CN1441485A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN1441485A CN1441485A CN03104446A CN03104446A CN1441485A CN 1441485 A CN1441485 A CN 1441485A CN 03104446 A CN03104446 A CN 03104446A CN 03104446 A CN03104446 A CN 03104446A CN 1441485 A CN1441485 A CN 1441485A
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- CN
- China
- Prior art keywords
- lead
- electrode pad
- chip
- jut
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/64—Impedance arrangements
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP050940/2002 | 2002-02-27 | ||
JP050940/02 | 2002-02-27 | ||
JP2002050940A JP3913574B2 (ja) | 2002-02-27 | 2002-02-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1441485A true CN1441485A (zh) | 2003-09-10 |
CN100353531C CN100353531C (zh) | 2007-12-05 |
Family
ID=27784574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031044468A Expired - Fee Related CN100353531C (zh) | 2002-02-27 | 2003-02-14 | 半导体器件 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6894371B2 (zh) |
EP (1) | EP1347514B1 (zh) |
JP (1) | JP3913574B2 (zh) |
KR (1) | KR100643820B1 (zh) |
CN (1) | CN100353531C (zh) |
DE (1) | DE60322459D1 (zh) |
TW (1) | TW583758B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004016940B4 (de) * | 2004-04-06 | 2019-08-08 | Continental Automotive Gmbh | Schaltungsträger für einen Halbleiterchip und ein Bauelement mit einem Halbleiterchip |
US20070200210A1 (en) * | 2006-02-28 | 2007-08-30 | Broadcom Corporation | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages |
US10431532B2 (en) * | 2014-05-12 | 2019-10-01 | Rohm Co., Ltd. | Semiconductor device with notched main lead |
CN111587538B (zh) | 2018-01-11 | 2022-03-11 | 株式会社村田制作所 | 开关模块 |
CN115668763A (zh) * | 2020-04-03 | 2023-01-31 | 沃孚半导体公司 | 使用在栅极和/或漏极上具有穿过碳化硅通孔的晶体管管芯的堆叠rf电路拓扑 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6604965A (zh) * | 1966-04-14 | 1967-10-16 | ||
JPS53135574A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Lead frame |
JPH04280664A (ja) * | 1990-10-18 | 1992-10-06 | Texas Instr Inc <Ti> | 半導体装置用リードフレーム |
US5294826A (en) * | 1993-04-16 | 1994-03-15 | Northern Telecom Limited | Integrated circuit package and assembly thereof for thermal and EMI management |
JP2944403B2 (ja) * | 1993-12-24 | 1999-09-06 | 日本電気株式会社 | 半導体装置 |
US5519576A (en) * | 1994-07-19 | 1996-05-21 | Analog Devices, Inc. | Thermally enhanced leadframe |
JP3907743B2 (ja) * | 1995-05-11 | 2007-04-18 | ローム株式会社 | 半導体装置 |
JPH09283690A (ja) * | 1996-04-08 | 1997-10-31 | Murata Mfg Co Ltd | 半導体集積回路用リードフレーム |
US5859387A (en) * | 1996-11-29 | 1999-01-12 | Allegro Microsystems, Inc. | Semiconductor device leadframe die attach pad having a raised bond pad |
JP2891233B2 (ja) * | 1997-04-11 | 1999-05-17 | 日本電気株式会社 | 半導体装置 |
US6121674A (en) * | 1998-02-23 | 2000-09-19 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
US6114756A (en) * | 1998-04-01 | 2000-09-05 | Micron Technology, Inc. | Interdigitated capacitor design for integrated circuit leadframes |
JP3770763B2 (ja) * | 1999-12-07 | 2006-04-26 | ローム株式会社 | 電気機器駆動装置 |
JP2003204027A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法 |
US6627977B1 (en) * | 2002-05-09 | 2003-09-30 | Amkor Technology, Inc. | Semiconductor package including isolated ring structure |
-
2002
- 2002-02-27 JP JP2002050940A patent/JP3913574B2/ja not_active Expired - Fee Related
- 2002-11-28 TW TW091134580A patent/TW583758B/zh not_active IP Right Cessation
-
2003
- 2003-02-06 US US10/359,251 patent/US6894371B2/en not_active Expired - Lifetime
- 2003-02-14 CN CNB031044468A patent/CN100353531C/zh not_active Expired - Fee Related
- 2003-02-20 EP EP03003224A patent/EP1347514B1/en not_active Expired - Fee Related
- 2003-02-20 DE DE60322459T patent/DE60322459D1/de not_active Expired - Fee Related
- 2003-02-26 KR KR1020030011948A patent/KR100643820B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1347514B1 (en) | 2008-07-30 |
EP1347514A2 (en) | 2003-09-24 |
TW583758B (en) | 2004-04-11 |
TW200303605A (en) | 2003-09-01 |
KR100643820B1 (ko) | 2006-11-10 |
JP2003258188A (ja) | 2003-09-12 |
JP3913574B2 (ja) | 2007-05-09 |
CN100353531C (zh) | 2007-12-05 |
US20030164536A1 (en) | 2003-09-04 |
DE60322459D1 (de) | 2008-09-11 |
US6894371B2 (en) | 2005-05-17 |
EP1347514A3 (en) | 2005-10-19 |
KR20030071524A (ko) | 2003-09-03 |
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