CN115151036A - Circuit board made of copper-aluminum material and manufacturing method thereof - Google Patents
Circuit board made of copper-aluminum material and manufacturing method thereof Download PDFInfo
- Publication number
- CN115151036A CN115151036A CN202110369750.6A CN202110369750A CN115151036A CN 115151036 A CN115151036 A CN 115151036A CN 202110369750 A CN202110369750 A CN 202110369750A CN 115151036 A CN115151036 A CN 115151036A
- Authority
- CN
- China
- Prior art keywords
- copper
- aluminum
- circuit board
- film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 229920001721 polyimide Polymers 0.000 claims abstract description 7
- 239000013039 cover film Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000010408 film Substances 0.000 claims description 15
- 229920002799 BoPET Polymers 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910017767 Cu—Al Inorganic materials 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000005030 aluminium foil Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 13
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 239000011265 semifinished product Substances 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a circuit board made of a copper-aluminum material and a manufacturing method thereof, in particular to a circuit board made of a copper-aluminum material, which is manufactured by gluing an aluminum foil, adhering the aluminum foil on a PET (polyethylene terephthalate) or PI (polyimide) film, then electroplating the exposed surface of the aluminum foil, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer by using a cover film or ink.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board made of a copper-aluminum material and a manufacturing method thereof.
Background
In the prior art, the circuit board is made of copper foil, and the cost of copper is high.
The circuit board is made of aluminum directly, although the cost is low, the aluminum has poor solderability, so that the element is not firmly soldered and cannot be used all the time.
How to use low-cost aluminum for making circuits of circuit boards and solve the problem of solderability?
The circuit board made of the copper-aluminum material is manufactured by the following invention method, the problems are solved, the defects of the prior art are overcome, and the specific method comprises the following steps:
the aluminum foil is glued and adhered on a PET or PI film, then the non-glued side of the aluminum foil is electroplated, the metal exposed outwards is copper, according to the circuit design, the unnecessary metal is removed by an etching method or a die cutting method to form a circuit, a covering film or ink is used for manufacturing a solder mask, and the circuit board made of the copper-aluminum alloy material is manufactured.
And the thickness of copper is less than the thickness of aluminium, has both solved and has used copper cost too high completely, and the component welds on the copper when this kind of circuit board uses, has avoided again to make circuit component weld on aluminium weld the problem not firm.
Disclosure of Invention
The invention relates to a circuit board made of a copper-aluminum material and a manufacturing method thereof, in particular to a circuit board made of a copper-aluminum material, which is manufactured by gluing an aluminum foil, adhering the aluminum foil on a PET (polyethylene terephthalate) or PI (polyimide) film, then electroplating the exposed surface of the aluminum foil, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer by using a cover film or ink.
The invention provides a method for manufacturing a circuit board made of a copper-aluminum alloy material, which comprises the following steps of gluing an aluminum foil, adhering the aluminum foil on a PET (polyethylene terephthalate) or PI (polyimide) film, electroplating the non-glued surface of the aluminum foil, removing unnecessary metal by using an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer by using a cover film or ink to manufacture the circuit board made of the copper-aluminum alloy material.
According to the present invention, there is also provided a circuit board made of a cupper-aluminum material, comprising: a PI film or PET film substrate layer; an adhesive layer; a copper-aluminum material circuit layer; a surface solder mask layer; the polyimide/polyimide composite printed circuit board is characterized in that the PI film is a resin material film taking polyimide as a main component, the PET film is a resin material film taking polyethylene terephthalate as a main component, the aluminum surface of a copper-aluminum material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of the copper-aluminum material circuit layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the upper surface and the lower surface of each circuit are copper layers, the other surface of each circuit is an aluminum layer, the thickness of each copper layer is smaller than that of each aluminum layer, a surface solder resist layer covers the surface of each copper layer, a pad exposed on the surface of each circuit board is a copper pad, and the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer.
According to a preferred embodiment of the present invention, the flexible circuit board made of a copper-aluminum material is used after a hole is drilled at a pad of the flexible circuit, and the drilled hole is used for soldering an in-line component or soldering and conducting through the hole to a back surface.
According to a preferred embodiment of the present invention, the copper-aluminum material circuit board is characterized in that the thickness of copper is A, and A is greater than or equal to 2um and less than or equal to 15um.
According to a preferred embodiment of the invention, the circuit board made of the copper aluminum alloy material is characterized in that the thickness of the aluminum is B, and B is more than or equal to 10um and less than or equal to 400um.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a partial schematic view of a whole roll of single-sided aluminum substrate.
FIG. 2 is a partial view of a whole roll of single-sided copper-aluminum-based substrate with copper exposed on one side.
Fig. 3 is a schematic plan view of a circuit board blank with a circuit pattern.
Fig. 4 is a schematic plan view of a circuit board semi-finished product with exposed copper on the front insulating layer.
FIG. 5 is a schematic plan view of a circuit board made of a Cu-Al material with pre-broken connection points.
Fig. 6 is a cross-sectional partial schematic view of a circuit board fabricated from a copper-aluminum material.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1, preparation of aluminum substrate
The aluminum foil 1.1 is coated with glue 1.2 on one side by a coater, then the solvent is dried, and then the aluminum foil is bonded with a PET film 1.3 to form a whole roll of single-sided aluminum substrate (shown in figure 1).
Description of the drawings: (PI film is also possible, but this example is described as PET film).
2, electroplating
The aluminum surface of the single-sided aluminum substrate is subjected to a plurality of pre-treatments by using a coil plating line, and then the whole surface of the aluminum is plated with copper 2.1 with the thickness of 3-15 um, the thickness of the copper is A, and the thickness of the aluminum is B, so that the whole-coil single-sided copper-clad aluminum substrate with copper exposed on one side is prepared (shown in figure 2).
3, circuit fabrication
The whole roll of single-sided copper-aluminum base material with copper exposed on one side is cut into single pieces, and then the copper-aluminum unnecessary for the circuit is completely removed by an etching process or a die cutting process to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).
4, solder mask layer fabrication
Applying an insulating layer 3.1 on the circuit board semi-finished product with circuit patterns, manufacturing a screen printing screen, printing solder resist ink on the circuit board semi-finished product, or punching a PET film with glue and then attaching the PET film on the circuit board semi-finished product to manufacture the circuit board semi-finished product with the insulating layer exposed with copper on the front surface (shown in figure 4).
5,OSP fabrication
A semi-finished product of the circuit board with exposed copper on the insulating layer of the front surface, an oxidation preventing film 4.1 (shown in fig. 5) is applied by OSP at the locations where copper is exposed.
6, forming
The oxidation-resistant film-formed circuit board was cut into a copper-aluminum material circuit board with pre-cut connection points by a cutting die (see fig. 5 and 6).
The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in the following description. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (5)
1. A method for preparing the circuit board with Cu-Al material includes such steps as coating adhesive on aluminium foil, sticking it on PET or PI film, electroplating, etching or die cutting to remove unnecessary metal to form circuit, and preparing solder mask layer with cover film or ink.
2. A circuit board fabricated of a cupper-aluminum material, comprising:
a PI film or PET film substrate layer;
an adhesive layer;
a copper-aluminum material circuit layer;
a surface solder mask layer;
the polyimide-PI-type printed circuit board is characterized in that the PI film is a resin material film with polyimide as a main component, the PET film is a resin material film with polyethylene terephthalate as a main component, the aluminum surface of a copper-aluminum alloy material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of the copper-aluminum alloy material layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the copper layers are arranged on the upper surface and the lower surface of each circuit, the aluminum layers are arranged on the other surface of each circuit, the thickness of the copper layers is smaller than that of the aluminum layers, the surface solder resist layer covers the surface of the copper layers, the exposed pads on the surface of the circuit board are copper pads, and the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer.
3. The circuit board made of a cuprum-aluminum material as claimed in claim 1 or 2, characterized in that the flexible circuit board made of a cuprum-aluminum material can be used after punching on the bonding pad of the flexible circuit, and the punched hole is used for welding an in-line component or is connected to the back surface through hole welding.
4. The circuit board made of the copper-aluminum alloy material according to claim 1 or 2, wherein the thickness of the copper is A,2um is less than or equal to A and less than or equal to 15um.
5. The circuit board made of the copper-aluminum alloy material according to claim 1 or 2, wherein the thickness of the aluminum is B, and B is more than or equal to 10um and less than or equal to 400um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369750.6A CN115151036A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369750.6A CN115151036A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum material and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115151036A true CN115151036A (en) | 2022-10-04 |
Family
ID=83404809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110369750.6A Pending CN115151036A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115151036A (en) |
-
2021
- 2021-03-29 CN CN202110369750.6A patent/CN115151036A/en active Pending
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| PB01 | Publication | ||
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