CN115305542A - Electroplating device and method for non-metal plated part with nano metal conductive object adsorbed on surface - Google Patents

Abstract

The invention discloses an electroplating device and method for a non-metal plated part with a nano metal conductive object adsorbed on the surface, comprising the following steps: placing the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in a first electroplating solution without forced convection to carry out first electroplating at a first preset current density, and completely covering the surface of the nanometer metal conductive object to form a first coating; placing the non-metal plated part after the first electroplating into a second electroplating solution with forced convection for second electroplating at a second preset current density to form a second coating on the surface of the first coating; wherein the second predetermined current density is greater than the first predetermined current density. The invention can realize electroplating on the insulating material with the surface adsorbed with the nano metal conductive substance, and improve the electroplating quality of the insulating material.

Description

Electroplating device and method for non-metal plated part with nano metal conductive object adsorbed on surface

Technical Field

The invention relates to the field of electroplating, in particular to an electroplating device and method for a non-metal plated part with a nano metal conductive object adsorbed on the surface.

Background

Electroplating is a process in which electron transfer occurs at the interface between a conductive material and an electroplating solution, and metal ions in the electroplating solution are reduced to elemental atoms and are orderly accumulated on the surface of the conductive material. Therefore, there are several prerequisites for the electroplating process to proceed smoothly: (a) the plating material is a conductive material; (b) contacting the plating material with a plating solution; (c) Proper potential difference exists between the electroplating materials and the electroplating solution; (d) the reduced metal atom has an adsorption site.

In most electroplating situations, the conductive material is a metal material, the contact between the conductive material and the electroplating solution is ensured by completely immersing the plating part in the electroplating solution, the potential difference between the conductive material and the electroplating solution is provided by an external power supply, and the surface of the metal material is generally a better adsorption point.

However, when electroplating is performed on the surface of the insulating material, one method is to form a metal conductive layer on the surface of the insulating material, and the specific method includes Chemical plating, PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), and the like; and the other large direction is to adsorb conductive materials, such as carbon series (carbon black, graphite and graphene) and conductive polymers (large pi bonds, such as polypyridine), and can also adsorb nano metal materials. Electroplating on the surface of the metal conductive layer, which is not obviously different from common metal block electroplating; however, electroplating on the surface of the adsorbed and conductive material may be significantly different from electroplating on the surface of the metal bulk material, and the difference is mainly caused by the difference of the crystal nucleus.

Researches show that the surface of the covering adsorbate such as carbon series and conductive polymer does not have good electroplating crystallization nuclei, and the crystallization nuclei are generated in the electroplating process; therefore, it has been studied to form a conductive polymer coating layer and to adsorb metal particles as crystal nuclei.

For the non-metal plated part adsorbing the nano metal conductive substance, the nano conductive metal on the surface is a good crystal nucleus, but the form of the nano conductive metal may change in the electroplating process and even fall off in the form change process, so that the electroplating quality of the non-metal plated part is poor.

Disclosure of Invention

Therefore, the electroplating device and the electroplating method for the nonmetal plated part with the nanometer metal conductive object adsorbed on the surface are provided, and the problem that in the electroplating process in the prior art, the nanometer metal conductive object falls off from the surface of the nonmetal plated part, so that the electroplating quality of the nonmetal plated part is poor is solved.

The invention provides an electroplating method of a non-metal plated part with a nano metal conductive object adsorbed on the surface, which comprises the following steps:

placing the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in first electroplating solution without forced convection to carry out first electroplating at a first preset current density, and completely covering the surface of the nanometer metal conductive object to form a first plating layer;

placing the non-metal plated part after the first electroplating into a second electroplating solution of forced convection to carry out second electroplating at a second preset current density, and forming a second coating on the surface of the first coating; wherein the second predetermined current density is greater than the first predetermined current density.

The invention provides an electroplating method of a non-metal plated part with a nano-metal conductive object adsorbed on the surface, which forms a first plating layer completely covering the surface of the nano-metal conductive object in an electroplating environment with low current density and no forced convection in first electroplating, and ensures that the adsorbed nano-metal conductive object can not fall off from the surface of the non-metal plated part, thereby avoiding the phenomenon that the plating layer on part of the surface of the non-metal plated part is thin or not plated.

Optionally, the first predetermined current density is 0.01 to 0.5 amps per square decimeter and the second predetermined current density is 0.1 to 10 amps per square decimeter.

Optionally, the step of performing the first electroplating on the plated part with the nano metal conductive material adsorbed on the surface in the first electroplating solution with the first preset current density and without forced convection includes the following specific steps:

placing the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in first electroplating liquid of a first plating tank without forced convection to carry out first electroplating at a first preset current density;

the step of placing the plated part after the first electroplating in a second electroplating solution with a second preset current density and forced convection for second electroplating specifically comprises the following steps:

and after the first electroplating of the nonmetal plating part in the first plating tank is finished, the nonmetal plating part enters a second electroplating solution which is communicated with the first plating tank and is forcibly convected in the second plating tank to carry out the second electroplating at a second preset current density.

Optionally, the first and second plating solutions are the same composition.

The second aspect of the application provides an electroplating device of a non-metal plating part with a nano metal conductive object adsorbed on the surface, which comprises a first plating tank and a second plating tank; the first plating bath is used for carrying out primary electroplating on the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in first electroplating solution with first preset current density and without forced convection;

the second plating tank is used for carrying out secondary electroplating on the non-metal plated part in second electroplating solution with second preset current density and forced convection; the second preset current density is greater than the first preset current density.

The invention provides an electroplating device of a non-metal plated part with a nano metal conductive object adsorbed on the surface, which is characterized in that first electroplating is carried out in a first plating tank, a first coating completely covering the surface of the nano metal conductive object is formed in an electroplating environment with low current density and no forced convection, and the adsorbed nano metal conductive object is ensured not to fall off from the surface of the non-metal plated part, so that the phenomenon that the coating on the partial surface of the non-metal plated part is thin or not plated is avoided.

Optionally, a forced convection mechanism is arranged in the second plating tank to realize forced convection of the second plating solution, and the forced convection mechanism comprises at least two forced convection nozzles.

Optionally, the first plating bath and the second plating bath are arranged adjacently, a flow-blocking partition plate is arranged between the first plating bath and the second plating bath, and a plated part channel for allowing the non-metal plated part to enter the second plating bath from the first plating bath is formed in the flow-blocking partition plate.

Optionally, the number of the flow-resisting partition plates is N, N is larger than or equal to 2, and the flow-resisting partition plates are arranged in parallel.

Optionally, the width of the plated channels of the flow-impeding baffles is different.

Optionally, the flow blocking partition plate is obliquely arranged towards the second plating bath.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 is a schematic view of an electroplating apparatus for a non-metal plated part with a nano-metal conductive material adsorbed on the surface thereof according to an embodiment of the present invention;

FIG. 2 is another top view of an electroplating apparatus for a non-metal plated part with a nano-metal conductive material adsorbed on the surface thereof according to an embodiment of the present invention;

FIG. 3 is another side view of the electroplating apparatus for non-metal plating with a nano-metal conductive material adsorbed on the surface thereof according to an embodiment of the present invention;

FIG. 4 is a schematic view of a baffle plate provided in accordance with an embodiment of the present invention;

FIG. 5 is a top view of an electroplating apparatus including a non-metal plating part with a nano-metal conductive material adsorbed on the surface of a flow-blocking partition plate according to an embodiment of the present invention;

FIG. 6 is a side view of an electroplating apparatus including a non-metal plating part having a nano-metal conductive material adsorbed on a surface of a flow blocking partition plate according to an embodiment of the present invention;

FIG. 7 is another top view of an electroplating apparatus including a non-metal plating part with a nano-metal conductive material adsorbed on the surface of a flow-blocking partition plate according to an embodiment of the present invention;

FIG. 8 is another side view of an electroplating apparatus including a non-metal plate having a nano-metal conductor adsorbed on a surface thereof and including a flow-blocking partition plate according to an embodiment of the present invention;

FIG. 9 is a flowchart of a method for electroplating a non-metal plated part with a nano-metal conductive material adsorbed on the surface thereof according to an embodiment of the present invention;

wherein 101 is a first plating tank, 102 is a second plating tank, 103 is a spray pipe, 104 is a plating part, and 105 is a flow-resisting partition plate.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

Furthermore, in the description of the present invention and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present invention. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

It should be understood that, the sequence numbers of the steps in the following embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

Referring to fig. 1, a schematic diagram of an electroplating apparatus for a non-metal plated part with a nano-metal conductive material adsorbed on the surface according to an embodiment of the present invention is shown, the electroplating apparatus includes a first plating tank 101 and a second plating tank 102:

the first plating bath 101 is used for performing first electroplating on the nonmetal plated part with the nanometer metal conductive object adsorbed on the surface in a first electroplating solution without forced convection at a first preset current density to form a first plating layer on the surface of the nanometer metal conductive object of the nonmetal plated part;

the second plating tank 102 is used for performing second electroplating on the non-metal plated part in a second electroplating solution of forced convection at a second preset current density to form a second plating layer on the surface of the first plating layer; the second predetermined current density is greater than the first predetermined current density.

The first plating bath 101 and the second plating bath 102 are both bath bodies formed by welding carbon steel plates with insulating coatings, and the bath bodies welded by the carbon steel plates are high in strength, firm, durable, low in cost and convenient to manufacture. The insulating coating may be polytetrafluoroethylene, PVC, or the like. The sizes of the first plating tank 101 and the second plating tank 102 are determined according to the size of the non-metal plated part and the production capacity.

The first plating tank 101 and the second plating tank 102 are filled with plating liquid, and specifically, the first plating tank 101 or the second plating tank 102 is provided with an inlet through which plating liquid can be supplied into the first plating tank 101 or the second plating tank 102, and the first plating tank 101 or the second plating tank 102 is further provided with a drain port through which used plating liquid can be drained to the outside so as to facilitate replacement of the plating liquid.

The electroplating solution is a solution containing metal ions or a solution containing nano metal particles, the metal ions can be silver ions, gold ions, zinc ions, copper ions, nickel ions and the like, and the electroplating solution containing the metal ions is prepared by the following steps: a salt containing a metal or the like is dissolved in a solvent such as pure water or a salt solution. The preparation method of the electroplating solution containing the nano metal particles comprises the following steps: the nanoparticles of the metal are dispersed in a solvent.

The reason why the forced convection mechanism 103 is not provided in the first plating tank 101 is that: the first plating bath 103 is not provided with a structure for forced convection, so that electrolyte is not sprayed out, the stirring of electroplating solution is reduced, and the adsorbed nano metal conductive object is ensured not to fall off from the surface of the non-metal plated part, thereby avoiding that the plating layer at the partial position of the non-metal plated part is thin or not plated.

Preferably, a forced convection mechanism 103 is provided in the second plating tank 102 to achieve forced convection of the second plating liquid. Specifically, the forced convection mechanism 103 includes at least two forced convection nozzles.

The forced convection mechanism 103 is arranged in the second plating tank 102 because: the forced convection mechanism 103 is used to eject the electrolyte solution to stir the plating solution. In the electroplating process, the electroplating efficiency of the non-metal plated part can be improved by stirring the electroplating solution, the purpose of stirring is to make the electroplating solution flow, the convection of the electroplating solution is accelerated, metal complex ions consumed nearby an electroplating cathode are supplemented in time, and the quality of an electroplating coating is ensured.

The non-metal plating part can be a high-molecular conductive polymer, and can also be an electric insulating material, such as one or more of silicon nitride, silicon dioxide, ceramic and organic resin.

The first plating tank 101 and the second plating tank 102 are both provided with a power supply capable of controlling the magnitude of the output current, and the power supply may be a dc stabilized power supply or a pulse power supply.

The implementation method that the first preset current density in the first plating bath 101 is smaller than the second preset current density in the second plating bath 102 is as follows:

as is known, the first plating tank 101 and the second plating tank 102 are provided with power supplies, respectively.

One or more first power supplies of the first plating tank 101 may be connected to a first controller, the first controller being connected to the plating anode and the plating cathode in the first plating tank 101, respectively, the plating anode and the plating cathode in the first plating tank 101 being connected to the anode and the cathode of the first power supply, respectively, the plating anode and the plating cathode in the first plating tank 101 being placed in the plating solution to form a loop. The first controller can time on and off the first power supply, control the electroplating time and the current density required by electroplating, and adjust the length of the electroplating time and the magnitude of the applied current.

One or more second power supplies of the second plating tank 102 may be connected to a second controller, the second controller being connected to the plating anode and the plating cathode in the second plating tank 102, respectively, the plating anode and the plating cathode in the second plating tank 102 being connected to the anode and the cathode of the second power supply, respectively, the plating anode and the plating cathode in the second plating tank 102 being placed in the plating solution to form a loop. The second controller can time and switch on the second power supply, control the electroplating time and the current density required by electroplating, and adjust the electroplating time and the applied current.

In this way, the current densities of the plating liquids in the first plating tank 101 and the second plating tank 102 can be controlled by the first controller and the second controller, so that the current output by the first power supply is smaller than the current output by the second power supply, and the first preset current density in the first plating tank 101 is controlled to be smaller than the second preset current density in the second plating tank 102.

It should be noted that, the non-metal plated part placed in the first plating tank 101 is already attached to the surface of the non-metal plated part by the prior art scheme such as coating before being placed in the first plating tank 101.

The electroplating device for the non-metal plated part with the nano metal conductive object adsorbed on the surface is provided with the first plating tank 101 and the second plating tank 102 which are communicated, wherein the first plating tank 101 is used for electroplating the non-metal plated part with the nano metal conductive object adsorbed on the surface to form a metal coating covering the nano metal conductive object on the surface of the non-metal plated part, and the second plating tank 102 is used for functionally electroplating the non-metal plated part with the metal coating. Since the effects of the first plating tank 101 and the second plating tank 102 on the non-metal plated article are different, the convection conditions and the current densities of the plating liquids in the first plating tank 101 and the second plating tank 102 are also different. The form of the nano metal conductive object adsorbed on the surface of the non-metal plated part is stable by controlling the electroplating solution without forced convection and applying smaller current density in the first plating tank 101, so that the problem of falling of the nano metal adsorbed object is reduced, and a good metal coating is formed on the surface of the non-metal plated part. The convection of the electroplating solution is accelerated by controlling the forced convection of the electroplating solution in the second plating tank 102, so that metal complex ions consumed near the electroplating cathode are supplemented in time, and the electroplating efficiency of the non-metal plated part with the surface covered by the metal coating is improved by applying a larger current density.

In one example, the first predetermined current density is 0.01-0.5 amps per square decimeter and the second predetermined current density is 0.1-10 amps per square decimeter.

The first predetermined current density setting is lower than the second predetermined current density because: when the first preset current density is lower, the falling of the nano metal conductive object adsorbed on the surface of the non-metal plated part due to the change of the appearance can be reduced. There is no forced convection in the first plating tank 101, and the first preset current density is objectively required to be small, otherwise, a side reaction or abnormal crystallization of the metal plating layer may be caused.

The reason that the second predetermined current density setting is higher than the first predetermined current density is that: after the non-metal plated part with the surface adsorbed with the nano metal conductive object is electroplated in the first plating tank 101, at this time, the surface of the non-metal plated part made of the insulating material is already covered with a complete metal conductive layer, i.e., a metal plating layer. Therefore, any plating parameters required for achieving the plating target as the conductive material are used in the second plating tank 102, and at this time, when the second predetermined current density is high, the polarization of the plating cathode is also high, and the crystallization of the metal plating layer of the non-metal plated part becomes fine and compact.

In one example, the electroplating apparatus for a non-metal plated part with a nano-metal conductive material adsorbed on the surface further includes: and a circulating jet pump is arranged in the second plating bath 102, two ends of the circulating jet pump are respectively connected with a liquid inlet pipe and a liquid outlet pipe, and the liquid inlet pipe and the liquid outlet pipe of the circulating pump are arranged in the electroplating solution. Wherein, the drain pipe is connected with the nozzle, and the nozzle is used for spouting solution and realizes that solution evenly stirs.

The setting of circulation jet-flow pump is that the plating solution can be in circulation flow under circulation jet-flow pump's drive to realized that electroplating process in-process plating solution flows, thereby the plating solution can carry out the convection current and improve the electroplating efficiency of second coating bath.

In one example, temperature sensors can be disposed on the inner walls of the first plating tank 101 and the second plating tank 102, the temperature sensors, the controller and the heating assembly are connected in sequence, the temperature sensors collect temperature signals and upload the temperature signals to the controller, and the controller controls the heating assembly to be powered on or powered off according to the temperature signals so as to keep the temperature of the electroplating solution in the first plating tank or the second plating tank stable.

The heating assembly can be an electric heating pipe, the electric heating pipe is made of a conductive material with an insulating coating on the surface, and the conductive material can be: cadmium-nickel alloy, or iron-cadmium-nickel, or iron-chromium-aluminum alloy. The electric heating tube may be spirally arranged. Therefore, the contact area of the electric heating pipe and the electroplating solution is large, namely, the heat exchange area is increased, and the heating efficiency is improved.

In an example, an air dispersion pipe can be disposed at the bottom of the second plating tank 102, and the air dispersion pipe is connected with a compressed air pipeline.

External compressed air enters the air dispersion pipe through the compressed air pipeline to stir the electroplating solution in the second plating tank 102, so that convection is increased, and the electroplating efficiency is improved.

Preferably, the first plating tank 101 and the second plating tank 102 are arranged adjacently, a flow-resisting partition plate is arranged between the first plating tank 101 and the second plating tank 102, and a plating piece channel for allowing the non-metal plating piece to enter the second plating tank 102 from the first plating tank 101 is arranged on the flow-resisting partition plate. The first plating tank 101 and the second plating tank 102 are integrally provided as a tank body. In this case, as a preferable mode, the first plating tank 101 and the second plating tank 102 are formed in one tank body by being partitioned by a designed flow-resisting partition plate; and the first plating tank 101 and the second plating tank 102 are communicated, so that the continuity of plating can be realized.

In one embodiment, there is provided an electroplating apparatus for a non-metal plated part with a nano-metal conductive substance adsorbed on a surface thereof, which is different from the electroplating apparatus for a non-metal plated part with a nano-metal conductive substance adsorbed on a surface thereof in fig. 1, and referring to fig. 2 and 3, another top view and another side view of the electroplating apparatus for a non-metal plated part with a nano-metal conductive substance adsorbed on a surface thereof are provided, and the apparatus further includes: the flow-resisting partition plate 105, which is provided between the first plating tank 101 and the second plating tank 102, prevents the disturbance of the plating liquids in the first plating tank 101 and the second plating tank 102 from affecting each other.

The flow-resisting partition plate 105 is a baffle plate for separating the plating bath, and a plated part channel is arranged at the center line of the plating bath to ensure that the non-metal plated part 104 can pass through. Therefore, the first plating tank 101 and the second plating tank 102 can be communicated, and the influence of forced solution convection in the second plating tank 102 on the first plating tank 101 can be reduced as much as possible.

The choke plate 105 may also be made of a carbon steel plate with an insulating coating.

In addition to the choke partition 105, there is a method that the length of the first plating tank 101 is increased properly, that is, the non-metal plated part 104 with the surface adsorbed with the nano-metal conductive substance is still in the first plating tank 101 after being electroplated to form the metal plating layer, because the non-metal plated part 104 is located at a position of the first plating tank 101 far away from the second plating tank 102, even if the convection of the electrolyte in the second plating tank 102 is slightly strong, the non-metal plated part 104 located in the first plating tank 101 will not be affected, so that the nano-metal conductive adsorbed substance on the surface of the non-metal plated part 104 falls off.

Referring to fig. 4, which is a schematic view of a choke partition plate according to an embodiment of the present invention, a plated part channel is disposed at an upper portion of the choke partition plate 105, and the plated part channel is used for allowing a non-metal plated part to pass from a first plating bath to a second plating bath.

In one example, the choked flow partitions 105 are N, N is greater than or equal to 2, and the choked flow partitions 105 are arranged in parallel. The plurality of flow-resisting partition plates 105 are arranged in parallel at the junction of the first plating tank and the second plating tank and are used for increasing the flow-resisting effect, so that the interference of the electroplating solution with forced convection in the second plating tank to the electroplating solution without forced convection in the second plating tank is avoided.

In one example, the width of the plating channels of each of the parallel-arranged baffle plates 105, which are distributed from the first plating bath toward the second plating bath, is gradually reduced. The purpose of this is: the flow choking effect is increased, and the interference of the electroplating solution without forced convection in the second plating tank by the electroplating solution with forced convection in the second plating tank is avoided.

In an example, a plating apparatus of a non-metal plated part with a nano metal conductive object adsorbed on the surface thereof is provided, and different from the plating apparatus of the non-metal plated part with the nano metal conductive object adsorbed on the surface thereof in fig. 1, referring to fig. 5 and 6, a top view and a side view of the plating apparatus of the non-metal plated part with the nano metal conductive object adsorbed on the surface thereof are provided, N is greater than or equal to 3, that is, the number of the flow-resisting partition plates 105 is greater than or equal to 3, and the width of the plated part channel of each flow-resisting partition plate 105 distributed in parallel from the first plating tank 101 to the second plating tank 102 is increased and then decreased. The purpose of this is: the choking effect is increased, and the interference of the electroplating solution without forced convection in the second plating tank 102 by the electroplating solution with forced convection in the second plating tank 102 is avoided.

In one example, N is greater than or equal to 4, that is, the number of the baffle plates is greater than or equal to 4, the width of the plated part channel of each baffle plate distributed from the first plating tank to the second plating tank in parallel is increased first, then decreased and then increased, and the width of the plated part channel of the baffle plate closest to the second plating tank is set to be a preset size. The purpose of this is: increase the choked flow effect, avoid having the plating solution of forced convection in the second coating bath to do not have the plating solution of forced convection in the second coating bath to cause the interference.

In an example, an electroplating apparatus including a non-metal plated part having a nano metal conductive substance adsorbed on a surface thereof is provided, and referring to fig. 7 and 8, another top view and another side view of the electroplating apparatus including the non-metal plated part having the nano metal conductive substance adsorbed on the surface thereof are provided, and the flow-resisting partition plate 105 is disposed to be inclined toward the second plating bath 102, different from the electroplating apparatus of the non-metal plated part having the nano metal conductive substance adsorbed on the surface thereof in fig. 1. The purpose of this is: increase the choked flow effect, avoid having the plating solution of forced convection in the second coating bath to do not have the plating solution of forced convection in the second coating bath to cause the interference.

Referring to fig. 9, it is a flowchart of an electroplating method of a non-metal plated part with a surface adsorbed with a nano-metal conductive object according to an embodiment of the present invention, where the method includes:

s101, a first plating layer forming step: placing the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in a first electroplating solution without forced convection to carry out first electroplating at a first preset current density, and completely covering the surface of the nanometer metal conductive object to form a first coating;

specifically, the non-metal plating part with the nano metal conductive object adsorbed on the surface is placed in a first electroplating solution without forced convection to carry out first electroplating at a first preset current density.

The nonmetal plated part placed in the first plating tank is coated with the nanometer metal conductive object on the surface of the nonmetal plated part before being placed in the first plating tank, namely the nanometer metal conductive object is formed on the surface of the nonmetal plated part in advance.

When the non-metal plated part with the nano metal conductive object attached to the surface is electroplated in the first plating tank, metal is deposited on the surface of the non-metal plated part, so that a metal coating (a first coating) is formed on the surface of the non-metal plated part. The reason why no forced convection mechanism such as a spray pipe for realizing forced convection is arranged in the first plating tank is to avoid the occurrence of the conditions that the nano metal conductive object attached to the surface of the non-metal plated part falls off due to the convection or stirring of the electrolyte, and the metal plating layer electroplated from the non-metal plated part in the first plating tank is too thin and uneven. In the process, correspondingly, a small current density is adopted (no forced convection, the limiting current density of the solution is low, and the small current density electroplating is required to be used), and after the surface of the nano metal conductor is completely covered by the first plating layer, the risk of falling off of the nano metal conductor does not exist, so that any electroplating parameter required for realizing an electroplating target can be adopted, namely, preparation is made for second electroplating.

S102, a second plating layer forming step: placing the non-metal plated part after the first electroplating into a second electroplating solution with forced convection for second electroplating at a second preset current density to form a second coating on the surface of the first coating; wherein the second predetermined current density is greater than the first predetermined current density.

Specifically, after the nonmetal plating part is plated for the first time in a first plating tank, the nonmetal plating part enters a second plating tank communicated with the first plating tank, and the nonmetal plating part after the plating for the first time is placed in a second plating solution of forced convection for the second time by using a second preset current density.

Wherein the first plating solution and the second plating solution have the same composition.

And continuously depositing the target metal on the non-metal plating part with the first plating layer in a second plating tank to form a second plating layer until the preset electroplating requirement is met.

According to the invention, the nano metal conductive object is attached to the surface of the non-metal plating part and placed in the first plating tank for electroplating, and a metal plating layer is electroplated. After the first coating is plated on the nonmetal plating part, the target metal can be continuously precipitated in the second plating tank until the preset electroplating requirement is met, and the forced convection is arranged in the second plating tank to improve the electroplating efficiency.

Preferably, the first predetermined current density is 0.01 to 0.5 amps per square decimeter and the second predetermined current density is 0.1 to 10 amps per square decimeter.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. An electroplating method of a non-metal plated part with a nano metal conductive object adsorbed on the surface is characterized by comprising the following steps:

placing the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in first electroplating solution without forced convection to carry out first electroplating at a first preset current density, and completely covering the surface of the nanometer metal conductive object to form a first plating layer;

placing the non-metal plated part after the first electroplating into a second electroplating solution of forced convection to carry out second electroplating at a second preset current density, and forming a second coating on the surface of the first coating; wherein the second predetermined current density is greater than the first predetermined current density.

2. The electroplating method according to claim 1, wherein the first predetermined current density is 0.01 to 0.5 ampere per square decimeter and the second predetermined current density is 0.1 to 10 ampere per square decimeter.

3. The electroplating method according to claim 1, wherein the step of performing the first electroplating on the plated part with the nano-metal conductive material adsorbed on the surface in the first electroplating solution with the first preset current density and without forced convection comprises the following steps:

placing the non-metal plating part with the surface adsorbed with the nano metal conductive object in first plating solution of a first plating tank without forced convection to carry out first plating at a first preset current density;

the step of placing the plated part after the first electroplating in a second electroplating solution with a second preset current density and forced convection for second electroplating specifically comprises the following steps:

and after the first electroplating of the nonmetal plating part in the first plating tank is finished, the nonmetal plating part enters a second electroplating solution which is communicated with the first plating tank and is forcibly convected in the second plating tank to carry out the second electroplating at a second preset current density.

4. The plating method according to claim 1, wherein the first plating solution and the second plating solution are the same in composition.

5. An electroplating device of a non-metal plated part with a nano metal conductive object adsorbed on the surface is characterized by comprising a first plating tank and a second plating tank; the first plating bath is used for carrying out primary electroplating on the nonmetal plated part with the surface adsorbed with the nanometer metal conductive object in first electroplating solution without forced convection at a first preset current density to form a first plating layer on the surface of the nanometer metal conductive object of the nonmetal plated part;

the second plating tank is used for carrying out second electroplating on the nonmetal plated part in second electroplating solution of forced convection at a second preset current density to form a second plating layer on the surface of the first plating layer; the second preset current density is greater than the first preset current density.

6. The plating apparatus as recited in claim 5, wherein a forced convection mechanism is provided in said second plating tank for effecting forced convection of said second plating solution, said forced convection mechanism comprising at least two forced convection nozzles.

7. The electroplating apparatus according to claim 5, wherein the first plating bath and the second plating bath are arranged adjacently, a flow-resisting partition plate is arranged between the first plating bath and the second plating bath, and a plating passage for the non-metal plating part to enter the second plating bath from the first plating bath is arranged on the flow-resisting partition plate.

8. The electroplating device according to claim 7, wherein the number of the flow-resisting partition plates is N, N is more than or equal to 2, and each flow-resisting partition plate is arranged in parallel.

9. The plating apparatus as recited in claim 8, wherein the plating channels of the flow-impeding partitions have different widths.

10. The plating apparatus as recited in any one of claims 8 to 9, wherein the flow-resisting partition is disposed obliquely toward the second plating tank.

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