TW583758B - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
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- TW583758B TW583758B TW091134580A TW91134580A TW583758B TW 583758 B TW583758 B TW 583758B TW 091134580 A TW091134580 A TW 091134580A TW 91134580 A TW91134580 A TW 91134580A TW 583758 B TW583758 B TW 583758B
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- electrode pads
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- semiconductor device
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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Description
583758
[發明所屬之技術領域] 本發明係有關於化合物半導體裝置者,尤係有關於可 使封件外形小形化之化合物半導體裝置者。 [先前技術] 行動電話等移動通信機器,係以使用GHz頻帶的微波 者多’且在天線之切換電路或在送收信之切換電路,多使 用切換此等南頻信號用之切換元件(例如特開平9 _丨8丨6 4 2 號)°此種元件’由於係使用於高頻,故以採用由珅化鎵 (GaAs)形成之場效電晶體(以下稱為FET)為多,隨著亦有 將上述切換電路予以積體化之單石微波積體電路(MM丨c )及 實現低失真或寬頻帶動作之混合用途之積體電路研發。 第6圖為習用之化合物半導體切換電路裝置電路圖。 該電路中,係在進行切換之FET1與FET2之輸出端〇UT1與 01^2與接地間連接分路(3]111111:扞£丁3、?£丁4,且在分路、 FET3、FET4之閘極施加與FET2及FET1控制端Ctl-2、CU-1 為互補之信號。其結果,在FET1為ON時,使分路FET4g ON,而FET2及分路FET3則為OFF者。 ” 在此電路中,若共用輸入端IN-輸出端OUT 1之信號通 路為ON,且將共用輸入端IN—輸出端out 2之信號通路為U 時,因為分路FET4為ON,故洩漏於輸出端0UT2之輸人作 號’將介由接地電容器C接地,因而可提昇隔絕性。° 第7圖係表示,該化合物半導體切換電路裝置積體化 之化合物半導體晶片示例。
將進行切換之FET1及FET2配置於GaAs基板左右之中央 部’而將分路FET3及分路FET4配置在左右之下方角落附X
314217.ptc 第8頁 583758 -案號91134^___h年/r月%日 倏正 五、發明說明(2) 近’並在各F Ε Τ之閑極連接電阻r 1、r 2、R 3及r 4。又將對 應於共用輸入端子IN、輸出端子〇un、〇υτ2、控制端子 CU-卜Ctl-2、及接地端子GND之焊墊(b〇nding pad)][、 (Η、02、Cb C2、G設置於基板周邊。且將分路FET3及分 路FET4之源極藉由接地電容器ca連接於接地端子GND。 第8圖係表示將第7圖中之晶片裝於導線架之圖。如第 8圖(A)所示,係由6接點之導線架所構成,在中央部配置 承座(header )40,且在承座40固定化合物半導體晶片4卜 該化合物半導體晶片4 1,具有如第7圖所示之圖案 (p a 11 e r η )延伸於一端之3條導線板4 2、4 3、4 4分別以焊接 線(bonding wire)連接於化合物半導體晶片41之控制端子 Ctl-2、共用輸入端in、控制端子ctl-1用之電極焊墊 (pad)C2、I、C卜導出於另一端之2條導線板45、47,則 分別以焊線連接化合物半導體晶片41之輸出端子0UT2、輸 出端子0 U T 1用之電極烊塾〇 2、0 1,而中央導線4 6則連接於 承座40作為接地端子GND。 如第8圖(B )(C )所示,半導體晶片係以導電焊膏8 5固 定於承座,並將各導線42、43、44、45、46、4 7之尖端露 出’而以下注模鑄(t r a n s f e r m ο 1 d )形成之樹脂層8 1予以 模塑。 發明所欲解_迭之課題 目前化合物半導體晶片係向小型化方向發展中,如第 9圖顯示,將上述半導體晶片之晶片尺寸予以縮小之構 造。其中,第9圖(A)為等效電路圖,而第9圖(B)係表示積 體化之晶片之一例。將電容以外加方式,或將F E T尺寸及
314217.ptc 第9頁 583758 月祝日 案號 91134fj«n 修正 五、發明說明(3) 配置合理化方式降低晶片尺寸者。可將習用 1. 07χ 〇· 5min降低到如第9圖(β) 0片尺寸 導體晶片,係沿晶片一邊配置於田5X 〇· 5mm。該半 用輸入端子用電極焊墊I、控制m子^電極焊墊c卜共 知斟的曰κ、嘉航里认f ?制知子用電極焊墊C2,而沿 相對的曰曰片邊配置輸出端子用電極焊墊 極焊墊CP、及輸出端子用電 逼谷知子用電 1 V川电徑乂于墊〇 2。由於 加,所以GND端子用電極焊墊g係由雷裳 替代,其餘構成元件則盘第^斤由_電//门子用電極焊藝cp 丁⑴兴弟〖圖所不者相同,故省略其說 日月0 八 第1 0圖顯示,將晶片固著於導線架之狀態。在此情 形,可將晶片尺寸縮小,以降低晶片成本,但是晶片料由 方向之尺寸(〇· 5mm)仍與第7圖所示之習用晶片相同。半導 體晶片+ 4 1 ’係以銀焊膏8 5等導電性黏合劑或非導電性黏合 劑固著=承座,而各焊墊電極由此處將焊接線8〇以放射狀 延伸’为別與各對應之導線連接。尤其,電容端子用電極 鮮塾cp係$承座以焊接線連結,並且連接於電容端子c, 唯用以固定晶片之銀焊膏的擴散難予控制,為了安定生 產 考慮银干賞之擴散而將導線予以擴大固定。亦即,雖 然使晶片尺寸縮小,仍然有為了安全性之問題而不能使整 個封裝體也隨之縮小。 現,’由於化合物半導體晶片尺寸之小型化進步且將 以廉價提供,所以在價格競爭上亦有勝於矽半導體晶片之 製品。然而,即使晶片之小型化進步,封裝體外形仍無法 予以小型化而維持原來之大尺寸,則其用途亦受到限制, 口而升y成無去將晶片尺寸之小型化反應於封裝體外形小型
314217.ptc 第10頁 583758 月如曰 修正 五、發明說明(4) 化之問題。 [發明内容] 本發明係有鑑於上述諸狀 裝置,具有:半導體a # . / ,‘、、, 提供—種半導體 於上述晶片之電用以固定該晶片之承座,·對應 連接上述電極焊墊及連結上述導 = = =yead);用以 I封固上述晶片、承座及導線板之樹浐声,衣置以及用以 置至少一個延伸於上述2條導 '曰於上述承座設 上述電極銲墊h何—,將連接於 部或上述突出部附近。 ’L 衣固疋於上述突出 由此,即使將承座做小 所以可提供可安定生產亦能使 線連結領域, 置。 1更封衣體小型化之半導體裝 [實施方式] ^恥第1圖至第5圖說明本發明之實施例如下. f 1圖係表示在導線架上固定化合物· :說導體晶片係與第9圖⑻所示者相^ 如第1圖所示,導線架係具有6接點之導線板,且在中 二在二…0上固定化合物半導體晶片 sk Ϊ : 11 : : V:; .5Γ ^^ 丨U 口视千V體日日片51之控制端子Ctl — 2、共用輸 入端子IN、控制端子cu — i用電極焊墊C2、卜c卜又在導 ΐίΐ端之2條導線板55、57,則分別以焊接線連接於化 口 ‘體晶片51之輸出端子0UT2、輸出端子ουτί用電極
314217.ptc 第11頁 583758
焊墊02、0卜又將中央之導線板56,連結於承座5〇。且盥 化合物半導體晶片5 1之電容端子用電極焊墊cp連接。” 本發明之第1項特徵,係在於承座之形狀及承座線焊 接位置。而在承座5 0,係於各導線板間設置至少丨處突出 部1 ο〇***其間。然後,將電容端子用電極焊墊2丈曰 接線連接於電容端子C之承座突出部丄〇 〇或突出部上〇 〇附于 近。 、 第2項特徵,係在於晶片固定位置。化合物半導體 51,並非固定於承座50中央,而係固定於偏離突出部" 之方向,所以可充分確保焊接於承座5〇之焊接線與苴兩 焊接線間之空間。 μ 第3項特徵,係在於橫跨晶片形成線焊接。先前技 術,係將焊接線,由各電極焊墊以放射狀固定於配置在其 外側之導線板,但是,以本發明之構造,係將固定於電^ 焊墊(在此處為電容端子用電極焊墊cp)以連接承座5 〇之焊 接線橫跨晶片上面延伸至固定在承座突出部1 〇 〇或其附 近。 f即,由於上述構造,在橫方向(χ軸方向)細小之承 座亦得以在突出部附近以焊接線連結。因而,即使在承座 上部之銀焊膏8 5擴散,仍可由焊接線連結於可確保焊接領 域之承座附近,所以可縮小承座尺寸,而使封裝體小型 化,且可安定生產。 在本實施形態中,係在承座設置多個突出部,且配置 於各導線板間。而將提供電容端子C之導線板5 6藉由外設 電容予以接地,且將連接控制端子Ct 1-1、Ct 1-2之導線板
314217.ptc 第12頁 583758 修正 案號 91134580 五、發明說明(6) 5 4、5 2 ’構成為僅施加直流之d C接點(p i n ),對高頻與接 地為等效’而於成為共用輸入端子〇之導線板53,成為輸 出端子OUT1之導線板57,及成為輸出端子out2導線板55 間’配置成對高頻為接地或接近接地之導線板或承座之突 出部’以提昇各高頻信號端子I N、〇UT1、⑽以間之隔絕 性。唯如特性上無問題,則承座之突出部,得僅作為一個 部位成為焊接線領域。 ffl 圖J系表不,將第1圖之晶片予以塑固之平面圖(第2 ΐ ΓίΓΐ圖(第2圖(B)、(C))。晶片51,係以導電焊 ^ 非導電焊膏固定於承座,將各導線52、53、54、 5 7之尖端露出,以下注模镇法、 塑固。此封裝體即稱為MCP6,小型化【s’曰' u 9_之尺寸。較第所_夕门j圣化為2. 0mmx 2. Immx 0. 寸為2 f 圖所不之同一晶片封襞體先前之封裝尺 寸為二.9mmx 2·8瞧已縮小許多。 間距,ΐ將突出部或其附近焊接之線需要適度之 度,因雖使長度較長但可限制高 又如^日片之溥形化有所貢獻。 此種封巢’ ^寻將晶片予以顛倒固定之構造。 若包括導線ΐ i rr:則:固部㈣^ 本菸明1 Γ 寸則與MCP6為同—尺寸。 限於電容端子用電極焊墊,而;;二!ίΐ】;:墊亦* 丨…丨咖珂冤極焊墊。如第
突出部或突出部附近,以^ f線領域確保於設在承座之 小型化者。因❿,只要可尺寸之縮小及封裝體之 在承座中央等任何位置。且;、領域,則可將晶片固定 583758 五、發明說明(7) 9圖(A)所示之電路圖中,因不需將外 容端子C之上,該端子可直接接地,而验二附s又在外加電 GND端子,X,相對於施加在附有外加電=::T = 1信號0/ + 3V,,亦有於控制端子施加〇/_3v控制信、號之之^換 第3圖係表示,本發明之第2實施 4項特徵’其與承座連接之電極焊塾 ’'置 '明之第 之同-線上,係、配置於較同一邊其他電極不焊配墊置之^ 片中央之位置。如第3圖(A)所示之晶片 =於晶 電極焊墊CP偏於晶片中央之外,其餘係與第啯電:第':用 (B)之構造完全相同。由此’如第3圖(B)所示, 9圖 =線連接之角度範圍得以擴大,因此焊接線位置之只施烊 棱昇,於是得將焊接線之不良率大幅度降低。 自由度 且將鄰接於電容端子用電極焊墊cp之電極 ,將0UT2端子用電極焊墊02,與悍接線離間距離大在此 侍以抑制***損失之劣化。 、人,故 再以第4圖及第5圖表示,本發明第3實施形雜 GaAs & FET之混頻器(mixer)用積體電路裝置之=壯吏用 第4圖(A)係表示,混頻器積體電路裝置雷衣例。 將第1及第4之FET卜4之問極連接於共用間極 ^。係 將第2與第3之FET2、3之間極連接於共用間極’而 將第丨與第2之FEn、2之源極(或没極)連接於丘用且 :S2,而將第3與第eFET3、4之源極(或及極)則端 共用源極端子S1。並且,將第1與第3之FET1、 樓於 源極)與共用没極端子D1連接,而將第2與第把
314217.ptc 第14頁 —1 " .......... 4-^^.
/DO /DO 號 91134,(
修正 五、發明說明(8) 汲極(或源極)連接於Α田、 此種混頻器積體^路=極端子D2。 此種電路構成之混頻哭衣置,係用以變換頻率之裝置, 之平衡-不平衡變換哭°。 c破稱為雙平衡混頻器,係以外加 180。相位倒置之各^信號、L0信號、IF信號予以 壓,因而適合於需要^。u ’所以偶數次高諧波成分被抑 無線通信。且可使用磨失真之移動體通信機器等高頻數位 路用之混頻器。其動二,頻帶、’所以最適合於CATV調諧電
在閘極卜閘極2輸入LfVfi。’在源極1、源極2輸入RF信號而 信號。 ^號’然後由汲極1、汲極2取出I F 第4圖(B)係表示,g — 頻器電路裝置予以積體ί = f弟4圖ΛΑ)之化合物半導體混 在GaAS基板之中央部配二?半導體晶片之示例。 而將對應於問極端子Jat 1' FET2' FET3' FET4° 墊G2、S2配置於沪日片^源極端子S〇urce2之各電極焊 夕濟朽踹+ ς 邊之同一線上,且將連接於承座 用電極銲塾si配置於較該兩電極ΐί 曰曰片”,部。且將對應於間極端子…以、“3 = 科 端子Drain2之電極焊墊G卜Dl、D2配置於 沿晶片相對方之一邊之同一線上。 -置於 各端子用電極焊墊,如第4圖( 有兩個:源極、汲極、及間極分別為共用、」I:個 州G1、G2及兩個源極端子用電極焊塾 S卜S2以及兩個汲極端子用電極焊墊M、s 二…V圖之晶片予以組裝後之-例。 ® )所不,ν線架(f rame)具有6接點之導線
583758 修正 案號91134如〇 五、發明說明(9)
半導^ ΐ :=。配乂置―承山座150 ’並在該承座150固定化合物 以r iT曰Γ * 。在一端之3條導線板1 5 2、1 5 3、1 5 4分別 接線連接於化合物半導體晶片51之 J 極端子用電極焊墊D1、汲極端子用電極焊墊/ 15=上1上6則與承座150連結,並與化合物半導體晶片 1之源極知子用電極焊墊s丨連接。 並將愈,Π至田夕5又置1處突出部2 〇 〇介入各導線板間, 部或突出部料。 斗接之焊接線固定於該突出 化合物半導體晶片,並不固定於承座中 偏離突出部方向位置,以充分 中央而固疋於 兩鄰焊接線間之空間。承^之焊接線與其 枝烊墊以放射狀固定於配置在其外 分电 明之構造,係固定於焊接在承 V Λ板,唯於本發 極端子用雷椏γ、妾在豕座電極焊墊(在此處為源 定)之銲線係橫跨於晶片上面而延伸固 疋於犬出〇卩或其附近。經由此部分 = 膏擴散仍可確保焊接線連、:領域領:以使 ^女疋組^生產’且可縮小承座之尺寸以實現封裝體小型 線上且接之電極焊塾,不配置於晶片邊之同- 中央之位置。由此,可將焊接線連 近曰曰片 可焊接線位置之自由度擴大而 n =,所以 不良率。 r田没|牛低烊接線連接時之 如第5圖⑻所示’各導線板152、153、154、出、
314217.ptc 第16頁 583758 案號 修」 五、發明說明(10) 1 5 6、1 5 7係將其尖端% , 予以塑固。此種封麥二出而以下注模鑄法形成之樹脂層81 2_0m恥< 2.1mnp< 〇.9\^%4MCP6,其尺寸已小型化為 而且,因用以固定 、 度之間距,可做成M字;大出0部或其附近之焊接線需要適 制其高度而使晶片薄形’化狀之環狀’ I長度較長而仍可抑 上述混頻器用穡辦^ ° n 甘雙電路裝置,其晶片尺寸可為η κ x0.45mm’其先所裝罢 ^ ^ · 4 5 m m 罝係與第8圖相同之大型封株 , 用本發明,則可利用 〃 i 了仵。如採 .^ 、笫1或第2實施例中之切換雷敗壯 相同之導線架,組裝於心伏电路装置 ^ ^ 衣於MCP6或MCPH6之已經小型化之私壯 體,所以可滿足行動+ — < 土1ϋ之封裝 求。而且,若共用=手機或catv調譜電路用途之需 成本。 換電路裝置之導線架,則可節省沖模 上述本毛明之貫施形態係以化 予以說明,但本發明甘丁阳6 — 丁〒瓶日日片為例 么土 L ^ 乃亚不限定於此實施形態,只要Λ捏垃 線連結於承座之晶片,心你Α丄…音Α 八聲為知接 果。 片 即使石夕半導體晶片亦可獲得同樣效 [發明之效果] t上所述,本發明可獲得如下各種效果。 可對:上:;由之在ί承f突出部或突出部附近連接焊接線, 日了 = ΐ 有所貢獻。先前在承座桿接焊接線 ^ , ^ ^ IV m ^电枉纟干墊將知接線以放射狀之最短距離
延伸而予以固定,但由於郃、卩曰AW ^ , _ . + π —由於銀烊肩擴散,致使晶片尺寸雖在 杈方向縮小,亦因連社捏垃綠、* 4立M d ^ „ ^ ^ ^4. "钚接線連接領域難於確保,導致封 I體之外形變大。然而,其拉士义 ^ 右私:本發明,可使焊接線橫跨晶
3l42l7.ptc 第17頁 583758 案號 911345Sn 五、發明說明(11)
修正 二上:延伸,因而可在承座突 域,所以承座可不必使用大型者。4其附近確保固定領 座中心部往突出部方向偏移固定j且因晶片位置,係由承 電極焊墊位置較其他電極焊墊$近使焊接線連結於承座之 之焊接線與其兩鄰之焊接線間確保充=,以使連接於承座 如此’使得先前為安定生產而不 ]封裝體尺寸縮小到2· Ommx 2. lmmx n 0 ^ u · 9 m m。且 m 曰 y 土仏 於中央而形成焊接線距離加長,但將焊接線纟M曰曰月禾位 形,使得對於薄形化有所貢獻。 、、做成M字狀環 第2,於組裝切換電路裝置時,承座突出部 線板間,因而與電容端子C連結導線板由外加g =伸於導 而且,與控制端子Ct 1-1、Ct 1-2連接之導線板各接地,’構成僅施 之較大尺寸 加直流之DC接點,在高頻與接地為等效,且在共 子I N之導線板、及輸出端子0 U T 1之導線板、以及 用輪 輪出 入 z八取 端 OUT2之導線板間,配置高頻時接地或近乎接地$ =出端子 承座突出部,所以,可提昇各高頻信號端子I N線板及 OUT2間之隔絕性。 Tl ' 第3,於組裝混頻器積體電路裝置時,可與G I c共用附裝有突出部之導線架。經由使導線架共換 降低沖壓模型成本,以實現裝配時之生產安定遍^ ’則可 型化之混頻器積體電路裝置。 衣懸小
314217.ptc 第18頁 583758 案號 91134580
圖式簡單說明 [圖式簡單說明]
第1圖:用以說明本發明之平面圖。 第2圖:用以說明本發明之(A)平面圖、 (C)剖視圖。 几’I視圖、 第3圖(A)及(B ):用以說明本發明之平面圖。 第4圖:用以說明本發明之(A)電路圖、^ ί- V 13 J 十 。 =圖:用以,明本發明之(A)平面圖、(B)剖視圖。 第6圖·用以說明習用技術之電路圖。 弟7圖·用以說明習用技術之平面圖。 第8圖:用以說明習用技術之(A)平面圖、(B)平面 圖、(C)剖視圖。 第9圖:用以說明先前技術之(a )電路圖、(B)平面 圖。 第1 0圖:用以說明先前技術之平面圖。 42、 43、 44、 45、 46、 47、 52、 53、 54、 55、 56、 57 152、153、154、155、156、157 導線板 50、 150 承座(header) 5 1、1 5 1 化合物半導體晶片 80 焊接線(bonding wire) 85 銀焊膏 100、 200 突出部
Dl、D2 没極端子用電極焊墊 G 1、G 2 閘極端子用電極焊墊 51、 S 2 源極端子用電極焊墊
314217.ptc 第19頁
Claims (1)
- 583758 _案號91134580_Λ年/P月抑曰 修正_ 六、申請專利範圍 1 . 一種半導體裝置,係具備: 半導體晶片; 用以固定該晶片之承座, 對應於上述晶片之電極焊墊配置之複數個導線 板; 用以焊接上述電極焊墊及上述導線板之連結機 構,以及, 用以封裝上述晶片、承座以及導線板樹脂層’ 且於上述承座至少設置一個延伸於上述兩條導線 板間之突出部,連接於上述任一電極焊墊之上述連結 機構固定於上述突出部或上述突出部附近者。 2. —種半導體裝置,具備: 設在半導體基板上之4個FET、兩個閘極端子用電 極焊墊、兩個源極端子用電極焊墊、兩個汲極端子用 電極焊墊,構成半導體混頻器積體電路之半導體晶 片; 用以固定該晶片之承座, 對應於上述晶片之電極焊墊而配置之複數個導線 板, 用以連接上述電極焊墊及上述導線板之連結機 構,以及 用以封裝上述晶片及承座以及導線板之樹脂層; 且係於上述承座至少設置一個延伸於上述兩條導 線板間之突出部,與任一上述電極焊墊連接之上述連314217.ptc 第20頁 583758 _案號 91134580_> 年 /p 月曰__ 六、申請專利範圍 結機構固定於上述突出部或上述突出部附近者。 3. 如申請專利範圍第2項之半導體裝置,其中,上述任一 電極焊墊為上述源極端子用電極焊墊之一者。 4. 一種半導體裝置,具備: 在半導體基板設置上至少具有兩個FET、一個輸入 端子用電極焊塾、至少一個控制端子用電極焊墊、兩 個輸出端子用電極焊墊及一個接地端子用電極焊墊或 電容端子用電極焊墊,以構成切換電路之半導體晶 片; 用以固定該晶片之承座, 對應於上述晶片之電極焊墊而配置之複數個導線 板, 用以連接上述電極焊墊及上述導線板之連結機 構,以及, 用以封裝上述晶片及承座以及導線板之樹脂層, 而在上述承座至少設置一個延伸於上述兩條導線 板間之突出部,以將連接於上述接地端子用電極焊墊 或電容端子用電極焊墊之上述連結機構固定於上述突 出部或上述突出部附近者。 5. 如申請專利範圍第1或第2或第4項之半導體裝置,其 中,係將上述晶片固定於上述承座上之偏離上述突出 部方向位置者。 6. 如申請專利範圍第1或第2或第4項之半導體裝置,其 中,係將固定於上述突出部或上述突出部附近之上述314217.ptc 第21頁 583758 案號91134580 A年A月日 修正 寸 六、申請專利範圍 連結機構延伸於上述晶片上面者。 7. 如申請專利範圍第1或第2或第4項之半導體裝置,其 中,與上述突出部或與上述突出部附近連接之上述電 極焊墊,係較沿上述晶片邊配置之其他電極焊墊配置 於靠近上述晶片中央部者。 8. 如申請專利範圍第1或第2或第4項之半導體裝置,其 中,係將連接上述突出部或上述突出部附近與上述電 極焊墊之連結機構以Μ字狀之環狀固定者。 9. 如申請專利範圍第1或第2或第4項之半導體裝置,其 中,係將上述晶片以導電性膠合劑或非導電性膠合劑 固定於上述承座者。 1 0 .如申請專利範圍第1或第4項之半導體裝置,其中,係 將挾住上述突出部而配置之上述導線板因上述突出部 而於高頻形成分離者。314217.ptc 第22頁
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JP (1) | JP3913574B2 (zh) |
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DE102004016940B4 (de) * | 2004-04-06 | 2019-08-08 | Continental Automotive Gmbh | Schaltungsträger für einen Halbleiterchip und ein Bauelement mit einem Halbleiterchip |
US20070200210A1 (en) * | 2006-02-28 | 2007-08-30 | Broadcom Corporation | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages |
US10431532B2 (en) * | 2014-05-12 | 2019-10-01 | Rohm Co., Ltd. | Semiconductor device with notched main lead |
CN111587538B (zh) | 2018-01-11 | 2022-03-11 | 株式会社村田制作所 | 开关模块 |
CN115668763A (zh) * | 2020-04-03 | 2023-01-31 | 沃孚半导体公司 | 使用在栅极和/或漏极上具有穿过碳化硅通孔的晶体管管芯的堆叠rf电路拓扑 |
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NL6604965A (zh) * | 1966-04-14 | 1967-10-16 | ||
JPS53135574A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Lead frame |
JPH04280664A (ja) * | 1990-10-18 | 1992-10-06 | Texas Instr Inc <Ti> | 半導体装置用リードフレーム |
US5294826A (en) * | 1993-04-16 | 1994-03-15 | Northern Telecom Limited | Integrated circuit package and assembly thereof for thermal and EMI management |
JP2944403B2 (ja) * | 1993-12-24 | 1999-09-06 | 日本電気株式会社 | 半導体装置 |
US5519576A (en) * | 1994-07-19 | 1996-05-21 | Analog Devices, Inc. | Thermally enhanced leadframe |
JP3907743B2 (ja) * | 1995-05-11 | 2007-04-18 | ローム株式会社 | 半導体装置 |
JPH09283690A (ja) * | 1996-04-08 | 1997-10-31 | Murata Mfg Co Ltd | 半導体集積回路用リードフレーム |
US5859387A (en) * | 1996-11-29 | 1999-01-12 | Allegro Microsystems, Inc. | Semiconductor device leadframe die attach pad having a raised bond pad |
JP2891233B2 (ja) * | 1997-04-11 | 1999-05-17 | 日本電気株式会社 | 半導体装置 |
US6121674A (en) * | 1998-02-23 | 2000-09-19 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
US6114756A (en) * | 1998-04-01 | 2000-09-05 | Micron Technology, Inc. | Interdigitated capacitor design for integrated circuit leadframes |
JP3770763B2 (ja) * | 1999-12-07 | 2006-04-26 | ローム株式会社 | 電気機器駆動装置 |
JP2003204027A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法 |
US6627977B1 (en) * | 2002-05-09 | 2003-09-30 | Amkor Technology, Inc. | Semiconductor package including isolated ring structure |
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KR100643820B1 (ko) | 2006-11-10 |
JP2003258188A (ja) | 2003-09-12 |
JP3913574B2 (ja) | 2007-05-09 |
CN100353531C (zh) | 2007-12-05 |
CN1441485A (zh) | 2003-09-10 |
US20030164536A1 (en) | 2003-09-04 |
DE60322459D1 (de) | 2008-09-11 |
US6894371B2 (en) | 2005-05-17 |
EP1347514A3 (en) | 2005-10-19 |
KR20030071524A (ko) | 2003-09-03 |
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