CN1635950A - 碳-碳及/或金属-碳纤维复合物的热散布体 - Google Patents
碳-碳及/或金属-碳纤维复合物的热散布体 Download PDFInfo
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Abstract
描述了一种由多方位定向的大量碳素纤维组成的热散布体(305),以碳或金属基质材料分散于这些纤维的四周。这些碳素纤维促进了热的散逸远离较小半导体器件(303)而去向较大的除热器件如散热片(306)。
Description
发明背景
发明领域
本发明涉及一般半导体制造技术,更具体地说,涉及用于在半导体组件中散逸热的热散布体(heat spreader)技术。
相关技术描述
对于给定集成电路(这里也指器件)嵌入功能数目日趋增加。这样导致了器件电路密度增加。随着电路密度增加,人们又总希望数据处理速率加快;因此,也就要加快器件的时计速度。由于线路密度和时计速度都增大,器件所产生的热量也增大。不幸地是,随着器件承受热量增加,器件可靠性和性能下降。因此,关键在于必须要有一个与集成电路相关的有效除热体系。
图1说明一种典型集成电路和相关组件。对集成电路103除热的方法有许多,包括主动法如风扇或再循环冷却剂(未示出),或被动法如散热片107和热散布体105。由于器件103尺寸缩小,通常需要将小器件103产生的热量均匀分配给较大的散热片107,以消除器件中的“热点”。这就是热散布体105的功能。热散布体是通过使用热传导材料104与集成电路103连接的。在器件103和热散布结构105之间涂布了热界面材料104,诸如含有改善热传导的金属微粒的凝胶或润滑脂,以增强从集成电路103至热散布体105的传热。一般,这种热散布结构105是用陶瓷材料或金属如铝或铜构造的。从成本观点看,铝是优选的,因为它生产容易和便宜;但是,在所需传递热负荷增加时,所选金属变为铜,因为铜传热特征优异(Al导热系数是250W/m·K,Cu导热系数是395W/M·K)。在这种热散布体四周一般都有一相邻壁106,在基底101和热散布体105之间起连接点和支撑的作用。通常使散热片107与热散布体105连接,以使高表面积的散热片107有较高的冷却能力。
随散热要求提高,必需改善热散布体105及/或散热片107的性能。尽管通过主动冷却法如风扇或再循环液体提高散热片的性能运行较好,但这种方案也存在许多相关缺点,包括体积庞大、成本高和噪音大。
增加集成电路组件的散热能力的第二种方法是借助于改善热散布体的性能。目前热散布体材料能使热传导(的导热系数)达到80-400W/m-°K。图2说明增大热散布体201a、201b中热传导速率的一种方法。图2a显示散布器201a的顶视图,图2b说明同一热散布体201b的横截面图。已知用碳树脂或金属203a、203b浸渍的高热传导碳素纤维202a、202b层的复合物,是非常有效的热导体。这些材料也具备额外的优点,其重量比目前材料轻(如Cu基质复合物的密度为5.9克/毫升,而Cu密度为8.9克/毫升)、降低了组件重量及运输费用,并提供了生产人员人机控制的便利。但是,这些材料缺点是,其热流定向各向不相同,因此它们一般仅一个方向是高热传导的(>500W/m-K°)。热传导方向遵循碳素纤维的纵向取向,因此单向热流是由于复合物中大部分纤维定向于一个方向的结果。第二水平和垂直方向热传导不良的缺点常常超过上述这些优点。
因此,需要有一种用于增大所有三个方向热传递速率的装置,可以通过热散布体快速散逸热量至散热片。
附图简要说明
参照附图通过实施例对本发明加以说明,而非对其限制,其中:
图1显示已有技术集成电路组件的一种设计。
图2a显示已有技术热散布体的一种设计。
图2b显示已有技术热散布体设计的横截面。
图3显示一种集成电路组件横断面,包含利用碳素纤维多维分散热量的热散布体实施方案。
图4a显示利用碳素纤维多维分散热量的热散布体实施方案顶视图。
图4b显示利用碳素纤维多维分散热量的热散布体实施方案横截面。
图5显示利用碳素纤维多维分散热量的热散布体的一种不同实施方案。
图6显示一种利用碳素纤维多维分散热量的热散布体实施方案,在该热散布体的顶部和底部有热界面层,用以提高分散热效能。
图7显示一种利用碳素纤维多维分散热量的热散布体实施方案,其水平纤维层间装有截短纤维。
图8a显示利用碳素纤维多维分散热量的热散布体实施方案的顶视和侧视图,其热散布体已与支杆(standoffs)连接。
图8b显示在图8a热散布体上可用支杆的不同实施方案的顶视和侧视图。
图9显示一种集成电路组件,其含有利用碳素纤维多维分散热的热散布体的实施方案,该组件包含多个集成电路,
详细说明
描述了一种通过热散布体提高热流速率的装置。以下描述列举了许多诸如材料类型、尺寸等具体细节,以利于对本发明的全面理解。但是,对本领域技术人员来说,显然没有这些具体细节也可以实施本发明。在其它情况下,对众所周知的元件和处理技术没有具体详细说明,以免对本发明引起不必要的模糊认识。
描述了一种热散布体,是由大量多方向定向的碳素纤维组成,并使碳或金属基质物料分散于这些纤维四周。这些碳素纤维促使热量分散离开较小的半导体器件而往上至较大的除热器件如散热片。
本讨论主要限于有关从SMT或INT组件内安置的倒装片(flipchip)背部除热的要求。但是,应当承认,这样集中关注只是为了描述目的,本发明装置及方法是适用于其它类型电子器件及其它类型组件的。
图3说明本发明一组实施方案中半导体组件的横截面图。此组件包括基底301,装在基底301顶表面上的半导体器件303。在一组实施方案中,此基底301是一种印刷电路板。在另一实施方案中,此基底301可以是不同材料的,如硅或陶瓷。
在一组实施方案中,半导体器件303用机械及电方法经多个焊料凸接头(solder bump connections)302与基底顶表面连接。在一组实施方案中,可用底层环氧树脂材料(epoxy underfill material)(未示出)充填其间隙。基底301包含至少一层线路层(未示),使该器件与沿基底301底表面设置的销钉或球体(pins and balls)连接。
按照本发明,借助一种柔顺传热介质304使复合热散布体305与倒装片结构302、303底部进行热连接。在一组实施方案中,此传热介质是热润滑脂。在另一实施方案中,可采用凝胶或其它专有配方。
对此热散布体是用一种密封材料307使之进一步与基底连接的。密封材料307环饶器件303,并充填基底301和热散布体305之间的间隙,形成内含器件303的完全封闭空腔。用密封材料307可使基底301与热散布体305之间有更柔性的连接。在一组实施方案中,此密封材料可以是聚硅氧烷或其它专有密封材料。这种柔性连接有助于补偿热散布体与基底之间热膨胀系数(CTE)的差异,使热传导路径更一致。目前实施方案的第二个优点是,这种密封剂重量比已有技术相邻壁设计(参见图1,106)所用金属的重量轻很多,而使组件更轻。
其次,利用热界面材料308使散热片306与热散布体305连接。在一组实施方案中,此热界面材料308是一种热润滑脂。散热片306因增加了冷却表面积应允许热量散逸更快,如以上背景部分所述。
图4a(顶视图)和4b(横断面图)进一步说明了图3的热散布体。该热散布体305a、305b由一种复合材料组成,此复合材料包括用树脂材料403a、403b(称为碳/碳纤维复合材料)浸渍的碳素纤维402a、404a、405a、402b、404b、405b,或用金属或金属合金403a、403b(称为金属/碳纤维复合材料)浸渍的碳素纤维402a、404a、405a、402b、404b、405b的碳素纤维。在本发明的一组实施方案中,采用了一种碳/铜复合材料。但是,在另一实施方案中,该复合材料可采用不同热传导基体金属如铝或镁、合金、陶瓷如碳化硅,或有机材料如树脂。
选择用什么复合材料的一个要素可能是组件工艺中早先已用过何种材料。使金属/复合材料与先前的热散布体材料匹配,可允许使用与先前所用的同一胶粘剂或热润滑脂体系,从而简化了从一种热散布体材料变换为另一种材料的过程。考虑选用复合材料类型的第二个要素是基底材料的热膨胀系数。热散布体的热膨胀系数与基底热膨胀系数的较好匹配,生产更可靠的组件,是有可能的。
在本实施方案中,热散布体含有定向于该装置的x-y平面内的水平层纤维束402a、404a和402a、404b,由被编织成一薄片的两正交纤维束组成。这些编织纤维束促进在x-y平面中的热传导。此外,还有第二组纤维束405a,405b,基本定向垂直于第一组。此基本垂直的纤维束有助于促进z-轴方向的热传导。
在本实施方案中,这些纤维束由被缠绕成一束纤维束的约1000株碳素纤维组成。然后这些纤维束又被编织成片。本发明中的编织物应是平整均衡的,以便形成较平坦的热散布体。尽力保证整个织物x-y平面上纤维上下针数基本相同,可使编织物达到平整均衡。在一组实施方案中,各株碳素纤维直径约10微米,密度约2.2克/毫升。在这个实施方案中,纤维导热系数可以高达1000W/mK。市场可供应的碳素纤维的一个实例是Amoco K11002KTM。尽管在此实施方案中讨论了碳素纤维,但其它类型的高热传导性(>500W/mK)的纤维或金属丝、基于诸如聚合物、金属或陶瓷的材料,也可进入本发明。在一不同实施方案中,这些纤维可具有非常不同的物理和空间特性,上述热和物理性能不应被解释为对所用纤维材料特性的限制。
如上所述,然后用金属、金属合金、碳或陶瓷基质材料浸渍这些编织纤维薄片。可用许多不同方法,使此基质材料分散于编织片的周围。在此实施方案中,采用压缩成型方法。在另一实施方案中,可用注射成型、或本领域所实行的许多成型方法中任一种。先使这种成型材料固化,然后如有必要可将其切割为准确尺寸。在一组实施方案中,可采用激光器切割复合材料。在另一实施方案中,可采用机械法如锯切或碾压。
本发明中的热散布体在z-轴方向具有较好的热传导性能,其导热系数可能在500-1000W/mK范围。在本实施方案中,可使翅片散热器连接热散布体的顶表面。通过使用定向于z-轴方向的纤维,能穿过这种热散布体使热量向上传导给散热片,并可借助外界空气或主动冷却方法,冷却散热片,使热量散逸于周围环境,如背景部分中所述。
此外,定向于x-y平面内的纤维402a、402b、403a和403b允许热径向散逸,因此防止了局部热点的形成。局部加热会缩小有效传热面积,也减小了器件的总热通量。在x-y平面内的纤维402a、402b、403a和403b允许所传导的热量从器件联结点上较小的接触面积迅速散逸给其热散布体,实际上散逸给热散布体的整个(较大)面积。这意味着能够有效除去多得多的热量。
图5说明纤维在z-轴方向的定向可不同于上述基本垂直的定向。在这个实施方案中,可使z-轴的纤维502定向于与x-y平面纤维503成约+/-30度的角度。但是,应当明白,z-轴方向的相对定向可包括与x-y平面成0至+/-90度间的任何角度。
在本发明第三实施方案中,可能最好在该热散布体的顶和底部表面上包括一层较高密度的热界面层,如图6所示。在这个实施方案中,此热界面层601可包括与以上发明所用的相同碳素纤维材料603,只不过纤维密度比热散布体603主体所用的纤维密度有所增加。在一组实施方案中,热界面层601中纤维密度可4倍于主体603中的纤维密度。尽管这个实施方案可采用与以上实施方案相同的纤维,但应当明白,其它热传导的材料也可用作为热界面材料,包括非复合材料。此外,较高密度的碳素纤维层可由截短纤维组成,如下图7所讨论。在一组实施方案中,密度增大的纤维601可能达到甚至更高热传导能力,并可用于使在器件303/热散布体305界面区热点的热量沿x-y方向更迅速地散逸,此外还可通过顶层602,使从热散布体303至散热片(未显示)间的热传导更快。
在本发明另一实施方案中,用截短纤维替换基本定向于z-轴方向的纤维。在一组实施方案中,此截短纤维由用机械法打断或切割为长度小于0.5mm节段的碳素纤维组成。但是,截短纤维长度可明显不同于这个数值,上述尺寸不应被解释为对允许截短纤维长度的限制。此外,另一实施方案可采用其它类型的高热传导的纤维材料,而非碳素纤维,如上图4中所讨论。
在这个实施方案中,示于图7,截短纤维701被置于编织片702之间,即定向于x-y平面的,形成分层结构。然后,用碳或金属基的基质703浸渍截短纤维701和编织片702,形成一种复合材料。截短纤维701会有助于z-轴导热系数增大,很象前述实施方案所述的定向纤维。用截短纤维701可使热散布体的生产具有上述的成本降低的许多优点。在进一步实施方案中,可同时删去编织片702,而可采用截短纤维701或其它类型的碳材料如碳碎片,将其分散于整个热散布体中,以促进通过基质的热传导。
再回顾一下图3的讨论,用密封材料307使热散布体305与基底301连接。这样使两种结构之间的联结点更柔性和重量更轻。但是,有时可能希望组件刚性更大。图8a和8b说明可以怎样通过本发明获得更刚性的结构。在这个实施方案中,对热散布体305a增加了许多支杆802a,作为在粘接热散布体305a与基底(图3中的301)时起附加支撑和联结点的作用。在此说明中,示出了4个圆柱形支杆。应当明白,支杆数和其形状可根据应用场合而变化。参照图8b,其它形状可包括,但不局限于,矩形支杆801b、相邻壁802b、非相邻壁803b、有孔眼的矩形支杆804b或有底座的矩形支杆805b。基底对这些结构的关系有806b表明。在一组实施方案中,以上结构高约0.63毫米。但是,应该明白,这些结构的高度会随不同应用而变化,上述尺寸不应被解释为对该结构的限制。
再参看图8A,可用各种材料和方法构造支杆802a。在一组实施方案中,它们由聚合材料构造。这种材料的一个实例是高模数环氧树脂。
用高模数环氧树脂生产支杆的一种方法可以是注射成型法。但是,还有许多其它方法可用于构成支杆,这取决于所用的材料。这些包括,但不局限于:机加工、液态树脂成型和热成型。
对支杆802a,可通过粘结方法使之与热散布体305a连接。粘结类型的实例可包括利用胶粘剂诸如环氧树脂胶粘剂,或焊接。为了提高根脚/热散布体粘接强度,有可能需要对热散布体联结点的表面打毛,这取决于支杆所用材料类型和粘结法类型。虽然可采用的方法许多,但用于打毛方法的实例可包括机械法或激光器印痕法。
尽管前述实施方案集中于含单一器件的倒装片组件,但是本发明也可用于与多集成电路器件连接的组件基底。如图9所示,这些组件可能具有一种类似于单芯片组件的结构,包含通过球网排列(ball-grid arrays)302使多器件303与基底301连接,和利用柔顺传热介质304,通过加热,使之与碳/碳或金属/碳热散布体305连接。对该热散布体305,利用密封材料307或通过密封材料与支杆组合的方法,使之与基底连接,如图8所述。对此热散布体,可进一步使之连接在散热片306上,以促进通过热散布体305的除热。所有上述实施方案在热散布体构造方面也可应用于多芯(multi-chip)片结构。
因此,现已描述的是一种散逸从组合半导体器件的背部除去热量的装置。在前述详细说明中,已经参考其具体示范实施方案,对本发明的装置进行了描述。但是,显然在不偏离本发明广泛的精神和范围下,可进行各式各样的改进和变化。因此,本说明书和附图均应被看成是说明性的而非限制性的。
Claims (30)
1.一种包括以下步骤的方法:
将多元纤维置于模具中,这些纤维是近似定向于x与y方向的;
添加第二多元纤维;
沿这些纤维四周放置热传导材料,和
固化此热传导材料。
2.按照权利要求1的方法,其中纤维是编织的。
3.按照权利要求1的方法,其中纤维由碳组成。
4.按照权利要求1的方法,其中第二多元纤维是近似定向于垂直方向。
5.按照权利要求1的方法,其中第二多元纤维是被截短的。
6.一种热散布体,包括
定向于近似沿水平轴的多元纤维;
定向于近似沿第二水平轴并近似垂直于第一组纤维的第二多元纤维;
部分或全部定向于近似垂直方向,并近似垂直于第一及第二组纤维的第三多元纤维,和
沿这些纤维四周放置的一种热传导材料。
7.按照权利要求6的方法,其中纤维由碳组成。
8.按照权利要求6的方法,其中纤维是编织的。
9.按照权利要求6的方法,其中第三多元纤维是被截短的。
10.一种热散布体,包括:
第一层纤维,近似沿水平轴定向;
第二层纤维,近似沿同一水平轴定向,第二层纤维密度不同于第一层的;
第二层中的第二多元纤维,近似沿第二水平轴定向,并近似垂直于第二层中第一组纤维;
第二层中的第三多元纤维,近似沿垂直方向定向,并近似垂直于第二层中第二组纤维;
第三层纤维,其纤维密度不同于第二层纤维密度;
沿这些纤维四周放置的一种热传导材料。
11.按照权利要求10的热散布体,其中第一和第三层具有比第二层更高的纤维密度。
12.按照权利要求10的热散布体,其中第一和第三层纤维密度相同。
13.按照权利要求10的热散布体,其中纤维由碳组成。
14.按照权利要求10的热散布体,其中纤维是编织的。
15.按照权利要求11的热散布体,其中第一和第三层是被截短的。
16.一种半导体组件,包括:
一种具有顶表面的基底;
至少一个与所述基底的所述顶表面连接的半导体器件;
一层被固定在所述基底上其间构成一个空间的覆盖层,所述半导体器件处于所述空间内,所述覆盖层具有一个平坦的顶表面和一个底表面的周边;
被置于整个所述覆盖层上的第一多元纤维,被置于沿所述覆盖层基本水平方向的所述第一多元纤维结构;和
被置于整个所述覆盖层上的第二多元纤维结构,被置于沿所述覆盖层基本垂直方向的所述第二多元纤维。
17.按照权利要求16的半导体组件,其中覆盖层另外由一种复合材料组成。
18.按照权利要求16的半导体组件,其中纤维另外由碳组成。
19.按照权利要求16的半导体组件,另外包括与该覆盖层的平坦顶表面连接的散热片。
20.按照权利要求16的半导体组件,其中覆盖层是用密封剂将其固定在基底上的。
21.按照权利要求16的半导体组件,另外包括设置于基底和垫板之间的多个支柱(posts),对该覆盖层提供支撑。
22.按照权利要求21的半导体组件,其中支柱由聚合材料组成。
23.一种半导体组件,包括:
一种具有顶表面的基底;
至少一个与所述基底的所述顶表面连接的半导体器件;
一层被固定在所述基底上其间构成一个空间的覆盖层,该半导体器件处于所述空间内,该覆盖层具有平坦的顶表面和底表面的周边;该顶表面和底表面的周边是由一种热界面材料建造的;
被置于整个覆盖层的第一多元纤维,被置于沿该覆盖层近似水平方向的第一多元纤维;和
被置于整个覆盖层的第二多元纤维,被置于沿该覆盖层近似垂直方向的第二多元纤维。
24.按照权利要求23的半导体组件,其中所述覆盖层另外由一种复合材料组成。
25.按照权利要求23的半导体组件,其中纤维另外由碳组成。
26.按照权利要求23的半导体组件,其热界面材料由与该复合材料相同的材料组成。
27.按照权利要求26的半导体组件,另外包括与覆盖层平坦顶表面连接的散热片。
28.按照权利要求23的半导体组件,其中界面材料由复合材料组成,其中纤维的密度高于覆盖层纤维密度。
29.按照权利要求24的半导体组件,另外包括设置于所述基底与所述垫板之间的多个支柱(posts),对所述覆盖层提供支撑。
30.按照权利要求29的半导体组件,其中所述支柱由聚合材料组成。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101971310A (zh) * | 2007-12-31 | 2011-02-09 | 通用电气智能平台嵌入***公司 | 形成内嵌热解石墨的散热器的方法 |
CN103531564A (zh) * | 2012-06-29 | 2014-01-22 | 飞思卡尔半导体公司 | 带散热的功率晶体管及其形成方法 |
CN103531564B (zh) * | 2012-06-29 | 2017-12-22 | 恩智浦美国有限公司 | 带散热的功率晶体管及其形成方法 |
CN103635066A (zh) * | 2012-08-22 | 2014-03-12 | 英飞凌科技股份有限公司 | 散热器的制造方法及散热器 |
CN103635066B (zh) * | 2012-08-22 | 2016-05-18 | 英飞凌科技股份有限公司 | 散热器的制造方法及散热器 |
US10017870B2 (en) | 2012-08-22 | 2018-07-10 | Infineon Technologies Ag | Method for fabricating a heat sink, and heat sink |
Also Published As
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WO2002026479A2 (en) | 2002-04-04 |
US7534650B2 (en) | 2009-05-19 |
AU2001294836A1 (en) | 2002-04-08 |
EP1320455A2 (en) | 2003-06-25 |
US20050104197A1 (en) | 2005-05-19 |
US6469381B1 (en) | 2002-10-22 |
US6837306B2 (en) | 2005-01-04 |
WO2002026479A3 (en) | 2002-08-15 |
US20020038704A1 (en) | 2002-04-04 |
US7195951B2 (en) | 2007-03-27 |
US20070111383A1 (en) | 2007-05-17 |
CN100434262C (zh) | 2008-11-19 |
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