CN1331221C - 芯片球栅阵列封装结构 - Google Patents
芯片球栅阵列封装结构 Download PDFInfo
- Publication number
- CN1331221C CN1331221C CNB2003101095496A CN200310109549A CN1331221C CN 1331221 C CN1331221 C CN 1331221C CN B2003101095496 A CNB2003101095496 A CN B2003101095496A CN 200310109549 A CN200310109549 A CN 200310109549A CN 1331221 C CN1331221 C CN 1331221C
- Authority
- CN
- China
- Prior art keywords
- chip
- grid array
- ball grid
- fin
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101095496A CN1331221C (zh) | 2003-12-19 | 2003-12-19 | 芯片球栅阵列封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101095496A CN1331221C (zh) | 2003-12-19 | 2003-12-19 | 芯片球栅阵列封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1630073A CN1630073A (zh) | 2005-06-22 |
CN1331221C true CN1331221C (zh) | 2007-08-08 |
Family
ID=34843088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101095496A Expired - Fee Related CN1331221C (zh) | 2003-12-19 | 2003-12-19 | 芯片球栅阵列封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1331221C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102097398A (zh) * | 2010-01-28 | 2011-06-15 | 江苏长电科技股份有限公司 | 树脂线路板芯片正装带散热块封装结构 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102088009A (zh) * | 2010-01-26 | 2011-06-08 | 江苏长电科技股份有限公司 | 基岛露出芯片正装锁定孔散热块封装结构 |
CN102074519A (zh) * | 2010-01-27 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装带散热块封装结构 |
CN102044503A (zh) * | 2010-01-27 | 2011-05-04 | 江苏长电科技股份有限公司 | 印刷线路板芯片正装带锁定孔散热块封装结构 |
CN102044504A (zh) * | 2010-01-28 | 2011-05-04 | 江苏长电科技股份有限公司 | 内脚埋入芯片倒装带散热块封装结构 |
CN102088006A (zh) * | 2010-01-29 | 2011-06-08 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装带锁定孔散热块封装结构 |
CN102082134A (zh) * | 2010-01-29 | 2011-06-01 | 江苏长电科技股份有限公司 | 基岛埋入芯片正装散热块外接散热器封装结构 |
CN102074520A (zh) * | 2010-01-29 | 2011-05-25 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装散热块表面凸出或全包覆封装结构 |
CN102074530A (zh) * | 2010-01-29 | 2011-05-25 | 江苏长电科技股份有限公司 | 基岛埋入芯片正装锁定孔散热块外接散热帽或板封装结构 |
CN102088007A (zh) * | 2010-01-29 | 2011-06-08 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装倒t型或矩形锁定孔散热块封装结构 |
CN102054802A (zh) * | 2010-01-29 | 2011-05-11 | 江苏长电科技股份有限公司 | 基岛露出芯片正装锁定孔散热块外接散热器封装结构 |
CN102054803A (zh) * | 2010-01-29 | 2011-05-11 | 江苏长电科技股份有限公司 | 基岛露出芯片正装散热块外接散热器封装结构 |
CN102054800A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 内脚露出芯片倒装散热块外接散热器封装结构 |
CN102044508A (zh) * | 2010-01-30 | 2011-05-04 | 江苏长电科技股份有限公司 | 树脂线路板芯片正装锁孔散热块凸柱外接散热器封装结构 |
CN102044507A (zh) * | 2010-01-30 | 2011-05-04 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装外接散热器封装结构 |
CN102054801A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 内脚埋入芯片倒装锁定孔散热块外接散热器封装结构 |
CN102074521A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装散热块外接散热器封装结构 |
CN102074528A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片正装锁孔散热块凸柱外接散热器封装结构 |
CN102074524A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装锁定孔散热块外接散热器封装结构 |
CN102054797A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装锁孔散热块外接散热器封装结构 |
CN102088010A (zh) * | 2010-01-30 | 2011-06-08 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装散热块外接散热器封装结构 |
CN102054799A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 内脚露出芯片倒装锁定孔散热块凸柱外接散热器封装结构 |
CN102044506A (zh) * | 2010-01-30 | 2011-05-04 | 江苏长电科技股份有限公司 | 内脚埋入芯片倒装散热块外接散热器封装结构 |
CN102074527A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 内脚露出芯片倒装锁定孔散热块外接散热器封装结构 |
CN102074526A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 树脂线路板芯片正装锁定孔散热块外接散热器封装结构 |
CN102074529A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片正装锁定孔散热块外接散热器封装结构 |
CN102044509A (zh) * | 2010-01-30 | 2011-05-04 | 江苏长电科技股份有限公司 | 内脚埋入芯片倒装锁定孔散热块凸柱外接散热器封装结构 |
CN102054805A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装外接散热器封装结构 |
CN102074523A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 树脂线路板芯片倒装锁孔散热块凸柱外接散热器封装结构 |
CN102074525A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片正装散热块外接散热器封装结构 |
CN102074522A (zh) * | 2010-01-30 | 2011-05-25 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装锁孔散热块凸柱外接散热器封装结构 |
CN102054798A (zh) * | 2010-01-30 | 2011-05-11 | 江苏长电科技股份有限公司 | 树脂线路板芯片正装散热块外接散热器封装结构 |
CN104752375A (zh) * | 2013-12-27 | 2015-07-01 | 奇鋐科技股份有限公司 | 半导体散热结构 |
CN209845575U (zh) * | 2018-08-29 | 2019-12-24 | 惠科股份有限公司 | 一种显示面板和显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077575A (ja) * | 1998-08-28 | 2000-03-14 | Ind Technol Res Inst | 熱的及び電気的に増強された半導体パッケージ |
CN2526977Y (zh) * | 2002-03-11 | 2002-12-18 | 威盛电子股份有限公司 | 芯片散热封装结构 |
US6646339B1 (en) * | 1999-10-15 | 2003-11-11 | Amkor Technology, Inc. | Thin and heat radiant semiconductor package and method for manufacturing |
-
2003
- 2003-12-19 CN CNB2003101095496A patent/CN1331221C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077575A (ja) * | 1998-08-28 | 2000-03-14 | Ind Technol Res Inst | 熱的及び電気的に増強された半導体パッケージ |
US6646339B1 (en) * | 1999-10-15 | 2003-11-11 | Amkor Technology, Inc. | Thin and heat radiant semiconductor package and method for manufacturing |
CN2526977Y (zh) * | 2002-03-11 | 2002-12-18 | 威盛电子股份有限公司 | 芯片散热封装结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102097398A (zh) * | 2010-01-28 | 2011-06-15 | 江苏长电科技股份有限公司 | 树脂线路板芯片正装带散热块封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN1630073A (zh) | 2005-06-22 |
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GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Shanghai Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: Shanghai Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee before: Weiyu Tech Test Packing Co., Ltd. |
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C56 | Change in the name or address of the patentee |
Owner name: RIYUEGUANG ENCAPSULATION TESTING ( SHANGHAI ) CO., Free format text: FORMER NAME: WEIYU TECHNOLOGY TEST ENCAPSULATION CO., LTD. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070808 Termination date: 20151219 |
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