CN115684367B - Design method of cross type creeping wave probe - Google Patents
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Abstract
The application provides a design method of a cross type creeping wave probe, which relates to the technical field of probes. The wedge block structure in the probe is two parts with two symmetrical sides, the dimension parameters are the same, and the empty space in the probe and the front end is filled with damping absorbing materials.
Description
Technical Field
The application relates to the technical field of probes, in particular to a design method of a cross type creeping wave probe.
Background
The angle of the primary creeping wave is 75-83 degrees, and the angle is almost vertical to the thickness direction of the detected workpiece and is close to 90 degrees with the vertical crack in the workpiece, so that the creeping wave probe has good detection sensitivity on the vertical crack, has low requirement on the roughness of the surface of the workpiece, and is suitable for crack detection on the surface and the near surface.
The cross type probe adopts a structure of large departure angle oblique incidence of two wafers, not only considers the incidence angle of an elliptical tangent plane in the propagation direction of an acoustic beam, but also considers the normal inclination angle perpendicular to the elliptical tangent plane in the propagation direction of the acoustic beam, and the tangent plane perpendicular to the elliptical tangent plane in the propagation direction of the acoustic beam is adopted for determination.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a design method of a cross type creeping wave probe, which adopts a structure that two wafers are obliquely incident at a large departure angle, not only considers the incidence angle of an elliptical tangent plane in the propagation direction of an acoustic beam, but also considers the normal inclination angle perpendicular to the elliptical tangent plane in the propagation direction of the acoustic beam, and the cross type creeping wave probe is determined by adopting the tangent plane perpendicular to the elliptical tangent plane in the propagation direction of the acoustic beam.
In order to achieve the above purpose, the application is realized by the following technical scheme: a design method of a cross type creeping wave probe comprises the following steps;
s1, determining the geometric focusing length of an acoustic beam, wherein the stainless steel weld joint has larger attenuation on acoustic waves and short creeping wave detection distance, so that a method of scanning along the edge of the weld joint by using a creeping wave probe can be adopted;
s2, determining an acoustic wave incidence point, wherein a K point is a center point of the front end surface of the organic glass wedge block perpendicular to an acoustic wave path;
s3, determining the angle of the longitudinal wave refraction sound beam in the pipe and the incidence angle of the sound beam in the wedge block, making an elliptical tangent line through an incidence point P, and making a normal mn of the tangent line;
s4, determining the length of the wafer and the central reference position of the wafer, taking the K' point as a parallel line of the incident sound beam path line, taking the incident sound beam path line as a mirror image reference, and taking the distance between the mirror image lines as the length range of the wafer;
s5, determining the height of the wedge block, wherein the height MM 'or KK' of the front end of the wedge block, which is counted by the vertex B or M of the coupling surface tube, is determined according to the position of the wafer;
s6, determining a wafer width reference, wherein the wafer width reference can be determined through the corresponding relation between the elliptical tangent plane of the propagation direction of the sound beam and the normal tangent plane of the sound beam;
s7, determining the length and the width of the wedge block, wherein the length WA and the width AD of the wedge block can be properly adjusted according to the wafer size, and the length WA can be shorter to be more favorable for coupling of contact surfaces, and the length WA is preferably 32mm;
s8, manufacturing a probe, namely setting a shell of the probe by taking the outline dimension of a wedge block as a reference, wherein a cable jack is respectively arranged on the left and right sides of the shell, and the inside of the cable jack is connected with a corresponding wafer by using an electric wire;
preferably, in step S1, the geometric focusing length of the sound beam is determined, and because the stainless steel weld has a large attenuation to the sound wave and a short detection distance of the creeping wave, the creeping wave probe can be used for scanning along the edge of the weld, and the probe can be used for scanning back and forth to evaluate the internal defects. For this reason, the geometric intersection point of the sound beams of the creeping wave probe should be within the width range of the welding seam, and is usually designed to be located on the central axis of the welding seam, the vertical distance from the intersection point O to the front end of the probe is at least half of the width of the welding seam, as shown in fig. 2, i is equal to or larger than w/2, and this is the geometric focusing length of the front end of the probe.
Preferably, the sound wave incident point is determined in step S2, and the K point is a center point of the front end surface of the plexiglas wedge block perpendicular to the sound wave path. Since the attenuation of the acoustic wave in stainless steel is large, it should be considered that the path of the acoustic wave propagation is as short as possible, and therefore the distance from the point of incidence P to the point of incidence K of the acoustic wave should take a small value, the length of projection P' to point K taken here is 8mm, depending on the intended wafer size, as shown in fig. 3.
Preferably, in step S3, the angle of the longitudinal wave refracted sound beam in the pipe and the angle of incidence of the sound beam in the wedge are determined, a tangent line of an ellipse is made through the incidence point P, and the normal mn and the normal PQ of the tangent line are made, wherein for the pipe with the wall thickness of less than 6mm, the Q point should be selected at the midpoint position of the pipe wall thickness, namely bq=t/2; for a tube with a wall thickness of more than 6mm, the Q point should not be larger than the depth of 5mm below the surface of the tube, and the Q point is at the midpoint of the wall thickness, where the refraction angle is nPQ =77.7°, the angle of incidence of the sound beam is approximately 27.9 °, and the path line of the incident sound beam is drawn on the graph, as shown in fig. 4.
Preferably, in step S4, the wafer length and the center reference position thereof are determined, the parallel line of the incident beam path line is taken as the K' point, and the incident beam path line is taken as the mirror image line, so that the distance between the mirror image lines is the wafer length range, as in fig. 5, RS is 13.95mm at maximum, so that the wafer length reference can be 13mm, the wafer center reference position PT needs to consider the near field of the ultrasonic beam, and the length of PT should be controlled so that the length of PQ is not less than the near field length of the acoustic beam. The distance PT from the wafer center to the point of incidence was calculated here to be chosen to be 10mm.
Preferably, the wedge height is determined in step S5, and the height MM 'or KK "of the front end of the wedge measured from the apex B or M of the coupling surface tube should be determined according to the position of the wafer, as in fig. 6, MM' or KK" is 12MM, and the overall height a 'a "of the wedge can be determined autonomously, but the coverage area of the ultrasonic beam transmission must be ensured, where a' a" is 22MM.
Preferably, in step S6, the wafer width reference is determined by determining the correspondence between the elliptical tangential plane of the propagation direction of the acoustic beam and the normal tangential plane thereof, as in fig. 7, the perpendicular line passing through the P point from the horizontal line intersecting to the tangential plane is taken as the R 'point, the perpendicular line of m' n 'is taken as the R' point, and the length of R 'S' is taken as the wafer width reference, and the measured length is 8.39.
The manufacturing of the probe takes the outline dimension of the wedge block as a reference, a shell of the probe is arranged, a cable jack is respectively arranged on the left and the right of the shell, the inside of the jack is connected with a corresponding wafer by an electric wire, and the main structure of the probe comprises six parts, namely the wedge block, a piezoelectric wafer, a sound insulation layer, damping absorbing materials, the shell and a cable interface. The wedge block structure in the probe is two parts with two symmetrical sides, the dimension parameters are the same, and the empty space in the probe and the front end is filled with damping absorbing materials.
The application provides a design method of a cross type creeping wave probe. The beneficial effects are as follows:
firstly, determining an acoustic wave incidence point, wherein the K point is the center point of the front end surface of the organic glass wedge block perpendicular to an acoustic wave path. Since the attenuation of the sound wave in the stainless steel is large, the path of the sound wave propagation should be considered to be as short as possible, so the distance from the incident point P to the point K of the sound wave should be smaller, and the length of the projection P' to the projection K of the point P is 8mm according to the expected wafer size, as shown in FIG. 3;
determining the angle of the longitudinal wave refraction sound beam in the pipe and the incidence angle of the sound beam in the wedge block, making an elliptical tangent line through an incidence point P, and making a normal mn and PQ of the tangent line as a refraction sound beam path, wherein for the pipe with the wall thickness of less than 6mm, the Q point is usually selected at the midpoint position of the pipe wall thickness, namely BQ=T/2; for a pipe with a wall thickness of more than 6mm, selecting a Q point which is not more than 5mm deep below the surface of the pipe, measuring a refraction angle nPQ =77.7 DEG at the moment, approximating an incident angle of 27.9 DEG, and drawing a path line of the incident sound beam on the graph, wherein the Q point is at the midpoint of the wall thickness, as shown in fig. 4;
the wafer length and the central reference position thereof are determined, the parallel line of the incident sound beam path line is taken as the K' point, and the incident sound beam path line is taken as the mirror image line, so that the distance between the mirror image lines is the wafer length range, as RS is 13.95mm at maximum in figure 5, therefore, the wafer length reference can be taken as 13mm, the near field of the ultrasonic beam is considered at the central reference position PT of the wafer, and the length of PT is controlled to be not less than the near field length of the sound beam. The distance PT from the center of the wafer to the incident point is selected to be 10mm through calculation;
the wedge height is determined and the wedge front height MM 'or KK "measured from the coupling face tube apex B or M should be determined according to the position of the wafer, as in figure 6, MM' or KK" takes 12MM, the overall height a 'a "of the wedge can be determined autonomously, but the coverage area of the ultrasound beam transmission must be ensured, where a' a" takes 22MM;
determining a wafer width reference, wherein the wafer width reference can be determined through the corresponding relation between an elliptical tangent plane of the propagation direction of the acoustic beam and a normal tangent plane of the acoustic beam, as shown in fig. 7, taking a horizontal line from a point R to a vertical line from the intersecting tangent plane of the horizontal line to a point P at a point R ', taking a vertical line from a point R ' to a point m ' n ' and extending twice the length to a point S ', wherein the length of R ' S ' is the wafer width reference, and the measured length is 8.39;
the manufacturing of the probe takes the outline dimension of the wedge block as a reference, a shell of the probe is arranged, a cable jack is respectively arranged on the left and the right of the shell, the inside of the jack is connected with a corresponding wafer by an electric wire, and the main structure of the probe comprises six parts, namely the wedge block, a piezoelectric wafer, a sound insulation layer, damping absorbing materials, the shell and a cable interface. The wedge block structure in the probe is two parts with two symmetrical sides, the dimension parameters are the same, and the empty space in the probe and the front end is filled with damping absorbing materials;
the cross probe adopts a structure of large departure angle oblique incidence of two wafers, solves the problems that the ultrasonic creeping wave probe is inconvenient to measure time delay on the incidence angle of an elliptical section in the propagation direction of an acoustic beam and the normal inclination incidence point perpendicular to the elliptical section in the propagation direction of the acoustic beam, is simple and convenient to operate, can conveniently, rapidly and accurately measure the incidence point position of the ultrasonic creeping wave probe and the time of ultrasonic waves in the probe, and can find the accurate positioning of the horizontal position of a defect.
Drawings
FIG. 1 is a flow chart of the present application;
FIG. 2 is a schematic diagram of a structure for determining the geometrical focusing length of an acoustic beam according to the present application;
FIG. 3 is a schematic diagram of a structure for determining an incidence point of an acoustic wave according to the present application;
FIG. 4 is a schematic diagram of the structure of the application for determining the angle of the longitudinal wave refracted beam in the pipe and the angle of incidence of the beam in the wedge;
FIG. 5 is a schematic view of a structure for determining the length of a wafer and the center reference position thereof in the present application;
FIG. 6 is a schematic view of the structure of the wedge height determination in the present application;
FIG. 7 is a schematic structural diagram of the determination of wafer width in the present application;
FIG. 8 is a schematic structural view of the wedge of the present application with its length and width determined;
FIG. 9 is a schematic diagram of the complete structure of the probe in the present application;
FIG. 10 is a schematic structural view of three-dimensional transformation of the external dimensions of a wedge in the present application;
FIG. 11 is a schematic structural diagram of three-dimensional conversion of wafer size and position in accordance with the present application;
fig. 12 is a schematic structural view showing the determination of the wafer positioning ridge line in the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Examples:
as shown in fig. 1 to 12, an embodiment of the present application provides a design method of a cross type creeping wave probe, including the following steps;
s1, determining the geometric focusing length of an acoustic beam, wherein the stainless steel weld joint has larger attenuation on acoustic waves and short creeping wave detection distance, so that a method of scanning along the edge of the weld joint by using a creeping wave probe can be adopted;
s2, determining an acoustic wave incidence point, wherein a K point is a center point of the front end surface of the organic glass wedge block perpendicular to an acoustic wave path;
s3, determining the angle of the longitudinal wave refraction sound beam in the pipe and the incidence angle of the sound beam in the wedge block, making an elliptical tangent line through an incidence point P, and making a normal mn of the tangent line;
s4, determining the length of the wafer and the central reference position of the wafer, taking the K' point as a parallel line of the incident sound beam path line, taking the incident sound beam path line as a mirror image reference, and taking the distance between the mirror image lines as the length range of the wafer;
s5, determining the height of the wedge block, wherein the height MM 'or KK' of the front end of the wedge block, which is counted by the vertex B or M of the coupling surface tube, is determined according to the position of the wafer;
s6, determining a wafer width reference, wherein the wafer width reference can be determined through the corresponding relation between the elliptical tangent plane of the propagation direction of the sound beam and the normal tangent plane of the sound beam;
s7, determining the length and the width of the wedge block, wherein the length WA and the width AD of the wedge block can be properly adjusted according to the wafer size, and the length WA can be shorter to be more favorable for coupling of contact surfaces, and the length WA is preferably 32mm;
s8, manufacturing a probe, namely setting a shell of the probe by taking the outline dimension of a wedge block as a reference, wherein a cable jack is respectively arranged on the left and right sides of the shell, and the inside of the cable jack is connected with a corresponding wafer by using an electric wire;
it can be understood that in the application, the geometric focusing length of the sound beam is determined in the step S1, and the stainless steel weld joint has larger attenuation to the sound wave and short creeping wave detection distance, so that the creeping wave probe can be adopted to scan along the edge of the weld joint, and the probe can also be scanned in a back-and-forth movement manner to evaluate the internal defects. For this reason, the geometric intersection point of the sound beams of the creeping wave probe should be within the width range of the welding seam, and is usually designed to be located on the central axis of the welding seam, the vertical distance from the intersection point O to the front end of the probe is at least half of the width of the welding seam, as shown in fig. 2, i is equal to or larger than w/2, and this is the geometric focusing length of the front end of the probe.
It can be understood that, in the present application, the sound wave incident point is determined in step S2, and the K point is the center point of the front end surface of the plexiglass wedge perpendicular to the sound wave path. Since the attenuation of the acoustic wave in stainless steel is large, it should be considered that the path of the acoustic wave propagation is as short as possible, and therefore the distance from the point of incidence P to the point of incidence K of the acoustic wave should take a small value, the length of projection P' to point K taken here is 8mm, depending on the intended wafer size, as shown in fig. 3.
It will be understood that in the present application, in step S3, the angle of the longitudinal wave refracted sound beam in the pipe and the angle of incidence of the sound beam in the wedge are determined, a tangent line is made to the ellipse passing through the incidence point P, and the normal mn of the tangent line is made, PQ is the refracted sound beam path, and for pipes with wall thickness of 6mm or less, the point Q should be selected at the midpoint position of the pipe wall thickness, i.e., bq=t/2; for a tube with a wall thickness of more than 6mm, the Q point should not be larger than the depth of 5mm below the surface of the tube, and the Q point is at the midpoint of the wall thickness, where the refraction angle is nPQ =77.7°, the angle of incidence of the sound beam is approximately 27.9 °, and the path line of the incident sound beam is drawn on the graph, as shown in fig. 4.
It can be understood that in the present application, the wafer length and the center reference position thereof are determined in step S4, the parallel line of the incident beam path line is taken as the K' point, and the incident beam path line is taken as the mirror image line, so that the distance between the mirror image lines is the wafer length range, as RS in fig. 5 is 13.95mm at maximum, so that the wafer length reference can be taken as 13mm, the near field of the ultrasonic beam needs to be considered at the wafer center reference position PT, and the length of PT should be controlled so that the length of PQ is not less than the near field length of the acoustic beam. The distance PT from the wafer center to the point of incidence was calculated here to be chosen to be 10mm.
It will be appreciated that in the present application, the wedge height determined in step S5 should be determined according to the wafer position by the wedge front end height MM 'or KK "measured from the coupling surface tube apex B or M, as in fig. 6, MM' or KK" is taken to be 12MM, and the entire height a 'a "of the wedge can be autonomously determined, but the coverage area of the ultrasonic beam transmission must be ensured, where a' a" is taken to be 22MM.
It can be understood that in the present application, in step S6, the wafer width reference is determined by the correspondence between the elliptical tangential plane of the propagation direction of the acoustic beam and the normal tangential plane thereof, as in fig. 7, the length of R ' S ' is the wafer width reference, and the measured length is 8.39, when the perpendicular line passing through the P point from the horizontal line intersecting with the tangential plane is made at the R ' point, and the perpendicular line of m ' n ' is made at the R ' point and extends twice the length to the S ' point.
It can be understood that in the application, the manufacturing of the probe in the step S7 takes the outline dimension of the wedge as a reference, a shell of the probe is arranged, a cable jack is respectively arranged on the left and the right of the shell, the inside of the cable jack is connected with a corresponding wafer by an electric wire, and the main structure of the probe comprises six parts, namely the wedge, the piezoelectric wafer, the sound insulation layer, the damping absorbing material, the shell and the cable interface. The wedge block structure in the probe is two parts with two symmetrical sides, the dimension parameters are the same, and the empty space in the probe and the front end is filled with damping absorbing materials.
Working principle:
firstly, determining an acoustic wave incidence point, wherein the K point is the center point of the front end surface of the organic glass wedge block perpendicular to an acoustic wave path. Since the attenuation of the sound wave in the stainless steel is large, the path of the sound wave propagation should be considered to be as short as possible, so the distance from the incident point P to the point K of the sound wave should be smaller, and the length of the projection P' to the projection K of the point P is 8mm according to the expected wafer size, as shown in FIG. 3;
determining the angle of the longitudinal wave refraction sound beam in the pipe and the incidence angle of the sound beam in the wedge block, making an elliptical tangent line through an incidence point P, and making a normal mn and PQ of the tangent line as a refraction sound beam path, wherein for the pipe with the wall thickness of less than 6mm, the Q point is usually selected at the midpoint position of the pipe wall thickness, namely BQ=T/2; for a pipe with a wall thickness of more than 6mm, selecting a Q point which is not more than 5mm deep below the surface of the pipe, measuring a refraction angle nPQ =77.7 DEG at the moment, approximating an incident angle of 27.9 DEG, and drawing a path line of the incident sound beam on the graph, wherein the Q point is at the midpoint of the wall thickness, as shown in fig. 4;
the wafer length and the central reference position thereof are determined, the parallel line of the incident sound beam path line is taken as the K' point, and the incident sound beam path line is taken as the mirror image line, so that the distance between the mirror image lines is the wafer length range, as RS is 13.95mm at maximum in figure 5, therefore, the wafer length reference can be taken as 13mm, the near field of the ultrasonic beam is considered at the central reference position PT of the wafer, and the length of PT is controlled to be not less than the near field length of the sound beam. The distance PT from the center of the wafer to the incident point is selected to be 10mm through calculation;
the wedge height is determined and the wedge front height MM 'or KK "measured from the coupling face tube apex B or M should be determined according to the position of the wafer, as in figure 6, MM' or KK" takes 12MM, the overall height a 'a "of the wedge can be determined autonomously, but the coverage area of the ultrasound beam transmission must be ensured, where a' a" takes 22MM;
determining a wafer width reference, wherein the wafer width reference can be determined through the corresponding relation between an elliptical tangent plane of the propagation direction of the acoustic beam and a normal tangent plane of the acoustic beam, as shown in fig. 7, taking a horizontal line from a point R to a vertical line from the intersecting tangent plane of the horizontal line to a point P at a point R ', taking a vertical line from a point R ' to a point m ' n ' and extending twice the length to a point S ', wherein the length of R ' S ' is the wafer width reference, and the measured length is 8.39;
the manufacturing of the probe takes the outline dimension of the wedge block as a reference, a shell of the probe is arranged, a cable jack is respectively arranged on the left and the right of the shell, the inside of the jack is connected with a corresponding wafer by an electric wire, and the main structure of the probe comprises six parts, namely the wedge block, a piezoelectric wafer, a sound insulation layer, damping absorbing materials, the shell and a cable interface. The wedge block structure in the probe is two parts with two symmetrical sides, the dimension parameters are the same, and the empty space in the probe and the front end is filled with damping absorbing materials;
the cross probe adopts a structure of large off-angle oblique incidence of two wafers, not only considers the incidence angle of an elliptical tangent plane of the propagation direction of an acoustic beam, but also considers the normal inclination angle perpendicular to the elliptical tangent plane of the propagation direction of the acoustic beam, and is determined by adopting a tangent plane perpendicular to the elliptical tangent plane of the propagation direction of the acoustic beam.
It should be understood that the foregoing examples of the present application are merely illustrative of the present application and not limiting of the embodiments of the present application, and that various other changes and modifications can be made by those skilled in the art based on the above description, and it is not intended to be exhaustive of all of the embodiments, and all obvious changes and modifications that come within the scope of the application are defined by the following claims.
Claims (1)
1. The design method of the cross type creeping wave probe comprises six parts, namely a wedge block, a piezoelectric wafer, a sound insulation layer, damping absorbing materials, a shell and a cable interface, wherein the wedge block is arranged in the probe, the wedge block structure is two parts with two symmetrical sides, the dimension parameters are the same, the free space in the probe and the front end is filled with the damping absorbing materials, and the cross type probe adopts a structure with two wafers which are inclined and incident at a large departure angle, and the design method is characterized in that: comprises the following steps of;
s1, determining the geometric focusing length of an acoustic beam: because the stainless steel welding seam has larger attenuation to sound waves and short creeping wave detection distance, in order to evaluate internal defects, the geometric intersection point of the sound beams of the creeping wave probe should be in the width range of the welding seam so as to be positioned on the central axis of the welding seam, and a method of scanning along the edge of the welding seam by the creeping wave probe is adopted;
s2, determining an elliptical tangent plane in the propagation direction of the sound wave, and plotting by taking the major axis of the elliptical tangent plane as the horizontal direction and the minor axis as the vertical direction, determining a sound wave incident point P, wherein the K point is the center point of the front end surface of the organic glass wedge block vertical to the sound wave path, and taking the projection P 'point of the P point on the horizontal line passing through the K point according to the expected wafer size, wherein the length from the P' point to the K point is 8mm because the sound wave is greatly attenuated in the stainless steel;
s3, determining the refraction sound beam angle of the longitudinal wave of the pipe and the sound beam incidence angle of the wedge block: making a tangent line of the elliptical tangential plane by passing through an incidence point P, and making a normal mn and PQ of the tangent line as a refraction sound beam path, wherein for a pipe with the wall thickness of less than 6mm, the point Q is at the midpoint position of the pipe wall thickness; for a pipe with the wall thickness of more than 6mm, the Q point is not more than 5mm deep below the surface of the pipe, and the Q point is at the midpoint of the wall thickness, the refraction angle is measured at the moment and nPQ =77.7 degrees, the incident angle of the sound beam is 27.9 degrees, and the path line of the incident sound beam is drawn on an elliptic tangential plane figure;
s4, determining the length of the wafer and the central reference position of the wafer: the point K 'is the intersection point of the perpendicular line passing through the point K and the elliptical section, the parallel line of the incident sound beam path line is made through the point K' and the mirror line is made by taking the incident sound beam path line as a mirror reference, the distance between the mirror lines is the wafer length range, 13mm is taken, the near field of the ultrasonic beam is considered at the reference position of the center of the wafer, the center of the wafer is T, the length of PT is controlled to ensure that the length of PQ is not less than the near field length of the sound beam, and the distance PT from the center of the wafer T to the point P of incidence is 10mm through calculation;
s5, determining the height of the wedge: the front end height of the wedge block counted from the top point B of the coupling surface pipe is 12mm according to the position of the wafer, and the whole height of the wedge block is 22mm and is required to ensure the coverage area of ultrasonic beam transmission;
s6, determining a wafer width reference, and determining the wafer width reference through the corresponding relation between the elliptical tangent plane of the propagation direction of the acoustic beam and the normal tangent plane of the acoustic beam: the R point is the intersection point of the wafer and the parallel line of the incident sound beam path line passing through the K 'point, the R point is used as a horizontal line to cross the vertical line passing through the P point in the normal section corresponding to the elliptical section at the R' point, the R 'point is used as a vertical line passing through the m' n 'point and extends twice the length to the S' point, the m 'n' point is the normal line passing through the P point in the normal section, and the length of the R 'S' point is 8.39mm as the width standard of the wafer;
s7, determining the length and the width of the wedge block: the length WA and the width AD of the wedge block are properly adjusted according to the wafer size, and the length WA is 32mm;
s8, manufacturing a probe: the outer dimension of the wedge block is used as a reference, a shell of the probe is arranged, a cable jack is respectively arranged on the left side and the right side of the shell, and the inside of the jack is connected with a corresponding wafer by using an electric wire.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101258403A (en) * | 2005-08-26 | 2008-09-03 | 住友金属工业株式会社 | Ultrasonic probe, ultrasonic flaw detector, ultrasonic flaw detecting method and production method of seamless pipe |
| CN101300484A (en) * | 2005-11-21 | 2008-11-05 | 杰富意钢铁株式会社 | Pipe ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method |
| CN103115963A (en) * | 2013-01-29 | 2013-05-22 | 上海中油天宝巴圣钢管有限公司 | Method for detecting welding seam of resistance weld pipe through creeping wave and creeping wave probe for method |
| CN104515807A (en) * | 2014-10-27 | 2015-04-15 | 浙江省特种设备检验研究院 | Pressure pipeline ultrasonic internal detection automation device |
| CN113466341A (en) * | 2021-07-02 | 2021-10-01 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | Radial crack creeping wave detection method for outer wall of opening of steam-water pipeline seat |
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2022
- 2022-12-28 CN CN202211689010.1A patent/CN115684367B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101258403A (en) * | 2005-08-26 | 2008-09-03 | 住友金属工业株式会社 | Ultrasonic probe, ultrasonic flaw detector, ultrasonic flaw detecting method and production method of seamless pipe |
| CN101300484A (en) * | 2005-11-21 | 2008-11-05 | 杰富意钢铁株式会社 | Pipe ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method |
| CN103115963A (en) * | 2013-01-29 | 2013-05-22 | 上海中油天宝巴圣钢管有限公司 | Method for detecting welding seam of resistance weld pipe through creeping wave and creeping wave probe for method |
| CN104515807A (en) * | 2014-10-27 | 2015-04-15 | 浙江省特种设备检验研究院 | Pressure pipeline ultrasonic internal detection automation device |
| CN113466341A (en) * | 2021-07-02 | 2021-10-01 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | Radial crack creeping wave detection method for outer wall of opening of steam-water pipeline seat |
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