CN116759354A - Automatic feeding machine for reflow soldering - Google Patents
Automatic feeding machine for reflow soldering Download PDFInfo
- Publication number
- CN116759354A CN116759354A CN202310754518.3A CN202310754518A CN116759354A CN 116759354 A CN116759354 A CN 116759354A CN 202310754518 A CN202310754518 A CN 202310754518A CN 116759354 A CN116759354 A CN 116759354A
- Authority
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- China
- Prior art keywords
- clamping
- fixedly arranged
- clamping jaw
- unit
- jaw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000005476 soldering Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000012546 transfer Methods 0.000 claims abstract description 5
- 230000006978 adaptation Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 16
- 230000001360 synchronised effect Effects 0.000 description 11
- 238000007664 blowing Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An automatic feeding machine for reflow soldering. To semiconductor processing equipment. Comprises an upper top unit and a clamping unit; the upper jacking unit jacks the copper frame in the material box upwards to a set position; the clamping and grabbing unit transfers the copper frame reaching the set position to the conveying unit; the pinch grip unit includes: the clamping rodless cylinder is horizontally and fixedly arranged at the top of the jacking unit; the clamping and grabbing lifting cylinder is vertically and fixedly arranged on a sliding block of the clamping and grabbing rodless cylinder; and the material taking part is fixedly arranged at the piston rod end of the clamping lifting cylinder, picks up the copper frame from the set position and then rotates to the upper part of the conveying unit through the clamping rodless cylinder. The invention realizes the distinction of different types of materials and prevents the mixing of materials.
Description
Technical Field
The invention relates to semiconductor processing equipment, in particular to an automatic reflow soldering feeder.
Background
After the power device chip finishes welding wires on the frame body, the welding stability is guaranteed through reflow soldering of a reflow oven, according to the process requirements, the copper frame is required to be stacked into five pieces each time during reflow soldering, then the five pieces are placed on a reflow soldering platform for high-temperature reflow soldering, and each card is required to be placed into the reflow soldering platform for interval marking after finishing, so that mixing is avoided. In the reflow soldering process, the five copper frames are usually placed manually, so that the efficiency is low, the chip is easy to damage, and the product is easy to mix.
Disclosure of Invention
Aiming at the problems, the invention provides an automatic reflow soldering feeder capable of efficiently realizing automatic landing of a copper frame.
The technical scheme of the invention is as follows:
an automatic reflow soldering feeder is characterized by comprising an upper jacking unit and a clamping unit; the upper jacking unit jacks the copper frame in the material box upwards to a set position; the clamping and grabbing unit transfers the copper frame reaching the set position to the conveying unit; the pinch grip unit includes:
the clamping rodless cylinder is horizontally and fixedly arranged at the top of the jacking unit;
the clamping and grabbing lifting cylinder is vertically and fixedly arranged on a sliding block of the clamping and grabbing rodless cylinder; and
and the material taking part is fixedly arranged at the piston rod end of the clamping lifting cylinder, picks up the copper frame from the set position and then rotates to the upper part of the conveying unit through the clamping rodless cylinder.
Specifically, the material taking part comprises:
the material taking bracket is fixedly arranged at the piston rod end of the clamping lifting cylinder;
the material taking rod is horizontally and fixedly arranged on the material taking bracket in an adjustable mode;
the clamping jaw fixing plates are provided with a pair of symmetrically adjustable fixing sleeves on the material taking rod; the clamping jaw fixing plate is provided with a plurality of clamping jaw grooves, and clamping jaw air holes are formed in the upper parts of the clamping jaw grooves; and
the clamping jaw connecting arms are provided with a plurality of clamping jaw connecting arms which are respectively and hinged in the corresponding clamping jaw grooves; the top of clamping jaw linking arm is equipped with the power portion that extends to clamping jaw gas pocket department, and the bottom is equipped with can dismantle fixed connection's clamping jaw post, a plurality of clamping jaw post respectively with copper frame looks adaptation to incline to outside direction respectively.
Specifically, the section diameter of the clamping jaw column is in a gradually decreasing structure from top to bottom.
Specifically, the clamping jaw column is provided with external threads.
Specifically, the clamping jaw column is detachably and fixedly connected with the bottom of the clamping jaw connecting arm through threads.
Specifically, the clamping jaw air holes extend downwards from the top of the clamping jaw fixing plate and are turned to the side part of the power part.
Specifically, the clamping jaw fixing plate is at least provided with two clamping jaw grooves matched with the clamping jaw connecting arms.
Specifically, an adjusting chute is arranged at the top of the material taking bracket; a plurality of threaded holes are formed in the adjusting chute;
the connecting plate of the piston rod end of the clamping rodless cylinder is adjustably and fixedly arranged in the adjusting chute through a connecting piece.
Specifically, the material taking part comprises:
the sucker frame is detachably and fixedly arranged at the piston rod end of the clamping lifting cylinder; and
the sucking disc is provided with a plurality of sucking discs, can be detachably and fixedly arranged at the bottom of the sucking disc frame and is matched with the copper frame.
Specifically, the topping unit includes:
the upper-jacking rodless cylinder is vertically and fixedly arranged in the workbench;
the support seat is fixedly arranged on the sliding block of the upper-top rodless cylinder;
the jacking column is vertically and fixedly arranged on the supporting seat and extends towards the top of the workbench; and
the jacking plate is plate-shaped and is fixedly arranged at the top of the jacking column; the top of workstation is equipped with the liftout mouth with liftout board adaptation.
The method comprises the steps that an operator places a plurality of full-load clips with tablets (copper frames) on a feed guide rail, a sliding block of a feed rodless cylinder moves to an upper ejector unit to drive a clip push plate to move towards a material ejecting plate, the full-load clips are pushed to move forward to a preset position, the material ejecting plate of the upper ejector unit moves upwards to push the tablets in the full-load clips to move upwards to the preset position, a clamping jaw column of a clamping and grabbing unit clamps the uppermost tablet, a clamping and grabbing lifting cylinder retracts a guide rod to enable the clamped tablet to move upwards, a sliding block of the clamping and grabbing rodless cylinder moves towards a conveying unit to drive the moved tablet to move, after moving to the preset position, the tablet falls freely onto a synchronous conveying belt, a plurality of equal tablet cylinders are arranged at the joint of the synchronous conveying belt, after the tablet is conveyed to the end of the synchronous conveying belt, the equal tablet cylinders are arranged in the same as a discharging cylinder in arrangement mode, the equal tablet cylinders are used for supporting the tablet, and after the number of the tablet on the equal conveying unit is detected by a clamping jaw column, namely, the fifth tablet falls to the fifth tablet cylinder is retracted, and the tablet falls back to the piston rod 5 is carried out, and the tablet is folded, and the tablet falls freely, and the tablet is conveyed to the piston rod is folded and the tablet is conveyed to the 5.
After all the material sheets in the full cartridge clip are conveyed, the empty cartridge clip is pushed out to a preset position through the movable cylinder and the cartridge clip ejecting unit. After the product reflow soldering of a material card model is completed, the aluminum plate in the aluminum plate bin falls onto the synchronous conveying belt and finally falls onto the reflow soldering runner platform, so that the distinction of different types of materials is realized, and the mixing is prevented.
Drawings
Figure 1 is a schematic perspective view of the present invention in use,
figure 2 is a schematic view of the hidden solder furnace rear perspective structure of the invention,
figure 3 is a perspective view of the connection state of the cartridge feeding and discharging units,
FIG. 4 is a perspective view showing the connection state of the cartridge feeding unit and the cartridge discharging unit,
figure 5 is a schematic view of the structure of the overhead unit,
figure 6 is a schematic perspective view of the use state of the pinch grip unit,
figure 7 is a schematic perspective view of the pinch grip unit,
figure 8 is a schematic diagram of a perspective view of a pinch grip unit,
figure 9 is a schematic perspective view of a jaw securing plate,
figure 10 is a schematic diagram showing a three-dimensional structure of the clamping jaw fixing plate,
figure 11 is a schematic view of the structure of the connecting state of the clamping jaw connecting arm,
figure 12 is a schematic structural view of the connection state of the clamping jaw connecting arm and the clamping jaw column,
figure 13 is a schematic perspective view of the use state of the automatic aluminum plate discharging device,
fig. 14 is a schematic perspective view of a connection state of an aluminum plate and a discharging cylinder;
100 is a cartridge-type clip and,
200 is a cartridge feeding clip unit, 210 is a cartridge feeding rodless cylinder, 220 is a cartridge clip push plate, 230 is a cartridge feeding side block, 240 is a cartridge feeding guide rail, 250 is a cartridge feeding station plate, 260 is a terminal limiting plate,
300 is a cartridge clip unit, 310 is a cartridge station plate, 320 is a cartridge cylinder, 330 is a cartridge push plate, 340 is a cartridge guide rail,
400 is an upper jacking unit, 410 is an upper jacking rodless cylinder, 420 is a supporting seat, 430 is a jacking column, 440 is a jacking plate,
510 is a moving cylinder, 520 is a moving push plate, 530 is a fine tuning cylinder,
600 is a gripper unit, 610 is a gripper rodless cylinder, 620 is a gripper lifting cylinder, 630 is a take-out section, 631 is a take-out rack, 632 is a take-out lever, 633 is a jaw securing plate, 633A balloon slot, 633b,634 are jaw connecting arms, 635 is a jaw air vent, 636 is a jaw post,
700, 710, conveyor rollers, 720, synchronous conveyor belts,
800 is an aluminum plate automatic discharging device, 810 is a limit baffle, 820 is a limit cylinder, 830 is a discharging cylinder,
900 is an aluminum plate and 910 is a snap-in groove.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 to 4, an automatic reflow soldering feeder further includes a clip feeding unit 200, by which the clip 100 loaded with the copper frame is pushed into the top of the topping unit 400;
the cartridge feeding unit 200 includes:
the feeding rodless cylinder 210 is horizontally and fixedly arranged on the workbench and positioned at the side part of the ejector plate 440;
the cartridge clip pushing plate 220 is fixedly arranged on the sliding block of the feeding rodless cylinder 210, and pushes the cartridge clip 100 to slide towards the material ejecting plate 440; and
the bullet feeding side block 230 is provided with a pair of bullet feeding side blocks which are symmetrically and fixedly arranged at two sides of the cartridge clip pushing plate 220; a sliding position matched with the clip pushing plate 220 is reserved between the pair of bullet feeding side baffles 230.
Further preferably, a pair of feed guides 240 for supporting the slide of the clip are provided on the table between the pair of feed ledges 230.
A pair of feed guides 240 are parallel to the feed rodless cylinder 210.
A bullet feeding station plate 250 which is matched with the tail end of the bullet feeding guide rail is arranged above the material ejection opening of the workbench, and a plate outlet which is matched with the material ejection plate 440 is arranged on the bullet feeding station plate 250;
the rear side of the feeding station plate 250 is provided with a terminal limiting plate 260 fixedly connected with the workbench.
The side of the cartridge feeding unit 200 is provided with a cartridge discharging unit 300; the loaded cartridge clip in the cartridge clip feeding unit 200 is pushed into the cartridge clip ejecting unit 300 by the moving cylinder 510;
the cartridge ejecting unit 300 includes:
the ejection station plate 310 is fixedly arranged at the side part of the ejection station plate 250;
the ejection cylinder 320 is horizontally and fixedly arranged at the rear side of the ejection station plate 310;
the ejection pushing plate 330 is fixedly arranged at the piston rod end of the ejection cylinder 320, and pushes the clip on the ejection station plate 310 into a pair of ejection guide rails 340 on the front side of the ejection station plate 310.
The moving cylinder 510 is a moving rodless cylinder, and a sliding block of the moving rodless cylinder is provided with a moving push plate 520 which is fixedly connected with the sliding block; the movable push plate 520 is provided with a receiving opening adapted to the cartridge clip.
The movable push plate 520 has a T-shaped configuration.
One end of the movable push plate 520 is provided with a fine adjustment cylinder 530 adapted to the clip on the ejector plate 440, and the accuracy of the butt joint of the clip and the clip grabbing unit 600 is improved by pushing the fine adjustment cylinder 530.
The cartridge feeding unit 200 and the cartridge discharging unit 300 work flows are as follows:
the clip filled with the copper frame is placed on the feeding guide rail 240 of the feeding clip unit 200, the feeding rodless cylinder 210 is started, the clip is moved towards the direction of the ejector plate 440 through the clip push plate 220, the feeding side stops 230 at the two sides are used for guiding, and after the clip is pushed onto the ejector plate 440, the copper frame is transported; after the copper frame in the clip is transferred, the movable push plate 520 moves towards the clip ejecting unit 300, the clip is pushed into the clip ejecting unit 300, and after the clip is pushed in, the clip is pushed forward through the clip ejecting cylinder 320, so that the entering position of the subsequent push clip is reserved.
An automatic reflow soldering feeder further comprises an upper jacking unit 400 and a clamping unit 600;
referring to fig. 5, the overhead unit 400 includes:
the upper-top rodless cylinder 410 is vertically and fixedly arranged in the workbench;
the supporting seat 420 is fixedly arranged on the sliding block of the upper-top rodless cylinder 410;
the top column 430 is vertically and fixedly arranged on the supporting seat 420 and extends towards the top of the workbench; and
the ejector plate 440 is plate-shaped and fixedly arranged at the top of the ejector column 430; the top of the workbench is provided with a jacking port matched with the jacking plate 440.
The liftout plate 440 is further optimized, the top of liftout plate 440 is equipped with the detection groove, be equipped with material sensor in the detection groove, detect through material sensor and have or not copper frame on the liftout plate 440, when can't detect copper frame, go up top rodless cylinder 410 and will stop upwards jacking, return to normal position, wait for next cartridge clip to get into the top of liftout plate 440.
Referring to fig. 6, the upper jacking unit 400 jacks up the copper frame in the magazine to a set position; the gripping unit 600 transfers the copper frame reaching the set position onto the transfer unit 700; the pinch grip unit 600 includes:
a grip rodless cylinder 610 horizontally fixedly provided at the top of the upper head unit 400; the connection between the material taking area and the material discharging area is realized;
the clamping and grabbing lifting cylinder 620 is vertically and fixedly arranged on the sliding block of the clamping and grabbing rodless cylinder 610; and
the material taking part 630 is fixedly arranged at the piston rod end of the clamping and grabbing lifting cylinder 620, and the copper frame is picked up from the set position and then is rotated to the upper part of the conveying unit 700 through the clamping and grabbing rodless cylinder 610.
Referring to fig. 7 to 12, the material taking part 630 includes:
the material taking bracket 631 is fixedly arranged at the piston rod end of the clamping lifting cylinder 620;
a material taking rod 632 which is adjustably and horizontally fixed on the material taking bracket 631;
the clamping jaw fixing plates 633 are provided with a pair of symmetrically adjustable fixing sleeves and are arranged on the material taking rod 632; the clamping jaw fixing plate 633 is provided with a plurality of clamping jaw grooves, clamping jaw air holes 635 are arranged above the clamping jaw grooves, and the clamping jaw air holes 635 are connected with an air source through air pipes; and
the clamping jaw connecting arms 634 are provided with a plurality of clamping jaw connecting arms which are respectively hinged in the corresponding clamping jaw grooves; the top of the clamping jaw connecting arm 634 is provided with a power part extending to a clamping jaw air hole 635, the bottom of the clamping jaw connecting arm 634 is provided with a clamping jaw column 636 which is detachably and fixedly connected, a plurality of clamping jaw columns 636 are respectively matched with a copper frame and are respectively inclined towards the outer side, and the clamping jaw column 636 is inclined towards the outer side by arranging an inclined plane at the bottom of the clamping jaw connecting arm 634.
When the single copper frame is taken out of the cartridge, the jaw air holes 635 start to blow air, and the jaw connecting arms 634 are turned outwards; the clamping claw lifting air cylinder 620 pushes the clamping claw columns 636 to move downwards, so that the corresponding clamping claw columns 636 extend into corresponding holes of the copper frame; after the jaw post 636 reaches the set position, the air blowing is stopped, suction is started, and the copper frame is clamped by turning the jaw connecting arm 634 inward.
In order to prevent adhesion between the copper frames, a plurality of air blowing holes connected with an air source are arranged at the bottom of the clamping jaw fixing plate 633, and air is blown to the surface of the copper frames in a clearance way through the air blowing holes, so that the copper frames vibrate, and adhesion is prevented.
After the material is taken, the lifting cylinder 620 is used for lifting the material, the lifting cylinder 610 is used for conveying the material to the upper side of the synchronous conveyor belt 720, then the piston rod of the lifting cylinder 620 is used for extending downwards, and after the lifting cylinder 620 reaches a set position, the clamping jaw air holes 635 are used for blowing air, so that the copper frame falls onto the synchronous conveyor belt 720 through dead weight.
The clamping jaw fixing plate 633 is further optimized, an air bag groove 633A connected with the clamping jaw air hole 635 is arranged in the clamping jaw groove, an air bag is arranged in the air bag groove 633A, and the air bag is connected with an air pipe; a spring hole 633B is provided in the jaw groove below the hinge portion of the jaw connecting arm 634, and a spring is installed in the spring hole 633B.
The air bag is inflated and expanded to drive the clamping jaw connecting arms 634 to turn outwards, so that the clamping jaw columns 636 move outwards, and the sheet-shaped products are loosened, and at the moment, the springs are compressed; after air intake is stopped, the clamping jaw connecting arm is reset due to the action of elastic potential energy of the spring, and the clamping jaw column is reset.
The airbag is on, the meaning of spring is below: if the air bag is arranged below and the spring is arranged above, the air bag is used for feeding air to drive the clamping jaw connecting arm to turn inwards so as to drive the clamping jaw column to move to finish, so that the clamping of the product can be realized only by feeding air to drive the clamping jaw connecting arm to move every time, the clamping of the product is realized, and the efficiency is reduced; in addition, the clamping force caused by the mode is not well controlled, and the sheet-shaped product is likely to be bent and deformed, so that the quality is affected.
The jaw post 636 further optimizes:
the cross-sectional diameter of the jaw post 636 is arranged in a decreasing configuration from top to bottom.
The jaw post 636 is provided with external threads, and the copper frame is clamped into the lines of the external threads, so that the conveying stability is improved.
The clamping jaw columns 636 on the clamping jaw connecting arms 634 are adopted to take materials, so that the problem that the porous suction at the edge of the copper frame is prone to failure can be solved, after the air is broken, the clamping jaw columns 636 on the clamping jaw connecting arms 634 can stably clamp the copper frame and are not prone to falling, the continuous work after re-air supply is ensured, and the original point is not required to be returned again for re-testing.
The clamping jaw column 636 is detachably and fixedly connected with the bottom of the clamping jaw connecting arm 634 through threads, so that the extending length of the clamping jaw column 636 is convenient to adjust, and the material taking efficiency is improved.
The jaw securing plate 633 further defines:
the jaw air holes 635 extend downward from the top of the jaw fixing plate 633 and turn to the sides of the power section.
The clamping jaw fixing plate 633 is provided with at least two clamping jaw grooves adapted to the clamping jaw connecting arms 634, and is distributed at two ends of the clamping jaw fixing plate 633.
The take-off bracket 631 is further optimized:
an adjusting chute is arranged at the top of the material taking bracket 631; a plurality of threaded holes are formed in the adjusting chute;
the connecting plate of the piston rod end of the clamping rodless cylinder 610 is adjustably and fixedly arranged in the adjusting chute through a connecting piece, and the adjusting efficiency and the adaptability of the clamping jaw column 636 and the copper frame are improved through the horizontal adjustment of the material taking bracket 631.
Further preferably, a stripper plate fixedly connected with the material taking bracket 631 is arranged between the pair of clamping jaw fixing plates 633, a plurality of stripper air holes are formed in the bottom surface of the stripper plate, which faces the copper frame, and air is blown through the plurality of stripper air holes simultaneously, so that the copper frame and the clamping jaw posts 636 are prevented from being adhered.
Further optimize a pair of clamping jaw fixed plate 633, connect through supporting baffle between a pair of clamping jaw fixed plate 633 lateral part, supporting baffle's bottom and take off flitch fixed connection, the restriction takes off flitch dislocation, improvement stability.
Further expanding, the material taking part 630 includes:
the sucker frame is detachably and fixedly arranged at the piston rod end of the clamping lifting cylinder 620; and
the sucking disc is provided with a plurality of sucking discs, can be detachably and fixedly arranged at the bottom of the sucking disc frame and is matched with the copper frame.
This case preferably adopts clamping jaw cylindricality formula to get material, mainly because the product is the lamellar, and has more through-holes on the product, and the sucking disc is difficult to select the impetus, can take place the gas leakage problem, can't guarantee to absorb the reliability of product. In addition, the position of the suction nozzle is difficult to adjust for products with different specifications; the clamping jaw column clamp has the advantage that the clamping and dropping of the product can be realized through the elastic change of the clamping jaw column (the swinging of the clamping jaw column) in the face of products with smaller specification differences. Meanwhile, if the sizes of the products are greatly different, when the elasticity change of the clamping jaw columns can not meet the clamping requirement, the clamping jaw fixing plates of different specifications or the spacing between a pair of clamping jaw fixing plates can be quickly replaced to adapt to the sheet products with larger specification difference.
Referring to fig. 13-14, after a stack of copper frames is placed into the solder pot, aluminum plate 900 is placed into the reflow soldering station for spaced marking to avoid mixing. An aluminum plate automatic discharging device 800 is arranged at the end part of the conveying unit 700; the aluminum plate automatic discharging device 800 includes:
the limit baffles 810 are provided with a plurality of (at least two when diagonally arranged) vertically and fixedly arranged on the conveying unit 700 to form a placement position matched with the aluminum plate 900;
the limiting cylinders 820 are at least provided with a pair, and are fixedly arranged on the outer sides of the limiting baffles 810, and the piston rod ends of the limiting cylinders extend into the placement positions through the limiting baffles 810; a clamping groove 910 which is matched with the piston rod of the limiting cylinder 820 is formed in the bottom of the aluminum plate 900; and
the discharging cylinders 830 are provided with a plurality of discharging cylinders and are horizontally and fixedly arranged on the conveying unit 700; the piston rod end of the discharging cylinder 830 horizontally extends into the discharging position and is located below the limiting cylinder 820.
Further defined, the limiting baffles 810 are L-shaped in cross section and are provided with at least one pair, and are diagonally arranged. Four limit baffles 810 are provided in this case.
The conveying unit 700 includes:
the conveying rollers 710 are provided with a pair, and are rotatably arranged on the workbench through a pair of supporting plates, wherein one conveying roller 710 is driven to rotate through a conveying motor; and
a pulley, at least a pair of pulleys are fixedly arranged on the conveying roller 710; the same-side pulleys on the pair of the conveying rollers 710 are synchronously rotated by the synchronous conveying belt 720.
Four discharging cylinders 830 are respectively and fixedly arranged on the supporting plate, and the piston rod ends of the four discharging cylinders are positioned above the synchronous conveying belt 720; the aluminum plate 900 is placed on the discharging cylinder 830, when the aluminum plate 900 falls onto the synchronous conveying belt 720, the piston rod of the limiting cylinder 820 stretches into the placing position, and at the moment, the piston rod just stretches into the clamping groove 910 in the bottom surface of the second aluminum plate 900 with the bottom upwards, so that limiting support of the aluminum plate 900 above is realized. After the piston rods of the discharging cylinders 830 are respectively retracted, the bottommost aluminum plate 900 falls into a pair of synchronous conveyor belts 720 and is conveyed into the welding furnace.
For the purposes of this disclosure, the following points are also described:
(1) The drawings of the embodiments disclosed in the present application relate only to the structures related to the embodiments disclosed in the present application, and other structures can refer to common designs;
(2) The embodiments disclosed herein and features of the embodiments may be combined with each other to arrive at new embodiments without conflict;
the above is only a specific embodiment disclosed in the present application, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An automatic reflow soldering feeder is characterized by comprising an upper jacking unit and a clamping unit; the upper jacking unit jacks the copper frame in the material box upwards to a set position; the clamping and grabbing unit transfers the copper frame reaching the set position to the conveying unit; the pinch grip unit includes:
the clamping rodless cylinder is horizontally and fixedly arranged at the top of the jacking unit;
the clamping and grabbing lifting cylinder is vertically and fixedly arranged on a sliding block of the clamping and grabbing rodless cylinder; and
and the material taking part is fixedly arranged at the piston rod end of the clamping lifting cylinder, picks up the copper frame from the set position and then rotates to the upper part of the conveying unit through the clamping rodless cylinder.
2. The automatic reflow soldering feeder of claim 1, wherein the pick-out section includes:
the material taking bracket is fixedly arranged at the piston rod end of the clamping lifting cylinder;
the material taking rod is horizontally and fixedly arranged on the material taking bracket in an adjustable mode;
the clamping jaw fixing plates are provided with a pair of symmetrically adjustable fixing sleeves on the material taking rod; the clamping jaw fixing plate is provided with a plurality of clamping jaw grooves, and clamping jaw air holes are formed in the upper parts of the clamping jaw grooves; and
the clamping jaw connecting arms are provided with a plurality of clamping jaw connecting arms which are respectively and hinged in the corresponding clamping jaw grooves; the top of clamping jaw linking arm is equipped with the power portion that extends to clamping jaw gas pocket department, and the bottom is equipped with can dismantle fixed connection's clamping jaw post, a plurality of clamping jaw post respectively with copper frame looks adaptation to incline to outside direction respectively.
3. An automatic reflow soldering feeder in accordance with claim 2, wherein the jaw posts have cross-sectional diameters which decrease from top to bottom.
4. A reflow soldering automatic feeder according to claim 2 or claim 3, wherein the jaw posts are provided with external screw threads.
5. The automatic reflow soldering feeder of claim 2, wherein the jaw post is detachably and fixedly connected to the bottom of the jaw connecting arm by threads.
6. An automatic reflow soldering feeder in accordance with claim 2, wherein the jaw air holes extend downwardly from the top of the jaw securing plate and turn to the sides of the power section.
7. An automatic reflow soldering feeder in accordance with claim 2, wherein the jaw securing plate has at least two jaw slots adapted to the jaw connecting arms.
8. The automatic reflow soldering feeder of claim 2, wherein the top of the take-out bracket is provided with an adjusting chute; a plurality of threaded holes are formed in the adjusting chute;
the connecting plate of the piston rod end of the clamping rodless cylinder is adjustably and fixedly arranged in the adjusting chute through a connecting piece.
9. The automatic reflow soldering feeder of claim 1, wherein the pick-out section includes:
the sucker frame is detachably and fixedly arranged at the piston rod end of the clamping lifting cylinder; and
the sucking disc is provided with a plurality of sucking discs, can be detachably and fixedly arranged at the bottom of the sucking disc frame and is matched with the copper frame.
10. The automatic reflow soldering feeder of claim 2, wherein the topping unit includes:
the upper-jacking rodless cylinder is vertically and fixedly arranged in the workbench;
the support seat is fixedly arranged on the sliding block of the upper-top rodless cylinder;
the jacking column is vertically and fixedly arranged on the supporting seat and extends towards the top of the workbench; and
the jacking plate is plate-shaped and is fixedly arranged at the top of the jacking column; the top of workstation is equipped with the liftout mouth with liftout board adaptation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310754518.3A CN116759354A (en) | 2023-06-26 | 2023-06-26 | Automatic feeding machine for reflow soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310754518.3A CN116759354A (en) | 2023-06-26 | 2023-06-26 | Automatic feeding machine for reflow soldering |
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CN116759354A true CN116759354A (en) | 2023-09-15 |
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CN202310754518.3A Pending CN116759354A (en) | 2023-06-26 | 2023-06-26 | Automatic feeding machine for reflow soldering |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118123168A (en) * | 2024-05-10 | 2024-06-04 | 四川英迈科技有限公司 | High-efficient vacuum reflow soldering machine |
-
2023
- 2023-06-26 CN CN202310754518.3A patent/CN116759354A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118123168A (en) * | 2024-05-10 | 2024-06-04 | 四川英迈科技有限公司 | High-efficient vacuum reflow soldering machine |
CN118123168B (en) * | 2024-05-10 | 2024-07-23 | 四川英迈科技有限公司 | High-efficient vacuum reflow soldering machine |
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