CN117620851A - 磨削装置 - Google Patents
磨削装置 Download PDFInfo
- Publication number
- CN117620851A CN117620851A CN202311035265.0A CN202311035265A CN117620851A CN 117620851 A CN117620851 A CN 117620851A CN 202311035265 A CN202311035265 A CN 202311035265A CN 117620851 A CN117620851 A CN 117620851A
- Authority
- CN
- China
- Prior art keywords
- grinding
- bevel
- wafer
- recess
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 183
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 description 83
- 238000004140 cleaning Methods 0.000 description 6
- 239000007767 bonding agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012840 feeding operation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-134595 | 2022-08-26 | ||
| JP2022134595A JP2024031191A (ja) | 2022-08-26 | 2022-08-26 | 研削装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117620851A true CN117620851A (zh) | 2024-03-01 |
Family
ID=90025910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311035265.0A Pending CN117620851A (zh) | 2022-08-26 | 2023-08-16 | 磨削装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2024031191A (ja) |
| CN (1) | CN117620851A (ja) |
-
2022
- 2022-08-26 JP JP2022134595A patent/JP2024031191A/ja active Pending
-
2023
- 2023-08-16 CN CN202311035265.0A patent/CN117620851A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024031191A (ja) | 2024-03-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |