CN1327518C - Sheet for sealing electrical wiring - Google Patents
Sheet for sealing electrical wiring Download PDFInfo
- Publication number
- CN1327518C CN1327518C CNB028153545A CN02815354A CN1327518C CN 1327518 C CN1327518 C CN 1327518C CN B028153545 A CNB028153545 A CN B028153545A CN 02815354 A CN02815354 A CN 02815354A CN 1327518 C CN1327518 C CN 1327518C
- Authority
- CN
- China
- Prior art keywords
- bus
- resin
- diaphragm seal
- thickness
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A sheet for sealing bus-bar comprising a thermoplastic resin layer having a thickness of not less than 300 mum, and a thermocurable resin layer having a thickness of not more than 100 mum placed on one surface thereof.
Description
Technical field
The present invention relates to be used for the insulating material of sealed wire circuit (electric wiring), especially for the insulating material of the delicate wire circuit that forms on the semiconductor device.
Background technology
In resin-encapsulated semiconductor device,, generally use the delicate wire circuit of resin-insulated material seal complex in order to prevent unexpected short circuit.Specifically, because a large amount of electric currents flows into the bus that is used for providing to semiconductor device certain voltage, as power supply or earth connection, so it need be sealed safely.
Up to now, only with the insulating material of thermosetting resin itself as this electrical wiring of sealing.Yet thermosetting resin has flowability and viscosity under its uncured state.When thermosetting resin itself when the electrical wiring insulating material, do not have full solidification can not carry out further work before becoming the non-sticky solid at it.Therefore, production process is delayed.In addition, owing to be difficult to prevent fully thermosetting resin outflow and swelling, the integrality of sealing often can not get guaranteeing.Also have,,, make insulation property become bad, thereby circuit is corroded easily so moisture is penetrated in the resin easily because thermosetting resin has higher moisture absorption (more than 1%).
In recent years, need to make littler, thinner and more cheap encapsulating large-scale integrated circuits, therefore must seal the said wires circuit, thereby overcome the shortcoming of thermosetting resin with safer easier step.
The invention solves above-mentioned problems of the prior art, and aim to provide the seal stock of one or more bus, thereby can bus be sealed safely by easy step.
Summary of the invention
The invention provides the diaphragm seal of bus (bus-bars), it comprises that thickness is not less than 300 microns thermoplastic resin and the thickness that forms is not more than 100 microns thermoset resin layer on a surface of thermoplastic resin.This diaphragm seal can reach above-mentioned purpose.
Description of drawings
Fig. 1 is the sectional view of bus diaphragm seal of the present invention.
Fig. 2 is the perspective view that schematically shows bus sealing step.
Fig. 3 is the perspective view with the structure of diaphragm seal sealing bus bar of the present invention.
Description of reference numerals
1 ... thermoplastic resin
2 ... thermosetting resin
3 ... glass plate
4 ... bus
Embodiment
Fig. 1 is the sectional view of bus diaphragm seal of the present invention.On a surface of thermoplastic resin 1, form thermoset resin layer 2.
Thermoplastic resin is made by thermoplastic resin.Thermoplastic resin should be a kind of like this material, at room temperature is to be easy to crooked solid, but has the resin flows of making and seal the flowability of bus with bus hot pressing the time.The preferred embodiment of thermoplastic resin comprises polyester, polyolefin, vinyl-vinyl acetate copolymer, vinyl-acrylate copolymer, acrylate, fluorine resin and polyethers.
In general, thermoplastic resin is suitable for stretching, and is processed into film.This is the manufacture method of the bus diaphragm seal simple reason that becomes.Commercially available film can be used as above-mentioned thermoplastic resin membrane.For example, pet film (trade name " 6010 ", Takiron K.K. makes) or similar film can be used as polyester.
The thickness of thermoplastic resin can suitably be adjusted, thereby when hot pressing, resin flows covers bus and security seal fully.The thickness of thermoplastic resin generally is set at and is not less than 300 microns, is preferably the 300-2000 micron, more preferably the 300-1000 micron.
If the film of thermoplastic resin less than 300 microns, just is difficult to electric wire is imbedded in the resin.On the other hand, if the thickness of thermoplastic resin is too big, for example surpass 5000 microns, then the thermal conductivity of thermosetting resin can descend when hot pressing.
Thermoset resin layer is made by thermosetting resin.A preferred embodiment of thermosetting resin is made by the compositions of thermosetting resin that contains following component:
(1) epoxy resin,
(2) epoxy curing agent and
(3) phenoxy resin.
Preferably, thermosetting resin did not have viscosity basically before solidifying.This is the bus diaphragm seal manufacture method of the present invention simple reason that becomes.
Under high temperature or ambient temperature, epoxy resin and curing agent reaction, thus can form cured product with three-dimensional net structure.In this case, the cured product of epoxy resin has good thermal endurance, and gives adhesive layer cohesive force, thereby adherend can be bonded together mutually.As a result, even owing to the bus energising thermosetting resin is applied resistance heat, thermoset resin layer also is not easy to peel away from adherend.
As long as epoxy resin can give character such as thermal endurance, cohesive force, its kind has no particular limits.The example of this epoxy resin comprises bisphenol A type epoxy resin, bisphenol f type epoxy resin, solvable novolac epoxy resin, cresols-solvable novolac epoxy resin, fluorenes epoxy resin, glycidyl polyimide resin, aliphatic epoxy resin, brominated epoxy resin and fluorinated epoxy resin.
In compositions of thermosetting resin, the content of above-mentioned epoxy resin is generally 5-80% weight.If the content of epoxy resin is lower than 5% weight, it is bad that the thermal endurance of thermosetting resin will become.Another aspect, if the content of epoxy resin surpasses 80% weight, the cohesive force of this composition can reduce, mobile meeting is too big.The content of epoxy resin preferably accounts for the 10-50% weight of compositions of thermosetting resin.
In compositions of thermosetting resin, also add curing agent.This curing agent and epoxy resin reaction make composition heat cured under high temperature or ambient temperature.As long as can press above-mentioned method, the kind of this curing agent is not particularly limited the above-mentioned composition hot curing.For example, can use following curing agent: amine hardener, acid anhydrides, cdicynanmide, imidazoles, cationic polymerization catalyst, hydrazine compound etc.From room temperature (30 ℃) thermal stability aspect, diamino amine is particularly preferred.
In addition, the content of curing agent is 0.1-30% weight in the compositions of thermosetting resin.If the content of curing agent is lower than 0.1% weight, then the ability to cure of this resin combination will reduce.If the content of curing agent surpasses 30% weight, then the insulating properties of thermosetting resin can reduce.The content of curing agent preferably accounts for the 0.5-10% weight of compositions of thermosetting resin.
Phenoxy resin is the thermoplastic resin with chain structure.Its weight average molecular weight is generally 2000-2000000, or number-average molecular weight is 10000-1000000, and epoxide equivalent is 500-500000.This resin can make composition form suitable shape (as film).This phenoxy resin has the structure similar to above-mentioned epoxy resin, and compatible with it.This resin is shaped separately, can forms bonding film.Particularly preferably be phenoxy resin is used with bisphenol A type epoxy resin or fluorenes epoxy resin.This is because bisphenol A type epoxy resin or fluorenes epoxy resin and phenoxy resin have good compatibility.
The minimum energy storage modulus of shearing of thermoset resin layer is 100000Pa or littler, is preferably 10-100000Pa.Even this is because this thermosetting resin of hot pressing also is not easy to produce unwanted resin flows.In the sealing bus bar step, generally 60-260 ℃ temperature and 10
4To 5 * 10
7Carry out hot pressing under the pressure of Pa.
On the other hand, if minimum energy storage modulus of shearing approximately greater than 100000Pa, then needs just can make resin-sealed bus with very big pressure.Therefore, hot pressing just becomes difficult.Energy storage modulus of shearing (G ') among the application is meant that at angular speed be 6.28 arc/seconds (frequency is 1Hz), temperature is measured the minimum value of modulus of shearing when 60 ℃ are increased to 260 ℃ in 5 ℃/minute speed with Measurement of Dynamic Viscoelasticity (" RDAII " that make as Reometrics Co.).
Thermoset resin layer can be made with the composition that contains bimaleimide resin (replacement epoxy resin), also can make with the composition that contains epoxy resin and bimaleimide resin.Various super engineering plastics, the polyhydroxy ether that is made by the reaction of fluorenes bis-phenol and epoxy resin or other thermoplastic resin can be used to replace phenoxy resin or add in the phenoxy resin.The polyhydroxy ether of introducing above-mentioned fluorenes main chain is particularly preferred for the thermal endurance and the resistance to water that improve thermoset resin layer.
As long as compositions of thermosetting resin does not depart from purpose of the present invention and effect, this compositions of thermosetting resin can need not be made by above-mentioned thermoplastic resin by mainly containing epoxy resin, bimaleimide resin or their mixture and curing agent.The main thermosetting resin of being made by ethylene-methyl methacrylate glycidyl ester copolymer has low water absorption.Therefore, this resin is suitable for using in high humidity environment.
Thickness to thermoset resin layer is suitably regulated, and this thermoset resin layer can make the firmly terminal and closely bonding of bus when making hot pressing.In general, the thickness setting of thermoset resin layer is 100 microns, is preferably the 5-100 micron, more preferably the 10-50 micron.
If the thickness of thermoset resin layer is too thin, as less than 3 microns, its adhesiveness is with regard to variation.On the contrary, if the thickness of thermoset resin layer surpasses 100 microns, then thermoset resin layer is not easy evenly, and has considerable thermoset resin layer outflow.
A certain amount of thermosetting resin coating solution is applied to one on the substrate surface of lift-off processing,, thereby can obtains the thermoset resin layer that supported by peelable base material then at a certain temperature with this base material drying.After peeling off thermoset resin layer from this peelable base material, this is pressed onto on the surface of thermoplastic resin layer by layer, just obtains the bus diaphragm seal.Above-mentioned lamination can carry out with the known method of hot pressing and so on.Thermoset resin layer also can be by on the surface that above-mentioned coating solution directly is coated to thermoplastic resin, is dried then to make.
The bus diaphragm seal that makes is placed on the bus, its thermoset resin layer is contacted with bus.Bus diaphragm seal and bus are carried out hot pressing, they are bonded together.Then, thermoplastic resin is heated full solidification.Like this, just bus is sealed.
Embodiment
Make adhesive layer
By the component shown in the mixture table 1, make the coating solution of thermosetting resin.
Table 1
| Component | Weight portion |
| Phenoxy resin is by " YP50S " that Tohto Kasei Co. makes, number-average molecular weight=11800 | 30 |
| Epoxy resin, " DER332 " that Dow Chemical Japan Ltd. makes, epoxide equivalent=174 | 20 |
| Be dispersed with the epoxy resin of acrylate polymer, " the Modiver RD 102 " that Nippon Oil Co. makes, acryloyl content=40% weight | 20 |
| Epoxy resin, " PCL-G402 " that Daicel Chemical Industries Ltd. makes, epoxide equivalent=1350 | 30 |
| The methylethylketone colloidal sol of silicon dioxide, Nissan Chemical Industries, " MEK-ST " that Ltd produces, dioxide-containing silica=30% weight | 50 |
| Dicyandiamide | 2.9 |
| The two dimethyl ureas of toluene, " Omicure-24 " that PTI Japan Co. produces | 2.0 |
| Methyl alcohol | 40 |
| Methylethylketone | 40 |
A PET film (thickness is 50 microns) is carried out lift-off processing (releasing treatment), coating composition with gained applies on this film, allow this film be 100-130 ℃ baking oven again, obtain thickness after the drying and be 25 microns bonding film by temperature.
Make the bus diaphragm seal
Bonding film is peeled off from the PET film, placed it in thickness then and be on 500 microns the surface of pet film (" 6010 " that Takiron K.K. makes), the roller heat lamination with 100 ℃ obtains the bus diaphragm seal.
The encapsulating method of bus
As shown in Figure 2, be of a size of 25 * 25 * 1 millimeter at one
3 Glass plate 3 surface on will be of a size of 50 * 2 * 0.6 millimeter
3Five buses 4 be arranged parallel to each other, be spaced apart 3 millimeters, another root bus T shape is placed.The bus diaphragm seal is pressed 25 * 25 millimeters
3Size cutting.The diaphragm seal that cuts is placed on those buses that are arranged on the glass plate, the thermoset resin layer of diaphragm seal is contacted with bus.Placement thickness is 1 millimeter silicon rubber on described bus diaphragm seal.Compacting is 20 seconds under the condition of 165 ℃ and 140kgf, just obtains being sealed with the structure of bus end.Fig. 3 is the perspective view of this structure.Then this structure is placed in the baking oven, 130 ℃ of heating 1 hour.
By the direction vertical,, measure 90 ° of peeling forces with the unsealing end stretching of resulting structures body bus with glass pane surface.90 ° of peeling forces are 3kgf.The sealed end of resulting structures body bus is under water, allow it leave standstill for 1 week.After from water, upwards spurring the end of each bus, measure the resistance between adjacent bus.The resistance value that records is more than 1 megohm.
In bus diaphragm seal of the present invention, combine bigger thermoplastic resin of thickness and the less thermoset resin layer of thickness.When use has the bus diaphragm seal of this structure, by the bus that hot pressing can make things convenient for and sealing need be flow through a large amount of electric currents safely.Therefore, can protect bus to avoid the influence of moisture and corrosive environment fully.In addition, when using bus diaphragm seal of the present invention, seal thickness is the bus more than 0.5 millimeter easily.
Claims (7)
1. at least one diaphragm seal that bus is used, it comprises that thickness is not less than 300 microns thermoplastic resin and the thickness that forms is not more than 100 microns thermoset resin layer on a surface of thermoplastic resin.
2. the diaphragm seal that at least one bus as claimed in claim 1 used is characterized in that described thermoplastic resin is selected from polyester, polyolefin, vinyl-vinyl acetate copolymer, vinyl-acrylate copolymer, acrylate, fluorine resin and polyethers.
3. the diaphragm seal that at least one bus as claimed in claim 1 or 2 used is characterized in that described thermosetting resin also comprises epoxy resin, phenoxy resin or their mixture.
4. the diaphragm seal that at least one bus as claimed in claim 2 used is characterized in that epoxy resin accounts for the 5-80% weight of compositions of thermosetting resin.
5. the manufacture method of the diaphragm seal used of at least one bus, it is included in thickness and is not less than the step that laminate thickness on 300 microns the surface of thermoplastic resin film is not more than 100 microns thermosetting resin film.
6. at least one encapsulating method that bus is used, it comprises the steps:
The described bus diaphragm seal of claim 1 is placed on the bus, the thermoset resin layer of sealing sheet is contacted with bus;
To the described bus diaphragm seal of bus hot pressing, make them bonding mutually; With
The heat hot thermosetting resin makes it full solidification.
7. a circuit is wherein used the described bus diaphragm seal sealing of claim 1 electrical wiring wherein.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001239204 | 2001-08-07 | ||
| JP2001239204A JP2003059363A (en) | 2001-08-07 | 2001-08-07 | Sheet for sealing electric wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1572022A CN1572022A (en) | 2005-01-26 |
| CN1327518C true CN1327518C (en) | 2007-07-18 |
Family
ID=19069988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028153545A Expired - Fee Related CN1327518C (en) | 2001-08-07 | 2002-08-06 | Sheet for sealing electrical wiring |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1415343A2 (en) |
| JP (1) | JP2003059363A (en) |
| CN (1) | CN1327518C (en) |
| BR (1) | BR0211509A (en) |
| CA (1) | CA2453338A1 (en) |
| MX (1) | MXPA04000893A (en) |
| WO (1) | WO2003015166A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2428537A1 (en) * | 2010-09-13 | 2012-03-14 | Sika Technology AG | Waterproofing membrane |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB902567A (en) * | 1958-02-06 | 1962-08-01 | Reyrolle A & Co Ltd | Improvements relating to elongated electrical conductors embedded in cast resin solid insulation |
| JPH05315473A (en) * | 1992-05-06 | 1993-11-26 | Nitto Denko Corp | Semiconductor device |
| JP2000049275A (en) * | 1998-07-28 | 2000-02-18 | Hitachi Ltd | Lead frame, semiconductor device and manufacture thereof |
| CN2458701Y (en) * | 2001-01-02 | 2001-11-07 | 山东省金曼克电气集团股份有限公司 | Low-voltage closed conductor outlet device for large and medium-sized air immersed transformer |
-
2001
- 2001-08-07 JP JP2001239204A patent/JP2003059363A/en not_active Withdrawn
-
2002
- 2002-08-06 EP EP02761237A patent/EP1415343A2/en not_active Withdrawn
- 2002-08-06 MX MXPA04000893A patent/MXPA04000893A/en active IP Right Grant
- 2002-08-06 BR BR0211509-3A patent/BR0211509A/en not_active IP Right Cessation
- 2002-08-06 CN CNB028153545A patent/CN1327518C/en not_active Expired - Fee Related
- 2002-08-06 WO PCT/US2002/024789 patent/WO2003015166A2/en not_active Application Discontinuation
- 2002-08-06 CA CA002453338A patent/CA2453338A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB902567A (en) * | 1958-02-06 | 1962-08-01 | Reyrolle A & Co Ltd | Improvements relating to elongated electrical conductors embedded in cast resin solid insulation |
| JPH05315473A (en) * | 1992-05-06 | 1993-11-26 | Nitto Denko Corp | Semiconductor device |
| JP2000049275A (en) * | 1998-07-28 | 2000-02-18 | Hitachi Ltd | Lead frame, semiconductor device and manufacture thereof |
| CN2458701Y (en) * | 2001-01-02 | 2001-11-07 | 山东省金曼克电气集团股份有限公司 | Low-voltage closed conductor outlet device for large and medium-sized air immersed transformer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1572022A (en) | 2005-01-26 |
| EP1415343A2 (en) | 2004-05-06 |
| WO2003015166A2 (en) | 2003-02-20 |
| JP2003059363A (en) | 2003-02-28 |
| BR0211509A (en) | 2004-09-14 |
| CA2453338A1 (en) | 2003-02-20 |
| WO2003015166A3 (en) | 2003-10-16 |
| MXPA04000893A (en) | 2004-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070718 Termination date: 20090907 |