CN115692247A - 加工装置 - Google Patents

加工装置 Download PDF

Info

Publication number: CN115692247A
Authority: CN; China
Prior art keywords: heating; unit; region; workpiece; sheet
Prior art date: 2021-07-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN202210852344.XA

Other languages

English (en)

Chinese (zh)

Inventor

政田孝行

川口吉洋

赵金艳

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-07-30

Filing date

2022-07-20

Publication date

2023-02-03

2022-07-20 Application filed by Disco Corp filed Critical Disco Corp

2023-02-03 Publication of CN115692247A publication Critical patent/CN115692247A/zh

Status Pending legal-status Critical Current

Links

238000012545 processing Methods 0.000 title claims abstract description 91
238000010438 heat treatment Methods 0.000 claims abstract description 496
238000004088 simulation Methods 0.000 claims abstract description 39
230000007246 mechanism Effects 0.000 claims abstract description 7
238000003754 machining Methods 0.000 description 21
238000010586 diagram Methods 0.000 description 18
238000000034 method Methods 0.000 description 17
230000008569 process Effects 0.000 description 13
238000004891 communication Methods 0.000 description 11
238000003825 pressing Methods 0.000 description 8
238000003860 storage Methods 0.000 description 4
230000009471 action Effects 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
239000000919 ceramic Substances 0.000 description 2
230000008859 change Effects 0.000 description 2
230000006870 function Effects 0.000 description 2
238000003384 imaging method Methods 0.000 description 2
239000000463 material Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
229910010271 silicon carbide Inorganic materials 0.000 description 2
238000001179 sorption measurement Methods 0.000 description 2
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
239000002390 adhesive tape Substances 0.000 description 1
238000004364 calculation method Methods 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000012790 confirmation Methods 0.000 description 1
238000010276 construction Methods 0.000 description 1
238000009826 distribution Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
239000011148 porous material Substances 0.000 description 1
238000003672 processing method Methods 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
239000000758 substrate Substances 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
- G05B19/4069—Simulating machining process on screen
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Human Computer Interaction (AREA)
Automation & Control Theory (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Laser Beam Processing (AREA)
Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Dicing (AREA)
Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

CN202210852344.XA 2021-07-30 2022-07-20 加工装置 Pending CN115692247A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2021-125357		2021-07-30
JP2021125357A JP2023020149A (ja)	2021-07-30	2021-07-30	加工装置

Publications (1)

Publication Number	Publication Date
CN115692247A true CN115692247A (zh)	2023-02-03

Family

ID=85060883

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN202210852344.XA Pending CN115692247A (zh)	2021-07-30	2022-07-20	加工装置

Country Status (4)

Country	Link
JP (1)	JP2023020149A (ja)
KR (1)	KR20230019017A (ja)
CN (1)	CN115692247A (ja)
TW (1)	TW202305910A (ja)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7109916B2 (ja)	2017-12-27	2022-08-01	株式会社ディスコ	分割装置

2021
- 2021-07-30 JP JP2021125357A patent/JP2023020149A/ja active Pending
2022
- 2022-07-06 KR KR1020220083062A patent/KR20230019017A/ko unknown
- 2022-07-20 CN CN202210852344.XA patent/CN115692247A/zh active Pending
- 2022-07-27 TW TW111128163A patent/TW202305910A/zh unknown

Also Published As

Publication number	Publication date
KR20230019017A (ko)	2023-02-07
JP2023020149A (ja)	2023-02-09
TW202305910A (zh)	2023-02-01

Legal Events

Date	Code	Title
2023-02-03	PB01	Publication
2023-02-03	PB01	Publication
2024-07-16	SE01	Entry into force of request for substantive examination

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