CN1374702A - 固体摄象装置 - Google Patents
固体摄象装置 Download PDFInfo
- Publication number
- CN1374702A CN1374702A CN02106736A CN02106736A CN1374702A CN 1374702 A CN1374702 A CN 1374702A CN 02106736 A CN02106736 A CN 02106736A CN 02106736 A CN02106736 A CN 02106736A CN 1374702 A CN1374702 A CN 1374702A
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- 230000002411 adverse Effects 0.000 claims description 11
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- 230000015572 biosynthetic process Effects 0.000 claims description 3
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/1506—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation with addressing of the image-sensor elements
- H04N3/1512—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation with addressing of the image-sensor elements for MOS image-sensors, e.g. MOS-CCD
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001060016 | 2001-03-05 | ||
JP2001060016 | 2001-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1374702A true CN1374702A (zh) | 2002-10-16 |
CN100347859C CN100347859C (zh) | 2007-11-07 |
Family
ID=18919491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021067368A Expired - Fee Related CN100347859C (zh) | 2001-03-05 | 2002-03-05 | 固体摄象装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7187410B2 (zh) |
CN (1) | CN100347859C (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100362854C (zh) * | 2003-02-13 | 2008-01-16 | 松下电器产业株式会社 | 固体摄像装置、其驱动方法及使用它的照相机 |
CN101438576A (zh) * | 2006-05-02 | 2009-05-20 | 伊斯曼柯达公司 | 使用光电二极管的cmos图像传感器像素 |
CN100518254C (zh) * | 2005-01-14 | 2009-07-22 | 佳能株式会社 | 图像拾取装置、其控制方法和照相机 |
CN101491086B (zh) * | 2006-05-15 | 2011-12-14 | 索尼株式会社 | 成像设备、该成像设备的驱动方法、显示设备和电子装置 |
CN102487436A (zh) * | 2010-12-01 | 2012-06-06 | 英属开曼群岛商恒景科技股份有限公司 | 感测像素阵列及感测装置 |
CN102307281B (zh) * | 2008-05-30 | 2014-04-16 | 索尼株式会社 | 固体摄像器件、固体摄像器件的驱动方法和电子装置 |
CN102623474B (zh) * | 2007-03-15 | 2015-08-05 | 全视技术有限公司 | 像素面积减小的图像传感器 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3988189B2 (ja) * | 2002-11-20 | 2007-10-10 | ソニー株式会社 | 固体撮像装置 |
CN1574370A (zh) * | 2003-05-30 | 2005-02-02 | 松下电器产业株式会社 | 固体摄像器件 |
JP4194544B2 (ja) * | 2003-12-05 | 2008-12-10 | キヤノン株式会社 | 固体撮像装置及び固体撮像装置の駆動方法 |
JP4298685B2 (ja) * | 2004-09-02 | 2009-07-22 | キヤノン株式会社 | シフトレジスタ、及び同シフトレジスタを用いた固体撮像装置、カメラ |
KR100877691B1 (ko) * | 2005-12-08 | 2009-01-09 | 한국전자통신연구원 | 이미지 센서 및 이미지 센서의 트랜스퍼 트랜지스터 구동방법 |
JP4058459B1 (ja) * | 2007-03-02 | 2008-03-12 | キヤノン株式会社 | 撮像装置及び撮像システム |
JP4413940B2 (ja) * | 2007-03-22 | 2010-02-10 | 株式会社東芝 | 固体撮像素子、単板カラー固体撮像素子及び電子機器 |
CN102023422B (zh) | 2009-09-15 | 2013-07-10 | 北京京东方光电科技有限公司 | Tft-lcd组合基板、液晶显示器及其制造方法 |
JP5238673B2 (ja) * | 2009-11-09 | 2013-07-17 | 株式会社東芝 | 固体撮像装置 |
JP6115982B2 (ja) * | 2011-07-04 | 2017-04-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像装置 |
JP2021010147A (ja) | 2019-07-03 | 2021-01-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、撮像装置、および、固体撮像素子の制御方法 |
CN114187870B (zh) * | 2020-09-14 | 2023-05-09 | 京东方科技集团股份有限公司 | 光电检测电路及其驱动方法、显示装置及其制作方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63100879A (ja) * | 1986-10-17 | 1988-05-02 | Hitachi Ltd | 固体撮像装置 |
US5122881A (en) * | 1988-08-10 | 1992-06-16 | Hitachi, Ltd. | Solid-state imaging device with an amplifying FET in each pixel and an output capacitor in each row |
US5933188A (en) * | 1994-10-19 | 1999-08-03 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and method with reset |
JP3793250B2 (ja) | 1995-03-08 | 2006-07-05 | 日本放送協会 | 固体撮像装置 |
JPH09275204A (ja) | 1996-04-04 | 1997-10-21 | Fuji Xerox Co Ltd | 固体撮像素子 |
JP3310164B2 (ja) * | 1996-05-30 | 2002-07-29 | 株式会社東芝 | 固体撮像装置 |
JP3579194B2 (ja) | 1996-09-17 | 2004-10-20 | 株式会社東芝 | 固体撮像装置の駆動方法 |
JP3383523B2 (ja) * | 1996-09-19 | 2003-03-04 | 株式会社東芝 | 固体撮像装置及びその駆動方法 |
US6087685A (en) * | 1996-12-12 | 2000-07-11 | Sony Corporation | Solid-state imaging device |
JPH10257392A (ja) | 1997-03-14 | 1998-09-25 | Matsushita Electron Corp | 物理量分布検知半導体装置およびその駆動方法ならびにその製造方法 |
US6115066A (en) * | 1997-06-12 | 2000-09-05 | International Business Machines Corporation | Image sensor with direct digital correlated sampling |
JP3466886B2 (ja) * | 1997-10-06 | 2003-11-17 | キヤノン株式会社 | 固体撮像装置 |
JP3406832B2 (ja) | 1998-03-19 | 2003-05-19 | 株式会社東芝 | 固体撮像装置 |
US6734906B1 (en) * | 1998-09-02 | 2004-05-11 | Canon Kabushiki Kaisha | Image pickup apparatus with photoelectric conversion portions arranged two dimensionally |
JP3512152B2 (ja) * | 1998-10-14 | 2004-03-29 | 松下電器産業株式会社 | 増幅型固体撮像装置およびその駆動方法 |
US6850278B1 (en) * | 1998-11-27 | 2005-02-01 | Canon Kabushiki Kaisha | Solid-state image pickup apparatus |
JP2001016502A (ja) | 1999-06-30 | 2001-01-19 | Toshiba Corp | 固体撮像装置 |
JP3501743B2 (ja) | 1999-10-05 | 2004-03-02 | キヤノン株式会社 | 固体撮像装置および撮像システム |
JP2001168310A (ja) | 1999-12-10 | 2001-06-22 | Innotech Corp | 固体撮像素子及び固体撮像装置 |
JP3658278B2 (ja) * | 2000-05-16 | 2005-06-08 | キヤノン株式会社 | 固体撮像装置およびそれを用いた固体撮像システム |
JP2002083949A (ja) | 2000-09-07 | 2002-03-22 | Nec Corp | Cmosイメージセンサ及びその製造方法 |
-
2002
- 2002-03-05 CN CNB021067368A patent/CN100347859C/zh not_active Expired - Fee Related
- 2002-03-05 US US10/087,824 patent/US7187410B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100362854C (zh) * | 2003-02-13 | 2008-01-16 | 松下电器产业株式会社 | 固体摄像装置、其驱动方法及使用它的照相机 |
CN100518254C (zh) * | 2005-01-14 | 2009-07-22 | 佳能株式会社 | 图像拾取装置、其控制方法和照相机 |
CN101438576A (zh) * | 2006-05-02 | 2009-05-20 | 伊斯曼柯达公司 | 使用光电二极管的cmos图像传感器像素 |
CN101491086B (zh) * | 2006-05-15 | 2011-12-14 | 索尼株式会社 | 成像设备、该成像设备的驱动方法、显示设备和电子装置 |
CN102623474B (zh) * | 2007-03-15 | 2015-08-05 | 全视技术有限公司 | 像素面积减小的图像传感器 |
CN102307281B (zh) * | 2008-05-30 | 2014-04-16 | 索尼株式会社 | 固体摄像器件、固体摄像器件的驱动方法和电子装置 |
CN102487436A (zh) * | 2010-12-01 | 2012-06-06 | 英属开曼群岛商恒景科技股份有限公司 | 感测像素阵列及感测装置 |
Also Published As
Publication number | Publication date |
---|---|
US20020122130A1 (en) | 2002-09-05 |
US7187410B2 (en) | 2007-03-06 |
CN100347859C (zh) | 2007-11-07 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141124 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Osaka Patentee after: Matsushita Electric Industrial Co.,Ltd. Address before: Japan Osaka Patentee before: Matsushita Electric Industrial Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20141124 Address after: California, USA Patentee after: Craib Innovations Ltd. Address before: Osaka Patentee before: Matsushita Electric Industrial Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071107 Termination date: 20180305 |
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