CN116075942A - 探测基板和平板探测器 - Google Patents

探测基板和平板探测器 Download PDF

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Publication number
CN116075942A
CN116075942A CN202180002345.9A CN202180002345A CN116075942A CN 116075942 A CN116075942 A CN 116075942A CN 202180002345 A CN202180002345 A CN 202180002345A CN 116075942 A CN116075942 A CN 116075942A
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substrate
layer
orthographic projection
photoelectric conversion
electrode
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CN202180002345.9A
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占香蜜
王振宇
杨祎凡
丁志
侯学成
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BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
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Publication of CN116075942A publication Critical patent/CN116075942A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14636Interconnect structures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • HELECTRICITY
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
    • H01L27/14616Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14658X-ray, gamma-ray or corpuscular radiation imagers
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    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
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  • Engineering & Computer Science (AREA)
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Abstract

本公开提供了一种探测基板,其中,包括:衬底基板、位于衬底基板上呈阵列排布的多个探测像素单元,探测像素单元包括:薄膜晶体管和位于薄膜晶体管远离衬底基板一侧的光电转换部,光电转换部远离衬底基板的一侧设置有偏置电压线;薄膜晶体管包括:有源层、第一电极和第二电极,第一电极和第二电极均与有源层电连接,有源层包括沟道区;光电转换部靠近衬底基板的一端与第二电极电连接,光电转换部远离衬底基板的一端与对应的偏置电压线电连接;光电转换部与偏置电压线之间设置有至少一层介质层,介质层上形成有第一过孔,沟道区在衬底基板上的至少部分正投影位于第一过孔在衬底基板上的正投影以内。本公开还提供了一种平板探测器。

Description

PCT国内申请,说明书已公开。

Claims (34)

  1. PCT国内申请,权利要求书已公开。
CN202180002345.9A 2021-08-31 2021-08-31 探测基板和平板探测器 Pending CN116075942A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/115488 WO2023028796A1 (zh) 2021-08-31 2021-08-31 探测基板和平板探测器

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CN116075942A true CN116075942A (zh) 2023-05-05

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US (1) US20240194705A1 (zh)
CN (1) CN116075942A (zh)
WO (1) WO2023028796A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102522578B1 (ko) * 2017-11-29 2023-04-14 엘지디스플레이 주식회사 디지털 엑스레이 검출기용 어레이 기판과 이를 포함하는 디지털 엑스레이 검출기
KR102569741B1 (ko) * 2018-10-31 2023-08-22 엘지디스플레이 주식회사 디지털 엑스레이 검출기용 박막 트랜지스터 어레이 기판 및 이를 포함하는 디지털 엑스레이 검출기
CN111244119A (zh) * 2019-12-13 2020-06-05 京东方科技集团股份有限公司 一种探测基板、其制作方法及平板探测器

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US20240194705A1 (en) 2024-06-13

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