CN1551495A - 表面声波器件及其制造方法 - Google Patents
表面声波器件及其制造方法 Download PDFInfo
- Publication number
- CN1551495A CN1551495A CNA2004100347475A CN200410034747A CN1551495A CN 1551495 A CN1551495 A CN 1551495A CN A2004100347475 A CNA2004100347475 A CN A2004100347475A CN 200410034747 A CN200410034747 A CN 200410034747A CN 1551495 A CN1551495 A CN 1551495A
- Authority
- CN
- China
- Prior art keywords
- substrate
- piezoelectric substrate
- acoustic wave
- surface acoustic
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02905—Measures for separating propagation paths on substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP131003/2003 | 2003-05-09 | ||
JP2003131003A JP2004336503A (ja) | 2003-05-09 | 2003-05-09 | 弾性表面波素子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1551495A true CN1551495A (zh) | 2004-12-01 |
CN1551495B CN1551495B (zh) | 2011-01-05 |
Family
ID=33410567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100347475A Expired - Fee Related CN1551495B (zh) | 2003-05-09 | 2004-05-09 | 表面声波器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7202590B2 (zh) |
JP (1) | JP2004336503A (zh) |
KR (1) | KR100674071B1 (zh) |
CN (1) | CN1551495B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101868917A (zh) * | 2007-12-14 | 2010-10-20 | 株式会社村田制作所 | 表面波装置及其制造方法 |
CN101114822B (zh) * | 2006-07-24 | 2011-03-16 | 太阳诱电株式会社 | 弹性波器件及其制造方法 |
CN103532513A (zh) * | 2012-07-04 | 2014-01-22 | 太阳诱电株式会社 | 兰姆波器件及其制造方法 |
CN104024846A (zh) * | 2011-12-22 | 2014-09-03 | 日本无线株式会社 | 被测量物特性测量装置 |
CN105340178A (zh) * | 2013-07-02 | 2016-02-17 | 日本碍子株式会社 | 弹性波装置 |
CN106301270A (zh) * | 2015-06-24 | 2017-01-04 | 株式会社迪思科 | Saw器件的制造方法 |
CN110391793A (zh) * | 2018-04-19 | 2019-10-29 | 株式会社迪思科 | 声表面波器件的制造方法 |
CN110426122A (zh) * | 2019-07-30 | 2019-11-08 | 扬州大学 | 一种表面声波波束散射检测芯片 |
CN113169726A (zh) * | 2018-12-13 | 2021-07-23 | 株式会社村田制作所 | 弹性波装置 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006211057A (ja) * | 2005-01-25 | 2006-08-10 | Oki Electric Ind Co Ltd | トリプレクサ |
TW200626893A (en) * | 2005-01-28 | 2006-08-01 | yong-yu Chen | Surface acoustic wave thin-film measuring device and measuring method thereof |
JP2006304206A (ja) * | 2005-04-25 | 2006-11-02 | Shin Etsu Chem Co Ltd | 弾性表面波素子及び複合圧電チップ並びにその製造方法 |
JP4655796B2 (ja) * | 2005-07-15 | 2011-03-23 | 株式会社村田製作所 | 弾性境界波装置の製造方法及び弾性境界波装置 |
WO2007049699A1 (ja) * | 2005-10-27 | 2007-05-03 | Kyocera Corporation | 分波器とそれを用いた通信装置 |
JP4316632B2 (ja) * | 2007-04-16 | 2009-08-19 | 富士通メディアデバイス株式会社 | 弾性表面波装置及び分波器 |
KR101196990B1 (ko) | 2007-12-25 | 2012-11-05 | 가부시키가이샤 무라타 세이사쿠쇼 | 복합 압전 기판의 제조방법 |
JP5146655B2 (ja) * | 2008-02-29 | 2013-02-20 | Tdk株式会社 | 弾性表面波デュプレクサ |
KR100909842B1 (ko) * | 2008-09-22 | 2009-07-28 | 주식회사 아이.티.에프 | 표면탄성파 공진기 및 표면탄성파 공진기를 포함한 rf 필터 |
WO2010087226A1 (ja) * | 2009-01-29 | 2010-08-05 | 株式会社村田製作所 | 複合基板の製造方法 |
JP5458651B2 (ja) * | 2009-04-28 | 2014-04-02 | 株式会社村田製作所 | 弾性表面波素子用基板及び弾性表面波素子の製造方法 |
KR20110020741A (ko) * | 2009-08-24 | 2011-03-03 | 엔지케이 인슐레이터 엘티디 | 복합 기판의 제조 방법 |
WO2011037145A1 (ja) * | 2009-09-25 | 2011-03-31 | 株式会社村田製作所 | 弾性表面波装置 |
KR101340310B1 (ko) * | 2009-10-13 | 2013-12-12 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성 표면파 장치 |
JP2011114851A (ja) * | 2009-11-30 | 2011-06-09 | Ngk Insulators Ltd | 弾性波素子 |
JP5882053B2 (ja) * | 2011-12-28 | 2016-03-09 | 太陽誘電株式会社 | 弾性波デバイスの製造方法 |
JP5892878B2 (ja) * | 2012-06-28 | 2016-03-23 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法 |
JP5882154B2 (ja) * | 2012-07-19 | 2016-03-09 | 太陽誘電株式会社 | 弾性波デバイスの製造方法 |
WO2015012005A1 (ja) | 2013-07-25 | 2015-01-29 | 日本碍子株式会社 | 複合基板及びその製法 |
WO2015064238A1 (ja) * | 2013-10-31 | 2015-05-07 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
JP6362327B2 (ja) * | 2013-12-26 | 2018-07-25 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法 |
JP6310360B2 (ja) | 2014-08-13 | 2018-04-11 | 太陽誘電株式会社 | 弾性波デバイス |
JP6347446B2 (ja) * | 2014-12-11 | 2018-06-27 | 太陽誘電株式会社 | 横結合型多重モードモノリシックフィルタ |
CN113810017A (zh) * | 2015-12-24 | 2021-12-17 | 株式会社村田制作所 | 弹性波装置 |
JP6635794B2 (ja) | 2016-01-12 | 2020-01-29 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
JP6699927B2 (ja) * | 2016-03-03 | 2020-05-27 | 株式会社ディスコ | Bawデバイス及びbawデバイスの製造方法 |
DE102016111144B4 (de) * | 2016-06-17 | 2024-03-07 | Tdk Electronics Ag | Verfahren zur Herstellung einer Vielzahl von Bauelementen und Bauelement |
JP2018042208A (ja) * | 2016-09-09 | 2018-03-15 | 株式会社ディスコ | 表面弾性波デバイスチップの製造方法 |
US10938372B2 (en) | 2018-05-17 | 2021-03-02 | Taiyo Yuden Co., Ltd. | Acoustic wave resonator, acoustic wave device, and filter |
JP7382707B2 (ja) * | 2018-05-17 | 2023-11-17 | 太陽誘電株式会社 | 弾性波デバイスの製造方法 |
JP7397573B2 (ja) * | 2019-02-14 | 2023-12-13 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
US11394364B2 (en) | 2019-02-15 | 2022-07-19 | Skyworks Solutions, Inc. | Acoustic wave device with anti-reflection layer |
DE102019109022A1 (de) * | 2019-04-05 | 2020-10-08 | RF360 Europe GmbH | Akustische-Oberflächenwellen-Resonatoranordnung |
CN110504934B (zh) * | 2019-08-28 | 2020-04-07 | 杭州见闻录科技有限公司 | 一种芯片封装方法及封装结构 |
US11183987B2 (en) * | 2019-09-26 | 2021-11-23 | Avago Technologies International Sales Pte. Limited | Acoustic resonator device |
US11923822B2 (en) * | 2019-11-21 | 2024-03-05 | Skyworks Solutions, Inc. | Bulk acoustic wave resonator on surface acoustic wave device |
KR20220095695A (ko) * | 2020-12-30 | 2022-07-07 | (주) 와이팜 | 표면탄성파 공진기 및 표면탄성파 필터 |
CN113541636B (zh) * | 2021-07-29 | 2024-03-01 | 中国科学院上海微***与信息技术研究所 | 一种声波谐振器及其制备方法 |
CN116979927A (zh) * | 2023-07-19 | 2023-10-31 | 锐石创芯(重庆)科技有限公司 | 滤波器及电子设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5826220A (ja) | 1981-08-10 | 1983-02-16 | Mitsubishi Electric Corp | 空気量検出装置 |
JP2516817B2 (ja) | 1989-09-14 | 1996-07-24 | 清水 郁子 | 分極反転層を有するLiTaO▲下3▼基板及びこれを用いたデバイス |
JPH04109709A (ja) | 1990-08-29 | 1992-04-10 | Sanyo Electric Co Ltd | 弾性表面波素子 |
JPH06112764A (ja) | 1992-09-30 | 1994-04-22 | Hitachi Ltd | 弾性境界波装置 |
JPH0716427A (ja) | 1993-06-22 | 1995-01-20 | Kaoru Umeya | 空気浄化装置 |
DE69424737T2 (de) * | 1993-10-08 | 2000-09-28 | Matsushita Electric Ind Co Ltd | Akustisches Oberflächenwellenfilter |
JPH08237065A (ja) | 1995-02-28 | 1996-09-13 | Kinseki Ltd | 弾性表面波フィルタ |
JPH09208399A (ja) | 1996-01-31 | 1997-08-12 | Kyocera Corp | 圧電基体及び弾性表面波装置 |
JPH10190404A (ja) | 1996-12-20 | 1998-07-21 | Tdk Corp | 弾性表面波装置 |
JP3880150B2 (ja) | 1997-06-02 | 2007-02-14 | 松下電器産業株式会社 | 弾性表面波素子 |
JP3951379B2 (ja) | 1997-09-24 | 2007-08-01 | 株式会社村田製作所 | 表面波装置 |
KR20000014587A (ko) | 1998-08-21 | 2000-03-15 | 구자홍 | 표면탄성파 필터 |
US6320295B1 (en) * | 1998-11-18 | 2001-11-20 | Mcgill Robert Andrew | Diamond or diamond like carbon coated chemical sensors and a method of making same |
FR2788176B1 (fr) | 1998-12-30 | 2001-05-25 | Thomson Csf | Dispositif a ondes acoustiques guidees dans une fine couche de materiau piezo-electrique collee par une colle moleculaire sur un substrat porteur et procede de fabrication |
JP3341704B2 (ja) * | 1999-03-18 | 2002-11-05 | 株式会社村田製作所 | 端面反射型表面波装置の製造方法 |
JP4368499B2 (ja) | 1999-06-14 | 2009-11-18 | パナソニック株式会社 | 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法 |
US6426583B1 (en) * | 1999-06-14 | 2002-07-30 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave element, method for producing the same and surface acoustic wave device using the same |
JP2001345658A (ja) | 2000-05-31 | 2001-12-14 | Kinseki Ltd | 弾性表面波装置の製造方法 |
-
2003
- 2003-05-09 JP JP2003131003A patent/JP2004336503A/ja active Pending
-
2004
- 2004-05-07 US US10/840,632 patent/US7202590B2/en not_active Expired - Lifetime
- 2004-05-08 KR KR1020040032457A patent/KR100674071B1/ko active IP Right Grant
- 2004-05-09 CN CN2004100347475A patent/CN1551495B/zh not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101114822B (zh) * | 2006-07-24 | 2011-03-16 | 太阳诱电株式会社 | 弹性波器件及其制造方法 |
CN101868917B (zh) * | 2007-12-14 | 2014-02-19 | 株式会社村田制作所 | 表面波装置及其制造方法 |
CN101868917A (zh) * | 2007-12-14 | 2010-10-20 | 株式会社村田制作所 | 表面波装置及其制造方法 |
CN104024846B (zh) * | 2011-12-22 | 2016-06-08 | 日本无线株式会社 | 被测量物特性测量装置 |
CN104024846A (zh) * | 2011-12-22 | 2014-09-03 | 日本无线株式会社 | 被测量物特性测量装置 |
US9645116B2 (en) | 2011-12-22 | 2017-05-09 | Japan Radio Co., Ltd. | Object characteristics measurement apparatus |
CN103532513A (zh) * | 2012-07-04 | 2014-01-22 | 太阳诱电株式会社 | 兰姆波器件及其制造方法 |
CN105340178A (zh) * | 2013-07-02 | 2016-02-17 | 日本碍子株式会社 | 弹性波装置 |
CN105340178B (zh) * | 2013-07-02 | 2018-10-19 | 日本碍子株式会社 | 弹性波装置 |
CN106301270A (zh) * | 2015-06-24 | 2017-01-04 | 株式会社迪思科 | Saw器件的制造方法 |
CN110391793A (zh) * | 2018-04-19 | 2019-10-29 | 株式会社迪思科 | 声表面波器件的制造方法 |
CN113169726A (zh) * | 2018-12-13 | 2021-07-23 | 株式会社村田制作所 | 弹性波装置 |
CN113169726B (zh) * | 2018-12-13 | 2024-02-09 | 株式会社村田制作所 | 弹性波装置 |
CN110426122A (zh) * | 2019-07-30 | 2019-11-08 | 扬州大学 | 一种表面声波波束散射检测芯片 |
CN110426122B (zh) * | 2019-07-30 | 2022-02-22 | 扬州大学 | 一种表面声波波束散射检测芯片 |
Also Published As
Publication number | Publication date |
---|---|
KR100674071B1 (ko) | 2007-01-26 |
KR20040096780A (ko) | 2004-11-17 |
JP2004336503A (ja) | 2004-11-25 |
CN1551495B (zh) | 2011-01-05 |
US20040222717A1 (en) | 2004-11-11 |
US7202590B2 (en) | 2007-04-10 |
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