CN1326234C - 堆栈型半导体装置 - Google Patents
堆栈型半导体装置 Download PDFInfo
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- CN1326234C CN1326234C CNB2004100597875A CN200410059787A CN1326234C CN 1326234 C CN1326234 C CN 1326234C CN B2004100597875 A CNB2004100597875 A CN B2004100597875A CN 200410059787 A CN200410059787 A CN 200410059787A CN 1326234 C CN1326234 C CN 1326234C
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003180200A JP3858854B2 (ja) | 2003-06-24 | 2003-06-24 | 積層型半導体装置 |
JP2003180200 | 2003-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574309A CN1574309A (zh) | 2005-02-02 |
CN1326234C true CN1326234C (zh) | 2007-07-11 |
Family
ID=33562247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100597875A Expired - Fee Related CN1326234C (zh) | 2003-06-24 | 2004-06-23 | 堆栈型半导体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7217993B2 (zh) |
JP (1) | JP3858854B2 (zh) |
KR (1) | KR100627099B1 (zh) |
CN (1) | CN1326234C (zh) |
TW (1) | TWI282153B (zh) |
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- 2003-06-24 JP JP2003180200A patent/JP3858854B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-16 TW TW093117314A patent/TWI282153B/zh not_active IP Right Cessation
- 2004-06-16 US US10/867,722 patent/US7217993B2/en not_active Expired - Lifetime
- 2004-06-23 KR KR1020040046997A patent/KR100627099B1/ko active IP Right Grant
- 2004-06-23 CN CNB2004100597875A patent/CN1326234C/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
CN1574309A (zh) | 2005-02-02 |
JP3858854B2 (ja) | 2006-12-20 |
TWI282153B (en) | 2007-06-01 |
KR100627099B1 (ko) | 2006-09-25 |
US7217993B2 (en) | 2007-05-15 |
JP2005019568A (ja) | 2005-01-20 |
KR20050001368A (ko) | 2005-01-06 |
TW200501345A (en) | 2005-01-01 |
US20050006745A1 (en) | 2005-01-13 |
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