CN1220057A - 电子部件,尤其是利用声表面波工作的电子部件-ofw部件 - Google Patents
电子部件,尤其是利用声表面波工作的电子部件-ofw部件 Download PDFInfo
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Abstract
具有装在基板(3)上并电接触的部件***(1,2)的OFW部件,其中在部件侧面上提供面向离开部件***(1,2)和基板(3)连接区方向的保护层(8)以及保护层(8)对部件***(1,2)形成防止对基板(3)受环境影响的密封层。
Description
根据权利要求1的描述,本发明涉及电子部件,尤其是涉及用声表面波工作的部件-OFW部件。
大家知道,电子部件通过保护层防止环境影响如化学物质或许湿度的侵蚀。因而例如US-PS3438873描述通过氧化硅、氮化硅和混合硅化物如或许为硅酸铝保护半导体部件。这时保护层直接涂敷到半导体部件的***上。这里关于部件***理解为包含部件的有源电子元件的基板。换言之表示在部件***情况下涉及除了包含部件的外壳之外的部件。
在确定的电子部件情况下上述类型的保护层涂敷到部件***本身上可能是不合适的,甚至对部件功能有害。例如在用声表面波工作的部件情况下就是这种情况,因为在这类部件的部件***上涂敷保护层能影响声表面波的传播。对此的另一例是机械应力的传感器,因为由传感器***内的保护层引起机械的过大应力能影响对于待测机械应力的检测。
基于本发明的任务是:给出一种办法能够防止电子部件受环境影响,而且能够不因涂敷在部件***上的保护层产生损害。
本任务在本文一开始类型的电子部件情况下根据本发明由权利要求1特征部分的标志解决。
本发明的改进为从属权利要求的对象。
本发明依靠附图的图所描绘的实施例详细说明如下。这里图1到图3图示给出了由本发明构成的电子部件的各种实施例。
在图1电子部件实施例,一部件***电接触装配在基板3上。部件***通过衬底上和包围未图示导电结构的绝缘框架2简略描述。在此导电结构情况下,对于OFW部件它可以涉及到例如叉指式换能器、谐振器或反射器。
在本发明的范围内所谓“基板”理解为在合成物基、玻璃基或陶瓷基上的印刷电路衬底。在基板3上提供印制导线4,该印制导线经缓冲件5与部件***的衬底1上的(未图示的)导电结构相接触。在这种电接触中涉及本身公知的所谓倒装晶片式安装。
在包围衬底1上导电结构的框架2和印制导线4之间提供例如由环氧树脂或玻璃构成的绝缘层6。最后在部件***1、2和基板3之间的联接区提供一镶框7,在该镶框可涉及例如粘着剂、热塑合成树脂或塑胶。因此特别提供该镶框以便吸收由部件***和基板的不同热膨胀引起以及能够通过缓冲件5机械上损害在衬底1上导电结构和基板3的印制导线之间电接触的剪力。
根据本发明在遍及结构部件***1、2和基板3之间连接区的部件端上,提供一保护层8用于对部件***形成防止对基板环境影响的密封的封闭层。正如在以下还要详细说明的那样,该保护层可以不同方式构成。
在图2的OFW部件的实施例中OFW的部件***通过压电衬底10并在该预定的导电结构11和为导电结构的引线面12-焊接点-上形成。在导电结构11的情况下例如又涉及叉指式换能器、谐振器或反射器。导电结构11和焊接点12按照图1的实施例为绝缘框架21所包围。而图2的OFW部件***10、11、12的描绘完成是图解性质。OFW部件用的这种部件***的完整结构本身是大家熟悉的,因此在这里不详细说明。
此外,提供一基板13,在其转向部件***10、11、12的侧面上提供在其上具有缓冲件15的印制导线14,经缓冲件15实现部件上在焊接点12的接触。基板13的构成不限于双层性。多于两层也是可以应用的。
由部件通过下述方式引出电接通,即,印制导线14围绕基板13建立,正如在图2左侧所示,或者通过基板经引线16-1,16-2,16-3在基板13的外侧与印制导线17相连。电引线16-1,16-2,16-3在垂直方向偏心安排用于阻止影响部件功能的化学物质进入,即:通过引线的偏心构成保证从基板13的外侧来的气密性。当印制导线14围绕基板13建立并经缓冲件15与焊接点12相连,则在印制导线14和下述保护层19之间必须一绝缘层20。
部件***10、11、12通过塑料涂层18覆盖在基板13上。该覆盖层18通过热塑合成树脂、塑胶或热塑形成。
根据本发明在覆盖层上面向离开部件***10、11、12和基板13之间的连接区方向提供根据本发明的保护层19,该保护层形成防止对基板13环境影响的密封层。
正如以上说明,图1的保护层8和图2的保护层19可以不同方式构成。根据实施例它可以是包含金属的层或完全金属层。此外,它也可以通过多个分层形成(在图1和2内并未特别表示),其中至少有一层是金属层。此外分层之一可以是玻璃层,此时涉及分层系列的下分层。例如,铜、镍或金可考虑作为金属区。金属层可以通过蒸发、真空金属喷涂、电镀或叠层胶合涂敷。在必要时在金属层上提供未特别说明的抗腐蚀层。此外,在金属层下也可以提供未特别描绘的粘附层。
正如依靠图2的实施例描绘的那样,保护层19,即:尤其是其金属部分是电接触的,以致保护层19不仅是对环境影响起保护的层,而且同时也形成对部件***10、11、12的高频屏蔽。但是为此目的,保护层19与基板13上的印制导线14相连,正如在图2通过焊接22所描绘的那样。
在图1和图2的相同部分提供同一参考符号的图3给出一实施例,其中部件***是导线连接的。这时衬底1借助一合适的连接,例如粘接30固定在基板3上。在转向固定区的一侧,经接触线31引线连接到印制导线4上。
在本实施例,按照图2的实施例塑料涂层18提供一本发明的保护层19。
Claims (14)
1.电子部件,尤其是用声表面波工作的部件-OFW部件-,其中包含在衬底(1;10)上的导电结构(11,12)的部件***(1,2;10,11,12)在基板(3;13)上电接触装配,并且其中提供对部件***(1,2;10,11,12)屏蔽环境影响的保护层(8;9),其特征在于:在部件一侧提供保护层,该保护层面向离开部件***(1,2;10,11,12)和基板(3;13)之间的连接区方向,并对部件***(1,2;10,11,12)形成防止对基板(3;13)环境影响的密封层。
2.根据权利要求1所述的部件,其特征为:以倒装晶片方式的技术把部件***(1,2;10,11,12)装配在基板(3;13)上。
3.根据权利要求1所述的部件,其特征为:部件***(1)固定在基板(3)上,借助导线接触实现电连接。
4.根据权利要求1或2所述的部件,其特征为:在面向离开部件***(1,2)和基板(3)之间的连接区方向的衬底(1)侧到基板(3)的保扩层(8)是这样涂敷的,以致形成对基板(3)环境影响的更密封的封闭层。
5.根据权利要求1到3之一所述的部件,其特征为:在部件***(10,11,12)上提供一塑料覆盖层(18),一直到基板(13)的塑料覆盖层(18)上保护层是这样涂敷的,以致形成防止对基板(13)的环境影响的密封层。
6.根据权利要求1到5之一所述的部件,其特征为:保护层(18;19)是含金属的层。
7.根据权利要求1到之一所述的部件,其特征为:保护层(8)是金属层。
8.根据权利要求1到5之一所述的部件,其特征为:保护层(8;19)是由多个分层形成的层。
9.根据权利要求8所述的部件,其特征为:至少一个分层是金属层。
10.根据权利要求8所述的部件,其特征为:至少一个分层是玻璃层。
11.根据权利要求10所述的部件,其特征为:玻璃层是分层系列的下分层。
12.根据权利要求1到11之一所述的部件,其特征为:在保护层(8;19)上提供一抗腐蚀层。
13.根据权利要求1到12之一所述部件,其特征为:在保护层(8;19)之下提供一粘接层。
14.根据权利要求1到13之一所述部件,其特征为:保护层(8;19)的金属部分是电接触的。
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DE19621127.1 | 1996-05-24 | ||
DE19621127 | 1996-05-24 |
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CN1220057A true CN1220057A (zh) | 1999-06-16 |
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US (1) | US6528924B1 (zh) |
EP (1) | EP0900477B1 (zh) |
JP (1) | JPH11510666A (zh) |
CN (1) | CN1169235C (zh) |
CA (1) | CA2255961A1 (zh) |
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CN108735890A (zh) * | 2018-05-25 | 2018-11-02 | 张琴 | 准气密性声表面波元件封装结构及制作方法 |
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DE19806818C1 (de) | 1998-02-18 | 1999-11-04 | Siemens Matsushita Components | Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements |
DE19818824B4 (de) * | 1998-04-27 | 2008-07-31 | Epcos Ag | Elektronisches Bauelement und Verfahren zu dessen Herstellung |
DE19822794C1 (de) * | 1998-05-20 | 2000-03-09 | Siemens Matsushita Components | Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente |
DE19933548C2 (de) * | 1999-07-16 | 2001-07-26 | Epcos Ag | Passiviertes elektronisches Bauelement und Verfahren zur Herstellung einer Passivierung eines elektronischen Bauelements |
FR2799883B1 (fr) | 1999-10-15 | 2003-05-30 | Thomson Csf | Procede d'encapsulation de composants electroniques |
IL133453A0 (en) | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
DE10006446A1 (de) * | 2000-02-14 | 2001-08-23 | Epcos Ag | Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung |
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-
1997
- 1997-05-23 CA CA002255961A patent/CA2255961A1/en not_active Abandoned
- 1997-05-23 EP EP97925867A patent/EP0900477B1/de not_active Expired - Lifetime
- 1997-05-23 WO PCT/DE1997/001055 patent/WO1997045955A1/de not_active Application Discontinuation
- 1997-05-23 JP JP9541398A patent/JPH11510666A/ja active Pending
- 1997-05-23 CN CNB971949360A patent/CN1169235C/zh not_active Expired - Lifetime
- 1997-05-23 DE DE59704079T patent/DE59704079D1/de not_active Expired - Lifetime
-
1998
- 1998-11-24 US US09/198,887 patent/US6528924B1/en not_active Expired - Lifetime
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CN108735890A (zh) * | 2018-05-25 | 2018-11-02 | 张琴 | 准气密性声表面波元件封装结构及制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH11510666A (ja) | 1999-09-14 |
WO1997045955A1 (de) | 1997-12-04 |
US6528924B1 (en) | 2003-03-04 |
CN1169235C (zh) | 2004-09-29 |
EP0900477A1 (de) | 1999-03-10 |
DE59704079D1 (de) | 2001-08-23 |
EP0900477B1 (de) | 2001-07-18 |
CA2255961A1 (en) | 1997-12-04 |
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