CN1181526C - 部件安装方法和电光装置的制造方法 - Google Patents

部件安装方法和电光装置的制造方法 Download PDF

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CN1181526C
CN1181526C CNB00132358XA CN00132358A CN1181526C CN 1181526 C CN1181526 C CN 1181526C CN B00132358X A CNB00132358X A CN B00132358XA CN 00132358 A CN00132358 A CN 00132358A CN 1181526 C CN1181526 C CN 1181526C
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内山宪治
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Abstract

本发明提供一种可提高使用了各向异性导电膜等的导电粘接剂的部件安装的可靠性的部件安装方法。该方法是经导电粘接剂12将部件11热压接到基板3b上的部件安装方法，具备：将基板3b加热到比导电粘接剂12中包含的粘接用树脂12a的玻璃转移点低20～40℃的温度的基板加热工序；以及经导电粘接剂12将部件11热压接到已被加热到该温度的基板3a上的热压接工序。

Description

部件安装方法和电光装置的制造方法
技术领域
本发明涉及经各向异性导电膜等的导电粘接剂将半导体芯片等的部件热压接到基板上的部件安装方法和电光装置的制造方法。
背景技术
已知通过使用各向异性导电膜(ACF)将半导体芯片等的部件安装在液晶面板等的玻璃基板上的技术。在该技术中，通过在基板与部件之间夹住各向异性导电膜的状态下对部件施加热和压力，使各向异性导电膜中包含的树脂硬化，将部件粘接到基板上。此外，此时利用各向异性导电膜中包含的导电粒子进行基板上的端子与部件的端子之间的导电性的连接。
但是，在使用了各向异性导电膜的安装工序中，由于在热压接时部件被加热，故存在安装的可靠性因在冷却后、即将部件安装在基板上后的残留应力而下降的担心。此外，为了对基板上的端子与部件的端子之间的导电性的连接提供高的可靠性，必须在两端子间夹入充分的个数的导电粒子，为此，要求适当地控制在热压接时被熔融的各向异性导电膜的流动。
发明内容
本发明的目的在于，提供一种能提高使用了各向异性导电膜等的导电粘接剂的部件安装的可靠性的部件安装方法和电光装置的制造方法。
本发明是一种部件安装方法，其中，经导电粘接剂将部件热压接到基板上，其特征在于，具备：基板加热工序，将上述基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及热压接工序，经上述导电粘接剂将上述部件热压接到已被加热到上述温度的上述基板上。
按照该部件安装方法，由于在将基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度后，经导电粘接剂将部件热压接到基板上，因可使热压接工序中热压接部件时的部件的温度与基板的温度的差减少，故可减少安装了部件后的残留应力。此外，由于在热压接工序中基板被加热、导电粘接剂的温度也上升，故在热压接工序中的导电粘接剂的粘度充分地下降，导电粘接剂的流动加快。因此，导电粘接剂中包含的导电粒子容易留在部件的端子与基板的端子之间，可提高两端子间的导电性的连接的可靠性。
本发明是一种部件安装方法，其中，经导电粘接剂将部件热压接到基板上，其特征在于，具备：暂时压接工序，经上述导电粘接剂将上述部件暂时压接到上述基板上；基板加热工序，在已将上述部件暂时压接到上述基板上的状态下，将上述基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及热压接工序，经上述导电粘接剂将上述部件热压接到已被加热到上述温度的上述基板上。
按照该部件安装方法，由于在将基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度后经导电粘接剂将部件热压接到基板上，因可使热压接工序中热压接部件时的部件的温度与基板的温度的差减少，故可减少安装了部件后的残留应力。此外，由于在热压接工序中基板被加热、导电粘接剂的温度也上升，故在热压接工序中的导电粘接剂的粘度充分地下降，导电粘接剂的流动加快。因此，导电粘接剂中包含的导电粒子容易留在部件的端子与基板的端子之间，可提高两端子间的导电性的连接的可靠性。
在上述基板加热工序中，可将上述基板加热到比上述导电粘接剂的玻璃转移点低25～35℃的温度。
在上述基板加热工序中，可通过加热放置了上述基板的接受台来将上述基板加热到上述温度。
上述导电粘接剂可含有热硬化性树脂和混入到上述热硬化性树脂中的导电粒子。
可将作为上述部件的半导体芯片安装到作为上述基板的玻璃基板上。
上述玻璃基板可以是构成液晶装置的基板。
上述导电粘接剂的玻璃转移点可处于80～130℃的范围内。
按照本发明的电光装置的制造方法，该电光装置是在基板上形成了电光材料的电光装置，其特征在于：经各向异性导电膜将半导体芯片安装到上述基板上的工序具备：将各向异性导电膜粘贴到上述一个基板上的工序；基板加热工序，将上述一个基板加热到比上述各向异性导电膜中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及热压接工序，经上述各向异性导电膜将上述半导体芯片热压接到已被加热到上述温度的上述基板上。
按照本发明的一个方面，提供一种部件安装方法，其中，经导电粘接剂将部件热压接到基板上，其特征在于，具备：暂时压接工序，经上述导电粘接剂将上述部件暂时压接到上述基板上；基板加热工序，在已将上述部件暂时压接到上述基板上的状态下，将上述基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及热压接工序，经上述导电粘接剂将上述部件热压接到已被加热到上述温度的上述基板上；上述导电粘接剂含有作为上述粘接用树脂的热硬化性树脂和混入到上述热硬化性树脂中的导电粒子；上述粘接用树脂的玻璃转移点处于80～130℃的范围内。
按照本发明的又一个方面，提供一种电光装置的制造方法，该电光装置是在基板上形成了电光材料的电光装置，其特征在于：经各向异性导电膜将半导体芯片安装到上述基板上的工序具备：将各向异性导电膜粘贴到上述一个基板上的工序；暂时压接工序，经上述各向异性导电膜将上述半导体芯片暂时压接到上述一个的基板上；基板加热工序，将上述一个基板加热到比上述各向异性导电膜中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及热压接工序，经上述各向异性导电膜将上述半导体芯片热压接到已被加热到上述温度的上述基板上；上述各向异性导电膜含有作为上述粘接用树脂的热硬化性树脂和混入到上述热硬化性树脂中的导电粒子；上述粘接用树脂的玻璃转移点处于80～130℃的范围内。
附图说明
图1是示出应用本发明的部件安装方法的的液晶装置的斜视图。
图2是分解了图1的液晶装置而示出的斜视图。
图3是示出液晶驱动用IC的安装工序的剖面图，(a)是示出放置了ACF的状态的图，(b)是示出暂时压接了液晶驱动用IC的状态的图。
图4是示出液晶驱动用IC的安装工序的剖面图，(a)是示出利用热压接头热压接液晶驱动用IC时的状态的图，(b)是示出热压接了液晶驱动用IC后的状态的图。
图5是示出在液晶驱动用IC的安装工序中使用的制造装置的一例的图。
图6是示出具备图1和图2中示出的液晶装置的携带电话机的斜视图。
具体实施方式
以下，参照图1～图5，说明将本发明的部件安装方法应用于将COG(玻璃上的芯片)方式的液晶作为电光材料使用的电光装置的制造工艺的实施例。
图1是本实施例的液晶装置的斜视图，图2是该液晶装置的分解斜视图。
该液晶装置1具备由密封材料2互相粘接其周围的一对基板3a和3b。利用例如丝网印刷等的印刷技术来形成该密封材料2。通过在由玻璃等的材料或塑料等的具有柔性的膜材料等形成的基板原材料5a和5b上形成各种要素来制造基板3a和3b。
利用多个衬垫将在这些基板3a和3b之间形成的间隙、即单元间隙的尺寸限制为均匀的值、例如约5微米，在由该单元间隙内的密封构件2包围的区域中封入液晶。
在基板3a的液晶侧表面(与基板3b的相对面)上形成多条平行的电极7a，在基板3b的液晶侧表面(与基板3a的相对面)上形成多条平行的电极7b。在互相正交的方向上配置在基板3a上形成的电极7a和在基板3b上形成的电极7b，这些电极以点矩阵状交叉的多个点构成用于显示像的像素。此外，在基板3a和3b的外侧表面上分别粘贴偏振片8a和8b。
基板3b具有封入液晶的液晶区域部分E和朝向该液晶区域部分E的外侧突出的突出部H。即，基板3b从基板3a的端面突出，基板3a的电极7b按原样朝向该突出部H延伸而形成了布线。此外，基板3a的电极7a经分散在密封材料2的内部的导通材料(未图示)来谋求与基板3b的电极9b的导通，电极9b朝向该突出部H延伸而形成了布线。
如图2中所示，在突出部H上设置安装液晶驱动用IC11的矩形的安装区。液晶驱动用IC11经ACF(各向异性导电膜)12粘接到该安装区上而被安装。如图1和图2中所示，对于液晶驱动用IC11的安装区，从其三边侧引入电极7b或与电极7a连接的电极9b的端部。此外，从该安装区的剩下的一边侧引入与外部电路连接用的连接端子14的端部。
图4(b)是示出液晶驱动用IC11的凸点11a与基板3b上的端子14之间的导电性的连接的情况的剖面图，如图4(b)中所示，ACF12具备作为热硬化性树脂的粘接用树脂12a和分散在粘接用树脂12a中的导电粒子12b。利用粘接用树脂12a将液晶驱动用IC11粘接到基板3b上。此外，此时，将ACF12中包含的导电粒子12b夹入凸点11a与端子14之间，导电性地连接凸点11a与端子14之间。再有，电极7b和电极9b分别与端子14相同，经ACF12与凸点11a导电性地连接。
以下，参照图3～图5，说明液晶驱动用IC11的安装工序。
如图3(a)中所示，将ACF12放置在基板3b上的液晶驱动用IC11的安装区上，用规定的压力将液晶驱动用IC11压到ACF12上。由此，如图3(b)中所示，利用ACF12的粘接性对液晶驱动用IC11进行暂时压接。
其次，如图5中所示，通过驱动运送台52来运送基板3b，将基板3b的端部(在图5中是左端部)放置在接受台51上，以使暂时压接了的液晶驱动用IC11的部分与热压接头50相对。如图5中所示，在接受台51中内置了加热器51a，通过在规定的时间内将基板3b放置在接受台51上，使液晶驱动用IC11的安装区域中的基板3b的温度上升到比ACF12中包含的热硬化性树脂、即粘接用树脂的玻璃转移点低20～40℃的温度、更为理想的是比ACF12的粘接用树脂的玻璃转移点低25～35℃的温度。该温度最好是ACF12的粘接用树脂的热硬化实质上未开始、而且粘接用树脂的粘度下降的温度。
在本实施例中，对加热器进行控制，使得基板的温度为60～90℃，即，ACF的温度为60～90℃。
在使基板3b的温度上升到上述温度后，如图4(a)中所示，通过用规定的压力将已加热到规定的温度的热压接头压到液晶驱动用IC11上，使ACF12熔融、流动。在ACF12流动后，通过使ACF12的粘接用树脂12a热硬化，将液晶驱动用IC11粘接到基板3b上。此外，通过在液晶驱动用IC11的凸点11a与基板3b的连接端子14之间夹入导电粒子12b，互相导电性地连接液晶驱动用IC11与端子14。
这样，在本实施例中，在进行利用热压接头50的本压接之前，由于已将基板3b加热到比ACF12的玻璃转移点低20～40℃的温度，故可利用本压接使安装液晶驱动用IC11时的液晶驱动用IC11的温度与基板3b的温度差减少。因此，可减少安装了液晶驱动用IC11后的残留应力。此外，由于在本压接之前利用接受台51加热基板3b、ACF12的温度也上升，故本压接时的ACF12的粘度充分地下降，ACF12的流动加快。因此，导电粒子12b容易留在液晶驱动用IC11的凸点11a与基板3b上的端子14之间，可提高凸点11a与端子14的导电性的连接的可靠性。
以下，参照图6，说明作为具备图1和图2中示出的液晶装置的电子装置的一例的携带电话机。
这里示出的携带电话机100通过将天线101、扬声器102、液晶装置1、键开关103、话筒104等的各种构成要素放置在作为框体的外壳106内而构成。此外，在外壳106的内部，设置安装了控制上述的各构成要素的工作用的控制电路的控制电路基板107。
在该携带电话机100中，将通过键开关103和话筒104输入的信号及由天线101接收的接收数据等输入到控制电路基板107。然后，该控制电路根据已输入的各种数据，在液晶装置1的显示面内显示数字、文字、图形等的像，再从天线101发送发送数据。
以上举出优选实施例说明了本发明，但本发明不限定于该实施例，在权利要求的范围中记载的发明的范围内，可作各种改变。例如，在上述实施例中，例示了半导体芯片的安装，但可将本发明应用于其它各种部件的安装。
此外，在本实施例中，示出了单纯矩阵型的半透射型液晶显示装置的制造方法的应用例，但本发明也可应用于有源矩阵型的液晶装置及液晶装置以外的平板面板、例如等离子体显示面板、EL(场致发光)面板等的电光装置及其它各种装置的制造方法。再者，例示了将本发明的液晶装置用于作为电子装置的携带电话机的情况，但也可将使用本发明的部件安装方法制造的液晶装置应用于除此以外的任意的电子装置、例如携带信息终端、电子笔记本、摄像机的取景器等。

Claims (6)

1.一种部件安装方法，其中，经导电粘接剂将部件热压接到基板上，其特征在于，具备：
暂时压接工序，经上述导电粘接剂将上述部件暂时压接到上述基板上；
基板加热工序，在已将上述部件暂时压接到上述基板上的状态下，将上述基板加热到比上述导电粘接剂中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及
热压接工序，经上述导电粘接剂将上述部件热压接到已被加热到上述温度的上述基板上；
上述导电粘接剂含有作为上述粘接用树脂的热硬化性树脂和混入到上述热硬化性树脂中的导电粒子；
上述粘接用树脂的玻璃转移点处于80～130℃的范围内。
2.如权利要求1中所述的部件安装方法，其特征在于：
在上述基板加热工序中，将上述基板加热到比上述导电粘接剂中所含的上述粘接用树脂的玻璃转移点低25～35℃的温度。
3.如权利要求1中所述的部件安装方法，其特征在于：
在上述基板加热工序中，通过加热放置了上述基板的接受台来将上述基板加热到上述温度。
4.如权利要求1中所述的部件安装方法，其特征在于：
将作为上述部件的半导体芯片安装到作为上述基板的玻璃基板上。
5.如权利要求4中所述的部件安装方法，其特征在于：
上述玻璃基板是构成液晶装置的基板。
6.一种电光装置的制造方法，该电光装置是在基板上形成了电光材料的电光装置，其特征在于：
经各向异性导电膜将半导体芯片安装到上述基板上的工序具备：将各向异性导电膜粘贴到上述一个基板上的工序；
暂时压接工序，经上述各向异性导电膜将上述半导体芯片暂时压接到上述一个的基板上；
基板加热工序，将上述一个基板加热到比上述各向异性导电膜中包含的粘接用树脂的玻璃转移点低20～40℃的温度；以及
热压接工序，经上述各向异性导电膜将上述半导体芯片热压接到已被加热到上述温度的上述基板上；
上述各向异性导电膜含有作为上述粘接用树脂的热硬化性树脂和混入到上述热硬化性树脂中的导电粒子；
上述粘接用树脂的玻璃转移点处于80～130℃的范围内。
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