CN1300877A - 基体的局部镀覆方法 - Google Patents
基体的局部镀覆方法 Download PDFInfo
- Publication number
- CN1300877A CN1300877A CN00135775A CN00135775A CN1300877A CN 1300877 A CN1300877 A CN 1300877A CN 00135775 A CN00135775 A CN 00135775A CN 00135775 A CN00135775 A CN 00135775A CN 1300877 A CN1300877 A CN 1300877A
- Authority
- CN
- China
- Prior art keywords
- plating
- matrix
- coating material
- catalyzer
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP363336/99 | 1999-12-21 | ||
JP363336/1999 | 1999-12-21 | ||
JP36333699 | 1999-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1300877A true CN1300877A (zh) | 2001-06-27 |
CN1323190C CN1323190C (zh) | 2007-06-27 |
Family
ID=18479078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001357751A Expired - Fee Related CN1323190C (zh) | 1999-12-21 | 2000-12-20 | 基体的局部镀覆方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6743477B2 (zh) |
EP (1) | EP1111090B1 (zh) |
KR (1) | KR100495340B1 (zh) |
CN (1) | CN1323190C (zh) |
AT (1) | ATE509137T1 (zh) |
DK (1) | DK1111090T3 (zh) |
HK (1) | HK1037692A1 (zh) |
SG (1) | SG92768A1 (zh) |
TW (1) | TWI238031B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101082126B (zh) * | 2007-07-10 | 2010-05-19 | 东莞市通旺达五金制品有限公司 | 一种铝散热器内孔局部化学镀工艺 |
CN101273155B (zh) * | 2005-09-23 | 2010-06-16 | 荷兰应用科学研究会(Tno) | 产品局部镀覆金属的方法 |
CN103074651A (zh) * | 2013-02-16 | 2013-05-01 | 马国荣 | 用于盖板局部镀金的电镀夹具 |
CN103220884A (zh) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | 线路基板结构及其制作方法 |
CN106543564A (zh) * | 2016-11-25 | 2017-03-29 | 厦门建霖工业有限公司 | 一种可以用水进行粗化的水电镀材料的制备方法 |
CN108018552A (zh) * | 2016-10-31 | 2018-05-11 | 现代自动车株式会社 | 汽车树脂部件的局部镀覆方法及使用其所镀覆的汽车树脂部件 |
CN111155075A (zh) * | 2019-12-31 | 2020-05-15 | 娄底市安地亚斯电子陶瓷有限公司 | 一种异形陶瓷二次金属化方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5095909B2 (ja) | 2003-06-24 | 2012-12-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 触媒組成物および析出方法 |
DE10348734B4 (de) * | 2003-10-16 | 2006-04-20 | OTB Oberflächentechnik in Berlin GmbH & Co. | Verfahren zum selektiven Galvanisieren von Metalloberflächen und Selektiv-Galvanisierungssystem für Metalloberflächen |
JP2010504438A (ja) * | 2006-09-26 | 2010-02-12 | ディーエスエム アイピー アセッツ ビー.ブイ. | 部品のメタライズ方法 |
KR100959878B1 (ko) | 2008-05-16 | 2010-05-27 | (주)옵티스 | 베이스의 부분 도금방법 |
US9506150B2 (en) * | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
CN113355661B (zh) * | 2021-05-31 | 2023-01-03 | 江苏软讯科技有限公司 | 一种高活性高稳定胶体钯催化剂及其制备工艺 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59133359A (ja) * | 1983-01-18 | 1984-07-31 | Sanritsu Kogyo Kk | 無電解メツキ法 |
JPS61108195A (ja) * | 1984-11-01 | 1986-05-26 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 基板上に電気的に連続した層を形成する方法 |
US4865873A (en) * | 1986-09-15 | 1989-09-12 | General Electric Company | Electroless deposition employing laser-patterned masking layer |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
JPH0660416B2 (ja) * | 1986-11-18 | 1994-08-10 | 三共化成株式会社 | プラスチック成形品の製法 |
JPS63157876A (ja) * | 1986-12-20 | 1988-06-30 | Toobi:Kk | 金属パタ−ンプリントフイルムの製造方法 |
JP2603828B2 (ja) | 1986-12-27 | 1997-04-23 | 三共化成 株式会社 | 回路基板等の成形品の製法 |
US4940608A (en) * | 1988-11-07 | 1990-07-10 | Okuno Chemical Industry Co., Ltd. | Local electroless plating process for plastics |
JP2966031B2 (ja) * | 1989-07-25 | 1999-10-25 | 大日本印刷株式会社 | 微細パターンの形成方法 |
US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
US5156732A (en) * | 1990-07-11 | 1992-10-20 | Sumitomo Metal Mining Co. Ltd. | Polyimide substrate and method of manufacturing a printed wiring board using the substrate |
JPH05202483A (ja) * | 1991-04-25 | 1993-08-10 | Shipley Co Inc | 無電解金属化方法と組成物 |
US5225315A (en) * | 1991-09-19 | 1993-07-06 | Dymax Corporation | Water soluble formulation for masking and the like, and method utilizing the same |
JP3016922B2 (ja) | 1991-09-30 | 2000-03-06 | ローム株式会社 | 合成樹脂製回路基板における導体パターンの形成方法 |
JPH077245A (ja) * | 1993-06-18 | 1995-01-10 | Hitachi Chem Co Ltd | 水溶性レジスト |
JPH07316825A (ja) * | 1994-05-25 | 1995-12-05 | Sankyo Kasei Co Ltd | 部分メッキした芳香族系ポリエステル液晶ポリマー成形品の製造法 |
EP0861923B1 (en) * | 1997-02-26 | 1999-12-29 | Murata Manufacturing Co., Ltd. | Activating catalytic solution for electroless plating and method for electroless plating |
JP4012600B2 (ja) * | 1997-06-23 | 2007-11-21 | 富士通株式会社 | 酸感応性重合体、レジスト組成物、レジストパターン形成方法、および半導体装置の製造方法 |
JP3031459B2 (ja) | 1997-06-26 | 2000-04-10 | 大塚化学株式会社 | 立体回路基板の作製方法 |
JP3616488B2 (ja) * | 1997-11-10 | 2005-02-02 | 三共化成株式会社 | 成形回路部品の製造方法 |
JPH11186697A (ja) * | 1997-12-19 | 1999-07-09 | Fuji Film Olin Kk | 金属画像の形成方法 |
JP3997590B2 (ja) * | 1998-02-05 | 2007-10-24 | Jsr株式会社 | 感放射線性樹脂組成物 |
EP1008910A1 (en) * | 1998-12-11 | 2000-06-14 | Shipley Company LLC | Photoimageable compositions having improved stripping ability and resolution |
-
2000
- 2000-12-08 KR KR10-2000-0074453A patent/KR100495340B1/ko not_active IP Right Cessation
- 2000-12-13 TW TW089126564A patent/TWI238031B/zh not_active IP Right Cessation
- 2000-12-13 SG SG200007445A patent/SG92768A1/en unknown
- 2000-12-14 US US09/735,931 patent/US6743477B2/en not_active Expired - Fee Related
- 2000-12-19 DK DK00127802.7T patent/DK1111090T3/da active
- 2000-12-19 AT AT00127802T patent/ATE509137T1/de active
- 2000-12-19 EP EP00127802A patent/EP1111090B1/en not_active Expired - Lifetime
- 2000-12-20 CN CNB001357751A patent/CN1323190C/zh not_active Expired - Fee Related
-
2001
- 2001-11-27 HK HK01108332A patent/HK1037692A1/xx not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101273155B (zh) * | 2005-09-23 | 2010-06-16 | 荷兰应用科学研究会(Tno) | 产品局部镀覆金属的方法 |
CN101082126B (zh) * | 2007-07-10 | 2010-05-19 | 东莞市通旺达五金制品有限公司 | 一种铝散热器内孔局部化学镀工艺 |
CN103220884A (zh) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | 线路基板结构及其制作方法 |
CN103074651A (zh) * | 2013-02-16 | 2013-05-01 | 马国荣 | 用于盖板局部镀金的电镀夹具 |
CN108018552A (zh) * | 2016-10-31 | 2018-05-11 | 现代自动车株式会社 | 汽车树脂部件的局部镀覆方法及使用其所镀覆的汽车树脂部件 |
CN106543564A (zh) * | 2016-11-25 | 2017-03-29 | 厦门建霖工业有限公司 | 一种可以用水进行粗化的水电镀材料的制备方法 |
CN111155075A (zh) * | 2019-12-31 | 2020-05-15 | 娄底市安地亚斯电子陶瓷有限公司 | 一种异形陶瓷二次金属化方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1111090A2 (en) | 2001-06-27 |
EP1111090B1 (en) | 2011-05-11 |
US6743477B2 (en) | 2004-06-01 |
US20010019739A1 (en) | 2001-09-06 |
TWI238031B (en) | 2005-08-11 |
KR100495340B1 (ko) | 2005-06-14 |
SG92768A1 (en) | 2002-11-19 |
DK1111090T3 (da) | 2011-08-29 |
EP1111090A3 (en) | 2003-07-09 |
KR20010062231A (ko) | 2001-07-07 |
CN1323190C (zh) | 2007-06-27 |
HK1037692A1 (en) | 2002-02-15 |
ATE509137T1 (de) | 2011-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: ITO LIANG; SUMITOMO CHEMICAL CO., LTD. Free format text: FORMER NAME OR ADDRESS: ITO LIANG; SUMITOMO PLASTIC CO., LTD. Owner name: ITO LIANG Free format text: FORMER NAME OR ADDRESS: ITO LIANG; SUMITOMO CHEMICAL CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Kanagawa County, Japan Patentee after: Yi Tengliang Address before: Kanagawa County, Japan Co-patentee before: Sumitomo Commercial Chemistry Co.,Ltd. Patentee before: Yi Tengliang Address after: Kanagawa County, Japan Co-patentee after: Sumitomo Commercial Chemistry Co.,Ltd. Patentee after: Yi Tengliang Address before: Kanagawa County, Japan Co-patentee before: Sumitomo Plastic Co.,Ltd. Patentee before: Yi Tengliang |
|
ASS | Succession or assignment of patent right |
Owner name: ITO LIANG; MEISHO CO., LTD Free format text: FORMER OWNER: ITO LIANG Effective date: 20080627 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20080627 Address after: Kanagawa County, Japan Co-patentee after: Ming Shang Kabushiki Kaisha Patentee after: Yi Tengliang Address before: Kanagawa County, Japan Patentee before: Yi Tengliang |
|
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: MEISHO CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100505 Address after: Kanagawa County, Japan Patentee after: Yi Tengliang Address before: Kanagawa County, Japan Co-patentee before: Ming Shang Kabushiki Kaisha Patentee before: Yi Tengliang |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070627 Termination date: 20131220 |