CN1203698A - 晶片安装方法与晶片安装设备 - Google Patents

晶片安装方法与晶片安装设备 Download PDF

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CN1203698A
CN1203698A CN96198679A CN96198679A CN1203698A CN 1203698 A CN1203698 A CN 1203698A CN 96198679 A CN96198679 A CN 96198679A CN 96198679 A CN96198679 A CN 96198679A CN 1203698 A CN1203698 A CN 1203698A
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L·I·奈何姆
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Abstract

为了简化一个具有至少一个有源光学表面的晶片的设备并将晶片相对于一个小型光学封壳定位于一个用于一个光纤与有源光学表面之间传输最佳。光的准确的位置,将晶片(1)粘接在一个箔片基底(9)上,该基底具有至少一个导体(4)并设置有用于箔片基底上晶片的准确定位和用于封壳上箔片基底/晶片组件的准确定位的对准标记和/或导向装置(8)。在将晶片固定在箔片基底上之后,可以将带有晶片的基底牢牢固定到封壳上并通过该装置把晶片粘接到封壳上。通过在封壳上采用导向装置,例如接触元件导销,可以相对于封壳将箔片基底/晶片组件准确定位,以使接触元件中的光纤端部位于晶片的有源光学表面的对面并与其相接触,以此提供最佳光传输。

Description

晶片安装方法与晶片安装设备
本发明涉及一种将一个具有至少一个有源光学表面的晶片安装在一个部件上的方法，和一种用来将一个具有至少一个光学表面的晶片安装在一个部件上的设备，例如用来将一个晶片安装在一个小型光学封壳内的设备。常常把象光探测器(PD)、发光二极管(LED)或激光二极管(LD)这样可以与其他电子元件结合在一起的安装和/或封装在表面的光电元件安装在小型封壳上以便于使用。
当使用一种高速通信光纤时，常在该光纤与光学元件上的有源表面之间设置一个固定连接，例如一个光发射器或光接收器。该连接要求光纤端部能与光学元件上严格限定的区域非常精确地配合。因此对于该光学元件来说，与一束通常称为引线的固定安装光纤段封装在一起是很常见的，从而将使小的固定安装光纤一直挂在封壳外。该封壳可以用一种金属或陶瓷材料密封制成。这种元件封装法费时、昂贵、使封壳体积大并且不允许将所封元件连接到光纤上或从光纤上断开。
US-A 5,168,537、5,199,093、5,230,030、5,249,245、5,309,537、5,337,391和5,420,954号专利文件描述了以前用来借助于互连装置将光纤连接到光发射器或光接收器上的方法与设备，其中借助于不同类型的导向装置将各个分离的光纤端部直接引至光电元件上的有源表面上。
为了简化具有至少一个有源光学表面的晶片的配置并将该晶片关于一个小型光学封壳定位于一个准确的位置以用于光纤与有源光学表面之间的最佳光传输，将该晶片固定在一个箔片上，该箔片具有至少一个导体并设有用于将晶片准确定位于箔片上和用于将箔片与所装的晶片准确定位于封壳上的对准标记和/或导向装置。在将晶片固定在箔片上后，可将箔片和晶片组件牢牢地固定到封壳上。通过使用导向装置，例如封壳上的接触元件导销(contact element guidepins)，可以将箔片和晶片组件相对于封壳准确定位，这样以使接触元件中光纤端部位于晶片的有源光学表面的对面并与其相接触，以此提供最佳的光透射。
图1表示出按照已有技术的小型光学封壳设备。
图2表示出按照具有用于一个晶片和导销的室的本发明的小型光学封壳设备。
图3a表示出一个箔片基底，它载有导体和按本发明具有有源光学表面的底层晶片。
图3b表示出带有图3a中所示的晶片和上层导体的箔片基底。
图3c表示图3a所示具有底层导体的晶片和箔片条。
图4a表示出一个小型光学封壳，它包括一个带有上层导体的按照本发明的安装在箔片上的晶片。
图4b表示出另一个小型光学封壳，它包括一个带有下层导体的按照本发明的安装在箔片上的晶片。
图5a和图5b表示出又一个小型光学封壳，它包括导向装置和按照本发明的安装在箔片上的晶片，所述附图分别从上面及一侧表示出该小型封壳。
图1表示出带有某种光电元件15的一种已知的模块或通常所说的小型光学封壳，并且表示出基底上一种可以想到的装置，例如一个电路板或类似装置。一个具有几条相邻光纤的多纤维光缆或带状纤维设置有具有导销的封壳连接器，当把连接器连接到封壳上时，借着连接器上的导销准确***设于封壳前侧的配合导销孔11，该导销起到相对于封壳准确定位连接器的作用。参考数字17表示从光电元件15沿直线向下延伸到封壳下侧的导电路径。在封壳的前侧有一个浅凹陷部分19，其中可将元件15安装在相对于封壳或模块的前侧其余部分凹下去的位置中。当将光学连接器上的导销***封壳的导销孔中时，该设备能使光学元件的外连接表面与光学连接器的相应表面——通常为光缆中光纤的端面——之间达到一个可控的距离。这样在安装光学连接器时能避免由于所施加的压力而产生的对连接表面的破坏。封壳的前侧可以包括对准十字记号或类似形式的标记21，它起着使光学元件能相对于导销接收孔11的位置准确放于封壳前侧的作用。
图2表示出按照本发明构造的模块/小型光学封壳10，该封壳10具有晶片接收凹陷部分14和用于光纤连接器的导销17。
图3a-c表示出一个模块/小型封壳电气连接设备，它包括柔性箔片基底9，由一种聚合物材料制成，例如聚酰亚胺，在通常所说的挠性箔片的一侧或双侧上带有金属箔片4，最好是铜箔片。铜箔片用于晶片1与电路板11之间电气连接，采用印刷电路形式。可以用倒装晶片法将晶片安装在箔片基底9上，以使晶片的有源表面7朝向该箔片基底。该箔片基底具有一个开口5，该开口位于晶片的有源表面的对面。可以用粘胶剂3进一步加强用于箔片基底与倒装晶片的结合。可以涂敷粘胶以使其部分或全部填入箔片开口。但是，当通过箔片基底获得足够的正常寿命的透射时不需要开口。可以将一层薄而透明且坚韧的膜6加到箔片基底的后侧上，处于与有源表面的位置相对应的位置。将带有用来接收封壳10上导销17的孔8的箔片基底放在这些导销上，将晶片放在模块/封壳内的凹陷部分14内。可以用粘胶14将晶片和箔片基底粘到封壳上，见图4。当连接连接器时，薄而透明的坚韧的膜6将防止在连接器与元件之间产生气隙。例如，当倒装晶片凸起2的高度为50-75μm时，铜箔片基底4的厚度为10μm，聚合物箔片9的厚度为25μm，薄膜6的厚度为20μm，连接器光纤与晶片表面间的总距离将为100-130μm，认为该距离是一个足够短的距离。
主要有两种实现晶片与挠性箔片上电路板之间电连接的方法，它们之间的差别在于通过挠性箔片有导体4的那一侧。如果导***于晶片的同侧，如图3b中所示，则使箔片基底“向前”弯曲，见图4a，当将它安装在电路板11上时，它并不位于封壳的下面，用焊剂或导电胶13将它与电路板18上的导体相连接。如果导体反过来位于装有晶片一侧的对侧，见图3c，则使导体弯曲到组件的下面，见图4b，并用焊剂或导电胶13将其与装有导体的电路板相连。在后一种情况下，通过孔16的媒质把在箔片基底一侧上的晶片连接到箔片基底另一侧上的导体上。
在把晶片放在箔片基底上时或是在把箔片基底装在模块上时可以将晶片的有源表面相对于组件中的导销定位。在前面一种情况下，可用一台安装机，它能将晶片相对于孔8以约5μm的精度准确放在适当的位置。
可以采用一种“可视”***，该***能够表示晶片的外边缘，或表示晶片载有的对准标记，并能相对于箔片基底中的孔准确设置这些边缘或标记。当这些孔具有与导销17相同的直径时，当把箔片基底/晶片组件装配到导销上时相对于导销准确定位晶片。在后一种情况下，见图5，相对于导销17对凹陷部分14的边缘19、20给出足够的准确度。然后在粘箔片基底/晶片组件之前将箔片基底/晶片组件安装到导销和紧压在严格限定的边缘19、20上的晶片的外边缘上去。后一种情况要求箔片基底8中的孔稍大于导销的直径。在给箔片装上晶片之前可安装一个严格限定了轮廓的金属箔片或塑料箔片，而不采用模块凹陷部分中的边缘。该箔片还可以具有相对于所述孔而严格限定的边缘，它们类似于前述模块凹陷部分的边缘，以此提供箔片基底/晶片组件的严格限定的定位方法。

Claims (8)

1.一种将一个具有至少一个有源光学表面的晶片安装到一个部件上的方法，例如将一个晶片安装在一个小型光学封壳上，其特征在于，将晶片固定到例如用胶粘在含有至少一个用于与晶片电接触的导体上，晶片的有源表面面向或背离箔片基底；为箔片基底设置用于使箔片基底上晶片的准确定位与用于使部件上箔片基底的准确定位的对准标记和/或导向装置；和将箔片基底/晶片组件固定到该部件上。
2.按照权利要求1的方法，其特征在于在箔片基底上设有与部件上的导销相配合的孔或部件安装用接触装置，用来将箔片基底准确定位于部件。
3.按照权利要求1的方法，其特征在于在箔片基底上设置一个开口，当把晶片固定到箔片基底上时所述开口将位于晶片的有源表面的对面。
4.一种用来将具有至少一个有源光学表面的晶片相对于一个部件准确定位的设备，例如在把一个晶片安装在一个小型光学封壳上时，其特征在于：将晶片(1)固定到一个包括至少一个导体(4)的箔片基底(9)上；和在箔片基底上设置用来将晶片准确定位于箔片基底上和用来将箔片基底安装定位于所述部件上的对准标记和/或导向装置(8)。
5.按照权利要求4的设备，其特征在于箔片基底包括与部件上的导销(17)配合的孔(8)或一个安装部件用的接触装置。
6.按照权利要求4的设备，其特征在于箔片基底包括一个开口(5)，所述开口(5)用来位于晶片的有源表面(7)的对面，接着用来将晶片粘接在箔片基底上。
7.按照权利要求4的设备，其特征在于为所述部件设置一个严格限定的凹陷部分(14)，所述凹陷部分(14)用来在将晶片安装在部件上时限定晶片(1)的位置。
8.一种包括一个具有至少一个有源光学表面的晶片的小型光学封壳，其特征在于将晶片(1)安装在一个具有至少一个导体(4)的箔片基底(9)上；将箔片基底/晶片组件安装在封壳(10)上；和将所述箔片基底上的导体连接到晶片上或能将其连接到一个电路板(11)上的一个导体上。
CN96198679A 1995-11-29 1996-11-27 晶片安装方法与晶片安装设备 Expired - Fee Related CN1100345C (zh)

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JP2000501239A (ja) 2000-02-02
EP0864173A1 (en) 1998-09-16
SE9504271D0 (sv) 1995-11-29
SE9504271L (sv) 1997-05-30
CA2238754A1 (en) 1997-06-05
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WO1997020344A1 (en) 1997-06-05
TW313687B (zh) 1997-08-21
AU7716496A (en) 1997-06-19
SE508763C2 (sv) 1998-11-02
US6242274B1 (en) 2001-06-05
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CA2238754C (en) 2008-01-15
CN1100345C (zh) 2003-01-29

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