CN1264271A - 双面柔性印刷电路板的制造方法 - Google Patents
双面柔性印刷电路板的制造方法 Download PDFInfo
- Publication number
- CN1264271A CN1264271A CN99122989A CN99122989A CN1264271A CN 1264271 A CN1264271 A CN 1264271A CN 99122989 A CN99122989 A CN 99122989A CN 99122989 A CN99122989 A CN 99122989A CN 1264271 A CN1264271 A CN 1264271A
- Authority
- CN
- China
- Prior art keywords
- layer
- metal level
- polyimide
- flexible printed
- polyimide precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP373092/1998 | 1998-12-28 | ||
JP37309298A JP3565069B2 (ja) | 1998-12-28 | 1998-12-28 | 両面フレキシブルプリント基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1264271A true CN1264271A (zh) | 2000-08-23 |
CN1183812C CN1183812C (zh) | 2005-01-05 |
Family
ID=18501566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991229894A Expired - Fee Related CN1183812C (zh) | 1998-12-28 | 1999-12-28 | 双面柔性印刷电路板的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6705007B1 (zh) |
EP (1) | EP1017258B1 (zh) |
JP (1) | JP3565069B2 (zh) |
CN (1) | CN1183812C (zh) |
DE (1) | DE69925893T2 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100344444C (zh) * | 2001-05-24 | 2007-10-24 | 东丽株式会社 | 带金属层的耐热性树脂膜与布线板及其制作方法 |
CN101374383B (zh) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | 绝缘基膜、电路板基板及电路板 |
CN1849035B (zh) * | 2005-04-12 | 2010-12-22 | 日本梅克特隆株式会社 | 柔性电路板 |
CN101501821B (zh) * | 2006-08-07 | 2011-02-09 | 住友电气工业株式会社 | 制造电子电路部件的方法 |
CN102009515A (zh) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
US8175740B2 (en) | 2007-02-20 | 2012-05-08 | Iro Ab | Yarn tension monitoring and setting system |
CN113490344A (zh) * | 2021-07-08 | 2021-10-08 | 江西柔顺科技有限公司 | 一种柔性线路板及其制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4696368B2 (ja) * | 2001-02-09 | 2011-06-08 | 日立化成工業株式会社 | 半導体パッケージ用基板とその製造方法および半導体パッケージとその製造方法 |
TW595283B (en) * | 2001-04-25 | 2004-06-21 | Benq Corp | Flexible circuit board and its manufacturing method |
US6838184B2 (en) * | 2002-03-22 | 2005-01-04 | Ube Industries, Ltd. | Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device |
CN102627856B (zh) * | 2012-04-01 | 2015-01-07 | 云南云天化股份有限公司 | 高剥离强度柔性电路板的聚酰亚胺薄膜、制备方法及其电路板 |
DE102014217295A1 (de) * | 2014-08-29 | 2016-03-03 | Robert Bosch Gmbh | Imagermodul für eine Fahrzeug-Kamera und Verfahren zu dessen Herstellung |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765926A1 (de) | 1968-08-09 | 1971-11-18 | Ibm Deutschland | Verfahren zur Herstellung einer gedruckten Schaltung |
US4088545A (en) | 1977-01-31 | 1978-05-09 | Supnet Fred L | Method of fabricating mask-over-copper printed circuit boards |
DE2739494B2 (de) * | 1977-08-30 | 1980-10-16 | Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen | Verfahren zum Herstellen elektrischer Leiterplatten |
DE3121131C2 (de) | 1981-05-27 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallischen Durchkontaktierungen |
JPS60157286A (ja) | 1984-01-27 | 1985-08-17 | 株式会社日立製作所 | フレキシブルプリント基板の製造方法 |
JPS60243120A (ja) | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
JPS63239998A (ja) | 1987-03-27 | 1988-10-05 | 新日鐵化学株式会社 | 配線材料の製造方法 |
JPS6453591A (en) | 1987-08-25 | 1989-03-01 | Sumitomo Electric Industries | Manufacture of flexible circuit board |
JPH01245586A (ja) | 1988-03-28 | 1989-09-29 | Nippon Steel Chem Co Ltd | フレキシブルプリント基板 |
JP2746643B2 (ja) | 1989-04-17 | 1998-05-06 | 住友ベークライト株式会社 | フレキシブルプリント回路板およびその製造方法 |
JPH0362988A (ja) | 1989-07-31 | 1991-03-19 | Chisso Corp | フレキシブルプリント回路用基板およびその製造法 |
JP2738453B2 (ja) | 1989-10-03 | 1998-04-08 | 新日鐵化学株式会社 | 銅張積層板の製造方法 |
JPH04262593A (ja) * | 1991-02-18 | 1992-09-17 | Hitachi Ltd | 多層配線構造体およびその製造方法とその用途 |
JP2612118B2 (ja) | 1991-10-15 | 1997-05-21 | 住友ベークライト株式会社 | 両面フレキシブル印刷回路用基板の製造方法 |
JPH05139027A (ja) | 1991-11-18 | 1993-06-08 | Oji Paper Co Ltd | 感熱記録体 |
JPH05291727A (ja) | 1992-04-14 | 1993-11-05 | Hitachi Chem Co Ltd | 配線板の製造法 |
JP3153017B2 (ja) | 1992-09-25 | 2001-04-03 | 日東電工株式会社 | フレキシブルプリント基板 |
JP3318035B2 (ja) | 1993-04-07 | 2002-08-26 | 三井化学株式会社 | フレキシブル両面金属積層板の製造法 |
JP2652325B2 (ja) | 1993-06-15 | 1997-09-10 | チッソ株式会社 | フレキシブルプリント基板の製造法 |
US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
US6180261B1 (en) * | 1997-10-21 | 2001-01-30 | Nitto Denko Corporation | Low thermal expansion circuit board and multilayer wiring circuit board |
JP3481117B2 (ja) * | 1998-02-25 | 2003-12-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
-
1998
- 1998-12-28 JP JP37309298A patent/JP3565069B2/ja not_active Expired - Fee Related
-
1999
- 1999-12-14 US US09/459,895 patent/US6705007B1/en not_active Expired - Fee Related
- 1999-12-27 DE DE69925893T patent/DE69925893T2/de not_active Expired - Lifetime
- 1999-12-27 EP EP99126019A patent/EP1017258B1/en not_active Expired - Lifetime
- 1999-12-28 CN CNB991229894A patent/CN1183812C/zh not_active Expired - Fee Related
-
2003
- 2003-12-16 US US10/735,679 patent/US7213334B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100344444C (zh) * | 2001-05-24 | 2007-10-24 | 东丽株式会社 | 带金属层的耐热性树脂膜与布线板及其制作方法 |
CN1849035B (zh) * | 2005-04-12 | 2010-12-22 | 日本梅克特隆株式会社 | 柔性电路板 |
CN101501821B (zh) * | 2006-08-07 | 2011-02-09 | 住友电气工业株式会社 | 制造电子电路部件的方法 |
US8026185B2 (en) | 2006-08-07 | 2011-09-27 | Sumitomo Electric Industries, Ltd. | Method for manufacturing electronic circuit component |
US8175740B2 (en) | 2007-02-20 | 2012-05-08 | Iro Ab | Yarn tension monitoring and setting system |
CN101374383B (zh) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | 绝缘基膜、电路板基板及电路板 |
CN102009515A (zh) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
CN102009515B (zh) * | 2010-07-21 | 2013-01-02 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
CN113490344A (zh) * | 2021-07-08 | 2021-10-08 | 江西柔顺科技有限公司 | 一种柔性线路板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20040131765A1 (en) | 2004-07-08 |
EP1017258A3 (en) | 2002-06-12 |
CN1183812C (zh) | 2005-01-05 |
US6705007B1 (en) | 2004-03-16 |
EP1017258B1 (en) | 2005-06-22 |
JP3565069B2 (ja) | 2004-09-15 |
EP1017258A2 (en) | 2000-07-05 |
JP2000196206A (ja) | 2000-07-14 |
DE69925893D1 (de) | 2005-07-28 |
DE69925893T2 (de) | 2006-05-11 |
US7213334B2 (en) | 2007-05-08 |
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Owner name: NANKAI UNIVERSITY Free format text: FORMER OWNER: + Effective date: 20130329 |
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Address after: Tokyo, Japan Patentee after: SONY CHEMICAL & INFORMATION DEVICE Corp. Address before: Tokyo, Japan Patentee before: Sony Chemicals Corp. |
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Effective date of registration: 20130329 Address after: Tokyo, Japan Patentee after: Sony Corp. Address before: Tokyo, Japan Patentee before: SONY CHEMICAL & INFORMATION DEVICE Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050105 Termination date: 20151228 |
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