CN115151053A - 一种铜合铝箔材料制作的led线路板模组及其制作方法 - Google Patents
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Abstract
本发明涉及一种铜合铝箔材料制作的LED线路板模组及其制作方法,具体而言,将铝箔涂胶后粘在PET或PI膜上,然后,将铝箔露出来的一面进行电镀加工,电镀后,向外露出的金属是铜,根据线路设计,用蚀刻法或模切法去除不需要的金属,形成线路,用覆盖膜或油墨制作阻焊层,制成了线路板,在线路板上焊上LED或LED及控制元件,制成一种铜合铝箔材料制作的LED线路板模组。
Description
技术领域
本发明涉及LED领域,具体涉及一种铜合铝箔材料制作的LED线路板模组及其制作方法。
背景技术
现有技术的LED线路板模组,线路板都是用铜箔制作电路,铜成本高。
直接用铝做线路制作线路板,虽然成本很低,但是,由于铝焊锡性很差,使元件焊不牢固,也一直无法使用。
如何将成本低的铝用于制作线路板的线路,又能解决焊锡性的问题呢?
我们用以下的发明方法制作一种铜合铝箔材料制作的LED线路板模组,解决了以上问题,克服了现有技术的不足,具体方法:
将铝箔涂胶后粘在PET或PI膜上,然后,将铝箔露出来的一面进行电镀加工,电镀后,向外露出的金属是铜,根据线路设计,用蚀刻法或模切法去除不需要的金属,形成线路,用覆盖膜或油墨制做阻焊层,制成了线路板,在线路板上焊上LED或LED及控制元件,制成一种铜合铝箔材料制作的LED线路板模组。
既解决了完全用铜成本太高,而且LED等元件焊铜上,又避免了用纯铝做电路元件焊在铝上焊不牢的问题。
发明内容
本发明涉及一种铜合铝箔材料制作的LED线路板模组及其制作方法,具体而言,将铝箔涂胶后粘在PET或PI膜上,然后,将铝箔露出来的一面进行电镀加工,电镀后,向外露出的金属是铜,根据线路设计,用蚀刻法或模切法去除不需要的金属,形成线路,用覆盖膜或油墨制作阻焊层,制成了线路板,在线路板上焊上LED或LED及控制元件,制成一种铜合铝箔材料制作的LED线路板模组。
根据本发明提供了一种铜合铝箔材料制作的LED线路板模组的制作方法,具体而言,将铝箔涂胶后粘在PET或PI膜上,然后,将铝箔露出来的一面进行电镀加工,电镀后,向外露出的金属是铜,根据线路设计,用蚀刻法或模切法去除不需要的金属,形成线路,用覆盖膜或油墨制作阻焊层,制成了线路板,在线路板上焊上LED或LED及控制元件,制成一种铜合铝箔材料制作的LED线路板模组。
根据本发明还提供了一种铜合铝箔材料制作的LED线路板模组,包括:PI薄膜或PET薄膜基材层;胶粘剂层;铜合铝材料的线路层;表面阻焊层;LED或LED及控制元件;其特征是,所述的PI薄膜是聚酰亚胺为主要成份的树脂材料薄膜,所述PET薄膜是聚对苯二甲酸乙二醇脂为主要成份的树脂材料薄膜,铜合铝材料层的铝面通过胶粘剂层和PET薄膜或PI薄膜结合在一起,铜合铝材料线路层的所有线路都是由铜和铝结合在一起的线路,线路层主要成份是铜和铝,每条线路的上下两面一面是铜层,另一面是铝层,铜层的厚度小于铝层的厚度,表面阻焊层覆盖在铜层的表面,线路板表面的焊盘都是铜焊盘,铜焊盘部分或者全部被锡覆盖,所述表面阻焊层是油墨阻焊层或覆盖膜阻焊层,所述的LED或LED及控制元件已焊接在线路板的铜焊盘上。
根据本发明的一优选实施例,所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的一种铜合铝材料制作的柔性线路板,可在所述柔性线路的焊盘处打孔后使用,在孔处,模组线路板的正面焊点和背面导体形成连通。
根据本发明的一优选实施例,所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的铜的厚度是A,2um≤A≤15um。
根据本发明的一优选实施例,所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的铝的厚度是B,10um≤B≤400um。
在以下对附图和具体实施方式的描述中,将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书,本发明的特征、目的和优点将变得更加显而易见,对附图的简要说明如下。
图1为整卷单面铝基材的局部示意图。
图2为一面露铜的整卷单面铜合铝基材的局部示意图。
图3为带线路图形的线路板半成品的平面示意图。
图4为正面绝缘层有露铜的线路板半成品的平面示意图。
图5为含预断连接点的连体线路板的平面示意图。
图6为含预断连接点的连体线路板的横截面局部示意图。
图7为含预断连接点的连体LED线路板模组的平面示意图。
图8为沿着预断连接点分成单条制成一种铜合铝箔材料制作的LED线路板模组的平面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解,以下所述仅仅是举例说明和描述一些优选实施方式,对本发明的权利要求并不具有任何限制。
实施例
1,铝基材的制作
用涂布机,将铝箔1.1一面涂胶1.2后将溶剂烘干,然后和PET膜1.3粘在一起,制成整卷单面铝基材(图1所示)。
说明:(也可以用PI膜,但本实施例用PET膜来表述)。
2,电镀
用卷料电镀线,将以上单面铝基材的铝表面进行多个前处理,然后在铝的表面整面镀铜2.1,铜厚镀至3um~15um,铜的厚度为A、铝的厚度为B,制成一面露铜的整卷单面铜合铝基材(图2所示)。
3,线路制作
先将一面露铜的整卷单面铜合铝基材分切成单张,然后用蚀刻工艺或者模切工艺把线路不需要的铜合铝全部去除,制成带线路图形的线路板半成品(图3所示)。
4,阻焊层制作
在带线路图形的线路板半成品上施加一层绝缘层3.1,制作丝印网把阻焊油墨印刷在线路板的半成品上,或者把带胶的PET薄膜冲孔后贴合在线路板的半成品上,制成正面绝缘层有露铜的线路板半成品(图4所示)。
5,OSP制作
正面绝缘层有露铜的线路板半成品,通过OSP在露铜的位置施加一层防氧化膜4.1(图5所示)。
6,成型
用刀模把制作完防氧化膜的线路板分切制成含预断连接点的连体线路板(图5、图6所示)。
7,贴片
通过定制的钢网把锡膏印刷在含预断连接点的连体线路板上,然后把LED5.1贴在线路板的锡膏上,通过回流焊设备把锡膏融化后把LED5.1焊接在线路板上,测试点亮后,沿着预断连接点分成单条制成一种铜合铝箔材料制作的LED线路板模组(图7、图8所示)。
以上结合附图将一种铜合铝箔材料制作的LED线路板模组及其制作方法的具体实施例对本发明进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本发明的范围,尤其是权利要求的范围,并不具有任何限制。
Claims (5)
1.一种铜合铝箔材料制作的LED线路板模组的制作方法,具体而言,将铝箔涂胶后粘在PET或PI膜上,然后,将铝箔露出来的一面进行电镀加工,电镀后,向外露出的金属是铜,根据线路设计,用蚀刻法或模切法去除不需要的金属,形成线路,用覆盖膜或油墨制作阻焊层,制成了线路板,在线路板上焊上LED或LED及控制元件,制成一种铜合铝箔材料制作的LED线路板模组。
2.一种铜合铝箔材料制作的LED线路板模组,包括:
PI薄膜或PET薄膜基材层;
胶粘剂层;
铜合铝材料的线路层;
表面阻焊层;
LED或LED及控制元件;
其特征是,所述的PI薄膜是聚酰亚胺为主要成份的树脂材料薄膜,所述PET薄膜是聚对苯二甲酸乙二醇脂为主要成份的树脂材料薄膜,铜合铝材料层的铝面通过胶粘剂层和PET薄膜或PI薄膜结合在一起,铜合铝材料线路层的所有线路都是由铜和铝结合在一起的线路,线路层主要成份是铜和铝,每条线路的上下两面一面是铜层,另一面是铝层,铜层的厚度小于铝层的厚度,表面阻焊层覆盖在铜层的表面,线路板表面的焊盘都是铜焊盘,铜焊盘部分或者全部被锡覆盖,所述表面阻焊层是油墨阻焊层或覆盖膜阻焊层,所述的LED或LED及控制元件已焊接在线路板的铜焊盘上。
3.根据权利要求1或2所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的一种铜合铝材料制作的柔性线路板,可在所述柔性线路的焊盘处打孔后使用,在孔处,模组线路板的正面焊点和背面导体形成连通。
4.根据权利要求1或2所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的铜的厚度是A,2um≤A≤15um。
5.根据权利要求1或2所述的一种铜合铝箔材料制作的LED线路板模组,其特征在于,所述的铝的厚度是B,10um≤B≤400um。
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