CN1638194A - 电路连接用粘接薄膜和电路连接结构体 - Google Patents
电路连接用粘接薄膜和电路连接结构体 Download PDFInfo
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- CN1638194A CN1638194A CNA2005100042363A CN200510004236A CN1638194A CN 1638194 A CN1638194 A CN 1638194A CN A2005100042363 A CNA2005100042363 A CN A2005100042363A CN 200510004236 A CN200510004236 A CN 200510004236A CN 1638194 A CN1638194 A CN 1638194A
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Classifications
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- H—ELECTRICITY
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Abstract
一种电路连接用粘接薄膜,是介于相对置的电路电极之间并将所述电路电极彼此电连接的电路连接用粘接薄膜,其中含有可通过加热产生游离自由基的固化剂、自由基聚合性物质和薄膜形成性高分子,而且相对于具有电路电极的柔性基板的临时固定力为40-180N/m。
Description
技术领域
本发明涉及一种电路连接用粘接薄膜和电路连接结构体。
背景技术
用电连接的方式连接相对置的电路电极的电路连接用薄膜,如把导电性粒子分散在环氧系粘接剂中所形成的各向异性导电粘接薄膜(环氧树脂系各向异性导电粘接薄膜)主要用于驱动液晶显示器(LCD;Liquid CrystalDisplay)的安装有半导体的TCP(Tape Carrier Package)和LCD面板、或者TCP和印刷电路板的电连接。
另外,最近,即使在以面朝下的方式直接在LCD面板或印刷电路板上安装半导体时,也不采用以往的引线接合法,而是采用有利于薄型化和窄间距连接的倒装片安装,其中各向异性导电粘接薄膜还可用作电路连接用粘接薄膜。
但是,上述环氧树脂系各向异性导电粘接薄膜虽然作业性良好,但是需要在约20秒钟的连接时间内加热并保持在约160-180℃,如果是在10秒钟则需要加热并保持在约180-210℃。
之所以需要进行如上所述的加热,是因为使用了在常温下惰性的催化剂型固化剂,以便通过同时获得短时间固化性(速固化性)和储藏稳定性(保存性)而得到良好的稳定性,因此固化时不能获得充分的反应。
近年来,随着LCD模件的大型化、窄框缘化,在使用电路连接用粘接薄膜连接时,存在对LCD面板的热影响增大或印刷电路基板的弯曲加深的问题。另外,从所谓轻量化的观点出发,还提出了将LCD面板基板由玻璃置换为塑料的研究,但是此时存在塑料耐热性低、TCP安装困难的问题。
因此,作为其对策要求实现电路连接用粘接薄膜的低温连接化。另外,为了提高生产效率,还要求连接时间缩短为10秒钟以下,因此低温速固化性变成了必不可少的特性。为此,提出了可以在10秒钟的连接时间内通过约160℃的加热完成连接的使用自由基聚合性物质的电路连接用粘接薄膜(例如,参考特许第3344886号)。
本发明人等发现在上述的使用自由基聚合性物质的电路连接用粘接薄膜中,存在如下问题,即,在进行将电路连接用粘接薄膜转印至基板的电路电极上的临时压接时,不能整齐地转印在该基板的电路电极上;或者在将所连接的电路构件临时固定在电路连接用粘接薄膜上之后,向实质压接工序过渡时,电路构件会在输送过程中因振动而从电路连接用粘接薄膜上剥落的问题等连接加工性差的问题。
发明内容
本发明的目的是提供一种连接电路构件时连接加工性良好的电路连接用粘接薄膜以及电路连接结构体。
为了达到上述目的,本发明提供一种电路连接用粘接薄膜,是介于相对置的电路电极之间并使上述电路电极彼此电连接的电路连接用粘接薄膜,其特征在于,含有可通过加热产生游离自由基的固化剂、自由基聚合性物质和薄膜形成性高分子,而且相对于具有上述电路电极的柔性基板的临时固定力为40-180N/m。
该电路连接用粘接薄膜在连接电路构件的电路电极之间时具有优异的连接加工性。具体地讲,提高了向作为电路构件的柔性基板的转印性。另外作为电路构件的柔性基板在被输送至下一个工序时不易因振动而脱落。另外将电路连接用粘接薄膜转印至柔性基板上之后,很难从通常与电路连接用粘接薄膜贴合使用的基体材料薄膜(也称为剥离性支撑薄膜)剥离电路连接用粘接薄膜。进而,即使将数十米以上的电路连接用粘接薄膜卷绕在卷轴(reel)上并在室温长时间放置,也可以充分地防止电路连接用粘接薄膜向基体材料薄膜的背面转印,可充分地消除不能由卷轴抽出电路连接用粘接薄膜的问题。
还有,临时固定力如果低于40N/m,则粘合性过弱,在电路连接用粘接薄膜上临时固定柔性基板后,在向下一个工序输送时柔性基板容易因振动而脱落,从而会导致连接工艺性、即生产效率下降。另一方面,粘接薄膜的临时固定力如果超过180N/m,则粘合性过强,在将粘接薄膜转印至柔性基板后,难以从基体材料薄膜剥离粘接薄膜,同样会导致生产效率的下降。另外,由于粘合性过强,当将数十米以上的电路连接用粘接薄膜卷绕在卷轴上并在室温长时间放置时,会发生电路连接用粘接薄膜向基体材料薄膜的背面转印,容易发生不能由卷轴抽出所需的电路连接用粘接薄膜的问题。
另外,本发明的电路连接结构体是通过以下方法得到的,即,把具有第一电路电极的第一电路构件或者具有第二电路电极的第二电路构件中的至少一个构件作为柔性基板,在该柔性基板上临时固定上述电路连接用粘接薄膜,并在使第一电路电极和第二电路电极对置的状态下配置上述第一电路构件和上述第二电路构件,且使上述电路连接用粘接薄膜介于上述对置的第一电路电极和第二电路电极之间,之后对上述电路连接用粘接薄膜进行加热和加压,以电连接的方式连接上述第一电路电极和第二电路电极。
另外,本发明的电路连接结构体具备在第一电路基板上形成有第一电路电极的第一电路构件、在第二电路基板上形成有第二电路电极的第二电路构件、和设置在上述第一电路电极和上述第二电路电极之间并连接上述第一和第二电路构件的电路连接构件,且上述电路连接构件由上述的电路连接用粘接薄膜的固化物组成,上述第一电路电极和上述第二电路电极通过上述电路连接构件以电连接的方式相连接。
如果采用这些电路连接结构体,则在由上述粘接薄膜连接电路构件时的连接工艺性良好。因此,可以提高生产效率,对于电路连接结构体来说可以降低其成本。
附图说明
图1是表示本发明电路连接结构体的一个实施方式的截面图。
图2是表示图1的电路连接结构体的一系列制造工序的工序图。
图3是表示本发明电路连接用粘接薄膜的一个实施方式的截面示意图。
具体实施方式
下面,对本发明的电路连接用粘接薄膜进行说明。
本发明的电路连接用粘接薄膜是介于相对置的电路电极间并以电连接方式连接上述电路电极的电路连接用粘接薄膜,其中含有可以通过加热产生游离自由基的固化剂、自由基聚合性物质和薄膜形成性高分子,而且相对于具有电路电极的柔性基板的临时固定力为40-180N/m。
该电路连接用粘接薄膜与作为电路构件的柔性基板的连接加工性优异。具体地讲,提高了向具有电路电极的柔性基板的转印性。另外,柔性基板在被输送至下一个工序的过程中也不易因振动而脱落。进而,在将电路连接用粘接薄膜转印至柔性基板后,电路连接用粘接薄膜不易从基体材料薄膜剥离。还有,即使将数十米以上的电路连接用粘接薄膜卷绕在卷轴上并在室温长时间放置,也可以充分地防止电路连接用粘接薄膜向基体材料薄膜的背面转印,可充分地消除不能由卷轴抽出电路连接用粘接薄膜的问题。
还有,临时固定力如果低于40N/m,则粘合性过弱,在电路连接用粘接薄膜上临时固定柔性基板后,在向下一个工序输送时柔性基板容易因振动而脱落,从而会导致连接工艺性、即生产效率下降。另一方面,粘接薄膜的临时固定力如果超过180N/m,则粘合性过强,在将粘接薄膜转印至柔性基板后,难以从基体材料薄膜剥离粘接薄膜,同样会导致生产效率的下降。另外,由于粘合性过强,当将数十米以上的电路连接用粘接薄膜卷绕在卷轴上并在室温长时间放置时,会发生电路连接用粘接薄膜向基体材料薄膜的背面转印,容易发生不能由卷轴抽出所需的电路连接用粘接薄膜的问题。
用于测量本发明电路连接用粘接薄膜的临时固定力的试样可通过如下操作制作。即,首先在ITO涂层玻璃(表面电阻15-20Ω/□,1.1mm厚)基板上,在70℃、1MPa、3s的条件下临时压接宽2.5mm的带有PET基体材料的电路连接用粘接薄膜,然后剥离PET基体材料,在电路连接用粘接薄膜上,在20-24℃、0.5MPa、5s的条件下压接把75μm厚的聚酰亚胺薄膜作为基体材料的间距为200μm的柔性配线板(18μmCu箔,镀Sn),从而制作临时固定用试样。
临时固定力的测量如下进行。即,使用如上所述地制作的试样,根据拉伸方向为90度(拉伸速度:50mm/分钟)的剥离(沿相对于FPC电路平行的方向上的剥离)测量间距为200μm的柔性配线板(FPC)和电路连接用粘接薄膜的粘接力(相对于宽1cm的FPC的粘接力)(测量温度23±2℃),并把此时的粘接力规定为临时固定力(N/m)。
本发明电路连接用粘接薄膜的临时固定力的特别优选的范围是60N/m-150N/m。
本发明中所使用的可通过加热产生游离自由基的固化剂是,通过加热发生分解而产生自由基的物质,并且只要是能与自由基聚合性物质和薄膜形成高分子一起作用把电路连接用粘接薄膜相对于柔性基板的临时固定力设定为40-180N/m,就没有特别限制。作为这种固化剂,可列举过氧化化合物、偶氮系化合物等固化剂,但是可根据目标连接温度、连接时间、储存期(pot life)等适当选择。作为上述过氧化化合物,从高反应性和储存期的观点来看,优选半衰期10小时的温度为40℃以上而且半衰期1分钟的温度为180℃以下的有机过氧化物。这时,有机过氧化物的混合量优选为0.05-10重量%,更优选为0.1-5重量%。有机过氧化物的混合量如果不足0.05重量%,则与0.05重量%以上的情况相比,存在反应性差的趋势。另一方面,有机过氧化物的混合量如果超过10重量%,则与10重量%以下的情况相比,存在保存稳定性劣化的趋势。具体地讲,作为固化剂可以选自二酰基过氧化物类、过氧二碳酸酯类、过氧化酯类、过氧缩酮类、二烷基过氧化物类、氢过氧化物类等。另外,为了抑制电路构件的电路电极的腐蚀,优选选自过氧化酯、二烷基过氧化物、氢过氧化物,更优选选自可获得高反应性的过氧化酯。
作为二酰基过氧化物类,可举出异丁基过氧化物、2,4-二氯苯甲酰过氧化物、3,5,5-三甲基己酰基过氧化物、过氧化辛酰、过氧化月桂酰、过氧化硬脂酰、过氧化琥珀酰、过氧化苯甲酰甲苯、过氧化苯甲酰等。
作为过氧二碳酸酯类,可举出二正丙基过氧二碳酸酯、二异丙基过氧二碳酸酯、双(4-叔丁基环己基)过氧二碳酸酯、二-2-乙氧基甲氧基过氧二碳酸酯、二(2-乙基己基过氧)二碳酸酯、二甲氧基丁基过氧二碳酸酯、二(3-甲基-3-甲氧基丁基过氧)二碳酸酯等。
作为过氧化酯类,可列举枯烯基过氧新癸酸酯、1,1,3,3-四甲基丁基过氧新癸酸酯、1-环己基-1-甲基乙基过氧新癸酸酯、叔己基过氧新癸酸酯、叔丁基过氧三甲基乙酸酯、1,1,3,3-四甲基丁基过氧2-乙基己酸酯、2,5-二甲基-2,5-双(2-乙基己酰基过氧)己烷、1-环己基-1-甲基乙基过氧-2-乙基己酸酯、t-己基过氧-2-乙基己酸酯、叔丁基过氧-2-乙基己酸酯、叔丁基过氧异丁酸酯、1,1-双(叔丁基过氧)环己烷、t-己基过氧异丙基单碳酸酯、叔丁基过氧-3,5,5-三甲基己酸酯、叔丁基过氧月硅酸酯、2,5-二甲基-2,5-双(m-甲苯酰基过氧)己烷、叔丁基过氧异丙基单碳酸酯、叔丁基过氧-2-乙基己基单碳酸酯、t-己基过氧苯甲酸酯、叔丁基过氧乙酸酯等。
作为过氧缩酮类,可举出1,1-双(t-己基过氧)-3,3,5-三甲基环己烷、1,1-双(t-己基过氧)环己烷、1,1-双(t-丁基过氧)-3,3,5-三甲基环己烷、1,1-双(t-丁基过氧)环十二烷、2,2-双(t-丁基过氧)癸烷等。
作为二烷基过氧化物类,可举出α,α’-双(t-丁基过氧)二异丙苯、二枯烯基过氧化物、2,5-二甲基-2,5-二(t-丁基过氧)己烷、叔丁基枯烯基过氧化物等。
作为氢过氧化物类,可举出二异丙基苯氢过氧化物、异丙基苯氢过氧化物等。这些游离自由基产生剂可以单独或者混合使用,也可以混合分解促进剂、抑制剂等使用。
用于本发明的自由基聚合性物质是具有可通过自由基进行聚合的官能团的物质,作为这种自由基聚合性物质,可列举丙烯酸酯、甲基丙烯酸酯、马来酰亚胺化合物等。
作为丙烯酸酯(甲基丙烯酸酯)的具体例子,可举出氨基甲酸酯丙烯酸酯、丙烯酸甲酯、丙烯酸乙酯、丙烯酸异丙酯、丙烯酸异丁酯、乙二醇二丙烯酸酯、二甘醇二丙烯酸酯、三甘醇二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、四羟甲基甲烷四丙烯酸酯、2-羟基-1,3-二丙烯氧基丙烷、2,2-双[4-(丙烯氧基甲氧基)苯基]丙烷、2,2-双[4-(丙烯氧基多乙氧基)苯基]丙烷、丙烯酸二环戊烯酯、丙烯酸三环癸酯、双(丙烯氧基乙基)三聚异氰酸酯、ε-己内酯改性三(丙烯氧基乙基)三聚异氰酸酯、三(丙烯氧基乙基)三聚异氰酸酯等。
马来酰亚胺化合物,是在分子中具有至少两个以上马来酰亚胺基的化合物,可以举例为例如1-甲基-2,4-双马来酰亚胺苯、N,N’-m-苯撑双马来酰亚胺、N,N’-p-苯撑双马来酰亚胺、N,N’-m-甲苯撑双马来酰亚胺、N,N’-4,4-联苯撑双马来酰亚胺、N,N’-4,4-(3,3’-二甲基-联苯撑)双马来酰亚胺、N,N’-4,4-(3,3’-二甲基二苯基甲烷)双马来酰亚胺、N,N’-4,4-(3,3’-二乙基二苯基甲烷)双马来酰亚胺、N,N’-4,4-二苯基甲烷双马来酰亚胺、N,N’-4,4-二苯基丙烷双马来酰亚胺、N,N’-4,4-二苯基醚双马来酰亚胺、N,N’-3,3’-二苯基砜双马来酰亚胺、2,2-双[4-(4-马来酰亚胺苯氧基)苯基]丙烷、2,2-双[3-s-丁基-4,8-(4-马来酰亚胺苯氧基)苯基]丙烷、1,1-双[4-(4-马来酰亚胺苯氧基)苯基]癸烷、4,4’-环己叉-双[1-(4-马来酰亚胺苯氧基)-2-环己基]苯、2,2-双[4-(4-马来酰亚胺苯氧基)苯基]六氟丙烷等。这些可以单独使用或者组合使用,或者也可以与烯丙基苯酚、烯丙基苯基醚、安息香酸烯丙酯等烯丙基化合物组合使用。
在本发明中,可以单独或者组合使用如上所述的自由基聚合性物质,但是在本发明中,优选至少含有25℃下的粘度为100000-1000000mPa·s的自由基聚合性物质,特别优选含有粘度为100000-500000mPa·s(25℃)的自由基聚合性物质。自由基聚合性物质的粘度的测量中可以使用市售的E型粘度计。25℃下的粘度如果不足100000mpa·s,则与100000mPa·s以上的情况相比,其粘合性过强,或者形成为带状时有可能渗出来,而25℃下的粘度如果超过1000000mPa·s,则与1000000mPa·s以下的情况相比,存在薄膜***而难以切开的趋势。
在自由基聚合性物质中,从粘接性的观点来看,优选氨基甲酸酯丙烯酸酯或者氨基甲酸酯甲基丙烯酸酯,另外,特别优选组合使用与用于提高耐热性的有机过氧化物交联后单独示出100℃以上的Tg的自由基聚合性物质。
作为用于本发明的自由基聚合性物质,可以使用具有二环戊烯基和/或三环癸基和/或三嗪环的物质。特别是,从提高耐热性的角度出发,优选具有三环癸基的自由基聚合性物质。进而,作为具有三环癸基的自由基聚合性物质优选丙烯酸酯或者甲基丙烯酸酯。还有,本发明的电路连接用粘接薄膜中也可以根据需要适当含有氢醌、甲基醚氢醌类等聚合抑制剂。
另外,用于本发明的自由基聚合性物质优选具有三嗪环。
另外,相对于100重量份薄膜形成性高分子和自由基聚合性物质的总和,优选使用0.1-10重量份具有磷酸酯结构的自由基聚合性物质,更优选0.5-5重量份。此时,可以提高在金属等无机物表面上的粘接强度。具有磷酸酯结构的自由基聚合性物质可作为磷酸酐和2-羟基(甲基)丙烯酸酯的反应产物获得。具体地讲,可列举2-甲基丙烯酰氧基乙基酸磷酸酯、2-丙烯酰氧基乙基酸磷酸酯等。这些既可以单独使用也可以组合使用。
另外,作为用于本发明的薄膜形成性高分子,可使用聚苯乙烯、聚乙烯、聚乙烯醇缩丁醛、聚乙烯醇缩甲醛、聚酰亚胺、聚酰胺、聚酯、聚氯乙稀、聚苯醚、脲醛树脂、三聚氰胺树脂、酚醛树脂、二甲苯树脂、环氧树脂、聚异氰酸酯树脂、苯氧基树脂、聚酰亚胺树脂等,在这些之中更优选具有羟基等官能团的树脂,因为这些可以提高粘接性。另外,可以使用将这些高分子用自由基聚合性官能团改性的高分子。这些高分子的分子量优选为10000-1000000。如果不足10000,则存在薄膜形成性差的趋势,而如果分子量超过1000000,则混合性会变差。
另外薄膜形成性高分子相对于100重量份自由基聚合性物质优选含80-180重量份。如果不足80重量份,则与80重量份以上的情况相比,存在薄膜形成性差的趋势,而如果超过180重量份,则与不足180重量份的情况相比,存在混合性变差的趋势。
另外,本发明的电路连接用粘接薄膜中还可以含有填充材料、软化剂、促进剂、抗老化剂、着色剂、阻燃剂、触变剂、偶合剂和酚醛树脂或三聚氰胺树脂、异氰酸酯类等。
当本发明的电路连接用粘接薄膜中含有填充材料时,连接可靠性等可以得到提高,所以优选。就填充材料而言,只要是填充材料的最大直径小于导电性粒子的粒径就可以使用,优选含有5-60体积%。如果不足5体积%,则与5体积%以上的情况相比,存在导通可靠性差的趋势,而如果超过60体积%,则与60体积%以下的情况相比,提高可靠性的效果会达到饱和。作为偶合剂,从提高粘接性的观点来看,优选含有乙烯基、丙烯基、氨基、环氧基和异氰酸酯基的物质。
本发明的电路连接用粘接薄膜中优选还含有导电性粒子。在这种情况下,当电路连接用粘接薄膜用于电路构件彼此之间的连接时,与使用不含有导电性粒子的电路连接用粘接薄膜的情况相比,可以使电路电极之间的连接可靠性获得进一步的提高。作为导电性粒子,可列举Au、Ag、Ni、Cu、焊锡等金属粒子或碳等,为了获得足够的储存期,优选表层不是Ni、Cu等过渡金属类,而是Au、Ag、铂族的贵金属类,更优选Au。另外,也可以用Au等贵金属类覆盖Ni等过渡金属类的表面。另外,当在非导电性的玻璃、陶瓷、塑料等上通过覆盖等形成上述的导通层,并且最外层为贵金属类、塑料为核的情况或者热熔化金属粒子的情况下,由于通过加热和加压可以进行变形,所以可增加连接时与电极的接触面积,提高可靠性,所以优选。若要获得良好的电阻,贵金属类覆盖层的厚度优选为100以上。但是,当在Ni等过渡金属上设置贵金属类的层时,贵金属类层的缺损或混合分散导电性粒子时产生的贵金属类层的缺损等会形成氧化还原作用,而由此产生的游离自由基会引起储存稳定性下降,所以优选300以上。相对于100体积%粘接剂成分,导电性粒子在0.1-30体积%范围内,并可根据用途适当调节。为了防止由于过量的导电性粒子产生的相邻电路间的短路,更优选为0.1-10体积%。
另外,当将上述结构的电路连接用粘接薄膜分为2层以上,并分离为含有可产生游离自由基的固化剂的层和含有导电性粒子的层时,除了能获得以往的高精细化的效果之外,还可改善延长储存期。
下面,参照图1说明本发明的电路连接结构体的实施方式。
图1是表示本发明电路连接结构体的适合的实施方式的截面图。如图1中所示,本实施方式的电路连接结构体100具有第1电路构件20、第2电路构件30和设置在第1电路构件20和第2电路构件30之间的电路连接构件10。第一电路构件20具有第一电路基板21和设置在第一电路基板21的一个面21a上的第一电路电极22。第二电路构件30具有第二电路基板31和设置在第二电路基板31的一个面31a上的第二电路电极32。另一方面,电路连接构件10连接第一电路构件20和第二电路构件30,并含有固化体11。其中,电路连接构件10可通过对电路连接用粘接薄膜进行加热和加压实施固化处理而获得。即电路连接构件10是电路连接用粘接薄膜的固化物。还有,电路连接构件10中也可以含有导电性粒子7。
本实施方式的电路连接结构体100可根据以下的制造方法获得。
即,首先如图2中的(a)所示,预备具有第一电路电极22的第一电路构件20和具有第二电路电极32的第二电路构件30。这时,例如把第一电路构件20作为柔性基板。还有,第二电路构件30在(a)中并没有表示出来,而是示于(c)中。
接着,在第一电路构件20上,转印电路连接用粘接薄膜40并临时固定。电路连接用粘接薄膜40由上述的电路连接用粘接薄膜组成。在本实施方式中,电路连接用粘接薄膜40由例如一个层构成,并含有上述固化剂、上述自由基聚合性物质、上述薄膜形成性高分子和导电性粒子7。这时,从卷绕在卷轴上的状态抽出电路连接用粘接薄膜40。
然后,在将电路连接用粘接薄膜40临时固定的状态下将第一电路构件20(参照图2中的(b))向用于连接第一电路构件20和第二电路构件30的场所输送。
接着,如图2中的(c)所示,在使第一电路电极22和第二电路电极32相对置的状态下配置第一电路构件20和第二电路构件30,并使上述电路连接用粘接薄膜40介于对置的第一电路电极22和第二电路电极32之间。然后,对电路连接用粘接薄膜40进行加热和加压,实施固化处理。由此,在第一和第二电路构件20,30之间形成电路连接构件10。固化处理可以用一般的方法进行,而且该方法可根据粘接剂组合物适当选择。由此,使第一电路电极22和第二电路电极32实现电连接。
通过上述制造方法得到的电路连接结构体100中,上述粘接薄膜40和作为柔性基板的第一电路构件20的连接工艺性优异。具体地讲,提高了向作为柔性基板的第一电路构件20的转印性。另外,柔性基板被输送至下一个工序时不易因振动而脱落。另外将电路连接用粘接薄膜10转印至作为柔性基板的第一电路构件20后,电路连接用粘接薄膜10不易从基体材料薄膜剥离。而且即使将数十米以上的电路连接用粘接薄膜10卷绕在卷轴上并在室温长时间放置,也可以充分地防止电路连接用粘接薄膜10向基体材料薄膜的背面转印,可充分地消除不能由卷轴抽出所需的电路连接用粘接薄膜的问题。因此,可以提高生产效率,减少电路连接结构体100的成本。
还有,在上述电路连接结构体100的制造方法中,是把第一电路构件20作为柔性基板使用,但是也可以把第二电路构件30作为柔性基板来代替第一电路构件20,也可以把第二电路构件30与第一电路构件20同时作为柔性基板。
另外,在上述实施方式中,电路连接用粘接薄膜40由一个层构成,该一个层中含有上述固化剂、上述自由基聚合性物质、上述薄膜形成性高分子和导电性粒子7,但是本发明的电路连接用粘接薄膜也可以如图3中所示,包括含有导电性粒子7的第1层50和含有可产生游离自由基的固化剂的第2层60。这时,可以实现高精细化,还可延长储存期。此外,电路连接用粘接薄膜也可以由2层以上构成。
实施例
下面,根据实施例更加具体地说明本发明。
(实施例1)将作为自由基聚合性物质的10重量份25℃下粘度为250000mPa·s的氨基甲酸酯丙烯酸酯、25重量份25℃下粘度为8000mPa·s的双(丙烯氧基乙基)三聚异氰酸酯、10重量份25℃下粘度为150mPa·s的二羟甲基三环癸烷二丙烯酸酯、3重量份2-甲基丙烯酰氧基乙基酸磷酸酯、作为游离自由基产生剂的4重量份2,5-二甲基-2,5-双(2-乙基己酰基过氧)己烷的50重量%烃稀释溶液,混合于130重量份把苯氧基树脂(重均分子量45000)溶解于甲苯/醋酸乙酯=50/50的混合溶剂而获得的40重量%的溶液,然后均匀搅拌该混合溶液。另外,相对于该混合液,在把聚苯乙烯作为核的粒子的表面上,设置厚0.2μm的镍层,并在该镍层的外侧,混合分散3体积%设置了厚0.04μm的金层的平均粒径为5μm的导电性粒子。使用涂布装置在对厚80μm的单面进行表面处理的PET薄膜上涂布通过以上得到的涂布液,在70℃下热风干燥10分钟。由此,可获得粘接剂层的厚度为20μm的电路连接用粘接薄膜(宽15cm,长60m)。将得到的粘接薄膜裁剪为1.5mm宽,在内径40mm、外径48mm的塑料制卷轴的侧面(厚1.5mm)上以粘接薄膜表面为内侧卷绕50m,获得带状的电路连接用粘接薄膜。得到的电路连接用粘接薄膜相对于柔性基板的临时固定力为110N/m。还有,电路连接用粘接薄膜相对于柔性基板的临时固定力的测量方法如上所述。
(电路的连接)由实施例1制作的带状电路连接用粘接薄膜即使在室温下放置3天,粘接薄膜层也不会在基体材料薄膜上发生背面转印,可以由卷轴抽出所需的粘接薄膜。
之后,在70℃、1MPa下加热和加压3秒钟,将该电路连接用粘接薄膜(宽1.5mm,长3cm)的粘接剂表面转印至ITO涂层玻璃基板上,并剥离PET薄膜。试样数是20,结果可以将所有电路连接用粘接薄膜(宽1.5mm,长3cm)转印至ITO涂层玻璃基板上。接着,将具有600个间距为50μm、厚18μm的镀锡铜电路的柔性电路板(FPC),在24℃、0.5MPa下加压5秒钟,临时固定在电路连接薄膜上。被临时固定的FPC(试样数20)即使使其与玻璃基板一起上下左右振动也没有脱落,而且设置在作为下个工序的实质压接机上时也不存在输送问题。接着,将用电路连接薄膜临时固定该FPC的玻璃基板设置在实质压接机上,用加热工具在160℃、3MPa下加热和加压10秒钟,从柔性配线板侧形成宽2mm的连接区域。
(连接电阻的测量)连接电路后,在初期和85℃、85%RH的高温高湿槽中保持1000小时后用万用表测量包括上述连接部分的FPC的相邻电路间的电阻值。计算电阻值时测量相邻电路间50个点的电阻,求出平均值。
使用由实施例1得到的电路连接用粘接薄膜的电路连接结构体的初期连接电阻平均值为1.5Ω,1000h的高温高湿(85℃、85%RH)试验后的电阻平均值为2.5Ω,连接电阻几乎没有变化,表现出了高的连接可靠性。
(粘接力的测量)连接电路后,在90度剥离、剥离速度为50mm/min的条件下进行粘接力的测量。就实施例1来说为约为1000gf/cm,获得了良好的粘接力。
(比较例1)除了使用45重量份25℃下粘度为8000mPa·s的双(丙烯氧基乙基)三聚异氰酸酯、3重量份2-甲基丙烯酰氧基乙基酸磷酸酯作为自由基聚合物质以外,与实施例1相同地获得粘接剂层厚度为20μm的电路连接用粘接薄膜。得到的电路连接用粘接薄膜的临时固定力为20N/m。
(电路的连接)由比较例1制作的带状电路连接用粘接薄膜即使在室温下放置3天,粘接薄膜层也不会在基体材料薄膜上发生背面转印,可以由卷轴抽出所需的粘接薄膜。
之后,在70℃、1MPa下加热和加压3秒钟,将该带状的电路连接用粘接薄膜(宽1.5mm,长3cm)的粘接剂表面转印至ITO涂层玻璃基板上,并剥离PET薄膜。但是,20个试样中,有8个试样的电路连接用粘接薄膜未能转印至ITO涂层玻璃基板上。接着,使用能在ITO涂层玻璃基板上转印电路连接用粘接薄膜的12个试样,将具有600个间距为50μm、厚18μm的镀锡铜电路的柔性电路板(FPC),在24℃、0.5MPa下加压5秒钟临时固定在电路连接用粘接薄膜上。然后,通过移动用电路连接用粘接薄膜临时固定该FPC的玻璃基板(试样数12),试着将其装置在实质压接机上,但是7个FPC由于输送中的振动而从电路连接用粘接薄膜剥落,不能提供于实质压接工序。
(比较例2)除了使用45重量份25℃下粘度为150mPa·s的二羟甲基三环癸烷二丙烯酸酯、3重量份2-甲基丙烯酰氧基乙基酸磷酸酯作为自由基聚合性物质以外,与实施例1相同地获得粘接剂层厚度为20μm的电路连接用粘接薄膜。得到的电路连接用粘接薄膜的临时固定力为200N/m。
(电路的连接)由比较例2制作的带状电路连接用粘接薄膜的粘合性过强,在室温下放置3天后,粘接薄膜层在基体材料薄膜上发生了背面转印,导致无法由卷轴抽出所需的粘接薄膜,未能提供于电路连接。
(比较例3)除了使用45重量份25℃下粘度为10mPa·s的三甘醇二丙烯酸酯、3重量份2-甲基丙烯酰氧基乙基酸磷酸酯(2-メタクリロイロキシエチルアツシドフオスヘ一ト)作为自由基聚合物质以外,与实施例1相同地获得粘接剂层厚度为20μm的电路连接用粘接薄膜。得到的电路连接用粘接薄膜的临时固定力为230N/m。
(电路的连接)由比较例3制作的带状电路连接用粘接薄膜的粘合性过强,在室温下放置3天后,粘接薄膜层在基体材料薄膜上发生了背面转印,导致无法由卷轴抽出所需的粘接薄膜,未能提供于电路连接。
由以上的实施例1和比较例1-3的结果可确认本发明的电路连接用粘接薄膜与柔性基板的连接工艺性良好。
如以上说明,根据本发明的电路连接用粘接薄膜,可以实现向作为电路构件的柔性基板的转印性和临时固定力的兼备,可克服自由基固化型电路连接用粘接薄膜的缺点,所以连接电路构件时的连接工艺性良好。
另外根据本发明的电路连接结构体,由于上述粘接薄膜与柔性基板的连接工艺性良好,所以可以改善生产效率,降低成本。
Claims (16)
1.一种电路连接用粘接薄膜,是介于相对置的电路电极之间并以电连接的方式连接所述电路电极之间的电路连接用粘接薄膜,其特征在于,含有可通过加热产生游离自由基的固化剂、自由基聚合性物质和薄膜形成性高分子,而且相对于具有电路电极的柔性基板的临时固定力为40-180N/m。
2.如权利要求1所述的电路连接用粘接薄膜,其特征在于,所述自由基聚合性物质是在25℃下具有100000mPa·s-1000000mPa·s粘度的自由基聚合性物质。
3.如权利要求2所述的电路连接用粘接薄膜,其特征在于,所述固化剂是半衰期为10小时的温度在40℃以上且半衰期为1分钟的温度在180℃以下的有机过氧化物。
4.如权利要求3所述的电路连接用粘接薄膜,其特征在于,有机过氧化物的配合量为0.05-10重量%。
5.如权利要求2所述的电路连接用粘接薄膜,其特征在于,所述自由基聚合性物质具有三环癸基。
6.如权利要求5所述的电路连接用粘接薄膜,其特征在于,所述自由基聚合性物质是丙烯酸酯或者甲基丙烯酸酯。
7.如权利要求2所述的电路连接用粘接薄膜,其特征在于,所述自由基聚合性物质中包含氨基甲酸酯丙烯酸酯或者氨基甲酸酯甲基丙烯酸酯。
8.如权利要求2所述的电路连接用粘接薄膜,其特征在于,所述自由基聚合性物质中包含具有三嗪环的自由基聚合性物质。
9.如权利要求2所述的电路连接用粘接薄膜,其特征在于,相对于100重量份所述自由基聚合性物质含有80-180重量份所述薄膜形成性高分子。
10.如权利要求2所述的电路连接用粘接薄膜,其特征在于,所述薄膜形成性高分子的分子量为10000-1000000。
11.如权利要求2所述的电路连接用粘接薄膜,其特征在于,还含有导电性粒子。
12.如权利要求11所述的电路连接用粘接薄膜,其特征在于,所述导电性粒子中,在过渡金属上具有由贵金属类构成的覆盖层,且所述覆盖层的厚度为30nm以上。
13.如权利要求2所述的电路连接用粘接薄膜,其特征在于,还含有5-60体积%范围的填充材料。
14.如权利要求11所述的电路连接用粘接薄膜,其特征在于,具有含有所述固化剂的第1层和含有所述导电性粒子的第2层。
15.一种电路连接结构体,其特征在于,是通过以下操作得到的,即,把具有第一电路电极的第一电路构件或者具有第二电路电极的第二电路构件中的至少一个构件作为柔性基板,在该柔性基板上临时固定权利要求1或2中所述的电路连接用粘接薄膜,并在使第一电路电极和第二电路电极对置的状态下配置所述第一电路构件和所述第二电路构件,且使所述电路连接用粘接薄膜介于所述对置的第一电路电极和所述第二电路电极之间,之后对所述电路连接用粘接薄膜进行加热和加压,以电连接的方式连接所述第一电路电极和第二电路电极。
16.一种电路连接结构体,其特征在于,具备在第一电路基板上形成有第一电路电极的第一电路构件、在第二电路基板上形成有第二电路电极的第二电路构件、和设置在所述第一电路电极和所述第二电路电极之间并连接所述第一和第二电路构件的电路连接构件,且所述电路连接构件由权利要求1或2所述的电路连接用粘接薄膜的固化物构成,所述第一电路电极和所述第二电路电极通过所述电路连接构件以电连接的方式相连接。
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CN101901788A (zh) * | 2009-02-06 | 2010-12-01 | 精工电子有限公司 | 树脂密封型半导体装置及其制造方法 |
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CN103173144B (zh) * | 2011-12-26 | 2015-05-20 | 第一毛织株式会社 | 用于各向异性导电粘附膜的组合物、各向异性导电粘附膜和半导体装置 |
CN103607855A (zh) * | 2013-10-26 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | 一种复合挠性基板的制造方法 |
CN103607855B (zh) * | 2013-10-26 | 2016-06-08 | 溧阳市东大技术转移中心有限公司 | 一种复合挠性基板的制造方法 |
CN107849425A (zh) * | 2015-06-02 | 2018-03-27 | 日产化学工业株式会社 | 无溶剂型光固化性粘接剂用组合物 |
CN112698523A (zh) * | 2019-10-07 | 2021-04-23 | 三星显示有限公司 | 制造显示模块的方法 |
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US20050151271A1 (en) | 2005-07-14 |
JP2005194393A (ja) | 2005-07-21 |
US20080064849A1 (en) | 2008-03-13 |
US7785708B2 (en) | 2010-08-31 |
TW200530366A (en) | 2005-09-16 |
KR101242930B1 (ko) | 2013-03-12 |
US7776438B2 (en) | 2010-08-17 |
KR20050072693A (ko) | 2005-07-12 |
CN100416921C (zh) | 2008-09-03 |
TWI265966B (en) | 2006-11-11 |
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