CN102417794B - 电路连接材料、连接方法、连接结构体及制造方法和用途 - Google Patents
电路连接材料、连接方法、连接结构体及制造方法和用途 Download PDFInfo
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- CN102417794B CN102417794B CN2011102511296A CN201110251129A CN102417794B CN 102417794 B CN102417794 B CN 102417794B CN 2011102511296 A CN2011102511296 A CN 2011102511296A CN 201110251129 A CN201110251129 A CN 201110251129A CN 102417794 B CN102417794 B CN 102417794B
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- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Adhesives Or Adhesive Processes (AREA)
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Abstract
Description
Claims (109)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-187456 | 2010-08-24 | ||
JP2010-187451 | 2010-08-24 | ||
JP2010187456 | 2010-08-24 | ||
JP2010187451 | 2010-08-24 | ||
JP2011173136A JP5668636B2 (ja) | 2010-08-24 | 2011-08-08 | 回路接続構造体の製造方法 |
JP2011-173136 | 2011-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102417794A CN102417794A (zh) | 2012-04-18 |
CN102417794B true CN102417794B (zh) | 2013-12-04 |
Family
ID=45723464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011102511296A Active CN102417794B (zh) | 2010-08-24 | 2011-08-23 | 电路连接材料、连接方法、连接结构体及制造方法和用途 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5668636B2 (zh) |
KR (1) | KR101227358B1 (zh) |
CN (1) | CN102417794B (zh) |
TW (1) | TWI436709B (zh) |
WO (1) | WO2012026470A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6065407B2 (ja) * | 2012-04-27 | 2017-01-25 | 日立化成株式会社 | 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法 |
JP6102105B2 (ja) * | 2012-07-19 | 2017-03-29 | 日立化成株式会社 | フィルム状回路接続材料及び回路接続構造体 |
JP6024261B2 (ja) * | 2012-07-26 | 2016-11-16 | 日立化成株式会社 | 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール |
JP6107175B2 (ja) * | 2013-01-29 | 2017-04-05 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
CN103336558B (zh) * | 2013-06-13 | 2016-12-28 | 业成光电(深圳)有限公司 | 电子装置 |
JP6398570B2 (ja) * | 2013-10-09 | 2018-10-03 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
JP6425382B2 (ja) * | 2014-01-08 | 2018-11-21 | デクセリアルズ株式会社 | 接続方法、及び接合体 |
JP6330346B2 (ja) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
JP6374192B2 (ja) * | 2014-03-25 | 2018-08-15 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
WO2022245957A1 (en) * | 2021-05-20 | 2022-11-24 | Illinois Tool Works Inc. | Air damper with integrated heater |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
KR100463558B1 (ko) * | 2000-04-25 | 2004-12-29 | 히다치 가세고교 가부시끼가이샤 | 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체 |
JP4747396B2 (ja) * | 2000-05-17 | 2011-08-17 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2006199825A (ja) * | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
JP2006173100A (ja) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
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TW201220995A (en) | 2012-05-16 |
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