CN115134995A - Circuit board made of copper-aluminum composite material and manufacturing method thereof - Google Patents
Circuit board made of copper-aluminum composite material and manufacturing method thereof Download PDFInfo
- Publication number
- CN115134995A CN115134995A CN202110369749.3A CN202110369749A CN115134995A CN 115134995 A CN115134995 A CN 115134995A CN 202110369749 A CN202110369749 A CN 202110369749A CN 115134995 A CN115134995 A CN 115134995A
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- China
- Prior art keywords
- copper
- layer
- aluminum
- circuit board
- aluminum composite
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a circuit board made of copper-aluminum composite material and a manufacturing method thereof, in particular to a circuit board made of copper-aluminum composite material, which is characterized in that aluminum and copper are overlapped together and then are rolled and pressed for multiple times through a rolling rod to form alloy fusion between the copper and aluminum interfaces, a copper layer and an aluminum layer are combined together to form a copper-aluminum composite foil, the aluminum surface is glued and then adhered on a resin material, the exposed metal is the copper layer, according to the circuit design, the unnecessary metal is removed by an etching method or a die cutting method to form a circuit, and a solder mask layer is made of cover film or printing ink, thus the circuit board made of copper-aluminum composite material is manufactured.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board made of copper-aluminum composite materials and a manufacturing method thereof.
Background
The circuit board of the prior art:
1. the copper foil is directly used for manufacturing the circuit, and the copper cost is high.
2. The circuit board is directly made of aluminum, although the cost is low, the poor aluminum soldering property causes the infirm soldering of elements, and the circuit board cannot be used all the time.
How to use low-cost aluminum for making circuits of circuit boards and solve the problem of solderability?
The invention uses the following method to manufacture a circuit board made of copper-aluminum composite material, solves the problems, overcomes the defects of the prior art, and comprises the following steps:
the method comprises the steps of overlapping aluminum and copper, rolling and pressing for multiple times through a rolling rod to form alloy fusion between the copper interface and the aluminum interface, combining a copper layer and an aluminum layer together to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the aluminum surface on a resin film, removing unnecessary metal through an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer through a cover film or ink to manufacture the circuit board made of the copper-aluminum composite material.
The circuit board solves the problem that the cost is high when pure copper is used for manufacturing the circuit, and also solves the problem that an aluminum welding element is not firmly welded when pure aluminum is used for manufacturing a circuit bonding pad.
Disclosure of Invention
The invention relates to a circuit board made of copper-aluminum composite material and a manufacturing method thereof, in particular to a circuit board made of copper-aluminum composite material, which is characterized in that aluminum and copper are overlapped together and then are rolled and pressed for a plurality of times through a rolling rod to form alloy fusion between copper and aluminum interfaces, so that a copper layer and an aluminum layer are combined together to form a copper-aluminum composite foil, the aluminum surface is glued and then adhered on a resin material, the exposed metal is the copper layer, according to the circuit design, the unnecessary metal is removed by an etching method or a die cutting method to form a circuit, and a cover film or printing ink is used for manufacturing a solder mask layer to manufacture the circuit board made of the copper-aluminum composite material.
The invention provides a method for manufacturing a circuit board made of a copper-aluminum composite material, which comprises the following steps of overlapping aluminum and copper, rolling for multiple times through a rolling rod to form alloy fusion between the copper and aluminum interfaces, combining a copper layer and an aluminum layer together to form a copper-aluminum composite foil, gluing the aluminum surface, adhering the aluminum surface on a resin film, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer by using a cover film or ink to manufacture the circuit board made of the copper-aluminum composite material.
The invention also provides a circuit board made of the copper-aluminum composite material, which comprises: a resin film base material layer; an adhesive layer; a copper aluminum composite foil circuit layer; a surface solder mask layer; the copper-aluminum composite circuit layer is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with the resin film base material layer through the adhesive layer, all circuits of the copper-aluminum composite circuit layer are formed by combining copper and aluminum, the upper layer and the lower layer of the circuit are copper layers, the other layer is an aluminum layer, the thickness of the aluminum layer is larger than that of the copper layer, the surface solder mask layer covers the surface of the copper layer, the exposed pad on the surface of the circuit board is a copper pad, and the surface solder mask layer is an ink solder mask layer or a cover film solder mask layer.
According to a preferred embodiment of the present invention, the circuit board made of copper-aluminum composite material is characterized in that holes are punched at the bonding pads of the flexible circuit for use, and the holes after punching are used for welding direct insertion components or are welded and conducted to the back surface through the holes for use.
According to a preferred embodiment of the invention, the circuit board made of the copper-aluminum composite material is characterized in that the thickness of copper is A, and A is more than or equal to 2um and less than or equal to 15 um.
According to a preferred embodiment of the invention, the circuit board made of the copper-aluminum composite material is characterized in that the thickness of aluminum is B, and B is more than or equal to 10um and less than or equal to 400 um.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a partial schematic view of a whole roll of copper aluminum composite foil.
FIG. 2 is a partial schematic view of a whole-roll single-side copper-aluminum composite substrate with copper leaking from one side.
Fig. 3 is a schematic plan view of a circuit board semi-finished product with a circuit pattern.
Fig. 4 is a schematic plan view of the semi-finished circuit board with copper partially exposed in the front side insulating layer.
Fig. 5 is a schematic plan view of a circuit board with pre-breaking connection points made of copper-aluminum composite material.
FIG. 6 is a schematic cross-sectional view of a circuit board made of copper-aluminum composite.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1, preparation of copper-aluminum composite foil
The copper strip 1.1a and the aluminum strip 1.1B are overlapped together, and rolled by cold pressing for multiple times by using a roller, wherein the thickness of the copper is A, and the thickness of the aluminum is B, so that the whole roll of copper-aluminum composite foil (shown in figure 1) is manufactured.
2, substrate preparation
Coating 1.2 of the aluminum surface 1.1b of the copper-aluminum composite foil with glue by a coating machine, drying the solvent, and then adhering the solvent and the PET film 1.3 together to prepare the whole roll of single-sided copper-aluminum composite substrate with copper leaking on one side (shown in figure 2).
Description of the drawings: (PI film is also possible, but this example is described as PET film).
3, circuit fabrication
Firstly, the whole roll of single-sided copper-aluminum composite base material with copper leaking on one side is cut into single pieces, and then the unnecessary copper of the circuit is completely removed by using an etching process or a die cutting process, so as to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).
4, solder mask preparation
Applying an insulating layer 3.1 on the circuit board semi-finished product with the circuit pattern, manufacturing a screen printing screen, printing solder resist ink on the semi-finished product of the circuit board, or punching a PET film with glue and attaching the PET film on the semi-finished product of the circuit board to manufacture the circuit board semi-finished product with the partial copper exposed in the insulating layer on the front surface (shown in figure 4).
5, OSP preparation
The semi-finished circuit board with partially exposed copper in the front insulating layer is coated with an oxidation-preventing film 4.1 (shown in fig. 5) at the position where copper is exposed by OSP.
6, forming
The circuit board with the anti-oxidation film is cut into a circuit board with pre-breaking connection points made of copper-aluminum composite materials by a cutting die (shown in figures 5 and 6).
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a circuit board made of copper-aluminum composite material and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (5)
1. A method for manufacturing a circuit board made of a copper-aluminum composite material comprises the steps of overlapping aluminum and copper, rolling for multiple times through a rolling rod to enable alloy fusion to be formed between the copper and aluminum interfaces, enabling a copper layer and an aluminum layer to be combined together to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the aluminum surface to a resin film, enabling the exposed metal to be the copper layer, removing unnecessary metal through an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer through a cover film or printing ink to manufacture the circuit board made of the copper-aluminum composite material.
2. A circuit board made of copper-aluminum composite material comprises:
a resin film base material layer;
an adhesive layer;
a copper-aluminum composite foil circuit layer;
a surface solder mask layer;
the copper-aluminum composite circuit layer is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with the resin film base material layer through the adhesive layer, all circuits of the copper-aluminum composite circuit layer are formed by combining copper and aluminum, the upper layer and the lower layer of the circuit are copper layers, the other layer is an aluminum layer, the thickness of the aluminum layer is larger than that of the copper layer, the surface solder mask layer covers the surface of the copper layer, the exposed pad on the surface of the circuit board is a copper pad, and the surface solder mask layer is an ink solder mask layer or a cover film solder mask layer.
3. The circuit board made of copper-aluminum composite material according to claim 1 or 2, wherein holes are punched at the bonding pads of the flexible circuit for use, and the holes are used for welding direct-insert components or are welded and conducted to the back surface through the holes for use.
4. The circuit board made of copper-aluminum composite material according to claim 1 or 2, wherein the thickness of copper is A, 2um is less than or equal to A and less than or equal to 15 um.
5. The circuit board made of copper-aluminum composite material according to claim 1 or 2, wherein the thickness of aluminum is B, and B is greater than or equal to 10um and less than or equal to 400 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369749.3A CN115134995A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum composite material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110369749.3A CN115134995A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum composite material and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115134995A true CN115134995A (en) | 2022-09-30 |
Family
ID=83375610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110369749.3A Pending CN115134995A (en) | 2021-03-29 | 2021-03-29 | Circuit board made of copper-aluminum composite material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115134995A (en) |
-
2021
- 2021-03-29 CN CN202110369749.3A patent/CN115134995A/en active Pending
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