CN115802596A - Thick-film ceramic circuit board and manufacturing method thereof - Google Patents
Thick-film ceramic circuit board and manufacturing method thereof Download PDFInfo
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Abstract
A thick-film ceramic circuit board and a manufacturing method thereof belong to the field of ceramic circuit boards. The base unit includes: the first conductive layer, the heat dissipation layer and the ground layer are sequentially stacked from top to bottom. The first conducting layer is used for arranging electronic components and is provided with a plurality of heating areas. The heat dissipation layer is of a ceramic plate structure and is provided with a plurality of heat dissipation areas, each heat dissipation area comprises heat conduction metal embedded in the heat dissipation layer, and a plurality of first metal holes are formed in the peripheries of the heating areas and the heat dissipation areas. The grounding layer is made of copper, the bottom of the heat dissipation layer is provided with a second metal hole, and the second metal hole is connected with the heat conduction metal and the grounding layer. The manufacturing method of the ceramic circuit board comprises the following steps: s1: providing a ceramic plate, and forming a circuit of a first conductive layer on the top surface of the ceramic plate; s2: determining a heating area; s3: arranging heat-conducting metal on the heat dissipation layer; s4: arranging a grounding layer; s5: drilling; s6: and (6) metallization. Has good heat dissipation effect.
Description
Technical Field
The invention belongs to the technical field of circuit board structures and production, and particularly relates to a thick-film ceramic circuit board and a manufacturing method thereof.
Background
The rapid development of high-power electronic information products such as modern communication base stations, power modules, large computer servers, heating integrators and the like has prompted the development of microwave circuits towards high frequency bands, ultra wide bands, miniaturization and the like. In order to ensure the reliability of circuit signal transmission, the design and manufacture of the printed circuit board used as an electronic complete machine loading component must solve the problem of circuit board heat dissipation.
At present, the conventional heat dissipation methods of the PCB substrate mainly comprise the following two methods: (1) A heat sink or a fan is installed, but there are disadvantages in that noise is generated and additional space is required; (2) The PCB is provided with a metal base at the bottom, a heat-conducting aluminum layer is embedded in the middle of the PCB, and a copper block is embedded in the PCB through resin bonding.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a thick-film ceramic circuit board and a manufacturing method thereof, which have good heat dissipation effect and small overall size.
In order to realize the purpose of the invention, the following scheme is adopted:
a thick-film ceramic circuit board includes a base unit. The base unit includes: at least comprises a first conductive layer, a heat dissipation layer and a ground layer which are sequentially overlapped from top to bottom.
The first conducting layer is used for arranging electronic components, the electronic components comprise but are not limited to a power amplifier, an MOS field tube, a transistor, an IC module, an inductor, a capacitor and a resistor, and the first conducting layer is provided with a plurality of heating areas.
The heat dissipation layer is of a ceramic plate structure, a plurality of heat dissipation areas are arranged in the heating area above the heat dissipation layer, each heat dissipation area comprises heat conduction metal embedded in the heat dissipation layer, and a plurality of first metal holes are formed in the peripheries of the heating area and the heat dissipation area.
The grounding layer is made of copper, the bottom of the heat dissipation layer is provided with a second metal hole, and the second metal hole is connected with the heat conduction metal and the grounding layer.
Furthermore, a plurality of basic units are overlapped from top to bottom, ceramic plates are arranged between every two adjacent basic units, and the second metal holes of all the basic units are connected with the grounding layer at the bottommost layer, so that the grounding layers of the top basic unit and the middle basic unit are connected with the grounding layer at the bottommost layer.
Furthermore, the heat conducting metal has a three-dimensional structure, and the bottom of the second metal hole and the bottom of the heat conducting metal are positioned on the same plane.
Furthermore, the heat dissipation layer comprises four layers of ceramic plates which are overlapped from top to bottom, through holes are formed in the middle two ceramic plates corresponding to the heat dissipation area, and the through holes are used for arranging heat conduction metal.
Furthermore, the first conductive layer is formed on the top surface of the heat dissipation layer by adopting a thick film process.
Furthermore, a first ceramic layer is arranged between the first conducting layer and the heat dissipation layer, and the first conducting layer is formed on the first ceramic layer by adopting a thick film process.
Furthermore, a second conductive layer is arranged between the heat dissipation layer and the grounding layer, a second ceramic layer is arranged between the second conductive layer and the grounding layer, the second conductive layer is formed on the top surface of the second ceramic layer through a thin film process, the grounding layer is made of copper foil or is formed on the bottom surface of the second ceramic layer through a thick film process, and a circuit between the second conductive layer and the first conductive layer is connected through a third metal hole.
Furthermore, third ceramic layers are arranged between the first conducting layer and the heat dissipation layer, and the second conducting layer and the heat dissipation layer are formed on the top surface of the third ceramic layer below the first conducting layer through a thick film process.
Furthermore, the second metal hole is internally filled with copper or silver.
A method for manufacturing a thick-film ceramic circuit board is used for producing the ceramic circuit board and comprises the following steps:
s1: providing a ceramic plate for manufacturing a heat dissipation layer, and forming a circuit of a first conductive layer on the top surface of the ceramic plate through a thick film process;
s2: determining the range of the heating area through physical field simulation;
s3: arranging heat-conducting metal in the heat dissipation layer corresponding to the heating area;
s4: a grounding layer is arranged on the bottom surface of the heat dissipation layer;
s5: drilling, namely drilling an upper counter bore used for forming a first metal hole downwards from the top surface of the ceramic circuit board, wherein the counter bore is distributed at the outer side of the heating area and does not penetrate through the bottom surface of the heat dissipation layer; drilling a sunken hole for forming a second metal hole upwards from the bottom surface of the ceramic circuit board, wherein the top of the sunken hole is in contact with the bottom surface of the heat-conducting metal;
s6: and (4) metalizing, so that a metal layer is formed on the inner walls of the upper counter bore and the lower counter bore, and the metal is copper or silver.
The invention has the beneficial effects that: through discerning the heat zone from first conducting layer to set up the heat dissipation region that corresponds with the region that generates heat at the heat dissipation layer, and be equipped with heat conduction metal in the heat dissipation region, then make the regional heat of generating heat to heat conduction metal transmission through first metal hole, then give the ground plane of bottom through second metal hole with heat conduction metal's heat transmission, thereby the back that makes electrical components during operation produce can follow the circuit board gives off fast.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 shows a schematic structural diagram of a preferred embodiment of the basic unit of the present application.
Fig. 2 shows a partial cross-sectional view of the first conductive layer and the heat dissipation layer.
The labels in the figure are: a first conducting layer-1, a heating area-11, a first metal hole-12, a third metal hole-13, a heat dissipation layer-2, a heat dissipation area-21, a heat conducting metal-22, a second metal hole-23, a ceramic sheet-24, a ground layer-3, a third ceramic layer-4, a second conducting layer-5 and a second ceramic layer-6.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, but the embodiments described in the present invention are some, not all, of the embodiments of the present invention.
Example 1
A thick-film ceramic circuit board includes a base unit.
Specifically, as shown in fig. 1, the base unit includes: at least comprises a first conductive layer 1, a heat dissipation layer 2 and a ground layer 3 which are sequentially overlapped from top to bottom.
Specifically, the first conducting layer 1 is used for arranging electronic components, the electronic components include but are not limited to a power amplifier, a MOS field tube, a transistor, an IC module, an inductor, a capacitor, and a resistor, the first conducting layer 1 has a plurality of heating areas 11, and heat of the heating areas 11 is formed by heat generated when the electronic components with large heating power work.
Specifically, as shown in fig. 1 and 2, the heat dissipation layer 2 is a ceramic plate structure, and a plurality of heat dissipation areas 21 are provided corresponding to the upper heat generation area 11, and the outline shape of the heat dissipation areas 21 is matched with the outline shape of the heat generation area 11. The heat dissipation area 21 includes a heat conducting metal 22 embedded inside the heat dissipation layer 2, the heat conducting metal 22 is a metal with good heat conducting performance such as graphene, copper or silver, the periphery of the heating area 11 and the heat dissipation area 21 is provided with a plurality of first metal holes 12, and the first metal holes 12 are used for transferring heat of the heating area 11 to the heat conducting metal 22 corresponding to the heat dissipation area 21.
Specifically, as shown in fig. 1, the ground layer 3 is made of copper, and is made of copper foil or formed on the bottom surface of the heat dissipation layer 2 by using a thick film process, the bottom of the heat dissipation layer 2 has a second metal hole 23, the second metal hole 23 is connected to the heat conductive metal 22 and the ground layer 3, the second metal hole 23 is used for transferring heat of the heat conductive metal 22 to the ground layer 3, and finally the heat is dissipated through the ground layer 3.
Example 2
A thick-film ceramic circuit board comprises a structure which is overlapped with a plurality of basic units from top to bottom to form a multilayer circuit board. As shown in fig. 1, the base unit includes: comprises a first conductive layer 1, a heat dissipation layer 2 and a ground layer 3 which are sequentially overlapped from top to bottom. And the ceramic plates are arranged between the two adjacent upper and lower basic units, and the second metal holes 23 of all the basic units are connected with the grounding layer 3 at the bottommost layer, so that the grounding layers 3 of the top and middle basic units are connected with the grounding layer 3 at the bottommost layer, and the whole quick heat dissipation is realized. The first conducting layer 1 of the uppermost basic unit is used for arranging electronic components, the electronic components include but are not limited to a power amplifier, a MOS field tube, a transistor, an IC module, an inductor, a capacitor, and a resistor, and the first conducting layers 1 of the other basic units are only used for forming various functional circuit diagrams.
Preferably, the heat conducting metal 22 has a three-dimensional structure, and the bottom of the second metal hole 23 and the bottom of the heat conducting metal 22 are in the same plane, so that the overlapping range of the thickness of the second metal hole and the depth of the first metal hole 12 is increased, and the heat conducting area is enlarged, thereby accelerating the heat dissipation to the heat conducting metal 22.
Preferably, as shown in fig. 2, the heat dissipation layer 2 includes four layers of ceramic sheets 24 stacked from top to bottom, the two middle ceramic sheets 24 have through holes corresponding to the heat dissipation area 21, and the through holes are used for arranging the heat conducting metal 22, the structural design not only facilitates the installation of the heat conducting metal 22, but also ensures the overall structural strength of the circuit board and can achieve a good signal isolation effect because the top surface and the bottom surface of the heat dissipation layer 2 are respectively provided with one complete ceramic sheet 24.
Preferably, the first conductive layer 1 is formed on the top surface of the heat dissipation layer 2 by a thick film process to improve the power endurance of the first conductive layer 1.
Preferably, first conducting layer 1 and heat dissipation layer 2 have first ceramic layer between, first conducting layer 1 adopts the thick film technology to form in first ceramic layer, form first conducting layer 1 on solitary first ceramic layer, so that can make during production, make first conducting layer 1 alone, conveniently detect first conducting layer 1 alone, and conveniently carry out the physical field simulation experiment to it, in order to confirm the scope of the regional 11 that generates heat in advance, and make the sign, thereby be convenient for make corresponding heat dissipation region 21, and can also increase signal shielding effect through setting up third ceramic layer 7, avoid the signal of upper and lower layer circuit to interfere with each other.
Preferably, a second conductive layer 5 is disposed between the heat dissipation layer 2 and the ground layer 3, a second ceramic layer 6 is disposed between the second conductive layer 5 and the ground layer 3, the second conductive layer 5 is formed on a top surface of the second ceramic layer 6 through a thin film process, the ground layer 3 is a copper foil or is formed on a bottom surface of the second ceramic layer 6 through a thick film process, a circuit between the second conductive layer 5 and the first conductive layer 1 is connected through a third metal hole 13, the second conductive layer 5 is added to increase a three-dimensional layout of the circuit and avoid a planar layout of the circuit, so as to reduce a planar area of the circuit board, the second conductive layer 5 can be used to form a pll module circuit, a filter module circuit, an amplifier module circuit or a control circuit module circuit, a plurality of second conductive layers 5 can be disposed between the heat dissipation layer 2 and the ground layer 3 according to a required circuit amount, and each second conductive layer 5 is formed on a separate second ceramic layer 6.
Further preferably, as shown in fig. 1, a third ceramic layer 4 is provided between the second conductive layer 5 and the heat dissipation layer 2, and the first conductive layer 1 is formed on the top surface of the third ceramic layer 4 therebelow by a thick film process.
Preferably, the second metal hole 23 is filled with copper or silver to further increase heat dissipation efficiency.
Example 3
A method for manufacturing a thick-film ceramic circuit board is used for producing the ceramic circuit board and comprises the following steps:
s1: a ceramic board for making the heat dissipation layer 2 is provided, and the wiring of the first conductive layer 1 is formed on the top surface of the ceramic board by a thick film process.
S2: the range of the heat generating region 11 is determined by physical field simulation, and as shown in fig. 1, the shape of the heat generating region 11 may be a polygon, a circle or an ellipse.
S3: the heat conducting metal 22 is arranged in the heat dissipation layer 2 corresponding to the heating area 11, and in a specific mode, counter bores are formed in the bottom surface of a ceramic plate for manufacturing the heat dissipation layer 2 corresponding to the heating area 11, then the heat conducting metal 22 is filled, and then the counter bores are sealed by the ceramic plate.
S4: a ground layer 3 is provided on the bottom surface of the heat dissipation layer 2.
S5: drilling, namely drilling upper counter bores for forming first metal holes 12 downwards from the top surface of the ceramic circuit board, wherein the counter bores are distributed on the outer side of the heating area 11 and do not penetrate through the bottom surface of the heat dissipation layer 2; drilling a sunken hole for forming a second metal hole 23 upwards from the bottom surface of the ceramic circuit board, wherein the top of the sunken hole is in contact with the bottom surface of the heat conducting metal 22;
s6: and (4) metalizing, so that a metal layer is formed on the inner walls of the upper counter bore and the lower counter bore, and the metal is copper or silver.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (10)
1. A thick-film ceramic wiring board comprising a base unit, characterized in that the base unit comprises: at least comprises a first conductive layer (1), a heat dissipation layer (2) and a grounding layer (3) which are sequentially overlapped from top to bottom;
the first conducting layer (1) is used for arranging electronic components, the electronic components comprise but are not limited to a power amplifier, an MOS field tube, a transistor, an IC module, an inductor, a capacitor and a resistor, and the first conducting layer (1) is provided with a plurality of heating areas (11);
the heat dissipation layer (2) is of a ceramic plate structure, a plurality of heat dissipation areas (21) are arranged on the heating area (11) above the heat dissipation layer, each heat dissipation area (21) comprises a heat conduction metal (22) embedded in the heat dissipation layer (2), and a plurality of first metal holes (12) are formed in the peripheries of the heating area (11) and the heat dissipation area (21);
the grounding layer (3) is made of copper, the bottom of the heat dissipation layer (2) is provided with a second metal hole (23), and the second metal hole (23) is connected with the heat conduction metal (22) and the grounding layer (3).
2. The thick-film ceramic circuit board of claim 1, wherein a plurality of basic units are stacked from top to bottom, and ceramic sheets are disposed between two adjacent basic units, and the second metal holes (23) of all basic units are connected to the grounding layer (3) at the bottom layer, so as to connect the grounding layers (3) of the top and middle basic units to the grounding layer (3) at the bottom layer.
3. The thick-film ceramic circuit board of claim 1, wherein the heat conducting metal (22) has a three-dimensional structure, and the bottom of the second metal hole (23) is in the same plane as the bottom of the heat conducting metal (22).
4. The thick-film ceramic circuit board of claim 1, wherein the heat dissipation layer (2) comprises four layers of ceramic sheets (24) stacked from top to bottom, and the two middle ceramic sheets (24) have through holes corresponding to the heat dissipation area (21), and the through holes are used for arranging the heat conductive metal (22).
5. The thick-film ceramic wiring board of claim 1, wherein the first conductive layer (1) is formed on the top surface of the heat dissipation layer (2) by a thick film process.
6. The thick-film ceramic circuit board of claim 1, wherein a first ceramic layer is arranged between the first conductive layer (1) and the heat dissipation layer (2), and the first conductive layer (1) is formed on the first ceramic layer by a thick film process.
7. The thick-film ceramic circuit board of claim 1, wherein a second conductive layer (5) is disposed between the heat dissipation layer (2) and the ground layer (3), and a second ceramic layer (6) is disposed between the second conductive layer (5) and the ground layer (3), the second conductive layer (5) is formed on the top surface of the second ceramic layer (6) by a thin film process, the ground layer (3) is a copper foil or is formed on the bottom surface of the second ceramic layer (6) by a thick film process, and the circuit between the second conductive layer (5) and the first conductive layer (1) is connected through the third metal hole (13).
8. The thick-film ceramic circuit board of claim 7, wherein a third ceramic layer (4) is disposed between the first conductive layer (1) and the heat dissipation layer (2) and the second conductive layer (5), and the first conductive layer (1) is formed on the top surface of the third ceramic layer (4) therebelow by a thick film process.
9. The thick-film ceramic circuit board according to claim 1, wherein the second metal hole (23) is internally filled with metallic copper or silver.
10. A method of manufacturing a thick-film ceramic wiring board for producing the ceramic wiring board of any one of claims 1 to 9, comprising the steps of:
s1: providing a ceramic plate for manufacturing a heat dissipation layer (2), and forming a circuit of a first conductive layer (1) on the top surface of the ceramic plate through a thick film process;
s2: determining the range of the heating area (11) through physical field simulation;
s3: a heat conducting metal (22) is arranged in the heat dissipation layer (2) corresponding to the heating area (11);
s4: a grounding layer (3) is arranged on the bottom surface of the heat dissipation layer (2);
s5: drilling, namely drilling upper counter bores for forming first metal holes (12) downwards from the top surface of the ceramic circuit board, wherein the counter bores are distributed on the outer side of the heating area (11), and the upper counter bores do not penetrate through the bottom surface of the heat dissipation layer (2); drilling a sunken hole for forming a second metal hole (23) upwards from the bottom surface of the ceramic circuit board, wherein the top of the sunken hole is in contact with the bottom surface of the heat-conducting metal (22);
s6: and (4) metalizing, so that a metal layer is formed on the inner walls of the upper counter bore and the lower counter bore, and the metal is copper or silver.
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| CN202310103065.8A CN115802596B (en) | 2023-02-13 | 2023-02-13 | Thick film ceramic circuit board and manufacturing method thereof |
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| CN202310103065.8A CN115802596B (en) | 2023-02-13 | 2023-02-13 | Thick film ceramic circuit board and manufacturing method thereof |
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