CN115802596B - Thick film ceramic circuit board and manufacturing method thereof - Google Patents
Thick film ceramic circuit board and manufacturing method thereof Download PDFInfo
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- CN115802596B CN115802596B CN202310103065.8A CN202310103065A CN115802596B CN 115802596 B CN115802596 B CN 115802596B CN 202310103065 A CN202310103065 A CN 202310103065A CN 115802596 B CN115802596 B CN 115802596B
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Abstract
A thick film ceramic circuit board and a manufacturing method thereof belong to the field of ceramic circuit boards, and the ceramic circuit board comprises a basic unit. The base unit includes: the first conductive layer, the heat dissipation layer and the grounding layer are sequentially overlapped from top to bottom. The first conductive layer is used for arranging electronic components and is provided with a plurality of heating areas. The heat dissipation layer is a ceramic plate structure and is provided with a plurality of heat dissipation areas, the heat dissipation areas comprise heat conduction metal embedded in the heat dissipation layer, and a plurality of first metal holes are formed in the peripheries of the heat generation areas and the heat dissipation areas. The grounding layer is made of copper, the bottom of the heat dissipation layer is provided with a second metal hole, and the second metal hole is connected with the heat conduction metal and the grounding layer. The manufacturing method of the ceramic circuit board comprises the following steps: s1: providing a ceramic plate, and forming a circuit of a first conductive layer on the top surface of the ceramic plate; s2: determining a heating area; s3: a heat conducting metal is arranged on the heat dissipation layer; s4: setting a grounding layer; s5: drilling holes; s6: and (5) metallizing. Has good heat dissipation effect.
Description
Technical Field
The invention belongs to the technical field of circuit board structures and production, and particularly relates to a thick film ceramic circuit board and a manufacturing method thereof.
Background
The high-speed development of high-power electronic information products such as modern communication base stations, power supply modules, large-scale computer servers, heating integrators and the like promotes the development of microwave circuits to high frequency bands, ultra wideband, miniaturization and the like. In order to ensure the reliability of circuit signal transmission, the design and manufacture of a printed circuit board as a loading component of an electronic complete machine must solve the problem of heat dissipation of the circuit board.
At present, the conventional heat dissipation method of the PCB substrate mainly comprises the following two methods: (1) Is to install a heat sink or a fan, but has disadvantages in that noise is generated and additional space is required; (2) The metal base is attached to the bottom of the PCB, the heat conduction aluminum layer is embedded in the middle of the PCB, and the copper block is embedded in the PCB through resin adhesion, but the disadvantage is that the whole structure design is complex and the cost is high.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides the thick film ceramic circuit board and the manufacturing method thereof, which have good heat dissipation effect and smaller overall size.
In order to achieve the object of the invention, the following scheme is adopted:
a thick film ceramic circuit board comprises a base unit. The base unit includes: at least comprises a first conductive layer, a heat dissipation layer and a grounding layer which are sequentially overlapped from top to bottom.
The first conductive layer is used for arranging electronic components, and the electronic components comprise, but are not limited to, a power amplifier, a MOS field tube, a transistor, an IC module, an inductor, a capacitor and a resistor, and the first conductive layer is provided with a plurality of heating areas.
The heat dissipation layer is a ceramic plate structure, a plurality of heat dissipation areas are arranged in the heat dissipation areas corresponding to the upper heat dissipation areas, the heat dissipation areas comprise heat conduction metals embedded in the heat dissipation layer, and a plurality of first metal holes are formed in the peripheries of the heat dissipation areas and the heat dissipation areas.
The grounding layer is made of copper, the bottom of the heat dissipation layer is provided with a second metal hole, and the second metal hole is connected with the heat conduction metal and the grounding layer.
Further, a plurality of basic units are overlapped from top to bottom, ceramic plates are arranged between two adjacent basic units from top to bottom, and second metal holes of all basic units are connected with the grounding layer of the bottommost layer so as to realize connection between the grounding layers of the top and middle basic units and the grounding layer of the bottommost layer.
Further, the heat conduction metal is in a three-dimensional structure, and the bottoms of the second metal holes and the bottoms of the heat conduction metal are in the same plane.
Further, the heat dissipation layer comprises four layers of ceramic plates which are overlapped from top to bottom, through holes are formed in the middle two ceramic plates corresponding to the heat dissipation areas, and the through holes are used for arranging heat conduction metals.
Further, the first conductive layer is formed on the top surface of the heat dissipation layer by a thick film process.
Further, a first ceramic layer is arranged between the first conductive layer and the heat dissipation layer, and the first conductive layer is formed on the first ceramic layer by adopting a thick film process.
Further, a second conductive layer is arranged between the heat dissipation layer and the grounding layer, a second ceramic layer is arranged between the second conductive layer and the grounding layer, the second conductive layer is formed on the top surface of the second ceramic layer through a thin film process, the grounding layer is copper foil or is formed on the bottom surface of the second ceramic layer through a thick film process, and a circuit between the second conductive layer and the first conductive layer is connected through a third metal hole.
Further, a third ceramic layer is arranged between the first conductive layer and the second conductive layer and between the first conductive layer and the heat dissipation layer, and the first conductive layer is formed on the top surface of the third ceramic layer below the first conductive layer through a thick film process.
Further, the second metal hole is internally filled with metal copper or silver.
A manufacturing method of a thick film ceramic circuit board is used for producing the ceramic circuit board and comprises the following steps:
s1: providing a ceramic plate for manufacturing a heat dissipation layer, and forming a circuit of a first conductive layer on the top surface of the ceramic plate through a thick film process;
s2: determining the range of a heating area through physical field simulation;
s3: a heat conducting metal is arranged in the heat dissipation layer corresponding to the heating area;
s4: a grounding layer is arranged on the bottom surface of the heat dissipation layer;
s5: drilling, namely downwards drilling an upper counter bore for forming a first metal hole from the top surface of the ceramic circuit board, wherein the upper counter bore is distributed outside the heating area, and the upper counter bore does not penetrate through the bottom surface of the heat dissipation layer; drilling a lower counter bore for forming a second metal hole upwards from the bottom surface of the ceramic circuit board, wherein the top of the lower counter bore is in contact with the bottom surface of the heat conducting metal;
s6: and (3) metallizing to form a metal layer on the inner walls of the upper counter bore and the lower counter bore, wherein the metal is copper or silver.
The invention has the beneficial effects that: the heating area is identified through the first conductive layer, the heat dissipation area corresponding to the heating area is arranged on the heat dissipation layer, heat conduction metal is arranged in the heat dissipation area, then heat in the heating area is transferred to the heat conduction metal through the first metal hole, and then the heat of the heat conduction metal is transferred to the grounding layer at the bottom layer through the second metal hole, so that heat generated during operation of the electrical element can be rapidly dissipated from the back of the circuit board.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the invention.
Fig. 1 shows a schematic structural diagram of a preferred embodiment of the basic unit of the present application.
Fig. 2 shows a partial cross-sectional view of the first conductive layer and the heat sink layer.
The marks in the figure: the heat-conducting ceramic comprises a first conductive layer-1, a heating area-11, a first metal hole-12, a third metal hole-13, a heat dissipation layer-2, a heat dissipation area-21, a heat conduction metal-22, a second metal hole-23, a ceramic plate-24, a grounding layer-3, a third ceramic layer-4, a second conductive layer-5 and a second ceramic layer-6.
Description of the embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings, but the described embodiments of the present invention are some, but not all embodiments of the present invention.
Example 1
A thick film ceramic circuit board comprises a base unit.
Specifically, as shown in fig. 1, the base unit includes: at least comprises a first conductive layer 1, a heat dissipation layer 2 and a grounding layer 3 which are sequentially overlapped from top to bottom.
Specifically, the first conductive layer 1 is used for setting electronic components, and the electronic components include, but are not limited to, a power amplifier, a MOS field tube, a transistor, an IC module, an inductor, a capacitor, and a resistor, the first conductive layer 1 has a plurality of heating areas 11, and heat of the heating areas 11 is formed by heat generated when the electronic components with larger heating power work.
Specifically, as shown in fig. 1 and 2, the heat dissipation layer 2 is a ceramic plate structure, and a plurality of heat dissipation areas 21 are provided corresponding to the upper heat generation areas 11, and the outline shape of the heat dissipation areas 21 is matched with the outline shape of the heat generation areas 11. The heat dissipation area 21 includes a heat conductive metal 22 embedded in the heat dissipation layer 2, where the heat conductive metal 22 is a metal with good heat conductivity such as graphene, copper or silver, and the periphery of the heat generation area 11 and the heat dissipation area 21 has a plurality of first metal holes 12, and the first metal holes 12 are used for transferring heat of the heat generation area 11 to the heat conductive metal 22 corresponding to the heat dissipation area 21.
Specifically, as shown in fig. 1, the material of the ground layer 3 is copper, which is copper foil or is formed on the bottom surface of the heat dissipation layer 2 by using a thick film process, the bottom of the heat dissipation layer 2 is provided with a second metal hole 23, the second metal hole 23 is connected with the heat conducting metal 22 and the ground layer 3, the second metal hole 23 is used for transferring the heat of the heat conducting metal 22 to the ground layer 3, and finally the heat is dissipated through the ground layer 3.
Example 2
A thick film ceramic circuit board comprises a plurality of basic units overlapped from top to bottom to form a structure of a multilayer circuit board. As shown in fig. 1, the base unit includes: comprises a first conductive layer 1, a heat dissipation layer 2 and a grounding layer 3 which are sequentially overlapped from top to bottom. And ceramic plates are arranged between two adjacent foundation units, and second metal holes 23 of all foundation units are connected with the grounding layer 3 at the bottommost layer, so that the grounding layers 3 of the top and middle foundation units are connected with the grounding layer 3 at the bottommost layer, and the whole rapid heat dissipation is realized. The first conductive layer 1 of the uppermost base unit is used for providing electronic components including, but not limited to, power amplifiers, MOS field transistors, IC modules, inductors, capacitors, resistors, and the first conductive layers 1 of the remaining base units are used only for forming functional circuit diagrams.
Preferably, the heat conducting metal 22 has a three-dimensional structure, and the bottom of the second metal hole 23 and the bottom of the heat conducting metal 22 are in the same plane, so that the overlapping range of the thickness increase and the depth of the first metal hole 12 is utilized to increase the heat conducting area, thereby accelerating the heat dissipation to the heat conducting metal 22.
Preferably, as shown in fig. 2, the heat dissipation layer 2 includes four layers of ceramic plates 24 stacked from top to bottom, two middle ceramic plates 24 are provided with through holes corresponding to the heat dissipation areas 21, and the through holes are used for arranging the heat conduction metal 22.
Preferably, the first conductive layer 1 is formed on the top surface of the heat dissipation layer 2 by using a thick film process to increase the power bearing of the first conductive layer 1.
Preferably, a first ceramic layer is arranged between the first conductive layer 1 and the heat dissipation layer 2, the first conductive layer 1 is formed on the first ceramic layer by adopting a thick film process, the first conductive layer 1 is formed on the independent first ceramic layer, so that the first conductive layer 1 can be independently manufactured during production, the first conductive layer 1 is conveniently and independently detected, a physical field simulation experiment is conveniently carried out on the first conductive layer 1, the range of the heating area 11 is determined in advance, an identification is made, the corresponding heat dissipation area 21 is conveniently manufactured, the signal shielding effect can be further increased by arranging the third ceramic layer 7, and the mutual interference of signals of upper and lower layers of circuits is avoided.
Preferably, a second conductive layer 5 is disposed between the heat dissipation layer 2 and the ground layer 3, a second ceramic layer 6 is disposed between the second conductive layer 5 and the ground layer 3, the second conductive layer 5 is formed on the top surface of the second ceramic layer 6 by a thin film process, the ground layer 3 is a copper foil or is formed on the bottom surface of the second ceramic layer 6 by a thick film process, the circuit between the second conductive layer 5 and the first conductive layer 1 is connected by a third metal hole 13, the purpose of adding the second conductive layer 5 is to increase the three-dimensional layout of the circuit, avoid the planar laying of the circuit, reduce the planar area of the circuit board, the second conductive layer 5 can be used to form a phase-locked loop module circuit, a filter module circuit, an amplifier module circuit or a control circuit module circuit, and a plurality of second conductive layers 5 can be disposed between the heat dissipation layer 2 and the ground layer 3 according to the amount of a required circuit, and each second conductive layer 5 is formed on the second ceramic layer 6 alone.
Further preferably, as shown in fig. 1, a third ceramic layer 4 is disposed between the second conductive layer 5 and the heat dissipation layer 2, and the first conductive layer 1 is formed on the top surface of the third ceramic layer 4 thereunder by a thick film process.
Preferably, the second metal holes 23 are filled with metal copper or silver inside to further increase heat dissipation efficiency.
Example 3
A manufacturing method of a thick film ceramic circuit board is used for producing the ceramic circuit board and comprises the following steps:
s1: a ceramic board for manufacturing the heat dissipation layer 2 is provided, and the circuit of the first conductive layer 1 is formed on the top surface of the ceramic board through a thick film process.
S2: the range of the heat generating region 11 is determined through physical field simulation, and as shown in fig. 1, the shape of the wheel house of the heat generating region 11 may be polygonal, circular or elliptical.
S3: the heat conducting metal 22 is arranged in the heat dissipation layer 2 corresponding to the heating area 11, and the counter bore is formed in the bottom surface of the ceramic plate for manufacturing the heat dissipation layer 2 corresponding to the heating area 11 in a specific mode, then the heat conducting metal 22 is filled, and then the counter bore is sealed by the ceramic plate.
S4: a ground layer 3 is provided on the bottom surface of the heat dissipation layer 2.
S5: drilling holes, namely downwards drilling upper counter bores for forming the first metal holes 12 from the top surface of the ceramic circuit board, wherein the upper counter bores are distributed outside the heating area 11, and the upper counter bores do not penetrate through the bottom surface of the heat dissipation layer 2; drilling a lower counter bore for forming a second metal hole 23 upwards from the bottom surface of the ceramic circuit board, wherein the top of the lower counter bore is in contact with the bottom surface of the heat conducting metal 22;
s6: and (3) metallizing to form a metal layer on the inner walls of the upper counter bore and the lower counter bore, wherein the metal is copper or silver.
The foregoing description of the preferred embodiments of the invention is merely exemplary and is not intended to be exhaustive or limiting of the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (9)
1. The utility model provides a thick film ceramic circuit board, includes basic unit, its characterized in that, basic unit includes: at least comprises a first conductive layer (1), a heat dissipation layer (2) and a grounding layer (3) which are sequentially overlapped from top to bottom;
the first conductive layer (1) is used for setting electronic components, wherein the electronic components comprise a power amplifier, a MOS field tube, a transistor, an IC module, an inductor, a capacitor and a resistor, and the first conductive layer (1) is provided with a plurality of heating areas (11);
the heat dissipation layer (2) is of a ceramic plate structure, a plurality of heat dissipation areas (21) are arranged corresponding to the heating areas (11) above the heat dissipation layer, the heat dissipation areas (21) comprise heat conduction metals (22) embedded in the heat dissipation layer (2), and a plurality of first metal holes (12) are formed in the peripheries of the heating areas (11) and the heat dissipation areas (21);
the raw material of the grounding layer (3) is copper, a second metal hole (23) is formed in the bottom of the heat dissipation layer (2), the second metal hole (23) is connected with the heat conduction metal (22) and the grounding layer (3), and metal copper or silver is poured into the second metal hole (23).
2. A thick film ceramic circuit board according to claim 1, characterized in that a plurality of base units are stacked from top to bottom, ceramic plates are arranged between two adjacent base units, and the second metal holes (23) of all base units are connected with the bottom-most ground layer (3) so as to realize connection of the ground layers (3) of the top and middle base units with the bottom-most ground layer (3).
3. A thick film ceramic circuit board according to claim 1, characterized in that the heat conducting metal (22) is three-dimensionally structured, and the bottom of the second metal hole (23) is in the same plane with the bottom of the heat conducting metal (22).
4. The thick film ceramic circuit board according to claim 1, wherein the heat dissipation layer (2) comprises four layers of ceramic plates (24) stacked from top to bottom, the middle two ceramic plates (24) are provided with through holes corresponding to the heat dissipation areas (21), and the through holes are used for arranging heat conducting metal (22).
5. A thick film ceramic circuit board according to claim 1, characterized in that the first conductive layer (1) is formed on the top surface of the heat dissipation layer (2) by a thick film process.
6. The thick film ceramic circuit board according to claim 1, wherein a first ceramic layer is provided between the first conductive layer (1) and the heat dissipation layer (2), and the first conductive layer (1) is formed on the first ceramic layer by a thick film process.
7. The thick-film ceramic circuit board according to claim 1, characterized in that a second conductive layer (5) is arranged between the heat dissipation layer (2) and the ground layer (3), a second ceramic layer (6) is arranged between the second conductive layer (5) and the ground layer (3), the second conductive layer (5) is formed on the top surface of the second ceramic layer (6) through a thin film process, the ground layer (3) is copper foil or is formed on the bottom surface of the second ceramic layer (6) through a thick film process, and a circuit between the second conductive layer (5) and the first conductive layer (1) is connected through a third metal hole (13).
8. The thick film ceramic circuit board according to claim 7, wherein a third ceramic layer (4) is disposed between the first conductive layer (1) and the second conductive layer (5) and the heat dissipation layer (2), and the first conductive layer (1) is formed on the top surface of the third ceramic layer (4) below the first conductive layer by thick film process.
9. A method for manufacturing a thick film ceramic circuit board, for producing the ceramic circuit board of any one of claims 1 to 8, comprising the steps of:
s1: providing a ceramic plate for manufacturing a heat dissipation layer (2), and forming a circuit of a first conductive layer (1) on the top surface of the ceramic plate through a thick film process;
s2: determining the range of the heating area (11) through physical field simulation;
s3: a heat conducting metal (22) is arranged in the heat dissipation layer (2) corresponding to the heating area (11);
s4: a grounding layer (3) is arranged on the bottom surface of the heat dissipation layer (2);
s5: drilling, namely downwards drilling an upper counter bore for forming a first metal hole (12) from the top surface of the ceramic circuit board, wherein the upper counter bore is distributed outside the heating area (11) and does not penetrate through the bottom surface of the heat dissipation layer (2); drilling a lower counter bore for forming a second metal hole (23) upwards from the bottom surface of the ceramic circuit board, wherein the top of the lower counter bore is in contact with the bottom surface of the heat conducting metal (22);
s6: and (3) metallizing to form a metal layer on the inner walls of the upper counter bore and the lower counter bore, wherein the metal is copper or silver.
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