WO2003015166A3 - Sheet for sealing electric wiring - Google Patents

Sheet for sealing electric wiring Download PDF

Info

Publication number
WO2003015166A3
WO2003015166A3 PCT/US2002/024789 US0224789W WO03015166A3 WO 2003015166 A3 WO2003015166 A3 WO 2003015166A3 US 0224789 W US0224789 W US 0224789W WO 03015166 A3 WO03015166 A3 WO 03015166A3
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
electric wiring
sealing electric
thickness
sealing
Prior art date
Application number
PCT/US2002/024789
Other languages
French (fr)
Other versions
WO2003015166A2 (en
Inventor
Kohichiro Kawate
Original Assignee
3M Innovative Properties Co
Kohichiro Kawate
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Kohichiro Kawate filed Critical 3M Innovative Properties Co
Priority to MXPA04000893A priority Critical patent/MXPA04000893A/en
Priority to BR0211509-3A priority patent/BR0211509A/en
Priority to US10/484,117 priority patent/US20040185237A1/en
Priority to CA002453338A priority patent/CA2453338A1/en
Priority to EP02761237A priority patent/EP1415343A2/en
Publication of WO2003015166A2 publication Critical patent/WO2003015166A2/en
Publication of WO2003015166A3 publication Critical patent/WO2003015166A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A sheet for sealing bus-bar comprising a thermoplastic resin layer having a thickness of not less than 300 μm, and a thermocurable resin layer having a thickness of not more than 100 μm placed on one surface thereof.
PCT/US2002/024789 2001-08-07 2002-08-06 Sheet for sealing electric wiring WO2003015166A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
MXPA04000893A MXPA04000893A (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring.
BR0211509-3A BR0211509A (en) 2001-08-07 2002-08-06 Sheet and process for preparing a sheet for sealing at least one tie bar, process for sealing a tie bar, and electrical circuit
US10/484,117 US20040185237A1 (en) 2001-08-07 2002-08-06 Sheet for sealing electrical wiring
CA002453338A CA2453338A1 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring
EP02761237A EP1415343A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239204A JP2003059363A (en) 2001-08-07 2001-08-07 Sheet for sealing electric wiring
JP2001-239204 2001-08-07

Publications (2)

Publication Number Publication Date
WO2003015166A2 WO2003015166A2 (en) 2003-02-20
WO2003015166A3 true WO2003015166A3 (en) 2003-10-16

Family

ID=19069988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/024789 WO2003015166A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Country Status (7)

Country Link
EP (1) EP1415343A2 (en)
JP (1) JP2003059363A (en)
CN (1) CN1327518C (en)
BR (1) BR0211509A (en)
CA (1) CA2453338A1 (en)
MX (1) MXPA04000893A (en)
WO (1) WO2003015166A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2428537A1 (en) * 2010-09-13 2012-03-14 Sika Technology AG Waterproofing membrane

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (en) * 1992-05-06 1993-11-26 Nitto Denko Corp Semiconductor device
JP2000049275A (en) * 1998-07-28 2000-02-18 Hitachi Ltd Lead frame, semiconductor device and manufacture thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2458701Y (en) * 2001-01-02 2001-11-07 山东省金曼克电气集团股份有限公司 Low-voltage closed conductor outlet device for large and medium-sized air immersed transformer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (en) * 1992-05-06 1993-11-26 Nitto Denko Corp Semiconductor device
JP2000049275A (en) * 1998-07-28 2000-02-18 Hitachi Ltd Lead frame, semiconductor device and manufacture thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 120 (E - 1516) 25 February 1994 (1994-02-25) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *

Also Published As

Publication number Publication date
CN1572022A (en) 2005-01-26
EP1415343A2 (en) 2004-05-06
WO2003015166A2 (en) 2003-02-20
JP2003059363A (en) 2003-02-28
BR0211509A (en) 2004-09-14
CA2453338A1 (en) 2003-02-20
CN1327518C (en) 2007-07-18
MXPA04000893A (en) 2004-06-03

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