CN1217403C - 多层配线装置和配线方法以及配线特性分析和预测方法 - Google Patents
多层配线装置和配线方法以及配线特性分析和预测方法 Download PDFInfo
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- CN1217403C CN1217403C CN031060617A CN03106061A CN1217403C CN 1217403 C CN1217403 C CN 1217403C CN 031060617 A CN031060617 A CN 031060617A CN 03106061 A CN03106061 A CN 03106061A CN 1217403 C CN1217403 C CN 1217403C
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/34—Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment
- G06F11/3438—Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment monitoring of user actions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
- G08B21/18—Status alarms
- G08B21/182—Level alarms, e.g. alarms responsive to variables exceeding a threshold
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B5/00—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied
- G08B5/22—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electric transmission; using electromagnetic transmission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Quality & Reliability (AREA)
- Electromagnetism (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002046765A JP2003249559A (ja) | 2002-02-22 | 2002-02-22 | 多層配線装置および配線方法並びに配線特性解析・予測方法 |
JP2002046765 | 2002-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1440068A CN1440068A (zh) | 2003-09-03 |
CN1217403C true CN1217403C (zh) | 2005-08-31 |
Family
ID=27750656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN031060617A Expired - Lifetime CN1217403C (zh) | 2002-02-22 | 2003-02-21 | 多层配线装置和配线方法以及配线特性分析和预测方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20030161128A1 (zh) |
JP (1) | JP2003249559A (zh) |
KR (3) | KR20030069890A (zh) |
CN (1) | CN1217403C (zh) |
TW (1) | TW582120B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040226735A1 (en) * | 2003-05-12 | 2004-11-18 | Ping Wu | Method and apparatus for integrated noise decoupling |
US7237217B2 (en) * | 2003-11-24 | 2007-06-26 | International Business Machines Corporation | Resonant tree driven clock distribution grid |
JP2005175415A (ja) * | 2003-12-05 | 2005-06-30 | Taiwan Semiconductor Manufacturing Co Ltd | 集積回路デバイスとその製造方法 |
JP4086816B2 (ja) * | 2004-07-01 | 2008-05-14 | 株式会社Nec情報システムズ | Bga部品搭載基板の層数見積もり装置及び方法並びに層数見積もりプログラム |
KR100574987B1 (ko) | 2004-10-02 | 2006-05-02 | 삼성전자주식회사 | Io 메탈 링 구조 및 io 메탈 링을 이용한 온-칩디커플링 커패시턴스 |
JP4343085B2 (ja) * | 2004-10-26 | 2009-10-14 | Necエレクトロニクス株式会社 | 半導体装置 |
KR100672673B1 (ko) | 2004-12-29 | 2007-01-24 | 동부일렉트로닉스 주식회사 | 커패시터 구조 및 그 제조방법 |
JP2007134468A (ja) | 2005-11-10 | 2007-05-31 | Kawasaki Microelectronics Kk | 半導体集積回路 |
JP5259054B2 (ja) | 2006-02-14 | 2013-08-07 | 富士通セミコンダクター株式会社 | 容量セル、および容量 |
JP4997786B2 (ja) | 2006-02-17 | 2012-08-08 | 富士通セミコンダクター株式会社 | 半導体集積回路装置 |
JP2009054702A (ja) * | 2007-08-24 | 2009-03-12 | Panasonic Corp | 半導体集積回路 |
JP5369544B2 (ja) * | 2008-08-29 | 2013-12-18 | 富士通株式会社 | 半導体装置およびその製造方法 |
US8242579B2 (en) * | 2009-05-25 | 2012-08-14 | Infineon Technologies Ag | Capacitor structure |
JP5493166B2 (ja) | 2009-12-03 | 2014-05-14 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
US8421205B2 (en) * | 2010-05-06 | 2013-04-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Power layout for integrated circuits |
KR101143634B1 (ko) * | 2010-09-10 | 2012-05-11 | 에스케이하이닉스 주식회사 | 캐패시터 형성 방법과 이를 이용한 반도체 소자 |
US8410579B2 (en) * | 2010-12-07 | 2013-04-02 | Xilinx, Inc. | Power distribution network |
US8659121B2 (en) * | 2011-07-21 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices with orientation-free decoupling capacitors and methods of manufacture thereof |
KR101329995B1 (ko) | 2012-05-03 | 2013-11-15 | 넷솔 주식회사 | 메모리 장치 |
US9508788B2 (en) | 2013-03-13 | 2016-11-29 | Infineon Technologies Ag | Capacitors in integrated circuits and methods of fabrication thereof |
CN103531577A (zh) * | 2013-10-30 | 2014-01-22 | 西安华芯半导体有限公司 | 一种集成电路的金属布线结构 |
JP6966686B2 (ja) * | 2016-10-21 | 2021-11-17 | 株式会社ソシオネクスト | 半導体装置 |
US10672709B2 (en) * | 2016-12-12 | 2020-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd | Power grid, IC and method for placing power grid |
CN109087922B (zh) * | 2018-09-19 | 2020-09-29 | 合肥鑫晟光电科技有限公司 | 阵列基板及其制作方法、显示面板 |
CN116113137A (zh) * | 2021-11-10 | 2023-05-12 | 华为技术有限公司 | 一种电路板封装结构、电路板组件以及电子设备 |
JP2023079055A (ja) * | 2021-11-26 | 2023-06-07 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体、および、光電変換装置の設計方法 |
JP2023084494A (ja) * | 2021-12-07 | 2023-06-19 | キヤノン株式会社 | 半導体装置、光電変換装置、光電変換システム、および、移動体 |
-
2002
- 2002-02-22 JP JP2002046765A patent/JP2003249559A/ja active Pending
-
2003
- 2003-02-20 TW TW092103558A patent/TW582120B/zh not_active IP Right Cessation
- 2003-02-21 KR KR10-2003-0010989A patent/KR20030069890A/ko not_active Application Discontinuation
- 2003-02-21 CN CN031060617A patent/CN1217403C/zh not_active Expired - Lifetime
- 2003-02-24 US US10/371,426 patent/US20030161128A1/en not_active Abandoned
-
2005
- 2005-02-21 KR KR10-2005-0014210A patent/KR100497712B1/ko active IP Right Grant
- 2005-02-21 KR KR10-2005-0014212A patent/KR100503219B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2003249559A (ja) | 2003-09-05 |
US20030161128A1 (en) | 2003-08-28 |
KR100503219B1 (ko) | 2005-07-21 |
KR20030069890A (ko) | 2003-08-27 |
TW582120B (en) | 2004-04-01 |
TW200303618A (en) | 2003-09-01 |
CN1440068A (zh) | 2003-09-03 |
KR100497712B1 (ko) | 2005-06-23 |
KR20050033055A (ko) | 2005-04-08 |
KR20050039766A (ko) | 2005-04-29 |
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