carry out distortion as described below.
(1) among the embodiment 1, to pressing in the vacation of leading portion in the attached operation with the false in advance substrate of pressing the regulation position that is attached to substrate of chip, it is attached to carry out true pressure that chip is completely fixed on the substrate, but also can press attachedly without vacation, only presses attached summary operation that chip is installed on the substrate with true.
At this moment, the adsorption hole of absorption fixed chip 4 usefulness not only is set in the bottom of pressure head portion 5, but also can below substrate 2, means of identification be set a side, identification is positioned in mark position on the substrate 2 of substrate supporting platform 7 and the mark position of chip 4 positions.
(2) in embodiment 1, has ceramic heater 10 in pressure head portion 5, from the top heating resin of chip 4, but can also only heater meanses such as ceramic heater be set, perhaps above chip 4, heater meanses such as ceramic heater all be set with the substrate supporting platform side in substrate supporting platform 7 sides.At this moment, better the heter temperature of substrate supporting platform 7 sides is set at the same temperature of vitrification point (Tg) with used resin.
Like this, by in advance the heater means of substrate supporting platform 7 one sides being set in Tg, the chip 4 in the time of resin almost completely can being solidified is consistent with the temperature of substrate 2.Therefore, can eliminate in the past only from the heating of pressure head portion 5 one sides, the buckling deformation of the substrate 2 that the coefficient of linear expansion difference of chip 4 sides and substrate 2 sides easily causes when being heating and curing resin.
As heater means, be not limited to ceramic heater, so long as the means of the resin that can be heating and curing get final product.
(3) in embodiment 1, a side is provided with the 1st stream 15 as cooling way above ceramic heater 10, still, also can carry out following distortion.
(variation 1)
Shown in Figure 12 the same as Figure 11 of the stereogram of pressure head portion 5 and its side view can also be provided with the through hole 22 that runs through horizontal direction on the sidewall of ceramic fixture 9, utilize air-supply means etc. to blow to this through hole inside from the outside with air, ventilates.
This through hole 22 as shown in Figure 11, can make up with the structure of the pressure head portion 5 of the foregoing description of the inside that supplies air to pressure head portion 5, also can only carry out the cooling of pressure head portion 5 by through hole 22.
(variation 2)
Shown in Figure 13 as the front view of pressure head portion 5 installed the heat transmission cooling-part 23 (fin) of the taper that the cardinal extremity one side along continuous straight runs from the sidewall of ceramic fixture 9 and tool body 8 of multistage extends.Like this, by multi-disc fin 23 is installed, can improve the radiating effect of pressure head portion 5, and then can carry out the cooling of pressure head portion 5.
Fin 23 better is the high parts of radiating effect, for example better is the fin of metal.
This fin 23, as shown in Figure 12, can be combined to the structure of the pressure head portion 5 of the embodiment 1 of pressure head portion 5 inside with air supply, also can only cool off with 23 pairs of pressure head portions 5 of fin.
(variation 3)
In embodiment 1 and variation, utilize air to cool off, but can also utilize cooling water that ceramic heater 10 is cooled off.Specifically, shown in the side view of Figure 14, like that, the 2nd stream 25 of " U " word shape is set, the cooling water that circulates and supply with along the top of ceramic heater 10 from cooling water supply mean 24.
(4) in embodiment 1, utilize air or cooling water that pressure head portion 5 is cooled off, but also can utilize other coolant.For example can also provide liquid nitrogen to circulate to the 2nd stream etc.
(5) in embodiment 2, utilize 1 adhering apparatus to carry out vacation respectively and press attached operation and the attached operation of true pressure, but the false device of pressing attached operation and really pressing attached operation also can be set respectively.At this moment, really press attaching to put, falsely in the attached operation press the chip 4 that is attached on the substrate because of only adding attached false pressure of hot pressing, so pressure head portion part also can not have the function of absorption fixed chip 4.
The false pressure of utilization attaching is put and is pressed attaching to put so respectively, can improve productive rate.
(6) in embodiment 2, the means of soften resin before installing as chip pass to resin G by glass support 6 with the heat of heater 102, but can also dispose nozzle etc. above substrates, supply with hot blast to resin, and it is softened.In addition, can also enable move above the substrate have heater mechanical arm move near the resin, utilize the radiant heat of heater, under contactless state, make resin softening.
The possibility of industrial utilization
As mentioned above, adhesion method of the present invention and device thereof are suitable for the chip element with semiconductor chip etc. Stick to the substrates such as plane display board of liquid crystal, EL (Electro Luminescence), plasma display etc. On the class.

Claims (27)

1. adhesion method, it is to make resin between installation elements and substrate, and installation elements is assemblied in adhesion method on the substrate, it is characterized in that, comprises and utilizes the pressurization means installation elements to be added the operation that is pressed on the substrate; Utilize at least one side in heater means heating installation elements or the substrate so that above-mentioned resin hot curing add the attached operation of hot pressing; Under the state with the above-mentioned installation elements that pressurizes, cool off the refrigerating work procedure of above-mentioned heater means; And after finishing, above-mentioned heater means cooling removes of the pressurization of above-mentioned pressurization means to installation elements.
2. adhesion method according to claim 1 is characterized in that above-mentioned refrigerating work procedure is cooled near the vitrification point of used resin.
3. adhesion method according to claim 2, it is characterized in that, above-mentioned refrigerating work procedure, when being cooled to resin near the vitrification point, regulate the temperature of at least one side in substrate and the installation elements, so that the temperature of resin is near vitrification point, and the thermal expansion amount from room temperature of substrate and installation elements is close.
4. adhesion method according to claim 3 is characterized in that, the adjusting of the temperature of aforesaid substrate and installation elements is at least one that carries out that adding of the cooling of installation elements and substrate pine for.
5. adhesion method according to claim 1 is characterized in that, above-mentioned refrigerating work procedure is the cooling heater means so that the operation of its temperature below vitrification point+20 of used resin ℃.
6. adhesion method, it is to make resin between installation elements and substrate, and installation elements is assemblied in adhesion method on the substrate, it is characterized in that, comprises to cause that less than heating resin self produces the 1st heating process of temperature heating resin of the temperature of gas; After in above-mentioned the 1st heating process, heating resin at the appointed time, with the 2nd overheated operation of the temperature heating resin of the design temperature that is higher than the 1st heating process.
7. adhesion method according to claim 6 is characterized in that, the design temperature of above-mentioned the 1st heating process is less than 190 ℃, and the design temperature of above-mentioned the 2nd heating process is more than 190 ℃.
8. adhesion method according to claim 6 is characterized in that, the stipulated time from above-mentioned the 1st heating process to above-mentioned the 2nd overheated operation is in 20 seconds.
9. adhesion method according to claim 6 is characterized in that, after above-mentioned the 2nd heating process, above-mentioned resin is cooled near the vitrification point.
10. adhesion method according to claim 6, it is characterized in that, above-mentioned installation elements is being assemblied on the substrate, the resin that is heating and curing makes in the operation of installation elements secure attachment on substrate, be divided into and press the vacation that is attached on the substrate to press attached operation installation elements, with resin is almost completely solidified with the true pressure attached operation of installation elements secure attachment on substrate, false press attached operation to be decided to be the 1st heating process with above-mentioned, the attached operation of above-mentioned true pressure is decided to be the 2nd heating process.
11. adhesion method, it is to make resin installation elements is assemblied in adhesion method on the substrate between installation elements and substrate, it is characterized in that, when installation elements being assemblied in the regulation position that has been coated with resin on the aforesaid substrate, comprise that heating the resin that is coated on this position in advance softens, under this state, attached operation is pressed in the attached vacation of the false pressure of installation elements; To above-mentioned false resin heating of pressing attached installation elements junction surface, it is solidified again, make the true pressure attached operation of installation elements secure attachment on substrate.
12. adhesion method according to claim 11 is characterized in that, above-mentioned false heating-up temperature of pressing the resin in the attached operation is set in 60 ℃-120 ℃ the scope.
13. adhesion method according to claim 11 is characterized in that, the heating of the resin of the attached operation of above-mentioned false pressure is to carry out from the inboard of substrate.
14. adhesion method according to claim 11 is characterized in that, above-mentioned false heating of pressing the resin of attached operation is that the last direction resin from substrate provides hot blast.
15. adhesion method according to claim 11 is characterized in that, comprise continuously or separate above-mentioned falsely press attached operation and very press attached operation.
16. adhesion method, it is to make resin between installation elements and substrate, installation elements is installed in adhesion method on the substrate, it is characterized in that the engaging speed when installation elements is installed in the regulation position that has been coated with resin on the aforesaid substrate is set in below the 10mm/s.
17. adhesion method according to claim 1 is characterized in that, above-mentioned resin is the resin of having sneaked into conducting particles.
18. adhering apparatus, it is to make resin installation elements is installed in adhering apparatus on the substrate between installation elements and substrate, it is characterized in that, comprises the fixedly supporting station of aforesaid substrate of mounting; The pressurization means of installation elements being pressurizeed at the regulation position of the above-mentioned substrate that is fixed; Heat the installation elements of above-mentioned pressured state, the heater means of the above-mentioned resin that is heating and curing; The cooling way that the heater means of the above-mentioned installation elements state that pressurizes is cooled off.
19. adhering apparatus according to claim 18 is characterized in that, comprises that the chilling temperature with above-mentioned cooling way is controlled at the temperature control device below the vitrification point of used resin+20 ℃.
20. adhering apparatus according to claim 18 is characterized in that, above-mentioned cooling way is that the through hole that forms air flow circuit is set on above-mentioned heater means, from the air-supply means of outside blow air.
21. adhering apparatus according to claim 18 is characterized in that, above-mentioned cooling way is by the 1st stream that is arranged on above-mentioned heater means inside and provide air to constitute to the air supply means of the 1st stream.
22. adhering apparatus according to claim 18 is characterized in that, above-mentioned cooling way is mounted in the cooling element of heat transmission of the periphery of above-mentioned heater means.
23. adhering apparatus according to claim 18 is characterized in that, above-mentioned cooling way is by the 2nd stream that is arranged on above-mentioned heater means inside and provide cooling water to constitute to the cooling water supply mean of the 2nd stream.
24. adhering apparatus according to claim 23 is characterized in that, above-mentioned the 2nd stream is towards the interior heater block that heating element (heat pattern) is housed.
25. adhering apparatus according to claim 19, it is characterized in that, have heater means in above-mentioned supporting station one side, and control the temperature of above-mentioned heater means, make the substrate temperature that is fixed on the above-mentioned supporting station below vitrification point+20 of used resin ℃.
26. adhering apparatus according to claim 25, it is characterized in that, comprise the temperature control device of controlling the heater means of cooling way and supporting station one side according to the temperature of installation elements and substrate, in the time of near resin being cooled to vitrification point, adjust the temperature of at least one side in substrate and the installation elements, so that the temperature of resin is near vitrification point, and substrate is similar to the thermal expansion amount from room temperature of installation elements from the thermal expansion amount of room temperature.
27. adhering apparatus, it is to make resin between installation elements and substrate, and installation elements is installed in adhering apparatus on the substrate, it is characterized in that, comprises the fixedly supporting station of aforesaid substrate of mounting; Installation elements is positioned at mounting is fixed in the regulation position that is coated with resin on the substrate of above-mentioned supporting station, the seating means of installing; The speed control means of engaging speed below 10mm/s of the seating means of above-mentioned installation elements to substrate the time regulate to be installed.
CNB038098040A 2002-04-30 2003-04-28 Bonding method and bonding device Expired - Fee Related CN100375256C (en)

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WO2003094222A1 (en) 2003-11-13
KR100978697B1 (en) 2010-08-30
CN100375256C (en) 2008-03-12
KR20050000499A (en) 2005-01-05
JP2004031885A (en) 2004-01-29

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