CN208462127U - A kind of thermally conductive multilayer circuit board - Google Patents
A kind of thermally conductive multilayer circuit board Download PDFInfo
- Publication number
- CN208462127U CN208462127U CN201820448268.5U CN201820448268U CN208462127U CN 208462127 U CN208462127 U CN 208462127U CN 201820448268 U CN201820448268 U CN 201820448268U CN 208462127 U CN208462127 U CN 208462127U
- Authority
- CN
- China
- Prior art keywords
- circuit
- layer
- circuit board
- sided
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 241001232787 Epiphragma Species 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a kind of thermally conductive multilayer circuit boards, specifically, with the copper-clad plate of a single side heat radiating material, circuit etching, complete welding resistance, the two-sided or multilayer circuit board made again with another, the back side applies one layer of adhesive, then a part of region is removed with mold punching, it is attached to two-sided or multilayer circuit strip glue on above a part of circuit with heat radiating material circuit board on one side, the circuit board of three layers or three layers or more the circuits containing heat radiating material has been made, wherein, a part of region is the single circuit of heat radiating material, design has the pad of welding heating device in single circuit, other regions are three layers or three layers or more of circuits, the thermally conductive multilayer circuit board of the utility model, avoid the multilayer heat resistant layer of multilayer circuit board, heater element is set directly to be welded in heat on thermally conductive single sided board quickly to conduct and dissipate It sends out.
Description
Technical field
The utility model relates to field of circuit boards, and in particular to a kind of thermally conductive multilayer circuit board
Background technique
The multilayer circuit board of currently available technology, one is thermally conductive thick metals to be clipped in by insulating layer by metallic circuit
Between, when the via hole between multilayer circuit passes through Metal Substrate, also a upper layer insulating, the big cost of difficulty are made in the hole wall of metal
Height is wrapped moreover, heat-conducting metal is clipped in the middle, and is radiated very poor, and another kind is on a metal plate with insulating heat-conductive sticker one
Multilayer circuit board, component are welded on top layer circuit, and heater element is caused to be welded on top layer circuit in this way, the heat of generation
It can be just transmitted on heat dissipating substrate plate by multilayer dielectric layer and lower metal circuit layer, thermally conductive road is very long and complex, causes
Poor heat conductivity.
For the defect more than overcoming the shortcomings of, the thermally conductive multilayer circuit board of the utility model is taken in multilayer circuit board
On, it is only multilayer circuit it is folded to weld the region except heat conducting element, heating device is welded in the single circuit on thermal-conductivity substrate plate
On, the heat for generating heating device has just been transmitted on heat-radiating substrate by one layer of thermally conductive insulating layer, has both realized complexity
The function of multilayer circuit board, and the multilayer heat resistant layer of multilayer circuit board is avoided, so that heater element has directly been welded in thermally conductive single side
Heat is quickly conducted on plate and is distributed.
Utility model content
The utility model relates to a kind of thermally conductive multilayer circuit boards and preparation method thereof, specifically, with single side heat dissipation base
The copper-clad plate of material, circuit etching, complete welding resistance, then the two-sided or multilayer circuit board made with another, and the back side is applied
Add one layer of adhesive, then remove a part of region with mold punching, by it is two-sided or multilayer circuit strip glue be attached on one side with
On on a part of circuit with heat radiating material circuit board, the circuit of three layers or three layers or more the circuits containing heat radiating material has been made
Plate, wherein a part of region is the single circuit of heat radiating material, and design has the pad of welding heating device in single circuit,
Its region is three layers or three layers or more of circuit, and the thermally conductive multilayer circuit board of the utility model avoids multilayer circuit board
Multilayer heat resistant layer makes heater element directly be welded in quickly to conduct heat on thermally conductive single sided board and distribute.
A kind of thermally conductive multilayer circuit board is provided according to the utility model, comprising: heat dissipating substrate plate first circuit layer；First
Solder mask on circuit；Second insulating layer；The second circuit layer；Third insulating layer；Tertiary circuit layer；Welding resistance on tertiary circuit
Layer；It is characterized in that, the solder mask on the heat dissipating substrate plate, first circuit layer, the first circuit is radiated by a single side
The one-sided circuit board that substrate is fabricated to, the second insulating layer, the second circuit layer, third insulating layer, tertiary circuit layer, third
Solder mask on circuit is the double-sided wiring board being fabricated to by double-sided copper-clad substrate, and one layer of gluing is arranged in Double-side line back
Agent, and the through-hole structure that the second circuit layer of double-sided wiring board, third insulating layer, tertiary circuit layer have plated through-hole to be connected,
For above-mentioned one-sided circuit board together with double-sided wiring board contraposition pressing, a part of region is three layers of circuit, another part region
Only single circuit, in single circuit region, (i.e. the first circuit region) is provided with the pad of soldered elements, and pad is towards third
The one side of circuit, the conduction mode between double-sided wiring board and first circuit layer is: double-sided wiring board design has and first layer electricity
Half bore of the road floor for conducting, is connected half bore and is characterized in second insulating layer, the second circuit layer, third insulating layer, tertiary circuit
Layer, the solder mask on tertiary circuit and gluing oxidant layer, which remove, to form half, and first layer circuit does not remove at half bore and from half bore
Place exposes upward, or design has conducting pad, a part weldering of conducting at odt circuit and the overlapping edge of single circuit
Disk is on first layer single side route, and another part pad is on the edge of third layer circuit, in the half bore or conducting pad
Place's conducting resinl or electrically conductive ink either scolding tin mode, make surface layer and bottom circuit realize conducting or with component or
Metallic conductor a part is welded on surface circuit, and another part is welded on bottom circuit, realizes surface layer and bottom circuit
Conducting.
A preferred embodiment according to the present utility model, a kind of thermally conductive multilayer circuit board, which is characterized in that described
Heat dissipating substrate plate be metal substrate base plate or be resin base plate or be ceramic base bottom plate.
A preferred embodiment according to the present utility model, a kind of thermally conductive multilayer circuit board, which is characterized in that described
The thermal coefficient of multilayer circuit board is more than or equal to 0.5 watt/square metre degree.
In the description below to the drawings and specific embodiments, one or more embodiments of the utility model will be illustrated
Details.
Detailed description of the invention
By reading this specification in conjunction with the following drawings, the feature, objects and advantages of the utility model will become more to show
And be clear to, it is as follows to the brief description of accompanying drawing.
Fig. 1 is the floor map of single-face aluminum-based circuit board 1.
Fig. 2 is the floor map of double-sided wiring board 2.
Fig. 3 is the floor map of thermally conductive three sandwich circuit board.
Fig. 4 is the schematic cross-section of thermally conductive three sandwich circuit board.
Fig. 5 is thermally conductive three layer line that design has conducting pad at the overlapping edge of odt circuit and single-face aluminum-based circuit board
The floor map of road plate.
Specific embodiment
The utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula, claim to the utility model simultaneously do not have any restrictions.
Using traditional single-face aluminum-based circuit board manufacture craft, single-sided aluminum-base is covered into Copper base material and passes through sawing sheet, cleaning, silk-screen
Film, silk-screen welding resistance are moved back in route, baking-curing, etching, expose the pad 1.1 for welding high heating device and the solder joint for conducting
1.2 (as shown in Figure 1), baking-curing are fabricated to single-face aluminum-based circuit board 1.
Using traditional double-sided wiring board manufacture craft, double-sided copper-clad substrate is passed through into sawing sheet, drilling, heavy copper, copper facing, clearly
It washes, paste dry film, exposure, development, etch, move back film, paste epiphragma on the route of two sides respectively, expose conducting pad 2.2, then exist
One layer of adhesive is coated at the back side of double-sided wiring board 2, then removes a part of region with mold punching, while being punched into half bore
2.1, it is fabricated to double-sided wiring board 2 (as shown in Figure 2).
The contraposition of double-sided wiring board 2 is fitted on single-face aluminum-based circuit board 1, by pressing, baking-curing, then by exposing
Pad is handled by OSP surface anti-oxidation, and being fabricated to a part of region is three layers of circuit, and another part region only has single circuit
Thermally conductive multilayer circuit board (as shown in Figure 3, Figure 4), single circuit region be provided with welding heater element pad 1.1, weldering
One side of the disk 1.1 towards tertiary circuit layer 2.6, wherein single-face aluminum-based circuit board 1 includes heat dissipating substrate plate 1.3, the first insulating layer
1.4, first circuit layer 1.5, the solder mask 1.6 on the first circuit, double-sided wiring board 2 include second insulating layer 2.3, second circuit
Layer 2.4, third insulating layer 2.5, tertiary circuit layer 2.6, the solder mask 2.7 on tertiary circuit, the second circuit layer 2.4 and third electricity
Conducting between road floor 2.6 was hole plating copper conducting, and double-sided wiring board 2, which designs, the half bore 2.1 be connected with first layer circuit 1.5
(as shown in Figure 2), conducting half bore 2.1 be characterized in break-through the second circuit layer 2.4, third insulating layer 2.5, tertiary circuit layer 2.6,
Solder mask 2.7 on tertiary circuit forms half pore structure, and first layer circuit 1.5 exposes upward at half bore 2.1, in half bore 2.1
Place's conducting resinl or electrically conductive ink or be scolding tin mode make first circuit layer 1.5 and the second circuit layer 2.4 and third electricity
Road floor 2.6 realizes conducting or uses component or metallic conductor, and a part is welded on a circuit layer 1.5, and another part welds
On tertiary circuit layer 2.6, realizes first circuit layer 1.5 and the second circuit layer 2.4 and tertiary circuit layer 2.6 and be connected, or
Conducting pad, single-face aluminum-based circuit board 1 are respectively designed at the overlapping edge of double-sided PCB 2 and single-face aluminum-based circuit board 1
On conducting pad 1.2a and double-sided wiring board 2 on conducting pad 2.2a form structure as shown in Figure 5, be connected pad at
With conducting resinl or electrically conductive ink or it is scolding tin mode, makes first circuit layer 1.5 and the second circuit layer 2.4 and tertiary circuit
Layer 2.6 realizes conducting or with component or metallic conductor, and a part is welded on a circuit layer 1.5, and another part is welded on
On tertiary circuit layer 2.6, realizes first circuit layer 1.5 and the second circuit layer 2.4 and tertiary circuit layer 2.6 and be connected.
Above in conjunction with attached drawing by a kind of specific embodiment of thermally conductive multilayer circuit board and preparation method thereof to the utility model
It is described in detail.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes
Specific embodiment to this with novel range, especially the scope of the claims, and does not have any restrictions.
Claims (3)
1. a kind of thermally conductive multilayer circuit board, comprising:
Heat dissipating substrate plate；
First circuit layer；
Solder mask on first circuit；
Second insulating layer；
The second circuit layer；
Third insulating layer；
Tertiary circuit layer；
Solder mask on tertiary circuit；
It is characterized in that, the solder mask on the heat dissipating substrate plate, first circuit layer, the first circuit is radiated by a single side
The one-sided circuit board that substrate is fabricated to, the second insulating layer, the second circuit layer, third insulating layer, tertiary circuit layer, third
Solder mask on circuit is the double-sided wiring board being fabricated to by double-sided copper-clad substrate, and one layer of gluing is arranged in Double-side line back
Agent, and the through-hole structure that the second circuit layer of double-sided wiring board, third insulating layer, tertiary circuit layer have plated through-hole to be connected,
For above-mentioned one-sided circuit board together with double-sided wiring board contraposition pressing, a part of region is three layers of circuit, another part region
Only single circuit is provided with the pad of soldered elements, one side of the pad towards tertiary circuit, two-sided line in single circuit region
Conduction mode between road plate and first circuit layer is: double-sided wiring board design has half for conducting with first layer circuit layer
Hole is connected half bore and is characterized in second insulating layer, the second circuit layer, third insulating layer, tertiary circuit layer, the resistance on tertiary circuit
Layer and gluing oxidant layer remove to form half bore, and first layer circuit does not remove at half bore and exposes upward at half bore, or
Design has conducting pad at odt circuit and the overlapping edge of single circuit, and a part of pad of conducting is in first layer single side line
On the road, another part pad is on the edge of third layer circuit, with conducting resinl or leads at the half bore or conducting pad
Electric ink either scolding tin mode makes surface layer and bottom circuit realize conducting or be welded with component or metallic conductor a part
It connects on surface circuit, another part is welded on bottom circuit, and surface layer and bottom circuit is made to realize conducting.
2. a kind of thermally conductive multilayer circuit board according to claim 1, which is characterized in that the heat dissipating substrate plate is metal
Substrate plate or it is resin base plate or is ceramic base bottom plate.
3. a kind of thermally conductive multilayer circuit board according to claim 1, which is characterized in that the thermally conductive system of the multilayer circuit board
Number is more than or equal to 0.5 watt/square metre degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820448268.5U CN208462127U (en) | 2018-03-24 | 2018-03-24 | A kind of thermally conductive multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820448268.5U CN208462127U (en) | 2018-03-24 | 2018-03-24 | A kind of thermally conductive multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208462127U true CN208462127U (en) | 2019-02-01 |
Family
ID=65156837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820448268.5U Expired - Fee Related CN208462127U (en) | 2018-03-24 | 2018-03-24 | A kind of thermally conductive multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208462127U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
| CN115802596A (en) * | 2023-02-13 | 2023-03-14 | 四川斯艾普电子科技有限公司 | Thick-film ceramic circuit board and manufacturing method thereof |
-
2018
- 2018-03-24 CN CN201820448268.5U patent/CN208462127U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
| CN115802596A (en) * | 2023-02-13 | 2023-03-14 | 四川斯艾普电子科技有限公司 | Thick-film ceramic circuit board and manufacturing method thereof |
| CN115802596B (en) * | 2023-02-13 | 2023-05-05 | 四川斯艾普电子科技有限公司 | Thick film ceramic circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190201 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |