CN115684367A - Design method of crossed creeping wave probe - Google Patents
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Abstract
The invention provides a design method of a cross-type creeping wave probe, which relates to the technical field of essence extraction. The wedge block structure in the probe is two symmetrical parts at two sides, the size parameters are the same, and the empty space in the probe and at the front end is filled with damping absorption materials.
Description
Technical Field
The invention relates to the technical field of probes, in particular to a design method of a cross-type creeping wave probe.
Background
A creeping wave probe. The angle of the primary creeping wave is between 75 and 83 degrees, is almost vertical to the thickness direction of the detected workpiece, and is close to 90 degrees with the crack in the vertical direction in the workpiece, so the method has better detection sensitivity for the vertical crack, has low requirement on the roughness of the surface of the workpiece, and is suitable for the crack detection of the surface and the near surface.
The cross probe adopts a structure that two wafers are obliquely incident at a large off angle, the incident angle of an elliptic section of a sound beam propagation direction and the normal inclination angle perpendicular to the elliptic section of the sound beam propagation direction are considered, and the cross probe is determined by adopting a section perpendicular to the elliptic section of the sound beam propagation direction.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a design method of a cross type creeping wave probe, the cross type probe adopts a structure that two wafers are obliquely incident at a large angle, the incident angle of an elliptic section in the sound beam propagation direction is considered, the normal inclination angle vertical to the elliptic section in the sound beam propagation direction is also considered, and the cross section vertical to the elliptic section in the sound beam propagation direction is adopted for determining.
In order to achieve the purpose, the invention is realized by the following technical scheme: a design method of a cross-type creeping wave probe comprises the following steps;
s1, determining the geometric focusing length of the acoustic beam, wherein a creeping wave probe can be adopted to scan along the edge of a welding seam because the stainless steel welding seam has larger attenuation to the acoustic wave and short creeping wave detection distance;
s2, determining an incident point of the sound wave, wherein a point K is the central point of the front end face of the organic glass wedge block perpendicular to the path of the sound wave;
s3, determining the angle of a longitudinal wave refraction sound beam in the pipe and the incident angle of a sound beam in the wedge block, drawing a tangent line of an ellipse through a point P of the incident point, and drawing a normal mn of the tangent line;
s4, determining the length of the wafer and the central reference position of the wafer, taking the K' point as a parallel line of an incident sound beam path line, taking the incident sound beam path line as a mirror image reference as a mirror image line, and taking the distance between the group of mirror image lines as the length range of the wafer;
s5, determining the height of the wedge block, wherein the height MM 'or KK' of the front end of the wedge block, counted from the top point B or M of the coupling surface pipe, is determined according to the position of the wafer;
s6, determining the width reference of the wafer, and determining the width reference of the wafer according to the corresponding relation between the elliptical section in the sound beam propagation direction and the normal section of the elliptical section;
s7, determining the length and the width of the wedge block, wherein the length WA and the width AD of the wedge block can be properly adjusted according to the size of the wafer, the length WA can be shorter, which is more favorable for contact surface coupling, and 32mm can be adopted in the example;
s8, manufacturing a probe, namely setting a shell of the probe by taking the shape size of the wedge block as a reference, wherein the left side and the right side of the shell are respectively provided with a cable socket, and the insides of the sockets are connected with corresponding wafers by wires;
preferably, the geometric focusing length of the acoustic beam is determined in the step S1, and because the stainless steel weld seam has large attenuation to the acoustic wave and short creeping wave detection distance, a method of scanning the edge of the weld seam by using a creeping wave probe can be adopted, and scanning by moving the probe back and forth can also be performed, so as to evaluate the internal defect. For this reason, the geometric intersection point of the acoustic beam of the creeping wave probe is within the width range of the weld joint, and is usually designed to be located on the central axis of the weld joint, the vertical distance from the intersection point O to the front end of the probe is at least half of the width of the weld joint, as shown in fig. 2, l is not less than w/2, which is the geometric focusing length of the front end of the probe.
Preferably, the sound wave incident point is determined in step S2, and the point K is a central point of the front end face of the organic glass wedge perpendicular to the sound wave path. Since the attenuation of the sound wave in stainless steel is large, the path of sound wave propagation should be considered as short as possible, so the distance from the point of incidence P to K of the sound wave should be a small value, and the length of the projection P' to K of the point P is 8mm according to the expected wafer size, as shown in fig. 3.
Preferably, in step S3, the angle of the refracted longitudinal wave beam in the tube and the angle of the incident beam in the wedge are determined, a tangent of the ellipse is drawn through the point P of incidence, and a normal mn of the tangent is drawn, PQ is the path of the refracted beam, and for a tube with a wall thickness of less than 6mm, the point Q should be generally selected at the midpoint of the tube wall thickness, that is, BQ = T/2; for a pipe with a wall thickness greater than 6mm, point Q is selected to be no greater than 5mm depth below the pipe surface, and point Q is at the midpoint of the wall thickness, where the angle of refraction ≦ nPQ =77.7 ° is measured, approximately resulting in a beam incident angle of 27.9 °, the incident beam path line being plotted on the graph, as shown in fig. 4.
Preferably, the wafer length and the center reference position thereof are determined in step S4, parallel lines of the incident beam path line are taken via point K', and mirror lines thereof are taken with the incident beam path line as a mirror reference, and the distance between the mirror lines of the group is the wafer length range, as RS in fig. 5 is 13.95mm at the maximum, so that the wafer length reference may be 13mm here, the wafer center reference position PT should consider the near field of the ultrasonic beam, and the length of PT should be controlled so that the length of PQ is not less than the near field length of the beam. The distance PT from the center of the wafer to the point of incidence is chosen to be 10mm here by calculation.
Preferably, the wedge height determined in step S5, i.e. the height MM 'or KK "of the wedge front end as measured from the coupling plane tube vertex B or M, should be determined according to the position of the wafer, as shown in fig. 6, MM' or KK" is 12MM, and the overall height a 'a "of the wedge can be determined autonomously, but it is necessary to ensure the coverage area for transmitting the ultrasonic beam, where a' a" is 22MM.
Preferably, the wafer width reference is determined in step S6, and the width reference of the wafer is determined by the corresponding relationship between the elliptical section of the propagation direction of the acoustic beam and the normal section thereof, as shown in fig. 7, a horizontal line is made from the point R, a vertical line passing through the point P is crossed with the normal section at the point R ', a vertical line is made from the point R ' to the normal section, a vertical line is made from the point R ' to the point P ', and the vertical line extends to the point S ' by twice the length, so that the length of the point R ' S ' is the width reference of the wafer, and the measured length is 8.39.
The manufacturing of the probe is characterized in that the outer shell of the probe is arranged by taking the overall dimension of the wedge as a reference, the left side and the right side of the outer shell are respectively provided with a cable socket, the inner parts of the sockets are connected with corresponding wafers through wires, and the main structure of the probe comprises six parts, namely the wedge, the piezoelectric wafers, a sound insulation layer, a damping absorption material, the outer shell and a cable interface. The wedge block structure in the probe is two symmetrical parts at two sides, the size parameters are the same, and the empty space in the probe and at the front end is filled with damping absorption materials.
The invention provides a design method of a cross-type creeping wave probe. The method has the following beneficial effects:
firstly, an incident point of sound wave is determined, and a K point is the central point of the front end face of the organic glass wedge block perpendicular to a sound wave path. Since the attenuation of the sound wave in stainless steel is large, the path of sound wave propagation should be considered as short as possible, so the distance from the incident point P to the point K of the sound wave should be a small value, and the length from the point P to the point K is 8mm according to the expected wafer size, as shown in FIG. 3;
determining the angle of a longitudinal wave refracted sound beam in a pipe and the incident angle of a sound beam in a wedge block, drawing a tangent of an ellipse through an incident point P, drawing a normal mn of the tangent, wherein PQ is a refracted sound beam path, and for a pipe with the wall thickness of less than 6mm, the Q point is usually selected to be at the midpoint of the pipe wall thickness, namely BQ = T/2; for the pipe with the wall thickness of more than 6mm, selecting a point Q which is not more than 5mm deep below the surface of the pipe and is at the midpoint of the wall thickness, measuring the refraction angle nPQ =77.7 degrees, looking up a table 1, approximating the incident angle of the sound beam to be 27.9 degrees, and drawing the path line of the incident sound beam on the graph, as shown in fig. 4;
determining the wafer length and its center reference position, making parallel lines of incident sound beam path lines through point K', and making mirror image lines with the incident sound beam path lines as mirror image reference, the distance between the group of mirror image lines is the wafer length range, such as RS maximum 13.95mm in FIG. 5, therefore the wafer length reference can be 13mm, the wafer center reference position PT must consider the near field of the ultrasonic beam, the length of PT should be controlled to make the length of PQ not less than the near field length of the sound beam. Calculating to obtain a distance PT from the center of the wafer to the incident point of 10mm;
the wedge height is determined such that the wedge front end height MM ' or KK "from the coupling surface tube vertex B or M should be determined according to the position of the wafer, as in figure 6, MM ' or KK ' is 12MM, the overall height A ' of the wedge block can be determined autonomously, but the coverage area for transmitting ultrasonic beams must be ensured, wherein A ' is 22MM;
determining the width reference of the wafer, determining the width reference of the wafer according to the corresponding relation between the elliptical section and the normal section of the acoustic beam in the propagation direction, and as shown in FIG. 7, taking a horizontal line from a point R as a horizontal line, intersecting the normal section through a vertical line of a point P at a point R ', taking a vertical line of m ' n ' from the point R ' and extending the length of the vertical line to a point S ' by twice, wherein the length of the point R ' S ' is the width reference of the wafer, and the measured length is 8.39;
the manufacturing of the probe is characterized in that the outer shell of the probe is arranged by taking the overall dimension of the wedge as a reference, the left side and the right side of the outer shell are respectively provided with a cable socket, the inner parts of the sockets are connected with corresponding wafers through wires, and the main structure of the probe comprises six parts, namely the wedge, the piezoelectric wafers, a sound insulation layer, a damping absorption material, the outer shell and a cable interface. The wedge block structure in the probe is two symmetrical parts at two sides, the size parameters are the same, and the empty space in the probe and at the front end is filled with damping absorption materials;
the cross probe adopts a structure that two wafers are obliquely incident at a large off angle, solves the problems that an ultrasonic creeping wave probe is inconvenient to measure time delay and normal dip angle incident points vertical to the elliptic section of the sound beam propagation direction on the incident angle of the elliptic section of the sound beam propagation direction, is simple and convenient to operate, can conveniently, quickly and accurately measure the incident point position of the ultrasonic creeping wave probe and the time of ultrasonic waves in the probe, and further can find the accurate positioning of the horizontal position of a defect.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic diagram of a structure for determining the geometric focusing length of an acoustic beam according to the present invention;
FIG. 3 is a schematic diagram of the structure for determining the incident point of the sound wave in the present invention;
FIG. 4 is a schematic structural diagram of the present invention for determining the angle of a longitudinal refracted sound beam in a pipe and the angle of incidence of a sound beam in a wedge;
FIG. 5 is a schematic diagram of a structure for determining the length of a wafer and the reference position of the center thereof according to the present invention;
FIG. 6 is a schematic view of the wedge height determination structure of the present invention;
FIG. 7 is a schematic view of a wafer width determining structure according to the present invention;
FIG. 8 is a structural view of the wedge according to the present invention, in which the length and width of the wedge are determined;
FIG. 9 is a schematic view of the complete structure of the probe in the present invention;
FIG. 10 is a structural diagram of three-dimensional transformation of the overall dimension of the wedge according to the present invention;
FIG. 11 is a structural diagram of three-dimensional transformation of the size and position of a wafer according to the present invention;
fig. 12 is a structural diagram illustrating the determination of the wafer positioning ridge line in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1 to 12, an embodiment of the present invention provides a method for designing a cross-type creeping wave probe, including the following steps;
s1, determining the geometric focusing length of the acoustic beam, wherein a creeping wave probe can be adopted to scan along the edge of a welding seam because the stainless steel welding seam has larger attenuation to the acoustic wave and short creeping wave detection distance;
s2, determining an incident point of the sound wave, wherein a point K is the central point of the front end face of the organic glass wedge block perpendicular to the path of the sound wave;
s3, determining the angle of a longitudinal wave refraction sound beam in the pipe and the incident angle of a sound beam in the wedge block, drawing a tangent line of an ellipse through a point P of the incident point, and drawing a normal mn of the tangent line;
s4, determining the length of the wafer and the central reference position of the wafer, taking the K' point as a parallel line of an incident sound beam path line, taking the incident sound beam path line as a mirror image reference as a mirror image line, and taking the distance between the group of mirror image lines as the length range of the wafer;
s5, determining the height of the wedge block, wherein the height MM 'or KK' of the front end of the wedge block, counted from the top point B or M of the coupling surface pipe, is determined according to the position of the wafer;
s6, determining the width reference of the wafer, and determining the width reference of the wafer according to the corresponding relation between the elliptical section in the sound beam propagation direction and the normal section of the elliptical section;
s7, determining the length and width of the wedge block, wherein the length WA and width AD of the wedge block can be properly adjusted according to the size of the wafer, the length WA can be shorter, which is more favorable for contact surface coupling, and 32mm can be adopted in the example;
s8, manufacturing a probe, namely arranging a shell of the probe by taking the external dimension of the wedge block as a reference, wherein the left side and the right side of the shell are respectively provided with a cable socket, and the insides of the sockets are connected with corresponding wafers by wires;
it can be understood that, in the present application, the geometric focusing length of the acoustic beam is determined in step S1, and since the stainless steel weld has a relatively large attenuation to the acoustic wave and a short detection distance of the creeping wave, a method of scanning the edge of the weld by using a creeping wave probe may be adopted, or a scanning operation of moving the probe back and forth may also be performed, so as to evaluate the internal defects. For this reason, the geometric intersection point of the acoustic beam of the creeping wave probe is within the width range of the weld joint, and is usually designed to be located on the central axis of the weld joint, the vertical distance from the intersection point O to the front end of the probe is at least half of the width of the weld joint, as shown in fig. 2, l is not less than w/2, which is the geometric focusing length of the front end of the probe.
It can be understood that, in the present application, the acoustic wave incident point is determined in step S2, and the point K is the center point of the front end face of the organic glass wedge perpendicular to the path of the acoustic wave. Since the attenuation of sound waves in stainless steel is large, the path of sound wave propagation should be considered as short as possible, so the distance from the point of sound wave incidence P to the point K should be small, and the length from the point P' to the point K is 8mm according to the expected wafer size, as shown in fig. 3.
It can be understood that in the present application, the angle of the longitudinal refracted sound beam in the pipe and the angle of incidence of the sound beam in the wedge are determined in step S3, a tangent of the ellipse is drawn through the point P of incidence, and a normal mn to the tangent is drawn, PQ is the refracted sound beam path, and for a pipe with a wall thickness of less than 6mm, the Q point should be generally selected at the midpoint of the pipe wall thickness, that is, BQ = T/2; for a pipe with a wall thickness greater than 6mm, point Q is selected to be no greater than 5mm depth below the pipe surface, and point Q is at the midpoint of the wall thickness, where the angle of refraction ≦ nPQ =77.7 ° is measured, approximately resulting in a beam incident angle of 27.9 °, the incident beam path line being plotted on the graph, as shown in fig. 4.
It is understood that, in the present application, the wafer length and the center reference position thereof are determined in step S4, the parallel line of the incident beam path line is taken as the point K', and the mirror image line is taken as the mirror image reference of the incident beam path line, and the distance between the group of mirror image lines is the wafer length range, as shown in fig. 5, RS is 13.95mm at the maximum, so that the wafer length reference may be 13mm here, the wafer center reference position PT should consider the near field of the ultrasonic beam, and the length of PT should be controlled so that the length of PQ is not less than the near field length of the beam. The distance PT from the center of the wafer to the point of incidence is chosen to be 10mm here by calculation.
It is understood that in the present application, the wedge height determined in step S5, i.e., the wedge front end height MM 'or KK "as measured from the coupling surface tube vertex B or M, should be determined according to the position of the wafer, and as shown in fig. 6, MM' or KK" is 12MM, the overall height a 'a "of the wedge can be determined autonomously, but it is necessary to ensure the coverage area for transmitting the ultrasonic beam, where a' a" is 22MM.
It is understood that in the present application, the wafer width reference is determined in step S6, and the width reference of the wafer is determined by the corresponding relationship between the elliptical section of the acoustic beam propagation direction and the normal section thereof, for example, in fig. 7, the horizontal line from the point R is perpendicular to the vertical line passing through the point P to the tangential section at the point R ', the vertical line from the point R' is perpendicular to the tangential section at the point P 'and extends twice the length to the point S', and then the length of R 'S' is the width reference of the wafer, and the measured length is 8.39.
It can be understood that, in the present application, in the manufacturing of the probe in step S7, the outer casing of the probe is set based on the external dimensions of the wedge, the left and right of the outer casing are respectively provided with a cable socket, the inside of the socket is connected with the corresponding wafer by an electric wire, wherein the main structure of the probe includes six parts, namely, the wedge, the piezoelectric wafer, the sound insulation layer, the damping absorption material, the outer casing and the cable interface. The wedge block structure in the probe is two symmetrical parts at two sides, the size parameters are the same, and the empty space in the probe and at the front end is filled with damping absorption materials.
The working principle is as follows:
firstly, an incident point of sound wave is determined, and a K point is the central point of the front end face of the organic glass wedge block perpendicular to a sound wave path. Since the attenuation of the sound wave in stainless steel is large, the propagation path of the sound wave should be considered as short as possible, so the distance from the incident point P of the sound wave to the point K should be a small value, and the length from the point P to the point K is 8mm according to the expected wafer size, as shown in fig. 3;
determining the angle of a longitudinal wave refracted sound beam in a pipe and the incident angle of a sound beam in a wedge block, drawing a tangent of an ellipse through an incident point P, drawing a normal mn of the tangent, wherein PQ is a refracted sound beam path, and for a pipe with the wall thickness of less than 6mm, the Q point is usually selected to be at the midpoint of the pipe wall thickness, namely BQ = T/2; for the pipe with the wall thickness of more than 6mm, selecting a point Q which is not more than 5mm deep below the surface of the pipe and is at the midpoint of the wall thickness, measuring the refraction angle nPQ =77.7 degrees, looking up a table 1, approximating the incident angle of the sound beam to be 27.9 degrees, and drawing the path line of the incident sound beam on the graph, as shown in fig. 4;
determining the wafer length and its center reference position, making parallel lines of incident sound beam path lines through point K', and making mirror image lines with the incident sound beam path lines as mirror image reference, the distance between the group of mirror image lines is the wafer length range, such as RS maximum 13.95mm in FIG. 5, therefore the wafer length reference can be 13mm, the wafer center reference position PT must consider the near field of the ultrasonic beam, the length of PT should be controlled to make the length of PQ not less than the near field length of the sound beam. Calculating to obtain a distance PT from the center of the wafer to the incident point of 10mm;
the wedge height is determined such that the wedge front end height MM ' or KK "from the coupling surface tube vertex B or M should be determined according to the position of the wafer, as in figure 6, MM ' or KK ' is 12MM, the overall height A ' of the wedge block can be determined autonomously, but the coverage area for transmitting ultrasonic beams must be ensured, wherein A ' is 22MM;
determining the width reference of the wafer, determining the width reference of the wafer according to the corresponding relation between the elliptical section and the normal section of the acoustic beam in the propagation direction, and as shown in FIG. 7, taking a horizontal line from a point R as a horizontal line, intersecting the normal section through a vertical line of a point P at a point R ', taking a vertical line of m ' n ' from the point R ' and extending the length of the vertical line to a point S ' by twice, wherein the length of the point R ' S ' is the width reference of the wafer, and the measured length is 8.39;
the manufacturing of the probe is characterized in that the outer shell of the probe is arranged by taking the overall dimension of the wedge as a reference, the left side and the right side of the outer shell are respectively provided with a cable socket, the inner parts of the sockets are connected with corresponding wafers through wires, and the main structure of the probe comprises six parts, namely the wedge, the piezoelectric wafers, a sound insulation layer, a damping absorption material, the outer shell and a cable interface. The wedge block structure in the probe is two symmetrical parts at two sides, the size parameters are the same, and the empty space in the probe and at the front end is filled with damping absorption materials;
the cross probe adopts a structure that two wafers are obliquely incident at a large off angle, not only the incident angle of the elliptic section of the sound beam propagation direction is considered, but also the normal inclination angle vertical to the elliptic section of the sound beam propagation direction is considered, and the cross section vertical to the elliptic section of the sound beam propagation direction is adopted for determination.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and obvious variations and modifications may be made within the scope of the present invention.
Claims (8)
1. A design method of a cross-type creeping wave probe is characterized by comprising the following steps: comprises the following steps;
s1, determining the geometric focusing length of the acoustic beam, wherein a creeping wave probe is adopted to scan along the edge of a welding seam because a stainless steel welding seam has large attenuation to the acoustic wave and short creeping wave detection distance;
s2, determining an incident point of the sound wave, wherein a point K is the central point of the front end face of the organic glass wedge block perpendicular to the path of the sound wave;
s3, determining the tube longitudinal wave refraction sound beam angle and the wedge block sound beam incidence angle, drawing a tangent line of the ellipse through the incidence point P, and drawing a normal mn of the tangent line;
s4, determining the length of the wafer and the central reference position of the wafer, and taking the path line of the incident sound beam as a mirror image reference as a mirror image line of the wafer, wherein the distance between the group of mirror image lines is the length range of the wafer;
s5, determining the height of the wedge block, wherein the height of the front end of the wedge block at the top point B of the coupling surface pipe is determined according to the position of the wafer;
s6, determining the width reference of the wafer, and determining the width reference of the wafer according to the corresponding relation between the elliptical section in the sound beam propagation direction and the normal section of the elliptical section;
s7, determining the length and width of the wedge block, wherein the length WA and width AD of the wedge block are properly adjusted according to the size of the wafer, and the length WA is shorter than the length WA by 32mm;
and S8, manufacturing the probe, namely setting a shell of the probe by taking the overall dimension of the wedge block as a reference, wherein the left side and the right side of the shell are respectively provided with a cable socket, and the insides of the sockets are connected with corresponding wafers by wires.
2. The method for designing a cross-type creeping wave probe according to claim 1, wherein: step S1, determining the geometric focusing length of the acoustic beam, wherein the attenuation of the stainless steel welding seam to the acoustic wave is large, the creeping wave detection distance is short so as to evaluate the internal defect, and the geometric intersection point of the acoustic beam of the creeping wave probe is within the width range of the welding seam and is usually designed to be positioned on the central axis of the welding seam.
3. The design method of the cross-type creeping wave probe according to claim 1, characterized in that: and S2, determining an incident point of the sound wave, wherein the point K is the central point of the front end face of the organic glass wedge block vertical to the sound wave path, and the length from the point P to the point K is 8mm according to the expected size of the wafer because the sound wave is greatly attenuated in stainless steel.
4. The design method of the cross-type creeping wave probe according to claim 1, characterized in that: s3, determining the angle of a longitudinal wave refracted sound beam in the pipe and the incident angle of the sound beam in the wedge block, drawing a tangent line of an ellipse passing through a point P of an incident point, and drawing a normal mn of the tangent line, wherein PQ is a refracted sound beam path, and for the pipe with the wall thickness of less than 6mm, namely BQ = T/2; for a pipe with a wall thickness of more than 6mm, the point Q is selected not to be greater than 5mm depth below the surface of the pipe, and the point Q is at the midpoint of the wall thickness, at which the angle of refraction ≦ nPQ =77.7 ° is measured, approximately resulting in a beam incident angle of 27.9 °, which is plotted on the graph.
5. The design method of the cross-type creeping wave probe according to claim 1, characterized in that: determining the wafer length and the center reference position thereof in step S4, taking the K' point as a parallel line of the incident sound beam path line, and taking the incident sound beam path line as a mirror image reference as a mirror image line, wherein the distance between the group of mirror image lines is the wafer length range, therefore, the wafer length reference is taken as 13mm, the wafer center reference position PT needs to consider the near field of the ultrasonic beam, the length of PT should be controlled so that the length of PQ is not less than the near field length of the sound beam, and the distance PT from the wafer center to the incident point is selected as 10mm through calculation.
6. The design method of the cross-type creeping wave probe according to claim 1, characterized in that: the wedge height determined in step S5, i.e. the wedge front end height MM 'or KK "from the coupling surface tube vertex B or M, should be determined according to the wafer position, MM' or KK" is 12MM, and the overall height a 'a "of the wedge is determined autonomously, but it is necessary to ensure the coverage area for transmitting ultrasonic beams, where a' a" is 22MM.
7. The method for designing a cross-type creeping wave probe according to claim 1, wherein: s6, determining the width reference of the wafer according to the corresponding relation between the elliptical section and the normal section of the acoustic beam in the propagation direction, taking the R point as a horizontal line, intersecting the normal section with a vertical line passing through the P point at the R ' point, taking the R ' point as a vertical line of m ' n ' and extending for twice the length to the S ' point, wherein the length of the R ' S ' is the width reference of the wafer, and the measurement length is 8.39mm.
8. The design method of the cross-type creeping wave probe according to claim 1, characterized in that: and S7, manufacturing the probe, namely setting a shell of the probe by taking the overall dimension of the wedge as a reference, arranging cable sockets on the left and right sides of the shell respectively, and connecting the insides of the sockets with corresponding wafers by using wires, wherein the main structure of the probe comprises six parts, namely the wedge, a piezoelectric wafer, a sound insulation layer, damping absorption materials, the shell and a cable interface, the wedge structure in the probe is two bilaterally symmetrical parts, the dimensional parameters are the same, and the empty spaces inside the probe and at the front end of the probe are filled with the damping absorption materials.
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| CN202211689010.1A CN115684367B (en) | 2022-12-28 | 2022-12-28 | Design method of cross type creeping wave probe |
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| CN101258403A (en) * | 2005-08-26 | 2008-09-03 | 住友金属工业株式会社 | Ultrasonic probe, ultrasonic flaw detector, ultrasonic flaw detecting method and production method of seamless pipe |
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| CN104515807A (en) * | 2014-10-27 | 2015-04-15 | 浙江省特种设备检验研究院 | Pressure pipeline ultrasonic internal detection automation device |
| CN113466341A (en) * | 2021-07-02 | 2021-10-01 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | Radial crack creeping wave detection method for outer wall of opening of steam-water pipeline seat |
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| CN101258403A (en) * | 2005-08-26 | 2008-09-03 | 住友金属工业株式会社 | Ultrasonic probe, ultrasonic flaw detector, ultrasonic flaw detecting method and production method of seamless pipe |
| CN101300484A (en) * | 2005-11-21 | 2008-11-05 | 杰富意钢铁株式会社 | Pipe ultrasonic flaw detecting apparatus and ultrasonic flaw detecting method |
| CN103115963A (en) * | 2013-01-29 | 2013-05-22 | 上海中油天宝巴圣钢管有限公司 | Method for detecting welding seam of resistance weld pipe through creeping wave and creeping wave probe for method |
| CN104515807A (en) * | 2014-10-27 | 2015-04-15 | 浙江省特种设备检验研究院 | Pressure pipeline ultrasonic internal detection automation device |
| CN113466341A (en) * | 2021-07-02 | 2021-10-01 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | Radial crack creeping wave detection method for outer wall of opening of steam-water pipeline seat |
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