CN116429376A - 激光光线照射装置和激光光线照射方法 - Google Patents

激光光线照射装置和激光光线照射方法 Download PDF

Info

Publication number
CN116429376A
CN116429376A CN202211680971.6A CN202211680971A CN116429376A CN 116429376 A CN116429376 A CN 116429376A CN 202211680971 A CN202211680971 A CN 202211680971A CN 116429376 A CN116429376 A CN 116429376A
Authority
CN
China
Prior art keywords
laser beam
unit
light
wafer
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211680971.6A
Other languages
English (en)
Chinese (zh)
Inventor
本乡智之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN116429376A publication Critical patent/CN116429376A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0207—Details of measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Optical Recording Or Reproduction (AREA)
  • Automatic Focus Adjustment (AREA)
CN202211680971.6A 2022-01-12 2022-12-27 激光光线照射装置和激光光线照射方法 Pending CN116429376A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-003310 2022-01-12
JP2022003310A JP2023102663A (ja) 2022-01-12 2022-01-12 レーザ光線照射装置及びレーザ光線照射方法

Publications (1)

Publication Number Publication Date
CN116429376A true CN116429376A (zh) 2023-07-14

Family

ID=87080341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211680971.6A Pending CN116429376A (zh) 2022-01-12 2022-12-27 激光光线照射装置和激光光线照射方法

Country Status (4)

Country Link
JP (1) JP2023102663A (ko)
KR (1) KR20230109099A (ko)
CN (1) CN116429376A (ko)
TW (1) TW202327778A (ko)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6110136U (ja) 1984-06-20 1986-01-21 東芝熱器具株式会社 飲料製造機
JP2005118808A (ja) 2003-10-15 2005-05-12 Disco Abrasive Syst Ltd レーザー加工装置
JP6600254B2 (ja) 2015-12-28 2019-10-30 株式会社ディスコ ウェーハの加工方法

Also Published As

Publication number Publication date
KR20230109099A (ko) 2023-07-19
TW202327778A (zh) 2023-07-16
JP2023102663A (ja) 2023-07-25

Similar Documents

Publication Publication Date Title
TWI609732B (zh) 雷射加工裝置
TWI657495B (zh) 晶圓的加工方法
TW201600208A (zh) 雷射加工裝置
CN107470782B (zh) 激光光线的检查方法
KR20200140725A (ko) 레이저 발진기 지지 테이블, 레이저 가공 장치 및 레이저 발진기 지지 테이블의 조정 방법
CN116429376A (zh) 激光光线照射装置和激光光线照射方法
CN112091412B (zh) 反射率测量装置和激光加工装置
TW202044367A (zh) 雷射加工裝置的光軸調整方法
TWI850392B (zh) 雷射振盪器支撐工作台、雷射加工裝置及雷射振盪器支撐工作台之調整方法
JP7199256B2 (ja) 出力測定ユニットの合否判定方法
TW202110562A (zh) 雷射加工裝置之光軸確認方法
JP2020092213A (ja) ドープ量検出方法および板状物の加工方法
JP7450447B2 (ja) レーザー加工装置
JP2018149573A (ja) レーザー加工装置
TW202401540A (zh) 雷射加工裝置
JP2020203306A (ja) レーザー加工装置およびビーム径測定方法
JP2021037539A (ja) 光軸調整ジグおよびレーザー加工装置の光軸確認方法
JP2023184129A (ja) レーザ光の集光点位置検出方法
JP2023114909A (ja) レーザー加工装置
CN117238798A (zh) 加工装置
KR20210018045A (ko) 레이저 가공 장치의 가공 성능의 확인 방법
JP2022069032A (ja) レーザー加工装置
JP2021146375A (ja) レーザー加工装置及び集光レンズの状態確認方法
JP2020142296A (ja) レーザー加工装置
JP2020021844A (ja) ウェーハの加工方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication