CN116714838A - Full-automatic semiconductor device burns record encapsulation all-in-one - Google Patents
Full-automatic semiconductor device burns record encapsulation all-in-one Download PDFInfo
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- CN116714838A CN116714838A CN202311010659.0A CN202311010659A CN116714838A CN 116714838 A CN116714838 A CN 116714838A CN 202311010659 A CN202311010659 A CN 202311010659A CN 116714838 A CN116714838 A CN 116714838A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/10—Feeding, e.g. conveying, single articles
- B65B35/16—Feeding, e.g. conveying, single articles by grippers
- B65B35/18—Feeding, e.g. conveying, single articles by grippers by suction-operated grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B7/00—Closing containers or receptacles after filling
- B65B7/16—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons
- B65B7/162—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons by feeding web material to securing means
- B65B7/164—Securing by heat-sealing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor device production, in particular to a full-automatic semiconductor device burning and packaging integrated machine, which comprises: the feeding device comprises a feeding platform and a burning inclined plate, wherein the feeding platform is provided with a feeding mechanism, a conveying plane is arranged above the burning inclined plate, the conveying plane is parallel to the surface of the feeding platform, the included angle between the burning inclined plate and the surface of the feeding platform is an acute angle, and the included angle between the conveying plane and the burning inclined plate is complementary with the included angle between the burning inclined plate and the surface of the feeding platform; the surface of the burning sloping plate is provided with a guide through groove and a blanking through groove, the tail end of the guide through groove is communicated with the starting end of the blanking through groove, a current limiting mechanism and a burning mechanism are sequentially arranged right above the guide through groove, the tail end of the blanking through groove is provided with a limiting mechanism, and a moving mechanism, a marking mechanism and a packaging mechanism are sequentially arranged right above a conveying plane; the moving mechanism comprises a rotating component and an adsorption component; the scheme provided by the utility model realizes the full-automatic burning, marking and packaging of the semiconductor device, and improves the production speed.
Description
Technical Field
The utility model relates to the field of semiconductor burning, in particular to a full-automatic semiconductor device burning and packaging integrated machine.
Background
The semiconductor device (semiconductor device) is an electronic device with conductivity between good conductor and insulator, which uses the special electric property of semiconductor material to realize specific function, and can be used to generate, control, receive, transform, amplify signal and perform energy conversion; the semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as equipment such as rectifiers, oscillators, light emitters, amplifiers, photometers and the like, and is sometimes called a discrete device for distinguishing the semiconductor device from an integrated circuit; semiconductor devices generally utilize different semiconductor materials and adopt different processes and geometric structures, so that various crystal diodes with various kinds and different functional purposes have been developed, and the frequency coverage range of the crystal diodes can be from low frequency, high frequency, microwave, millimeter wave, infrared to light wave; transistors can be divided into bipolar transistors and field effect transistors, and besides being used as general transistors for amplifying, oscillating and switching, there are special purpose transistors such as phototransistors, magneto-dependent transistors, field effect sensors, etc.
With the development of technology, many intelligent products are emerging on the market, and most of the intelligent products are provided with special semiconductor devices; the chip is a semiconductor device commonly used in the electronic industry at present, generally, manufacturers will buy various recordable IC chips from semiconductor manufacturers, and the IC chip (Integrated Circuit Chip) is a chip formed by placing an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate; an integrated circuit (integrated circuit) is a microelectronic device or component, and is formed by interconnecting the components, such as transistors, diodes, resistors, capacitors, inductors, and the like, and wiring required in a circuit by a process, on a small or several small semiconductor wafers or dielectric substrates, and then packaging the semiconductor wafers or dielectric substrates in a package to form a microstructure having the required circuit function; wherein all the components are structurally integrated, so that the electronic components are greatly advanced towards microminiaturization, low power consumption and high reliability; it is indicated in the circuit by the letter "IC".
The IC chip is produced by a plurality of manufacturing processes, the burning is one of the processes in the chip manufacture, the burning refers to the process of leading a preset program into the IC chip, in general, the data area of the IC chip purchased by a manufacturer is blank, in order to ensure that the IC chip can operate according to the functions designed by the manufacturer, a programmer writes the program in advance, and then writes the control program and data by using an IC chip writer, which is an essential process more important than the IC chip test, and is generally executed by a final electronic product manufacturer; the burning of the IC chip needs to use special burning equipment, most of the existing burning equipment on the market is semi-automatic burning equipment, wherein the semi-automatic burning equipment is used for feeding and discharging the chip by means of manual operation, a large amount of labor is consumed, the matching precision between the IC chip and a burning seat is low, the pins of the IC chip are bent to cause poor burning of the IC chip, the production efficiency and the qualification rate are low, and the like, and the manual operation can cause excessive fatigue of operators, in the burning process, misoperation such as mixing, misplacement, mixing of the un-burnt IC chip and the like easily occur, and the quality of the burned IC chip is difficult to ensure; meanwhile, after the chip is burnt, the information of the chip is required to be marked and the chip is subjected to film sealing and packaging, but the semi-automatic burning equipment on the market is single in function, the burnt chip is required to be transferred to the chip marking equipment for marking, and then transferred to the film sealing and packaging equipment for film sealing and packaging, so that the consumption of manpower and time cost is increased, and the risk of chip damage is possibly increased in the transferring process.
For example, the Chinese patent with the publication number of CN208969646U and the patent name of chip writer is specifically composed of a feeding group, a writing surface and a background group, wherein the writing surface is fixedly arranged below the feeding group, the background group is fixedly arranged behind the writing surface, the feeding group is connected with the background group through the writing surface, a material preparation area is arranged on the feeding group which is arranged in parallel, a material inlet is uniformly arranged above the material preparation area, a material pipe filled with chips is put in from the material inlet, rocker arms are fixedly arranged on two sides of the material inlet and used for compacting the material pipe, a writing board is arranged on the writing surface, a four-station writer is fixedly arranged on the writing board, the four-station writer is connected with the writing surface through the writing board, a material dividing shuttle is arranged in the four-station writer, the chips in the material pipe are divided by the material dividing shuttle after coming out from the material pipe, and in the arbitrary station of feeding into the burning ware respectively, the backstage group outside is equipped with the curb plate, be equipped with the motor in the curb plate, the motor is connected with the four-station burning ware through the backstage group, the motor is arranged in driving the burning seat in the burning ware and removes, the device has reached the effect of automatic burning through four-station burning ware collocation pan feeding mouth and pan feeding mouth, but the pan feeding mouth of the device can only be through artifical material loading each time, a pan feeding mouth can only hold a material pipe, need through artifical frequent material loading, and the function of the device is comparatively single, do not have functions such as test, the marking of chip and seal membrane in the device, need transfer to other equipment departments of corresponding flow and handle, manpower and time cost have been wasted, therefore the scope of application of this system is relatively narrow, unsuitable for popularization and use.
Therefore, how to design a fully automatic semiconductor device burning and packaging integrated machine is a technical problem that needs to be solved by the current technicians.
Disclosure of Invention
In order to overcome the problems in the related art, the utility model provides the full-automatic semiconductor device burning and packaging integrated machine, which realizes the full-automatic burning and packaging of the semiconductor device and improves the production efficiency.
In order to achieve the above purpose, the present utility model mainly adopts the following technical scheme, including: the device comprises a feeding platform and a burning inclined plate, wherein the feeding platform is provided with a feeding mechanism, the feeding mechanism is used for moving a carrier provided with a semiconductor device to be burned, a transport plane is further arranged above the burning inclined plate, the transport plane is parallel to the surface of the feeding platform, an included angle between the burning inclined plate and the surface of the feeding platform is an acute angle, and the included angle between the transport plane and the burning inclined plate is complementary with the included angle between the burning inclined plate and the surface of the feeding platform;
the surface of the burning sloping plate is provided with a guide through groove and a blanking through groove, the tail end of the guide through groove is communicated with the starting end of the blanking through groove, a current limiting mechanism and a burning mechanism are sequentially arranged right above the guide through groove, the tail end of the blanking through groove is provided with a limiting mechanism, and a moving mechanism, a marking mechanism and a packaging mechanism are sequentially arranged right above the conveying plane;
the moving mechanism comprises a rotating assembly and an adsorption assembly, the rotating assembly controls the rotation angle of the adsorption assembly, the adsorption assembly is used for sucking the burnt semiconductor device, the transport plane is used for transporting a carrier for placing the burnt semiconductor device, the current limiting mechanism is used for limiting the semiconductor device to be burnt in the guide through groove, the limiting mechanism is used for limiting the burnt semiconductor device in the blanking through groove, the marking mechanism is used for marking the semiconductor device which is moved to the carrier, and the packaging mechanism is used for packaging the marked semiconductor device.
Preferably, the feeding mechanism comprises a turnover assembly, the turnover assembly comprises a carrier clamping plate and a rotary straight plate, the rotary straight plate is hinged with the feeding platform, the rotary plane of the rotary straight plate is perpendicular to the feeding platform, the carrier clamping plate is fixed on the rotary straight plate, an upper clamping plate of the carrier clamping plate is in sliding connection with the rotary straight plate, the moving direction of the upper clamping plate is perpendicular to the lower clamping plate, and the tail end of the carrier clamping plate is aligned with the starting end of the guide through groove.
Preferably, the feeding mechanism further comprises a storage component, the storage component comprises a storage box body and a pushing block, the pushing block is located between the storage box body and the overturning component, the storage box body is located above the pushing block, the pushing block is slidably connected with the feeding platform, the moving direction of the pushing block is perpendicular to the rotating plane of the rotating straight plate, a clamping groove is formed in the pushing block, and the clamping groove is aligned with the discharging plane of the storage box body.
Preferably, the recording mechanism comprises a recording clamping jaw and a positioning cylinder, wherein the recording clamping jaw is adjacent to the positioning cylinder, the recording clamping jaw is positioned above the positioning cylinder, a telescopic rod of the positioning cylinder is positioned in the guiding through groove, the recording clamping jaw is positioned at two sides of the guiding through groove, the recording clamping jaw is in sliding connection with the recording sloping plate, and the moving directions of the recording clamping jaws at two sides are opposite.
Preferably, the flow limiting mechanism comprises a flow control rod, a separation rod and a driving cylinder, wherein the flow control rod is positioned below the separation rod, the flow control rod and the separation rod are respectively fixed on 2 driving ends of the driving cylinder, and the tail ends of the flow control rod and the separation rod are both positioned in the guide through groove.
Preferably, the limiting mechanism comprises a material blocking rod, a material pressing rod and a control cylinder, wherein the material blocking rod is positioned below the material pressing rod, the material blocking rod and the material pressing rod are respectively fixed on 2 driving ends of the control cylinder, and the tail ends of the material blocking rod and the material pressing rod are both positioned in the guide through groove.
Preferably, the rotating assembly comprises a rotating motor, a rotating guide rail and a sliding block, wherein the rotating guide rail is fixed at the rotating end of the rotating motor, and the sliding block is in sliding connection with the rotating guide rail.
Preferably, the adsorption component comprises a chip suction nozzle and a negative pressure suction pipe, wherein the chip suction nozzle is fixed at one end of the negative pressure suction pipe, the chip suction nozzle is communicated with the negative pressure suction pipe, the other end of the negative pressure suction pipe is connected with a vacuum pump, and the negative pressure suction pipe is fixedly connected with the sliding block.
Preferably, the turnover assembly further comprises vibration knocking rods, the vibration knocking rods are respectively located at two ends of the carrier clamping plate and are in sliding connection with the rotating straight plate, and the vibration knocking rods are used for knocking the carrier.
Preferably, the packaging mechanism comprises a heating plate and a lifting assembly, wherein the heating plate is arranged on two sides of the conveying plane, the plate surface of the heating plate is attached to the side edge of the conveying plane, the heating plate is fixed on the lifting assembly, and the moving direction of the lifting assembly is perpendicular to the conveying plane.
The technical scheme provided by the utility model can comprise the following beneficial effects:
according to the technical scheme, a feeding platform and a burning inclined plate are respectively arranged on an integrated machine, a feeding mechanism is arranged on the feeding platform, a carrier filled with a semiconductor device to be burned is moved by the feeding mechanism, a conveying plane is arranged above the burning inclined plate, the conveying plane is parallel to the surface of the feeding platform, the included angle between the burning inclined plate and the surface of the feeding platform is an acute angle, the included angle between the conveying plane and the burning inclined plate is complementary with the included angle between the burning inclined plate and the surface of the feeding platform, a guide through groove and a blanking through groove are arranged on the surface of the burning inclined plate, the tail end of the guide through groove is communicated with the initial end of the blanking through groove, a current limiting mechanism and a burning mechanism are sequentially arranged right above the guide through groove, a moving mechanism, a marking mechanism and a packaging mechanism are sequentially arranged right above the conveying plane; the moving mechanism consists of a rotating assembly and an adsorption assembly, the rotating assembly is used for controlling the rotation angle of the adsorption assembly, the adsorption assembly is used for sucking the semiconductor device after the burning, then a carrier for placing the burned semiconductor device is transported by a transport plane, the semiconductor device to be burned in the through groove is limited by a current limiting mechanism, meanwhile, the semiconductor device burned in the through groove is limited by a limiting mechanism, the semiconductor device moved to the carrier is marked by a marking mechanism, and finally the marked semiconductor device is packaged by a packaging mechanism; for example, when the chip needs to be burned, when the semiconductor device needs to be burned, the carrier provided with the semiconductor device is moved by the feeding mechanism to be aligned with the guide through groove, the semiconductor device slides from the carrier into the guide through groove by utilizing gravity and slides to the current limiting mechanism in the guide through groove, the current limiting mechanism limits the number of the semiconductor devices sliding down to the burning mechanism each time, after the semiconductor device enters the burning mechanism, the burning mechanism fixes the position of the semiconductor device and burns the semiconductor device, after the burning mechanism releases the position limit of the semiconductor device, the semiconductor device enters the blanking through groove and slides into the limiting mechanism by utilizing gravity in the blanking through groove, the limiting mechanism limits the number of the semiconductor devices moving each time, then the rotary component rotates the adsorption component from the surface of the transportation platform to the surface of the burning inclined plate, and then the adsorption component sucks and drives the semiconductor device to rotate to the transportation plane, the semiconductor device moves on the transportation platform, and finally the marking mechanism and the packaging mechanism completes marking and packaging of the semiconductor device in sequence, the marking mechanism and the packaging mechanism completes marking and packaging in sequence, the full-automatic marking operation and the semiconductor device are reduced, and the labor cost and the risk of the semiconductor device are reduced, and the labor cost is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.
Drawings
The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular descriptions of exemplary embodiments of the utility model as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the utility model.
Fig. 1 is a schematic structural diagram of a burn-in packaging integrated machine according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a flip assembly according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a flow restrictor mechanism according to an embodiment of the present utility model;
FIG. 4 is a schematic view of a limiting mechanism according to an embodiment of the present utility model;
FIG. 5 is a schematic view of a packaging mechanism according to an embodiment of the present utility model;
FIG. 6 is a schematic view of a moving mechanism according to an embodiment of the present utility model;
in the figure: 01. a feeding platform; 02. a feeding mechanism; 020. a flip assembly; 0200. a carrier clamp plate; 0201. rotating the straight plate; 0202. vibrating the knocking rod; 021. a storage assembly; 0210. a storage box; 02100. a discharging plane; 0211. a pushing block; 02110. a clamping groove; 03. burning a sloping plate; 04. a guide through groove; 05. discharging through grooves; 06. a flow restricting mechanism; 060. a flow control rod; 061. a spacer rod; 062. a driving cylinder; 07. a burning mechanism; 070. burning clamping jaws; 071. positioning a cylinder; 08. a limiting mechanism; 080. a material blocking rod; 081. a pressing rod; 082. a control cylinder; 09. a transport plane; 10. a moving mechanism; 100. a rotating assembly; 1000. a rotating motor; 1001. rotating the guide rail; 1002. a sliding block; 101. an adsorption assembly; 1010. a chip suction nozzle; 1011. a negative pressure suction pipe; 11. a marking mechanism; 12. a packaging mechanism; 120. heating the plate; 121. and a lifting assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present utility model. Preferred embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present utility model, it should be understood that the terms "thickness," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the utility model. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Aiming at the problems, the embodiment of the utility model provides a full-automatic semiconductor device burning and packaging integrated machine, which realizes full-automatic burning, marking and packaging of semiconductor devices and improves the production speed.
The following describes the technical scheme of the embodiment of the present utility model in detail with reference to the accompanying drawings.
Referring to fig. 1 to 6, the burn-in packaging integrated machine includes: the device comprises a feeding platform 01 and a burning inclined plate 03, wherein the feeding platform 01 is provided with a feeding mechanism 02, the feeding mechanism 02 is used for moving a carrier provided with a semiconductor device to be burned, a transport plane 09 is further arranged above the burning inclined plate 03, the transport plane 09 is parallel to the surface of the feeding platform 01, an included angle between the burning inclined plate 03 and the surface of the feeding platform 01 is an acute angle, and the included angle between the transport plane 09 and the burning inclined plate 03 is complementary with the included angle between the burning inclined plate 03 and the surface of the feeding platform 01;
the surface of the burning sloping plate 03 is provided with a guide through groove 04 and a blanking through groove 05, the tail end of the guide through groove 04 is communicated with the starting end of the blanking through groove 05, a current limiting mechanism 06 and a burning mechanism 07 are sequentially arranged right above the guide through groove 04, the tail end of the blanking through groove 05 is provided with a limiting mechanism 08, and a moving mechanism 10, a marking mechanism 11 and a packaging mechanism 12 are sequentially arranged right above the conveying plane 09;
the moving mechanism 10 includes a rotating assembly 100 and an adsorbing assembly 101, the rotating assembly 100 controls a rotation angle of the adsorbing assembly 101, the adsorbing assembly 101 is used for sucking the semiconductor device after the burning, the transporting plane 09 is used for transporting a carrier for placing the burned semiconductor device, the current limiting mechanism 06 is used for limiting the semiconductor device to be burned in the guiding through groove 04, the limiting mechanism 08 is used for limiting the burned semiconductor device in the blanking through groove 05, the marking mechanism 11 is used for marking the semiconductor device moved to the carrier, and the packaging mechanism 12 is used for packaging the marked semiconductor device.
Specifically, feed mechanism 02 is including upset subassembly 020, upset subassembly 020 is including carrier splint 0200 and rotation straight board 0201, rotate straight board 0201 with loading platform 01 articulates, just rotate straight board 0201's rotation plane perpendicular to loading platform 01, carrier splint 0200 is fixed rotate on the straight board 0201, carrier splint 0200's punch holder with rotate straight board 0201 sliding connection, just the direction of movement perpendicular to lower plate of punch holder, carrier splint 0200's end with the top of direction logical groove 04 aligns.
Specifically, the feeding mechanism 02 further comprises a storage component 021, the storage component 021 comprises a storage box 0210 and a pushing block 0211, the pushing block 0211 is located between the storage box 0210 and the overturning component 020, the storage box 0210 is located above the pushing block 0211, the pushing block 0211 is in sliding connection with the feeding platform 01, the moving direction of the pushing block 0211 is perpendicular to the rotating plane of the rotating straight plate 0201, a clamping groove 02110 is formed in the pushing block 0211, and the clamping groove 02110 is aligned with the discharging plane 02100 of the storage box 0210.
Specifically, the recording mechanism 07 includes a recording clamping jaw 070 and a positioning cylinder 071, the recording clamping jaw 070 is adjacent to the positioning cylinder 071, the recording clamping jaw 070 is located above the positioning cylinder 071, a telescopic rod of the positioning cylinder 071 is located in the guiding through groove 04, the recording clamping jaw 070 is located at two sides of the guiding through groove 04, the recording clamping jaw 070 is slidably connected with the recording sloping plate 03, and the moving directions of the recording clamping jaws 070 at two sides are opposite.
Specifically, the flow limiting mechanism 06 includes a flow control rod 060, an isolating rod 061 and a driving cylinder 062, the flow control rod 060 is located below the isolating rod 061, the flow control rod 060 and the isolating rod 061 are respectively fixed on 2 driving ends of the driving cylinder 062, and the tail ends of the flow control rod 060 and the isolating rod 061 are both located in the guiding through groove 04.
Specifically, the limiting mechanism 08 includes a blocking rod 080, a pressing rod 081 and a control cylinder 082, the blocking rod 080 is located below the pressing rod 081, the blocking rod 080 and the pressing rod 081 are respectively fixed on 2 driving ends of the control cylinder 082, and the blocking rod 080 and the tail end of the pressing rod 081 are both located in the guiding through groove 04.
Specifically, the rotating assembly 100 includes a rotating motor 1000, a rotating rail 1001 and a sliding block 1002, wherein the rotating rail 1001 is fixed at a rotating end of the rotating motor 1000, and the sliding block 1002 is slidably connected with the rotating rail 1001.
Specifically, the suction assembly 101 includes a chip suction nozzle 1010 and a negative pressure suction pipe 1011, the chip suction nozzle 1010 is fixed at one end of the negative pressure suction pipe 1011, the chip suction nozzle 1010 is communicated with the negative pressure suction pipe 1011, the other end of the negative pressure suction pipe 1011 is connected with a vacuum pump, and the negative pressure suction pipe 1011 is fixedly connected with the sliding block 1002.
Specifically, the turnover assembly 020 further comprises a vibration knocking rod 0202, the vibration knocking rod 0202 is respectively located at two ends of the carrier clamping plate 0200, the vibration knocking rod 0202 is in sliding connection with the rotary straight plate 0201, and the vibration knocking rod 0202 is used for knocking the carrier.
Specifically, the packaging mechanism 12 includes a heating plate 120 and a lifting assembly 121, the heating plate 120 is disposed on two sides of the transport plane 09, and the plate surface of the heating plate 120 is attached to the side edge of the transport plane 09, the heating plate 120 is fixed on the lifting assembly 121, and the moving direction of the lifting assembly 121 is perpendicular to the transport plane 09.
In the first embodiment, in order to realize full-automatic burning, marking and packaging of the semiconductor device, specifically, in this embodiment, a feeding platform and a burning inclined plate are respectively arranged on an integrated machine, a feeding mechanism is arranged on the feeding platform, a feeding pipe filled with the semiconductor device to be burned is moved by using the feeding mechanism, a transportation plane is arranged above the burning inclined plate, so that the transportation plane is parallel to the surface of the feeding platform, an included angle between the burning inclined plate and the surface of the feeding platform is an acute angle, the included angle between the transportation plane and the burning inclined plate is complementary with the included angle between the burning inclined plate and the surface of the feeding platform, a guide through groove and a blanking through groove are arranged on the surface of the burning inclined plate, the tail end of the guide through groove is communicated with the initial end of the blanking through groove, then a current limiting mechanism and a burning mechanism are sequentially arranged right above the guide through groove, and a moving mechanism, a marking mechanism and a packaging mechanism are sequentially arranged right above the transportation plane; the moving mechanism consists of a rotating assembly and an adsorption assembly, the rotating assembly is used for controlling the rotation angle of the adsorption assembly, the adsorption assembly is used for sucking the semiconductor device after the burning, then a carrier for placing the burned semiconductor device is transported by a transport plane, the semiconductor device to be burned in the through groove is limited by a current limiting mechanism, meanwhile, the semiconductor device burned in the through groove is limited by a limiting mechanism, the semiconductor device moved to the carrier is marked by a marking mechanism, and finally the marked semiconductor device is packaged by a packaging mechanism;
for example, when the chip needs to be burned, when the semiconductor device needs to be burned, the material pipe provided with the semiconductor device is moved by the feeding mechanism to be aligned with the guide through groove, the semiconductor device slides from the material pipe into the guide through groove by utilizing gravity and slides to the current limiting mechanism in the guide through groove, the current limiting mechanism limits that only one semiconductor device slides down to the burning mechanism at a time, the semiconductor devices are prevented from being clamped in the burning mechanism, the damage of the semiconductor device is caused, after the semiconductor device enters the burning mechanism, the burning mechanism fixes the position of the semiconductor device and burns the semiconductor device, after the burning is finished, the burning mechanism releases the position limit of the semiconductor device, when the semiconductor device enters the blanking through groove and slides into the limiting mechanism by utilizing gravity, the limiting mechanism limits that the moving mechanism can only move one semiconductor device at a time, the current limiting mechanism prevents a plurality of semiconductor devices from being plugged at a transfer port of the limiting mechanism, then the rotating assembly transfers the adsorption assembly from the face to the transportation platform to face the burning mechanism, and then the adsorption assembly absorbs and drives the semiconductor device to the transportation platform, and the semiconductor device is driven to the transfer platform, and the semiconductor device is packaged in turn, the cost of the semiconductor device is reduced, and the manual damage is reduced, and the packaging and the manual damage of the semiconductor device is reduced, and the packaging time and the manual damage of the packaging and the semiconductor device is reduced, and the packaging time and the device can be reduced.
In the second embodiment, in order to realize automatic feeding of the feeding mechanism, specifically, the feeding mechanism of the present embodiment is composed of a turnover assembly and a storage assembly, wherein the turnover assembly is composed of a carrier clamping plate, a rotating straight plate and a vibration striking rod, the rotating straight plate is hinged with the feeding platform, the rotating plane of the rotating straight plate is perpendicular to the feeding platform, then the carrier clamping plate is fixed on the rotating straight plate, an upper clamping plate of the carrier clamping plate is in sliding connection with the rotating straight plate, the moving direction of the upper clamping plate is perpendicular to the lower clamping plate, meanwhile, the tail end of the carrier clamping plate is aligned with the initial end of a guide through groove, the vibration striking rod is respectively arranged at the two ends of the carrier clamping plate, and the vibration striking rod is in sliding connection with the rotating straight plate; the material storage assembly consists of a material storage box body and a pushing block, the pushing block is positioned between the material storage box body and the overturning assembly, the material storage box body is positioned above the pushing block, the inner space of the material storage box body is matched with the width of the material pipe, then the pushing block is in sliding connection with the material loading platform, the moving direction of the pushing block is perpendicular to the rotating plane of the rotating straight plate, and finally a clamping groove is formed in the pushing block, and the clamping groove is aligned with the discharging plane of the material storage box body; for example, when the semiconductor device needs to be fed, the material pipe placed in the storage box descends by gravity, the material pipe descends to the clamping groove of the pushing block through the discharging plane, the pushing block moves and drives the material pipe to move to the carrier clamping plate, the upper clamping plate of the carrier clamping plate moves downwards to clamp the material pipe, then the support plate is rotated to drive the carrier clamping plate to overturn, when the plate surface of the carrier clamping plate is overturned to be parallel to the plate surface of the burning inclined plate, the material pipe is aligned with the guide through groove, at the moment, the chip in the material pipe slides into the guide through groove by gravity, automatic feeding of the feeding mechanism is realized, consumption of manpower and time cost is reduced, meanwhile, damage to the semiconductor device is avoided when the semiconductor device slides into the guide through groove from the material pipe, in order to avoid the semiconductor device being blocked in the material pipe, the vibration knocking rods at two ends of the carrier clamping plate knock the material pipe, and the semiconductor device can slide into the guide through the vibration material pipe smoothly.
It should be noted that, in order to prevent multiple semiconductor devices from entering the burning mechanism at the same time, specifically, the current limiting mechanism of this example is composed of a current control rod, a separation rod and a driving cylinder, the current control rod is arranged below the separation rod, the distance between the current control rod and the separation rod is consistent with the length of the semiconductor devices, then the current control rod and the separation rod are respectively fixed on 2 driving ends of the driving cylinder, and finally the optimal force glue rod on the separation rod and the tail end of the current control rod are both positioned in the guiding through groove; for example, when the semiconductor devices need to enter the burning mechanism, the tail end of the flow control rod blocks all the semiconductor devices, then the air cylinder is driven to drive the isolation rod to enable the excellent adhesive rod on the isolation rod to press the second semiconductor device positioned at the tail end of the guide through groove, and then the air cylinder is driven to drive the flow control rod to lift the flow control rod, so that the flow control rod releases the first semiconductor device positioned at the tail end of the guide through groove, the semiconductor devices enter the burning mechanism to control the flow, the semiconductor devices enter the burning mechanism, the problem of blockage caused by the fact that a plurality of semiconductor devices enter the burning mechanism simultaneously is avoided, and meanwhile the problem of damage to the semiconductor devices caused by the fact that the semiconductor devices enter the burning mechanism is also prevented.
It is worth noting that, in order to avoid that a plurality of semiconductor devices are sucked away by the adsorption assembly at the same time, specifically, the limiting mechanism of the embodiment is composed of a material blocking rod, a material pressing rod and a control cylinder, the material blocking rod is arranged below the material pressing rod, then the material blocking rod and the material pressing rod are respectively fixed on 2 driving ends of the control cylinder, and finally, the excellent adhesive rod on the material pressing rod and the tail end of the material blocking rod are both positioned in the guide through groove; for example, when the burnt semiconductor devices need to be transported to the transport plane, the tail end of the blocking rod blocks all the burnt semiconductor devices, then the cylinder is controlled to drive the pressing rod to press the second semiconductor device positioned at the tail end of the blanking through groove by the excellent adhesive rod on the pressing rod, and then the cylinder is controlled to drive the blocking rod to lift, so that the blocking rod releases the first semiconductor device positioned at the tail end of the guiding through groove and can slide down to the transfer port of the blanking through groove, the moving mechanism can transfer the semiconductor device to the transport plane, the phenomenon that a plurality of semiconductor devices are sucked by the adsorption component at the same time is avoided, and the existence of a plurality of semiconductor devices in the placing groove of the braid of the burnt semiconductor device on the transport plane is prevented.
The polyurethane PU elastomer is a novel material with good strength and small compression deformation, is between plastic and rubber, has the rigidity of the plastic and the elasticity of the rubber, has the characteristics of buffering, silencing, damping, wear resistance, high temperature resistance and the like, is durable and suitable for the protection treatment of the equipment surface in strong acid and alkali working environment, can improve the wear resistance of the equipment, reduce noise and the like, has strong resilience of PU plates, rods and sheets, can compress 50 percent, and has the advantages of pressure resistance, shock resistance, oil resistance, acid and alkali resistance and excellent wear resistance. The PU series elastomer has the characteristics of excellent tensile strength, tear resistance, high elasticity, high-pressure load resistance, abrasion resistance and the like, is easy to cut, grind, drill and the like, and can be suitable for mechanical buffer materials.
In the third embodiment, in order to realize that the burned semiconductor device can be transferred onto a transport plane, specifically, the rotating assembly of the embodiment is composed of a rotating motor, a rotating guide rail and a sliding block, the rotating guide rail is fixed at the rotating end of the rotating motor, and the sliding block is in sliding connection with the rotating guide rail; the suction assembly is provided with a chip suction nozzle and a negative pressure suction pipe, the chip suction nozzle is fixed at one end of the negative pressure suction pipe, the chip suction nozzle is communicated with the negative pressure suction pipe, the other end of the negative pressure suction pipe is connected with a vacuum pump, and finally the negative pressure suction pipe is fixedly connected with a sliding block; for example, when the semiconductor device needs to be transferred to a transport plane, the sliding block drives the adsorption assembly to move upwards, then the rotating motor drives the rotating guide rail to rotate, so that the chip suction nozzle can be aligned with a transfer port of the blanking through groove, the sliding block moves downwards along the rotating guide rail, the chip suction nozzle is close to the semiconductor device, then a vacuum pump at the other end of the negative pressure suction pipe generates negative pressure to adsorb the semiconductor device, then the sliding block moves upwards along the rotating guide rail, the rotating motor drives the rotating guide rail to rotate to an initial position, finally the sliding block moves downwards along the rotating guide rail, the semiconductor device is placed in a placing groove of the braid, the vacuum pump stops running, and the braid drives the semiconductor device to be transported to the next flow; the integrated machine has the advantages that the burnt semiconductor device can be transferred to the transport plane, the integrated machine can be matched with the marking mechanism and the packaging mechanism to perform marking and packaging, the integrated degree of the machine is improved, the manpower and time for manually transferring chips are saved, and the production efficiency is improved.
It should be noted that, in order to describe how the packaging mechanism encapsulates the semiconductor device after the burning, specifically, the packaging mechanism in this example includes a heating plate and a lifting assembly, the heating plate is disposed at two sides of the transportation plane, and the plate surface of the heating plate is attached to the side of the transportation plane, the lifting assembly includes a lifting cylinder and a return spring, the heating plate is fixed on a telescopic rod of the lifting cylinder, and the moving direction of the lifting assembly is perpendicular to the transportation plane, and two ends of the return spring are fixedly connected with the telescopic rod and the lifting cylinder respectively; for example, when the semiconductor device needs to be packaged, the semiconductor device is placed in a placing groove of the braid and moves on a transport plane along with the movement of the braid, and when the braid moves to the position right below the heating plate, the lifting cylinder drives the heating plate to move downwards and presses a packaging adhesive film positioned between the braid and the heating plate to the surface of the braid, so that the braid and the packaging adhesive film are fused together, the semiconductor device which is completed by burning is packaged, and the production efficiency of the integrated machine is improved.
In the fourth embodiment, in order to realize automatic writing of the semiconductor device, specifically, the writing mechanism of the present embodiment is composed of a writing clamping jaw and a positioning cylinder, the writing clamping jaw is disposed above the positioning cylinder, then a telescopic rod of the positioning cylinder is located in the guiding through groove, then the writing clamping jaw is disposed at two sides of the guiding through groove, and the writing clamping jaw is slidingly connected with the writing sloping plate, so that the movement directions of the writing clamping jaw at two sides are opposite; for example, when the semiconductor device needs to be burnt, the telescopic rod of the positioning cylinder stretches out to block the channel of the guide through groove, at the moment, the current limiting mechanism releases a semiconductor device, the semiconductor device slides to the lower part of the burnt mechanism by using gravity, the semiconductor device stops sliding at the telescopic rod of the positioning cylinder, then the burnt clamping jaws at two sides are controlled by the finger cylinder to move towards the direction of the semiconductor device, the burnt clamping jaws clamp the semiconductor device and start to burn, after the burning is finished, the burnt clamping jaws at two sides loosen the semiconductor device, finally the telescopic rod of the positioning cylinder retracts, and the semiconductor device slides downwards by using gravity to enter the next process; the automatic burning of the semiconductor device is realized, the consumption of manpower and time is saved, and meanwhile, the damage of the pins of the semiconductor device caused by manual burning can be avoided.
The aspects of the present utility model have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present utility model. In addition, it can be understood that the steps in the method of the embodiment of the present utility model may be sequentially adjusted, combined and pruned according to actual needs, and the structure in the apparatus of the embodiment of the present utility model may be combined, divided and pruned according to actual needs.
The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. The utility model provides a full-automatic semiconductor device burns record encapsulation all-in-one which characterized in that includes:
the device comprises a feeding platform and a burning inclined plate, wherein the feeding platform is provided with a feeding mechanism, the feeding mechanism is used for moving a carrier provided with a semiconductor device to be burned, a transport plane is further arranged above the burning inclined plate, the transport plane is parallel to the surface of the feeding platform, an included angle between the burning inclined plate and the surface of the feeding platform is an acute angle, and the included angle between the transport plane and the burning inclined plate is complementary with the included angle between the burning inclined plate and the surface of the feeding platform;
the surface of the burning sloping plate is provided with a guide through groove and a blanking through groove, the tail end of the guide through groove is communicated with the starting end of the blanking through groove, a current limiting mechanism and a burning mechanism are sequentially arranged right above the guide through groove, the tail end of the blanking through groove is provided with a limiting mechanism, and a moving mechanism, a marking mechanism and a packaging mechanism are sequentially arranged right above a conveying plane;
the moving mechanism comprises a rotating assembly and an adsorption assembly, the rotating assembly controls the rotation angle of the adsorption assembly, the adsorption assembly is used for sucking the burnt semiconductor device, the transport plane is used for transporting a carrier for placing the burnt semiconductor device, the current limiting mechanism is used for limiting the semiconductor device to be burnt in the guide through groove, the limiting mechanism is used for limiting the burnt semiconductor device in the blanking through groove, the marking mechanism is used for marking the semiconductor device which is moved to the carrier, and the packaging mechanism is used for packaging the marked semiconductor device.
2. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 1, wherein the feeding mechanism comprises a turnover assembly, the turnover assembly comprises a carrier clamping plate and a rotary straight plate, the rotary straight plate is hinged with the feeding platform, the rotary plane of the rotary straight plate is perpendicular to the feeding platform, the carrier clamping plate is fixed on the rotary straight plate, an upper clamping plate of the carrier clamping plate is in sliding connection with the rotary straight plate, the moving direction of the upper clamping plate is perpendicular to the lower clamping plate, and the tail end of the carrier clamping plate is aligned with the starting end of the guide through groove.
3. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 2, wherein the feeding mechanism further comprises a storage component, the storage component comprises a storage box body and a pushing block, the pushing block is located between the storage box body and the overturning component, the storage box body is located above the pushing block, the pushing block is in sliding connection with the feeding platform, the moving direction of the pushing block is perpendicular to the rotating plane of the rotating straight plate, a clamping groove is formed in the pushing block, and the clamping groove is aligned with the discharging plane of the storage box body.
4. The full-automatic semiconductor device burning packaging all-in-one machine according to claim 1, wherein the burning mechanism comprises a burning clamping jaw and a positioning cylinder, the burning clamping jaw is adjacent to the positioning cylinder, the burning clamping jaw is located above the positioning cylinder, a telescopic rod of the positioning cylinder is located in the guiding through groove, the burning clamping jaw is located at two sides of the guiding through groove, the burning clamping jaw is in sliding connection with the burning sloping plate, and moving directions of the burning clamping jaws at two sides are opposite.
5. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 1, wherein the flow limiting mechanism comprises a flow control rod, a separation rod and a driving cylinder, the flow control rod is located below the separation rod, the flow control rod and the separation rod are respectively fixed on 2 driving ends of the driving cylinder, and the tail ends of the flow control rod and the separation rod are located in the guide through groove.
6. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 1, wherein the limiting mechanism comprises a material blocking rod, a material pressing rod and a control cylinder, the material blocking rod is located below the material pressing rod, the material blocking rod and the material pressing rod are respectively fixed on 2 driving ends of the control cylinder, and the tail ends of the material blocking rod and the tail ends of the material pressing rod are located in the guide through groove.
7. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 1, wherein the rotating assembly comprises a rotating motor, a rotating guide rail and a sliding block, the rotating guide rail is fixed at the rotating end of the rotating motor, and the sliding block is in sliding connection with the rotating guide rail.
8. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 7, wherein the adsorption component comprises a chip suction nozzle and a negative pressure suction pipe, the chip suction nozzle is fixed at one end of the negative pressure suction pipe, the chip suction nozzle is communicated with the negative pressure suction pipe, the other end of the negative pressure suction pipe is connected with a vacuum pump, and the negative pressure suction pipe is fixedly connected with the sliding block.
9. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 2, wherein the overturning assembly further comprises vibration knocking rods, the vibration knocking rods are respectively located at two ends of the carrier clamping plates, the vibration knocking rods are in sliding connection with the rotating straight plates, and the vibration knocking rods are used for knocking the carriers.
10. The full-automatic semiconductor device burning and packaging all-in-one machine according to claim 1, wherein the packaging mechanism comprises heating plates and lifting assemblies, the heating plates are arranged on two sides of the conveying plane, the plate surfaces of the heating plates are attached to the side edges of the conveying plane, the heating plates are fixed on the lifting assemblies, and the moving direction of the lifting assemblies is perpendicular to the conveying plane.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311010659.0A CN116714838A (en) | 2023-08-11 | 2023-08-11 | Full-automatic semiconductor device burns record encapsulation all-in-one |
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| CN202311010659.0A CN116714838A (en) | 2023-08-11 | 2023-08-11 | Full-automatic semiconductor device burns record encapsulation all-in-one |
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Cited By (1)
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