CN1438765A - 压电振动器的制造方法 - Google Patents
压电振动器的制造方法 Download PDFInfo
- Publication number
- CN1438765A CN1438765A CN03106043A CN03106043A CN1438765A CN 1438765 A CN1438765 A CN 1438765A CN 03106043 A CN03106043 A CN 03106043A CN 03106043 A CN03106043 A CN 03106043A CN 1438765 A CN1438765 A CN 1438765A
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- Prior art keywords
- vibrator
- exciting electrode
- electrode
- framework
- exciting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 29
- 239000012528 membrane Substances 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 25
- 239000011159 matrix material Substances 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000009966 trimming Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0478—Resonance frequency in a process for mass production
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002038139A JP4008258B2 (ja) | 2002-02-15 | 2002-02-15 | 圧電振動子の製造方法 |
JP38139/2002 | 2002-02-15 | ||
JP38139/02 | 2002-02-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1438765A true CN1438765A (zh) | 2003-08-27 |
CN100566145C CN100566145C (zh) | 2009-12-02 |
Family
ID=27678151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031060439A Expired - Fee Related CN100566145C (zh) | 2002-02-15 | 2003-02-17 | 压电振动器的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6996884B2 (zh) |
JP (1) | JP4008258B2 (zh) |
CN (1) | CN100566145C (zh) |
TW (1) | TWI284454B (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101510766A (zh) * | 2008-02-14 | 2009-08-19 | 精工电子有限公司 | 压电振动片及其制造方法、晶圆、包括压电振动片的装置 |
CN101521494A (zh) * | 2008-02-26 | 2009-09-02 | 精工电子有限公司 | 压电振动片以及制造压电振动片的方法 |
CN101026364B (zh) * | 2006-02-23 | 2010-04-14 | 朱爱发 | 一种晶体元器件的生产方法 |
CN101939910A (zh) * | 2007-12-04 | 2011-01-05 | 精工电子有限公司 | 电压振动器的制造方法、压电振动器、振荡器、电子设备及电波钟 |
CN101964638A (zh) * | 2009-07-24 | 2011-02-02 | 精工电子有限公司 | 压电振动器、电压振动器的制造方法、振荡器、电子设备及电波钟 |
CN102334287A (zh) * | 2009-02-25 | 2012-01-25 | 精工电子有限公司 | 封装件、封装件的制造方法以及压电振动器的制造方法 |
CN102696173A (zh) * | 2010-04-01 | 2012-09-26 | 株式会社大真空 | 表面安装型的电子部件用封装的基底、以及表面安装型的电子部件用封装 |
CN103001600A (zh) * | 2011-09-08 | 2013-03-27 | 日本电波工业株式会社 | 表面安装晶体振子及其制造方法 |
CN103095243A (zh) * | 2011-11-02 | 2013-05-08 | 日本电波工业株式会社 | 压电振动片以及压电元件 |
CN103312289A (zh) * | 2012-03-14 | 2013-09-18 | 日本电波工业株式会社 | 晶体装置及其制造方法 |
CN101510765B (zh) * | 2008-02-14 | 2014-03-26 | 精工电子水晶科技股份有限公司 | 压电振动片及其制造方法、晶圆、包括压电振动片的装置 |
CN103716005A (zh) * | 2012-09-28 | 2014-04-09 | 日本电波工业株式会社 | 水晶振子 |
CN102204089B (zh) * | 2008-08-28 | 2015-01-14 | 精工电子水晶科技股份有限公司 | 压电振动片的制造方法、压电振动器、振荡器、电子设备及电波钟 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6918115B2 (en) * | 2001-02-16 | 2005-07-12 | Microsoft Corporation | Method and apparatus for synchronization of periodic processes |
JP2006148758A (ja) * | 2004-11-24 | 2006-06-08 | Kyocera Kinseki Corp | 水晶振動子パッケージ |
JP2006157369A (ja) * | 2004-11-29 | 2006-06-15 | Kyocera Kinseki Corp | 水晶振動子パッケージの製造方法 |
JP4504171B2 (ja) * | 2004-11-30 | 2010-07-14 | 京セラキンセキ株式会社 | 水晶振動子パッケージの製造方法 |
JP2006180169A (ja) * | 2004-12-22 | 2006-07-06 | Kyocera Kinseki Corp | 振動子パッケージの製造方法 |
JP4555068B2 (ja) * | 2004-12-27 | 2010-09-29 | 京セラキンセキ株式会社 | 水晶振動子パッケージの製造方法 |
JP2006211482A (ja) * | 2005-01-31 | 2006-08-10 | Kyocera Kinseki Corp | 周波数調整装置 |
JP4865350B2 (ja) * | 2005-02-10 | 2012-02-01 | セイコーインスツル株式会社 | 圧電発振器とその製造方法及び圧電発振器を備えた電子機器 |
JP2006339840A (ja) * | 2005-05-31 | 2006-12-14 | Kyocera Kinseki Corp | 水晶振動子 |
US7639104B1 (en) * | 2007-03-09 | 2009-12-29 | Silicon Clocks, Inc. | Method for temperature compensation in MEMS resonators with isolated regions of distinct material |
US7956517B1 (en) | 2007-05-10 | 2011-06-07 | Silicon Laboratories | MEMS structure having a stress inverter temperature-compensated resonator member |
JP5155685B2 (ja) * | 2008-02-15 | 2013-03-06 | セイコーインスツル株式会社 | 圧電振動片の製造方法 |
US7944124B1 (en) * | 2008-08-29 | 2011-05-17 | Silicon Laboratories Inc. | MEMS structure having a stress-inducer temperature-compensated resonator member |
WO2010082329A1 (ja) * | 2009-01-15 | 2010-07-22 | セイコーインスツル株式会社 | パッケージの製造方法及びウエハ接合体、圧電振動子、発振器、電子機器、並びに電波時計 |
WO2011030572A1 (ja) * | 2009-09-14 | 2011-03-17 | 株式会社村田製作所 | 水晶発振装置 |
JP5054146B2 (ja) | 2010-02-01 | 2012-10-24 | 日本電波工業株式会社 | 圧電デバイス及びその製造方法 |
CN104040725B (zh) | 2011-08-17 | 2017-08-22 | 公共服务解决方案公司 | 用于成像***的无源检测器 |
CN103280523B (zh) | 2013-06-18 | 2015-03-25 | 厦门乃尔电子有限公司 | 高温压电元件电极制作方法及压电元件结构 |
JP6589982B2 (ja) * | 2015-06-12 | 2019-10-16 | 株式会社大真空 | 圧電振動デバイス |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5323589A (en) * | 1976-08-18 | 1978-03-04 | Seiko Epson Corp | Crystal vibrator |
FR2477803A1 (fr) * | 1980-03-04 | 1981-09-11 | Suwa Seikosha Kk | Resonateur a quartz du type diapason a couplage de modes |
US4592663A (en) * | 1984-05-10 | 1986-06-03 | Quartex, Inc. | Resonator temperature transducer |
DE69628981T2 (de) * | 1995-04-04 | 2004-01-08 | Matsushita Electric Industrial Co., Ltd., Kadoma | Drehgeschwindigkeitssensor |
-
2002
- 2002-02-15 JP JP2002038139A patent/JP4008258B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-05 US US10/358,860 patent/US6996884B2/en not_active Expired - Fee Related
- 2003-02-12 TW TW92102897A patent/TWI284454B/zh not_active IP Right Cessation
- 2003-02-17 CN CNB031060439A patent/CN100566145C/zh not_active Expired - Fee Related
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101026364B (zh) * | 2006-02-23 | 2010-04-14 | 朱爱发 | 一种晶体元器件的生产方法 |
CN101939910A (zh) * | 2007-12-04 | 2011-01-05 | 精工电子有限公司 | 电压振动器的制造方法、压电振动器、振荡器、电子设备及电波钟 |
CN101939910B (zh) * | 2007-12-04 | 2013-12-25 | 精工电子有限公司 | 电压振动器的制造方法、压电振动器、振荡器、电子设备及电波钟 |
CN101510765B (zh) * | 2008-02-14 | 2014-03-26 | 精工电子水晶科技股份有限公司 | 压电振动片及其制造方法、晶圆、包括压电振动片的装置 |
CN101510766A (zh) * | 2008-02-14 | 2009-08-19 | 精工电子有限公司 | 压电振动片及其制造方法、晶圆、包括压电振动片的装置 |
CN101521494A (zh) * | 2008-02-26 | 2009-09-02 | 精工电子有限公司 | 压电振动片以及制造压电振动片的方法 |
CN101521494B (zh) * | 2008-02-26 | 2014-09-10 | 精工电子水晶科技股份有限公司 | 压电振动片以及制造压电振动片的方法 |
CN102204089B (zh) * | 2008-08-28 | 2015-01-14 | 精工电子水晶科技股份有限公司 | 压电振动片的制造方法、压电振动器、振荡器、电子设备及电波钟 |
CN102334287A (zh) * | 2009-02-25 | 2012-01-25 | 精工电子有限公司 | 封装件、封装件的制造方法以及压电振动器的制造方法 |
CN102334287B (zh) * | 2009-02-25 | 2015-04-29 | 精工电子有限公司 | 封装件、封装件的制造方法以及压电振动器的制造方法 |
CN101964638A (zh) * | 2009-07-24 | 2011-02-02 | 精工电子有限公司 | 压电振动器、电压振动器的制造方法、振荡器、电子设备及电波钟 |
CN102696173A (zh) * | 2010-04-01 | 2012-09-26 | 株式会社大真空 | 表面安装型的电子部件用封装的基底、以及表面安装型的电子部件用封装 |
CN102696173B (zh) * | 2010-04-01 | 2016-03-16 | 株式会社大真空 | 表面安装型的电子部件用封装的基底、以及表面安装型的电子部件用封装 |
CN103001600B (zh) * | 2011-09-08 | 2016-07-06 | 日本电波工业株式会社 | 表面安装晶体振子及其制造方法 |
CN103001600A (zh) * | 2011-09-08 | 2013-03-27 | 日本电波工业株式会社 | 表面安装晶体振子及其制造方法 |
CN103095243A (zh) * | 2011-11-02 | 2013-05-08 | 日本电波工业株式会社 | 压电振动片以及压电元件 |
CN103312289A (zh) * | 2012-03-14 | 2013-09-18 | 日本电波工业株式会社 | 晶体装置及其制造方法 |
CN103716005A (zh) * | 2012-09-28 | 2014-04-09 | 日本电波工业株式会社 | 水晶振子 |
Also Published As
Publication number | Publication date |
---|---|
US20030154584A1 (en) | 2003-08-21 |
JP2003243962A (ja) | 2003-08-29 |
TW200303116A (en) | 2003-08-16 |
JP4008258B2 (ja) | 2007-11-14 |
TWI284454B (en) | 2007-07-21 |
US6996884B2 (en) | 2006-02-14 |
CN100566145C (zh) | 2009-12-02 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: JINGGONG ELECTRONIC CRYSTAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SEIKO INSTRUMENTS, INC. Effective date: 20131219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131219 Address after: Chiba, Chiba, Japan Patentee after: Jinggong Electronic Crystal Technology Co., Ltd. Address before: Chiba, Chiba, Japan Patentee before: Seiko Instruments Inc. |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091202 Termination date: 20140217 |